CN116510942A - Radiator processing carrier and radiator processing method - Google Patents

Radiator processing carrier and radiator processing method Download PDF

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Publication number
CN116510942A
CN116510942A CN202310478695.3A CN202310478695A CN116510942A CN 116510942 A CN116510942 A CN 116510942A CN 202310478695 A CN202310478695 A CN 202310478695A CN 116510942 A CN116510942 A CN 116510942A
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China
Prior art keywords
processing
jig
spraying
heat
radiator
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Granted
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CN202310478695.3A
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Chinese (zh)
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CN116510942B (en
Inventor
田飞雄
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Dongguan Wanhengda Heat Transfer Technology Co ltd
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Dongguan Wanhengda Heat Transfer Technology Co ltd
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/20Masking elements, i.e. elements defining uncoated areas on an object to be coated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/32Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like

Abstract

The invention relates to the technical field of heat dissipation production, in particular to a radiator processing carrier and a radiator processing method, comprising a radiator body and a processing jig, wherein the radiator body comprises a contact part, a heat conduction part and a heat dissipation part; one surface of the contact part is provided with a spray coating, and the spray coating is formed by spraying nanoscale copper powder on the contact part; mounting clamping grooves are formed in two sides of the heat conducting part, and heat dissipation grooves are formed in the surface of the heat dissipation part; the processing jig comprises a jig base and a jig cover plate covering one surface of the jig base; a plurality of processing fixed slots are uniformly distributed on the jig base, the processing fixed slots penetrate through one side and the upper surface and the lower surface of the jig base, the processing fixed slots are obliquely formed in the jig base, the radiator body is matched in the processing fixed slots through the mounting clamping slots, one end of the radiator body extends out of one side of the processing fixed slots, and an inclined plane is formed at one end of the radiator body. The invention solves the problems of low processing efficiency and difficult shape fixation of the existing radiator.

Description

Radiator processing carrier and radiator processing method
Technical Field
The invention relates to the technical field of heat dissipation production, in particular to a radiator processing carrier and a heat dissipation processing method.
Background
Along with the continuous development of science and technology, a plurality of science and technology products are integrated in production and life, the science and technology products can continuously generate heat in the process of energy conversion when providing convenience for the production and life of people, and how to ensure the normal operation of the products, firstly, the problem of heat dissipation of the products is solved, particularly in some devices with higher power, because the working efficiency of the devices is continuously improved, and meanwhile, peripheral electronic components are continuously increased, so that the whole heat productivity of the devices is also greatly improved, and therefore, a radiator is required to dissipate heat of a heating element. Such as heat dissipation of components on a computer motherboard, the heat dissipation components are generally formed by processing aluminum alloy. The processing process is to process the aluminum alloy section or the aluminum alloy after die casting, the existing processing process is to process one by one, the processing efficiency is low, and the aluminum alloy heat dissipation efficiency is limited, so that the existing radiator and the processing process need to be improved.
Disclosure of Invention
In order to solve the problems, the invention provides a radiator processing carrier and a radiator processing method for solving the problems of low radiator processing efficiency and difficult shape fixation in the prior art.
The technical scheme adopted by the invention is as follows: a radiator processing carrier comprises a radiator body and a processing jig, wherein the radiator body comprises a contact part, a heat conduction part and a heat dissipation part; one surface of the contact part is provided with a spray coating, and the spray coating is formed by spraying nanoscale copper powder on the contact part; mounting clamping grooves are formed in two sides of the heat conducting part, and heat dissipation grooves are formed in the surface of the heat dissipation part; the processing jig comprises a jig base and a jig cover plate covering one surface of the jig base; the fixture comprises a fixture base, a radiator body, a plurality of machining fixing grooves, a plurality of mounting clamping grooves, a plurality of fixing grooves and a plurality of fixing grooves, wherein the machining fixing grooves are uniformly distributed on the fixture base and penetrate through one side and the upper surface and the lower surface of the fixture base; one surface of the jig cover plate covers one surface of the jig base and fixes the heat dissipation part, and the jig cover plate is provided with a processing groove corresponding to the heat dissipation groove.
