CN115576402A - Air-cooled liquid-cooled coupling heat radiation structure of board card chip - Google Patents

Abstract

The invention discloses an air-cooled and liquid-cooled coupled heat dissipation structure for a card chip, which includes a heat dissipation body, on which a plurality of heat dissipation fins are arranged, the heat dissipation body is a hollow profile structure, and a liquid inlet is provided at the left front lower part of the heat dissipation body to dissipate heat. There is a liquid outlet on the upper left rear of the body; there is a cooling fan on one side of the cooling body, and one or two cooling fans are installed; there are lugs on both sides of the cooling body, and a cross bar is connected to one side of the lug, and one end of the cross bar There is a longitudinal rod connected, and a U-shaped seat is provided at the lower end of the longitudinal rod, and the U-shaped seats on both sides are clamped on both sides of the board; the heat dissipation body of the chip air-cooled liquid-cooled coupling heat dissipation structure of the board is provided with a group according to the heat dissipation area. or multiple sets, when multiple sets of heat dissipation bodies are provided, adjacent heat dissipation bodies are connected by connectors. The invention couples air cooling and liquid cooling in a heat dissipation structure, and flexibly arranges the heat dissipation structure above the chip required for heat dissipation, thereby effectively solving the heat dissipation problem of the board chip.

Description

A board chip air-cooled liquid-cooled coupled heat dissipation structure

technical field

The invention belongs to the technical field of heat sinks, in particular to an air-cooled and liquid-cooled coupled heat dissipation structure for board chips.

Background technique

The heat dissipation of the board chip directly affects the performance of the board. Therefore, how to provide an efficient and low-energy heat dissipation structure for these boards is an urgent problem to be solved. Currently, the network cards, Raid cards, GPUs and other boards used in servers The chip on the card usually adopts a traditional heat sink, which is dissipated by the server fan. Use the fan turbine effect to induce wind to increase the alternating cold air to improve heat dissipation efficiency, but the profile inserts of the support seat at the bottom of the fan are usually in the form of rectangles or sunflowers, which are in complete contact with the heating electronic parts, and the circulation of the bottom air fluid is insufficient, resulting in replacement of cold air and Insufficient contact with the profile, the structure of the fan cover affects the installation and reduces the fan installation diameter, which affects the safety protection strength, resulting in poor energy efficiency.

Liquid-cooled radiators are also called water-cooled radiators, which set cold water pipes in the heat sink profile to achieve the purpose of cooling through cold water heat transfer, but the distribution of cold water pipes in the heat sink profile is limited, resulting in slow heat transfer at the edge of the profile, resulting in The energy efficiency is difficult to achieve the expected effect; in addition, regardless of the existing air-cooled radiator or liquid-cooled radiator, the radiator is currently fixed on the top of the commonly used chips to dissipate heat for the chip with a large heat dissipation, which cannot meet the requirements of other chips on the board. Chip cooling.

Contents of the invention

The purpose of the present invention is to overcome the deficiencies in the prior art and provide a board chip air-cooled liquid-cooled coupled heat dissipation structure to solve the problem of heat dissipation of the chips on the board.

In order to achieve the above object, the technical scheme adopted in the present invention is:

A board chip air-cooled liquid-cooled coupling heat dissipation structure, including a heat dissipation body, the heat dissipation body is an H-shaped structure, a number of heat dissipation fins are provided on the heat dissipation body, the heat dissipation body is a hollow profile structure, and the hollow The structure extends to the inside of the heat dissipation fins. The lower part of the heat dissipation body is provided with a bottom plate; The liquid outlet is connected with a liquid outlet pipe, and the liquid inlet pipe and the liquid outlet pipe are connected with the circulation pump (not shown in the figure); one side of the heat dissipation body is provided with a cooling fan, and one or two cooling fans are provided, and the cooling fan is provided with a cooling fan. When there is one cooling fan, it is installed on the upper or lower part of the heat dissipation body, and the wind direction blows to the chip or away from the chip. At the same time away from the chip; the two sides of the heat dissipation body are provided with lugs, one side of the lugs is connected to a cross bar, one end of the cross bar is connected to a longitudinal bar, the lower end of the longitudinal bar is provided with a U-shaped seat, and the U-shaped seats on both sides The card is on both sides of the board; the heat dissipation body of the chip air-cooled liquid-cooled coupling heat dissipation structure of the board is provided with one or more groups according to the heat dissipation area. When there are multiple groups of heat dissipation bodies, the adjacent heat dissipation bodies are connected by connecting file connection.

