CN218006817U - Multi-heat-source radiator - Google Patents
Multi-heat-source radiator Download PDFInfo
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- CN218006817U CN218006817U CN202220360564.6U CN202220360564U CN218006817U CN 218006817 U CN218006817 U CN 218006817U CN 202220360564 U CN202220360564 U CN 202220360564U CN 218006817 U CN218006817 U CN 218006817U
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- heat
- mounting plate
- mounting
- chip
- heat dissipation
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Abstract
The utility model discloses a multi-heat source radiator, which comprises a mounting plate; the front surface of the mounting plate is provided with a plurality of radiating fins which are vertical to the mounting plate to form a radiating part; the mounting plate is provided with at least two mounting areas for mounting the chip, the mounting areas are provided with heat conducting pads mutually attached to the mounting plate, and the heat of the chip is transferred to the heat dissipation part through the heat conducting pads; the radiating fins are distributed at equal intervals, and radiating channels are formed between the adjacent radiating fins. The back of the mounting plate is provided with mounting areas with different sizes for mounting a heat conducting pad to form multi-module heat dissipation, a high-precision measuring instrument chip is adhered to the heat conducting pad, and after the high-speed operation, heat generated by the chip is transferred from the heat conducting pad to the mounting plate and a heat dissipation part, so that a heat dissipation effect is achieved; the whole structure has light weight, small occupied space and good heat dissipation effect; the method is suitable for high-precision measuring instrument chips.
Description
Technical Field
The utility model relates to a radiator, especially a many heat sources radiator.
Background
With the development of technology, integrated circuits are increasingly used in various electronic devices, such as computers. The integrated circuit generates heat during the high-speed operation, and if the heat is accumulated, the temperature of the integrated circuit is increased, the operation of a system is influenced, and the service life is influenced. The radiator is used for radiating the heat generated by the integrated circuit to the outside of the integrated circuit so as to keep the operating temperature normal; since the integrated circuit has a high precision, includes various chips, and the chips are densely arranged, if each chip is equipped with a corresponding heat sink, it will occupy a large space, and the installation operation is also difficult. Therefore, it is necessary to provide a heat sink with multiple heat sources, which is light and has good heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a many heat sources radiator.
In order to achieve the above purpose, the utility model adopts the following technical scheme: comprises a mounting plate; the front surface of the mounting plate is provided with a plurality of radiating fins which are vertical to the mounting plate to form a radiating part; the mounting plate is provided with at least two mounting areas for mounting the chip, the mounting areas are provided with heat conducting pads mutually attached to the mounting plate, and the heat of the chip is transferred to the heat dissipation part through the heat conducting pads; the radiating fins are distributed at equal intervals, and radiating channels are formed between the adjacent radiating fins. The back of the mounting plate is provided with mounting areas with different sizes for mounting a heat conducting pad to form multi-module heat dissipation, a high-precision measuring instrument chip is adhered to the heat conducting pad, and after the high-speed operation, heat generated by the chip is transferred from the heat conducting pad to the mounting plate and a heat dissipation part, so that a heat dissipation effect is achieved; the whole structure has light weight, small occupied space and good heat dissipation effect.
In a further technical scheme, the bottoms of the plurality of radiating fins are connected to form a bottom plate, and the bottom plate and the mounting plate are assembled in a clinging manner.
In a further technical scheme, the bottom plate is superposed on the front surface of the mounting plate and fixedly connected with the mounting plate in any one mode of welding, screwing, gluing and the like.
In a further technical scheme, the mounting plate is of a rectangular structure, and a plurality of mounting holes are formed in the positions of four corners of the mounting plate; the heat dissipation part forms an abdicating space corresponding to the position of the mounting hole; four mounting holes are formed in the mounting plate, distributed in four right angles of the mounting plate and used for fixedly mounting the follow-up whole radiator.
In a further technical scheme, the heat dissipation part is an aluminum profile.
In a further technical scheme, a release paper layer is preset on one surface of the heat conducting pad connected with the chip.
In a further technical scheme, a concave position for assembling the chip is reserved on the surface of the heat conducting pad.