The contact part, the heat conduction part and the heat dissipation part are sequentially connected from bottom to top to form an I-shaped structure.
The heat conducting device is characterized in that the contact part, the heat conducting part and the heat radiating part are integrally formed through die casting, a plurality of heat conducting columns are coated in the heat conducting part through die casting, the heat conducting columns are heat conducting copper columns, and one surface of each heat conducting copper column is connected with the spraying layer.
The technical scheme is further improved in that two sides of the contact part are provided with side plates, the processing fixing groove is provided with a first positioning step corresponding to the side plates, and the first positioning step is used for positioning the side plates;
in a further improvement of the above scheme, one surface of the contact part is exposed to one surface of the processing fixing groove.
The heat conducting part and the heat radiating part are provided with a connecting step, the corresponding connecting step of the processing fixing groove is provided with a second positioning step, and the second positioning step is used for positioning the connecting step.
The improvement of the scheme is that the installation clamping groove is provided with an inwards concave part, two sides of the processing fixing groove are inwards convex with convex parts, and the convex parts are used for being matched with the concave parts.
According to the technical scheme, the jig cover plate is provided with a fixed pressing groove corresponding to the heat dissipation part, and the fixed pressing groove is used for pressing the heat dissipation part.
The further improvement of the scheme is that the jig cover plate and the jig base are formed by SKD11 or DC53 processing, and the quenching hardness reaches 55-60 HRC.
The radiator processing method comprises the radiator processing carrier, and comprises the following steps:
s1, forming a radiator body, wherein the radiator body is formed by extrusion or die casting of aluminum alloy, and the contact part, the heat conduction part and the heat dissipation part are formed together in the forming process;
s2, assembling the radiator body, preparing a processing jig, matching the mounting clamping groove of the formed radiator body into the processing fixing groove of the processing jig, and pressing and fixing the radiator body on the jig base by the jig cover plate;
s3, processing the radiator body once, placing a processing jig provided with a plurality of radiator bodies on processing equipment for fixing, and processing the inclined planes of the radiator bodies and the radiating grooves in sequence; finally, milling the surface of the contact part to obtain a spraying surface;
s4, spraying, namely placing a processing jig into spraying equipment after one-time processing is finished, and enabling one surface of a contact part to face a spraying opening, wherein the spraying equipment is used for spraying nanoscale copper powder on the contact part and covering a spraying surface, and filling sand holes existing on the spraying surface, and tool marks and flow marks generated in the processing process in the spraying process;
s5, carrying out secondary processing on the radiator body, placing a processing jig on grinding equipment, grinding the spray coating through the grinding equipment, and grinding the spray coating into a flat surface.
In the step S3, the radiating groove is machined through a saw blade, and in the machining process, the radiating groove is machined through a grooving cutter; the inclined plane is subjected to milling structure through an outer diameter edge of the milling cutter;
in the step S4, a cover plate is arranged in the spraying process, and covers the jig base and exposes the spraying surface;
in the step S4, the spraying speed is more than 620m/S;
in the step S4, cold spraying is adopted, and the spraying thickness is 2.0-200 mu m;
in step S5, the spray coating is polished to form a mirror surface by polishing equipment after polishing.
The beneficial effects of the invention are as follows:
compared with the existing radiator processing, the invention is used for radiator processing on a computer motherboard, is suitable for batch processing, is provided with the mounting clamping groove on the radiator body, and the mounting clamping groove is used for fixing a plurality of radiator bodies by matching with the processing fixing groove of the jig base, is pressed and fixed under the action of the jig cover plate, is convenient to process in the processing process, can perform milling and grooving processing on the radiator bodies in batches, has high processing efficiency, and effectively improves the processing efficiency of the radiator bodies. The problem of current radiator machining efficiency low, the shape is difficult to fixed is solved.