As a further preference of this technical solution, several partitions are provided on the bottom plate, and the partitions on the bottom plates on both sides are arranged alternately front and back, so that the cooling liquid circulates alternately left and right inside the cooling body, prolonging the cooling time of the cooling liquid in the cooling body. stroke, thereby prolonging the heat exchange time of the coolant and enhancing the heat dissipation effect of the radiator.

As a further preference of this technical solution, U-shaped clamping plates are symmetrically arranged on both sides of the partition, and a clamping groove is formed between the two U-shaped clamping plates. The separator is installed inside the clamping groove. There is a wave-shaped sealing strip, the front end of which extends into the card slot, and the wave-shaped sealing strip forms a multi-stage seal for the partition, which ensures the sealing effect between the partition and the heat dissipation body, and avoids the cross-flow of coolant.

As a further preference of this technical solution, a telescopic sleeve is provided on the outside of the cross bar, and a first adjusting bolt is threaded on the telescopic sleeve to adjust the lateral position of the heat dissipation body. The end of the cross bar is provided with a sleeve, and the sleeve is The sleeve is slidably connected to the longitudinal rod, and a second adjusting bolt is threadedly connected to one side of the sleeve, and the end of the second adjusting bolt abuts against the longitudinal rod for adjusting the height of the cooling body.

As a further preference of the technical solution, the upper end of the longitudinal rod is provided with a limit end plate, which is used to limit the adjustment range of the sleeve and prevent the sleeve from slipping off from the upper end of the longitudinal rod.

As a further optimization of this technical solution, several tube clips are provided on the upper part of the liquid inlet, and the tube clips have a U-shaped structure. The interior of the card enhances the aesthetics of the liquid inlet pipe and prevents the liquid inlet pipe from being placed on the board chip.

As a further optimization of this technical solution, horizontal bars are fixedly connected to both sides of the lower part of the heat dissipation body, and several pin shafts are integrally formed on the horizontal bars, and several air guide plates are arranged between the horizontal bars on both sides. There is a pin hole at the end, and the pin shaft and the pin hole are connected by interference. When the space above the chip is narrow or it is not suitable to install the heat dissipation structure, the heat dissipation mechanism can be installed on one side of the chip, and the angle of the air guide plate can be adjusted to control the chip. Heat dissipation, and the interference fit between the pin shaft and the pin hole avoids the change of the air guide angle when the heat dissipation structure is working, ensuring the heat dissipation effect of the chip.

As a further preference of this technical solution, the upper part of the U-shaped seat is rotatably connected to a fixed shaft, and a number of eccentric wheels are fixedly connected to the fixed shaft, and when the eccentric wheel is pressed against the upper surface of the card, the large The outer edge of the diameter is against the board; the two ends of the fixed shaft are fixedly connected with connecting rods, and the connecting rods on both sides are connected by pressing rods; Lift the pressing rod so that the outer edge of the large diameter of the eccentric wheel is against the board, and the quick installation of the U-shaped seat can be completed.

As a further optimization of this technical solution, the bottom of the U-shaped seat is provided with a buffer pad, and the eccentric wheel is made of plastic, which avoids damage to the board caused by the U-shaped seat and ensures the connection between the U-shaped seat and the board. stability.

As a further optimization of this technical solution, a buckle is provided on one side of the longitudinal rod, and a gap is provided on one side of the buckle, and the pressing rod is lifted and snapped into the inside of the buckle, which further ensures the stability of the connection between the U-shaped seat and the board sex.