In a further technical scheme, the heat conducting pad is arranged in an area radiated by the heat radiating part.
Known through foretell technical scheme, compare with prior art, the utility model discloses following beneficial technological effect has: the back of the mounting plate is provided with mounting areas with different sizes for mounting a heat conducting pad to form multi-module heat dissipation, the chip is adhered to the heat conducting pad, after the chip runs at a high speed, heat generated by the chip is transferred from the heat conducting pad to the mounting plate and the heat dissipation part, and then the heat generated by the chip passes through a heat dissipation channel formed between adjacent heat dissipation fins to achieve the heat dissipation effect; the whole structure is light in weight, small in occupied space and good in heat dissipation effect; the chip is suitable for high-precision measuring instrument chips.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of another angle structure of the present invention.
Fig. 3 is an exploded view of the present invention.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention. In the description of the present application, it is to be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present application. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in this application will be understood to be a specific case for those of ordinary skill in the art.
Referring to fig. 1-3, a multi-heat source heat sink includes a mounting plate 1; the front surface of the mounting plate 1 is provided with a plurality of radiating fins 201 which are vertical to the mounting plate 1 to form a radiating part 2; the mounting plate 1 is provided with at least two mounting areas for mounting the chip, the mounting areas are provided with heat conducting pads 3 mutually attached to the mounting plate 1, and the heat of the chip is transferred to the heat dissipation part 1 through the heat conducting pads 3; the radiating fins 201 are distributed at equal intervals, and a radiating channel 203 is formed between adjacent radiating fins 201. The back of the mounting plate is provided with mounting areas with different sizes for mounting the heat conducting pad 3 to form multi-module heat dissipation, the high-precision measuring instrument chip is adhered to the heat conducting pad 3, and after the high-speed operation, heat generated by the chip is transferred from the heat conducting pad to the mounting plate 1 and the heat dissipation part 2 to achieve the heat dissipation effect; the whole structure has light weight, small occupied space and good heat dissipation effect.
The heat dissipation fins 201 and the mounting plate 1 are made of aluminum materials with good heat conductivity, and simultaneously, before the heat dissipation fins 201 and the mounting plate 1 are fixed with each other, the heat dissipation fins 201 and the mounting plate 1 are subjected to surface treatment, namely, a layer of metal coating is coated on the surface in a spraying mode, and the metal coating can be made of materials with good heat conductivity, such as nickel, copper or alloys thereof. In the utility model, a chemical nickel plating layer is adopted, and the thickness of the chemical nickel plating layer is more than 1.2 μm; the nickel has good mechanical strength and high temperature resistance, and when the heat radiating fins 201 and the mounting plate 1 are not plated with any high temperature resistant layer, high temperature oxidation occurs, so that a layer of oxide is formed on the surface of the radiator, the oxide is not easy to clean, and the attractiveness of the radiator is influenced; the presence of the plating layer can not only maintain the beauty but also effectively inhibit the oxidation of the heat dissipating fins 201.
The bottoms of the plurality of radiating fins 201 are connected to form a bottom plate 202, and the bottom plate 202 is assembled with the mounting plate 1 in a clinging manner; the bottom plate 202 is superposed on the front surface of the mounting plate 1 and fixedly connected with the mounting plate 1 by any one of welding, screwing, gluing and the like. In the utility model, the low-temperature solder paste Sn is adopted 42 Bi 58 The base plate 202 is fixed to the mounting plate 1 by welding, and the entire heat dissipation portion 2 is fixed to the mounting plate 1; in the processing process, factors influencing subsequent use and installation, such as excessive edges, insufficient soldering, no tin beads, no tin overflow and the like, are avoided; in the aspect of safety and environmental protection, the material and the production process both meet the RoHS environmental protection requirement.
The mounting plate 1 is of a rectangular structure, and a plurality of mounting holes 101 are formed in the four corners of the mounting plate 1; the heat dissipation part 2 forms an abdicating space corresponding to the position of the mounting hole 101; the four mounting holes 101 are formed, and one mounting hole is formed corresponding to each of the four right angles, so that the whole radiator can be conveniently and fixedly mounted in the follow-up process.