The invention also relates to a radiator processing method, which comprises the following steps: : the method comprises the steps of forming a radiator body, assembling the radiator body, processing the radiator body once, spraying, placing a processing jig on spraying equipment after finishing the processing once, enabling one surface of a contact part to face a spraying opening, spraying nano-scale copper powder on the contact part by the spraying equipment, covering a spraying surface, and filling sand holes existing on the spraying surface, and tool marks and flow lines generated in the processing process in the spraying process; and (3) carrying out secondary processing on the radiator body, placing the processing jig on grinding equipment, grinding the spray coating through the grinding equipment, and grinding the spray coating into a flat surface. Because the radiator body is formed by adopting aluminum alloy, the formed aluminum has high heat dissipation coefficient and lower heat transfer coefficient, the spray coating is arranged to increase the heat transfer property, and the heat transfer effect and the heat dissipation effect are improved; the whole machining process is characterized in that a plurality of radiator bodies are fixedly machined by a machining jig, the consistency is good, the machining efficiency is high, no adverse phenomenon can occur, and the yield is high. And the structure is molded once by adopting twice processing, and the spray coating is processed after the second time spraying, so that the contact area of the spray coating is improved.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a perspective view of another view of the present invention;
FIG. 3 is an exploded view of the present invention of FIG. 2;
FIG. 4 is an exploded view of another view of the present invention;
FIG. 5 is a schematic perspective view of a radiator body according to the present invention;
fig. 6 is a schematic structural diagram of a radiator body according to the present invention.
Reference numerals illustrate: radiator body 1, contact 11 curb plate 111, heat conduction portion 12, mounting draw-in groove 121, heat conduction post 122, connection step 123, heat dissipation portion 13, heat dissipation groove 131, spray coating 14, processing tool 2, tool base 21, processing fixed slot 211, first location step 2111, second location step 2112, tool apron 22, fixed indent 221.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1 to 6, in one embodiment of the present invention, a heat sink processing carrier is related to, including a heat sink body 1, and a processing jig 2, where the heat sink body 1 includes a contact portion 11, a heat conducting portion 12, and a heat dissipating portion 13; a spraying layer 14 is arranged on one surface of the contact part 11, and the spraying layer 14 is formed by spraying nano-scale copper powder on the contact part 11; mounting clamping grooves 121 are formed in two sides of the heat conducting part 12, and heat dissipation grooves 131 are formed in the surface of the heat dissipation part 13; the processing jig 2 comprises a jig base 21 and a jig cover plate 22 covering one surface of the jig base 21; a plurality of processing fixing grooves 211 are uniformly distributed on the jig base 21, the processing fixing grooves 211 penetrate through one side and the upper surface and the lower surface of the jig base 21, the processing fixing grooves 211 are obliquely formed in the jig base 21, the radiator body 1 is matched in the processing fixing grooves 211 through the mounting clamping grooves 121, one end of the radiator body 1 extends out of one side of the processing fixing grooves 211, and an inclined surface is formed at one end of the radiator body 1; one surface of the jig cover plate 22 covers one surface of the jig base 21 and fixes the heat dissipation part 13, and a processing groove is formed in the jig cover plate 22 corresponding to the heat dissipation groove 131.
The contact part 11, the heat conduction part 12 and the heat dissipation part 13 are sequentially connected from bottom to top to form an I-shaped structure, the I-shaped structure is adopted, heat can be dissipated at the grooves on the two sides, when the structure is installed on a computer main board for use, the heat dissipation effect is better, a fan is installed on the side of a host machine for blowing and dissipating heat to the grooves on the two sides, and a flowable heat dissipation channel is formed.
The contact portion 11 is through die casting integrated into one piece with heat conduction portion 12 and heat dissipation portion 13, there is a plurality of heat conduction posts 122 through die casting cladding in the heat conduction portion 12, heat conduction post 122 is the heat conduction copper post, the one side of heat conduction copper post with spray coating 14 is connected, adopts aluminum alloy integrated into one piece die casting into one piece in this embodiment, specifically drops into die casting die after melting aluminum alloy heat, sets up the heat conduction copper post in die casting die, combines with the copper post through the aluminium liquid after the hot melting, forms an organic wholely, and copper aluminium combines the back than pure aluminum structure coefficient of heat transfer high.