The beneficial effects of the present invention are:

1) The present invention couples air cooling and liquid cooling in a heat dissipation structure, and flexibly arranges the heat dissipation structure above the chip required for heat dissipation, effectively solving the heat dissipation problem of the board chip.

2) There are several partitions on the bottom plate, and the partitions on the bottom plates on both sides are arranged in a staggered front and back direction, so that the coolant circulates alternately left and right inside the heat dissipation body, prolonging the stroke of the coolant in the heat dissipation body, thereby prolonging the flow of the coolant. The heat exchange time has enhanced the heat dissipation effect of the radiator.

3) U-shaped clamping plates are arranged symmetrically on both sides of the partition, and a card slot is formed between the two U-shaped clamping plates. The front end extends into the card slot, and the wave-shaped sealing strip forms a multi-stage seal on the partition, which ensures the sealing effect between the partition and the heat dissipation body, and avoids the cross flow of coolant.

4) The outer sleeve of the cross bar is equipped with a telescopic sleeve, and the first adjusting bolt is threaded on the telescopic sleeve to adjust the lateral position of the cooling body. The side thread is connected with a second adjusting bolt, and the end of the second adjusting bolt abuts against the longitudinal rod for adjusting the height of the cooling body.

5) The upper end of the longitudinal rod is provided with a limit end plate, which is used to limit the adjustment range of the sleeve and prevent the sleeve from slipping off from the upper end of the longitudinal rod.

6) There are several pipe clips on the upper part of the liquid inlet. The pipe clip is a U-shaped structure. One side of the pipe clip is fixedly connected with the heat dissipation body. Excellent aesthetics, avoiding the liquid inlet pipe on the board chip.

7) There are horizontal bars fixedly connected to both sides of the lower part of the cooling body, and a number of pin shafts are integrally formed on the horizontal bars. There are several air deflectors between the horizontal bars on both sides, and pin holes are provided at both ends of the air deflectors. Interference connection with the pin hole, when the upper space of the chip is narrow or it is not suitable to install the heat dissipation structure, the heat dissipation mechanism can be installed on one side of the chip, and the angle of the air guide plate can be adjusted to dissipate heat from the chip, and the pin shaft and the pin hole The interference fit avoids the change of the air guide angle when the heat dissipation structure is working, and ensures the heat dissipation effect of the chip.

8) The upper part of the U-shaped seat is rotatably connected to a fixed shaft, and a number of eccentric wheels are fixedly connected to the fixed shaft. Both ends are fixedly connected with connecting rods, and the connecting rods on both sides are connected by pressing rods; when installing this heat dissipation structure, the U-shaped seats on both sides are clamped on the board, and the pressing rods are lifted upwards to make the outer diameter of the eccentric wheel The edge of the board is pressed against the board to complete the quick installation of the U-shaped seat.

9) There is a buffer pad at the bottom of the U-shaped seat, and the eccentric wheel is made of plastic, which avoids damage to the board caused by the U-shaped seat, and at the same time ensures the stability of the connection between the U-shaped seat and the board.

10) There is a buckle on one side of the longitudinal rod, and a notch on one side of the buckle. After the pressing rod is raised, it snaps into the buckle, which further ensures the stability of the connection between the U-shaped seat and the board.

Description of drawings

Accompanying drawing 1 is a schematic diagram of a board chip air-cooled liquid-cooled coupled heat dissipation structure of the present invention.

Accompanying drawing 2 is a bottom view of the heat dissipation body in a board chip air-cooled liquid-cooled coupling heat dissipation structure of the present invention.

Accompanying drawing 3 is a schematic diagram of the structure of the heat dissipation body in the air-cooled liquid-cooled coupled heat dissipation structure of the board chip of the present invention.

Figure 4 is a schematic diagram of the interior of the heat dissipation body in a board chip air-cooled liquid-cooled coupling heat dissipation structure of the present invention.

Accompanying drawing 5 is a partial enlarged view of A in Fig. 4 of a board chip air-cooled liquid-cooled coupling heat dissipation structure of the present invention.

Accompanying drawing 6 is a schematic diagram of the structure of the bottom plate in the air-cooled liquid-cooled coupling heat dissipation structure of the board chip of the present invention.