The heat conducting pad 3 is composed of a heat conducting main body and release paper, and the release paper is arranged on one surface of the heat conducting pad connected with the chip; the heat conduction coefficient of the heat conduction pad is 3W/mk; in the utility model, a concave position for assembling the chip is reserved on the surface of the heat conducting pad 3, and the chip can be directly fixed in the concave position; the four heat conducting pads 3 are different in size, multi-module heat dissipation is formed through the heat conducting pads 3 with different sizes, and the heat conducting pads with proper sizes are correspondingly matched according to different chip sizes so as to dissipate heat to the maximum extent; the chip can be directly adhered to the heat conducting pad 3; in the actual use process, the right angle of the lower right part of one of the heat conducting pads 3 is cut to form the shape of an inner circular arc.
The principle of the present invention is further described below:
firstly, selecting a good product without bruise and scratch, carrying out cleaning treatment such as deburring and degreasing, directly attaching the heat conducting pad 3 to the back surface of the mounting plate 1, peeling off release paper, and then directly attaching the chip to the heat conducting pad 3, so that the heat conducting pad 3 is arranged in an area radiated by the heat dissipation part; installing the radiator lock screw provided with the chip at a corresponding position through the installation hole 101; when the chip runs at a high speed, a large amount of heat is generated, the generated heat is transmitted to the mounting plate 1 and the heat dissipation part 2 through the heat conduction pad 3, and then the heat dissipation channel 203 formed between the adjacent heat dissipation fins 201 is used for carrying out high-efficiency heat dissipation; due to the presence of the plating layer, oxidation of the heat radiation fin 201 is not caused, thereby affecting the use appearance.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A multi-heat source radiator is characterized in that: comprises a mounting plate (1);
the front surface of the mounting plate (1) is provided with a plurality of radiating fins (201) which are vertical to the mounting plate (1) to form a radiating part (2); the mounting plate (1) is provided with at least two mounting areas for mounting the chip, the mounting areas are provided with heat conducting pads (3) mutually attached to the mounting plate (1), and the heat of the chip is transferred to the heat dissipation part (2) through the heat conducting pads (3);
the radiating fins (201) are distributed at equal intervals, and radiating channels (203) are formed between the adjacent radiating fins (201).
2. A multi-heat-source heat sink as recited in claim 1, wherein: the bottoms of the plurality of radiating fins (201) are connected to form a bottom plate (202), and the bottom plate (202) is assembled with the mounting plate (1) in a clinging manner.
3. A multi-heat-source heat sink as recited in claim 2, wherein: the bottom plate (202) is overlapped on the front surface of the mounting plate (1) and is fixedly connected with the mounting plate (1) in any one mode of welding, screwing and gluing.
4. A multi-heat-source heat sink as recited in claim 1, wherein: the mounting plate (1) is of a rectangular structure, and a plurality of mounting holes (101) are formed in the positions of four corners of the mounting plate (1); the heat dissipation part (2) forms an abdicating space corresponding to the position of the mounting hole (101).
5. A multi-heat-source heat sink as recited in claim 4, wherein: the heat dissipation part (2) is an aluminum profile.
6. A multi-heat-source heat sink as recited in claim 1, wherein: and a release paper layer is preset on one surface of the heat conducting pad (3) connected with the chip.
7. A multi-heat-source heat sink as recited in claim 1, wherein: and a concave position for assembling the chip is reserved on the surface of the heat conducting pad (3).
8. A multi-heat-source heat sink as recited in claim 1, wherein: the heat conducting pad (3) is arranged in the area radiated by the heat radiating part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220360564.6U CN218006817U (en) | 2022-02-22 | 2022-02-22 | Multi-heat-source radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220360564.6U CN218006817U (en) | 2022-02-22 | 2022-02-22 | Multi-heat-source radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218006817U true CN218006817U (en) | 2022-12-09 |
Family
ID=84286400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220360564.6U Active CN218006817U (en) | 2022-02-22 | 2022-02-22 | Multi-heat-source radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218006817U (en) |
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2022
- 2022-02-22 CN CN202220360564.6U patent/CN218006817U/en active Active
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