The two sides of the contact part 11 are provided with side plates 111, the processing fixing groove 211 is provided with a first positioning step 2111 corresponding to the side plates 111, the first positioning step 2111 is used for positioning the side plates 111, a connecting step 123 is arranged between the heat conducting part 12 and the heat radiating part 13, the processing fixing groove 211 is provided with a second positioning step 2112 corresponding to the connecting step 123, and the second positioning step 2112 is used for positioning the connecting step 123; the two positioning steps are matched with the side plate 111 of the heat conducting part 12 and the connecting step 123 for positioning, so that the structure is stable in assembly and fixation, and the processing is convenient.
One surface of the contact portion 11 is exposed to one surface of the processing fixing groove 211, so that the contact portion 11 can be conveniently sprayed.
The installation draw-in groove 121 is equipped with the depressed part that inwards caves in, processing fixed slot 211's both sides inwards are protruding to have the bellying, the bellying is used for the cooperation depressed part, through the cooperation of depressed part and bellying, conveniently assembles processing on the processing tool 2.
The jig cover plate 22 is provided with a fixed pressing groove 221 corresponding to the heat dissipation part 13, the fixed pressing groove 221 is used for pressing the heat dissipation part 13, and the heat dissipation part 13 is pressed through the fixed pressing groove 221, so that the stability is good and the precision is high in the processing process.
The jig cover plate 22 and the jig base 21 are formed by SKD11 or DC53, and the quenching hardness reaches 55-60 HRC; the aluminum alloy is made of high-hardness materials and is subjected to heat treatment, so that the aluminum alloy is high in structural strength, stable in processing and good in durability.
The invention is used for processing the radiator on the computer motherboard, is suitable for batch processing, the radiator body 1 is provided with the mounting clamping groove 121, the mounting clamping groove 121 is used for fixing a plurality of radiator bodies 1 by matching with the processing fixing groove 211 of the jig base 21, and is pressed and fixed under the action of the jig cover plate 22, the processing is convenient in the processing process, the radiator bodies 1 can be milled and gouged in batches, the processing efficiency is high, and the processing efficiency of the radiator bodies 1 is effectively improved. The problem of current radiator machining efficiency low, the shape is difficult to fixed is solved.
A radiator processing method comprises the following steps:
s1, forming a radiator body 1, wherein the radiator body 1 is formed by extrusion or die casting of aluminum alloy, and the contact part 11, the heat conduction part 12 and the heat dissipation part 13 are formed together in the forming process;
s2, assembling the radiator body 1, preparing the machining jig 2, matching the mounting clamping groove 121 of the formed radiator body 1 into the machining fixing groove 211 of the machining jig 2, and pressing and fixing the radiator body 1 on the jig base 21 by the jig cover plate 22;
s3, the radiator body 1 is processed once, a processing jig 2 provided with a plurality of radiator bodies 1 is placed on processing equipment to be fixed, and the inclined planes of the radiator bodies 1 and the radiating grooves 131 are processed in sequence; finally, milling the surface of the contact part 11 to obtain a spraying surface;
s4, spraying, namely after one-time processing is finished, placing the processing jig 2 into spraying equipment, and enabling one surface of the contact part 11 to face a spraying opening, wherein the spraying equipment is used for spraying nanoscale copper powder on the contact part 11, covering a spraying surface, and filling sand holes in the spraying surface, and tool marks and flow marks generated in the processing process in the spraying process;
s5, carrying out secondary processing on the radiator body 1, placing the processing jig 2 on grinding equipment, grinding the spray coating 14 through the grinding equipment, and grinding the spray coating 14 into a flat surface.