Figure 7 is a schematic diagram of the connection between the vertical rod and the U-shaped seat in a board chip air-cooled liquid-cooled coupling heat dissipation structure of the present invention.

Figure 8 is a schematic diagram of the structure of the air deflector in the air-cooled liquid-cooled coupling heat dissipation structure of the board chip of the present invention.

Accompanying drawing 9 is a schematic diagram of combined use of a board chip air-cooled liquid-cooled coupling heat dissipation structure of the present invention.

In the figure: 1. Heat dissipation body; 2. Liquid inlet; 3. Liquid outlet; 4. Bottom plate; ;10, sleeve; 11, the second adjusting bolt; 12, limit end plate; 13, U-shaped seat; 14, cooling fan; 15, wind guide plate; 16, pin hole; Shaft; 19, tube clamp; 20, lug; 21, U-shaped clamp plate; 22, sealing strip; 23, buffer pad; 24, eccentric wheel; 25, fixed shaft; 26, connecting rod; 27, pressing rod; 28 , buckle; 29, connector.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings 1-9. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or It should not be construed as limiting the invention by implying that a referenced device or element must have a particular orientation, configuration, and operation in a particular orientation.

As shown in Figures 1-4, a board chip air-cooled liquid-cooled coupling heat dissipation structure includes a heat dissipation body 1, the heat dissipation body 1 is an H-shaped structure, and the heat dissipation body 1 is provided with a number of heat dissipation fins. The heat dissipation body 1 is a hollow profile structure, and the hollow structure extends to the inside of the heat dissipation fins. The lower part of the heat dissipation body 1 is provided with a bottom plate 4; A liquid inlet pipe is connected, and a liquid outlet 3 is provided on the upper left rear of the cooling body 1, and a liquid outlet pipe is connected to the liquid outlet 3, and the liquid inlet pipe and the liquid outlet pipe are connected to a circulation pump (not shown in the figure); One side of the heat dissipation body 1 is provided with a heat dissipation fan 14, and one or two heat dissipation fans 14 are provided. When one heat dissipation fan 14 is provided, it is installed on the upper or lower part of the heat dissipation body 1. When two fans 14 are provided, they are installed symmetrically on both sides of the heat dissipation body 1, and the wind direction of the two heat dissipation fans 14 blows to the chip or away from the chip at the same time; One side is connected with a cross bar 6, and one end of the cross bar 6 is provided with a longitudinal bar 9 connected thereto, and the lower end of the longitudinal bar 9 is provided with a U-shaped seat 13, and the U-shaped seats 13 on both sides are stuck on both sides of the board; the board There are one or more groups of heat dissipation bodies 1 of the chip air-cooled liquid cooling coupling heat dissipation structure according to the heat dissipation area.

As shown in FIG. 6 , in this embodiment, the bottom plate 4 is provided with a plurality of partitions 5 , and the partitions 5 on the bottom plates 4 on both sides are arranged in a staggered front and back direction, so that the cooling liquid circulates alternately left and right inside the heat dissipation body 1 , The stroke of the coolant in the heat dissipation body 1 is extended, thereby prolonging the heat exchange time of the coolant and enhancing the heat dissipation effect of the radiator.

As shown in Figure 4-5, in this embodiment, the two sides of the partition 5 are symmetrically provided with U-shaped clamping plates 21, and a slot is formed between the two U-shaped clamping plates 21, and the partition 5 is installed in the slot Inside, the U-shaped clamping plate 21 is provided with a wave-shaped sealing strip 22, and the front end of the sealing strip 22 extends into the slot. The wave-shaped sealing strip 22 forms a multi-stage seal for the partition 5, ensuring that the partition 5 The sealing effect between the cooling body and the cooling body 1 prevents the coolant from flowing through.