In step S3, the cooling groove 131 is machined by a saw blade, and in the machining process, the cooling groove 131 is machined by a grooving cutter; the inclined plane is subjected to milling structure through an outer diameter edge of the milling cutter; in this embodiment, in addition to the above processing, the radiator body 1 may be perforated.
In step S4, during the spraying process, a cover plate is provided, and the cover plate covers the jig base 21 and exposes the spraying surface; the cover plate is used for covering the part of the jig base 21 and preventing the spray coating from adhering to the jig base 21.
In the step S4, the spraying speed is more than 620m/S; adopting cold spraying, wherein the spraying thickness is 2.0-200 mu m; above, adopt the cold structure of spouting of high speed, can directly adhere to the surface of combining the nanoscale copper powder granule at the aluminum alloy, the wholeness is better, and both bondings are stronger.
In step S5, the sprayed layer 14 is polished to form a mirror surface by a polishing device after polishing, and the polished mirror surface structure is used for contacting components such as a hard disk to dissipate heat, so that the heat dissipation coefficient is high.
The radiator body 1 is molded, the radiator body 1 is assembled, the radiator body 1 is processed and sprayed once, after the processing is finished once, the processing jig 2 is placed into spraying equipment, one surface of the contact part 11 faces to a spraying opening, the spraying equipment sprays nano-scale copper powder on the contact part 11 and covers the spraying surface, and sand holes existing on the spraying surface, and knife marks and flow marks generated in the processing process are filled in the spraying process; the radiator body 1 is processed for the second time, the processing jig 2 is placed on a grinding device, the spray coating 14 is ground through the grinding device, and the spray coating 14 is ground into a flat surface. Because the radiator body 1 is formed by adopting aluminum alloy, the formed aluminum has high heat dissipation coefficient and lower heat transfer coefficient, the spray coating 14 is arranged to increase the heat transfer property, and the heat transfer effect and the heat dissipation effect are improved; the whole machining process is to fix and machine a plurality of radiator bodies 1 by the machining jig 2, so that the consistency is good, the machining efficiency is high, adverse phenomena can not occur, and the yield is high.
The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. A radiator processing carrier, characterized in that: comprising
The radiator comprises a radiator body, a heat conducting part and a heat radiating part, wherein the radiator body comprises a contact part, a heat conducting part and a heat radiating part; one surface of the contact part is provided with a spray coating, and the spray coating is formed by spraying nanoscale copper powder on the contact part; mounting clamping grooves are formed in two sides of the heat conducting part, and heat dissipation grooves are formed in the surface of the heat dissipation part;
the processing jig comprises a jig base and a jig cover plate covering one surface of the jig base; the fixture comprises a fixture base, a radiator body, a plurality of machining fixing grooves, a plurality of mounting clamping grooves, a plurality of fixing grooves and a plurality of fixing grooves, wherein the machining fixing grooves are uniformly distributed on the fixture base and penetrate through one side and the upper surface and the lower surface of the fixture base; one surface of the jig cover plate covers one surface of the jig base and fixes the heat dissipation part, and the jig cover plate is provided with a processing groove corresponding to the heat dissipation groove.
2. The heat sink processing carrier of claim 1, wherein: the contact part, the heat conduction part and the heat dissipation part are sequentially connected from bottom to top, and an I-shaped structure is formed.
3. The heat sink processing carrier of claim 1, wherein: the contact part, the heat conduction part and the heat dissipation part are integrally formed through die casting, a plurality of heat conduction columns are coated in the heat conduction part through die casting, the heat conduction columns are heat conduction copper columns, and one surface of each heat conduction copper column is connected with the spraying layer.
4. The heat sink processing carrier of claim 1, wherein: the two sides of the contact part are provided with side plates, the processing fixing groove is provided with a first positioning step corresponding to the side plates, and the first positioning step is used for positioning the side plates;
one surface of the contact part is exposed out of one surface of the processing fixing groove.