As shown in Figure 1, in this embodiment, the outer part of the crossbar 6 is provided with a telescopic sleeve 7, and the telescopic sleeve 7 is threaded with a first adjusting bolt 8 for adjusting the lateral position of the heat dissipation body 1. The end of the cross bar 6 is provided with a sleeve 10, and the sleeve 10 is slidingly connected with the longitudinal bar 9. One side of the sleeve 10 is threaded with a second adjusting bolt 11, and the end of the second adjusting bolt 11 is offset against the longitudinal bar 9. For adjusting the height of the cooling body 1 .

As shown in FIG. 7 , in this embodiment, the upper end of the longitudinal rod 9 is provided with a limiting end plate 12 for limiting the adjustment range of the sleeve 10 and preventing the sleeve 10 from slipping off from the upper end of the longitudinal rod 9 .

As shown in Figure 3, in this embodiment, the upper part of the liquid inlet 2 is provided with several tube clips 19, the tube clips 19 are U-shaped structures, one side of the tube clips 19 is fixedly connected with the cooling body 1, and the liquid inlet pipe After being connected with the liquid inlet 2, it is stuck inside the pipe card 19, which enhances the aesthetics of the liquid inlet pipe and prevents the liquid inlet pipe from being placed on the board chip.

As shown in Figure 2-3 and Figure 8, in this embodiment, horizontal bars 17 are fixedly connected to both sides of the lower part of the heat dissipation body 1, and several pin shafts 18 are integrally formed on the horizontal bar 17, and the horizontal bars 17 on both sides There are several air deflectors 15 between them, the two ends of the air deflectors 15 are provided with pin holes 16, and the pin shafts 18 are in interference connection with the pin holes 16. When the upper space of the chip is narrow or it is not suitable for installing a heat dissipation structure, this The heat dissipation mechanism is installed on one side of the chip, and the angle of the air deflector 15 is adjusted to dissipate heat from the chip, and the interference fit between the pin shaft 18 and the pin hole 16 avoids the change of the air guide angle when the heat dissipation structure is working, ensuring the stability of the chip. heat radiation.

As shown in Figure 7, in this embodiment, the upper part of the U-shaped seat 13 is rotatably connected with a fixed shaft 25, and a plurality of eccentric wheels 24 are fixedly connected to the fixed shaft 25, and when the eccentric wheel 24 is connected to the board When the surface is pressed tightly, the large-diameter outer edge of the eccentric wheel 24 is in contact with the board; the two ends of the fixed shaft 25 are fixedly connected with connecting rods 26, and the connecting rods 26 on both sides are connected by pressing rods 27; when the heat dissipation structure is installed, Clamp the U-shaped seats 13 on both sides on the board, lift the pressing rod 27 upwards, and make the large-diameter outer edge of the eccentric wheel 24 resist the board, and the quick installation of the U-shaped seats 13 can be completed.

As shown in Figure 7, in this embodiment, the bottom of the U-shaped seat 13 is provided with a buffer pad 23, and the eccentric wheel 24 is made of plastic, which avoids damage to the board caused by the U-shaped seat 13, and at the same time ensures The stability that U-shaped seat 13 is connected with board card.

As shown in Figure 7, in this embodiment, the side of the longitudinal rod 9 is provided with a buckle 28, and one side of the buckle 28 is provided with a gap, and the pressing rod 27 is lifted and snapped into the inside of the buckle 28, which further ensures The stability that U-shaped seat 13 is connected with board card.

When in use, determine the installation position of the U-shaped seat 13 according to the position of the required heat dissipation chip, after the U-shaped seat 13 is clamped on both sides of the board, lift the pressing rod 27 upwards and snap the pressing rod 27 into the inside of the buckle 28, Complete the fixing of the U-shaped seat 13 and the longitudinal bar 9, then adjust the height of the cross bar 6 according to the height of the chip, and adjust the position of the heat dissipation body 1 on the cross bar 6 according to the position of the chip; the cooling liquid performs heat exchange on the heat dissipation body 1 , when the wind direction of the heat dissipation fan 14 blows to the chip, the cold wind around the heat dissipation body 1 is used as the wind source, which effectively reduces the temperature of the air and ensures the heat dissipation effect of the chip; when the wind direction of the heat dissipation fan 14 deviates from the chip, the The heat is drained by the heat dissipation fan 14 to the heat dissipation body 1 for rapid cooling. In addition, the side wall of the H-shaped heat dissipation body 1 also has a heat dissipation effect on the chip, ensuring the heat dissipation effect of the chip. When the space above the chip is narrow or it is not suitable to install the heat dissipation structure, install the heat dissipation mechanism on one side of the chip, and adjust the angle of the air deflector 15 to dissipate heat from the chip, and the interference fit between the pin shaft 18 and the pin hole 16 is avoided. When the heat dissipation structure is working, the air guide angle changes to ensure the heat dissipation effect of the chip.