5. The heat sink processing carrier of claim 1, wherein: the heat conducting part and the heat radiating part are provided with connecting steps, the processing fixing groove is provided with second positioning steps corresponding to the connecting steps, and the second positioning steps are used for positioning the connecting steps.
6. The heat sink processing carrier of claim 1, wherein: the installation draw-in groove is equipped with the depressed part that inwards caves in, processing fixed slot's both sides inwards are protruding to have the bellying, the bellying is used for the cooperation depressed part.
7. The heat sink processing carrier of claim 1, wherein: the jig cover plate is provided with a fixed pressing groove corresponding to the heat dissipation part, and the fixed pressing groove is used for pressing the heat dissipation part.
8. The heat sink processing carrier of claim 1, wherein: the jig cover plate and the jig base are formed by SKD11 or DC53 processing, and the quenching hardness reaches 55-60 HRC.
9. A method of processing a heat sink comprising the heat sink processing carrier of any one of claims 1 to 8, characterized in that: the radiator processing method comprises the following steps:
s1, forming a radiator body, wherein the radiator body is formed by extrusion or die casting of aluminum alloy, and the contact part, the heat conduction part and the heat dissipation part are formed together in the forming process;
s2, assembling the radiator body, preparing a processing jig, matching the mounting clamping groove of the formed radiator body into the processing fixing groove of the processing jig, and pressing and fixing the radiator body on the jig base by the jig cover plate;
s3, processing the radiator body once, placing a processing jig provided with a plurality of radiator bodies on processing equipment for fixing, and processing the inclined planes of the radiator bodies and the radiating grooves in sequence; finally, milling the surface of the contact part to obtain a spraying surface;
s4, spraying, namely placing a processing jig into spraying equipment after one-time processing is finished, and enabling one surface of a contact part to face a spraying opening, wherein the spraying equipment is used for spraying nanoscale copper powder on the contact part and covering a spraying surface, and filling sand holes existing on the spraying surface, and tool marks and flow marks generated in the processing process in the spraying process;
s5, carrying out secondary processing on the radiator body, placing a processing jig on grinding equipment, grinding the spray coating through the grinding equipment, and grinding the spray coating into a flat surface.
10. The heat sink processing method according to claim 9, characterized in that: in the step S3, the radiating groove is machined through the saw blade, and in the machining process, the radiating groove is machined through the grooving cutter;
the inclined plane is subjected to milling structure through an outer diameter edge of the milling cutter;
in the step S4, a cover plate is arranged in the spraying process, and covers the jig base and exposes the spraying surface;
in the step S4, the spraying speed is more than 620m/S;
in the step S4, cold spraying is adopted, and the spraying thickness is 2.0-200 mu m;
in step S5, the spray coating is polished to form a mirror surface by polishing equipment after polishing.
CN202310478695.3A 2023-04-28 2023-04-28 Radiator processing carrier and radiator processing method Active CN116510942B (en)

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CN110420777A (en) * 2019-08-12 2019-11-08 苏州富强科技有限公司 A kind of workpiece ink-jet fixed fixture
CN215898269U (en) * 2021-06-08 2022-02-22 宏进金属科技股份有限公司 Forming device for manufacturing radiating fin and forming module thereof
CN215197767U (en) * 2021-06-24 2021-12-17 昆山欣弘昌电子有限公司 Paint spraying jig for computer heat dissipation plate
CN215345646U (en) * 2021-07-14 2021-12-28 苏州凯瑞斯精密机械科技有限公司 Spliced radiating fin structure capable of improving heat conduction efficiency
CN216775336U (en) * 2021-11-26 2022-06-17 东莞永亚五金电子有限公司 Integral type multi-structure aluminum alloy ex-trusions radiator
CN115121848A (en) * 2022-07-07 2022-09-30 中山铨展超导体科技有限公司 Efficient radiator base plane processing equipment
CN115921165A (en) * 2022-12-27 2023-04-07 西安鑫垚陶瓷复合材料股份有限公司 High-pressure turbine outer ring block coating tool and using method thereof

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