The above content is only an example and description of the structure of the present invention. Those skilled in the art make various modifications or supplements to the described specific embodiments or replace them in similar ways, as long as they do not deviate from the structure of the invention. Or beyond the scope defined in the claims, all should belong to the protection scope of the present invention.

Claims (10)

1. A board chip air-cooled liquid-cooled coupling heat dissipation structure, comprising a heat dissipation body, characterized in that, the heat dissipation body is an H-shaped structure, and the heat dissipation body is provided with some heat dissipation fins, and the heat dissipation body is hollow The profile structure, the hollow structure extends to the inside of the heat dissipation fins, the lower part of the heat dissipation body is provided with a bottom plate; There is a liquid outlet, and a liquid outlet pipe is connected to the liquid outlet, and the liquid inlet pipe and the liquid outlet pipe are connected to the circulation pump; one side of the heat dissipation body is provided with a cooling fan, one or two cooling fans are provided, and the cooling fan is provided with When there is one cooling fan, it is installed on the upper or lower part of the cooling body, and the wind direction blows toward the chip or away from the chip. When there are two cooling fans, they are installed symmetrically on both sides of the cooling body. Away from the chip; there are lugs on both sides of the heat dissipation body, one side of the lugs is connected to a cross bar, one end of the cross bar is connected to a vertical bar, the lower end of the vertical bar is provided with a U-shaped seat, and the U-shaped seat clips on both sides On both sides of the board; the heat dissipation body of the board chip air-cooled liquid-cooled coupling heat dissipation structure is provided with one or more groups according to the heat dissipation area. When there are multiple groups of heat dissipation bodies, the adjacent heat dissipation bodies are connected by connecting pieces connect. 2. A kind of air-cooled liquid-cooled coupling heat dissipation structure for board and chip according to claim 1, characterized in that, several partitions are arranged on the bottom plate, and the partitions on the bottom plates on both sides are arranged in a staggered front and rear, so that the cooling The liquid circulates alternately left and right inside the cooling body. 3. The air-cooled and liquid-cooled coupling heat dissipation structure of a card chip according to claim 2, characterized in that, U-shaped card boards are symmetrically arranged on both sides of the partition, and a card board is formed between the two U-shaped card boards. The slot and the partition are installed inside the slot. A wave-shaped sealing strip is provided inside the U-shaped clamp. The front end of the sealing strip extends into the slot. The wave-shaped sealing strip forms a multi-stage seal for the partition. 4. The air-cooled and liquid-cooled coupled heat dissipation structure for board and chip according to claim 1, wherein a telescopic sleeve is provided on the outside of the cross bar, and a first adjusting bolt is threaded on the telescopic sleeve. A sleeve is provided at the end of the cross bar, and the sleeve is slidingly connected with the longitudinal bar. One side of the sleeve is threaded with a second adjusting bolt, and the end of the second adjusting bolt is offset against the longitudinal bar. 5 . The board chip air-cooled liquid-cooled coupling heat dissipation structure according to claim 4 , wherein the upper end of the longitudinal rod is provided with a limiting end plate. 5 . 6. A kind of air-cooled liquid-cooled coupled heat dissipation structure for board and chip according to claim 1, characterized in that, the upper part of the liquid inlet is provided with several tube clamps, the tube clamps are in a U-shaped structure, and one side of the tube clamps It is fixedly connected with the heat dissipation body, and the liquid inlet pipe is connected to the liquid inlet and then stuck inside the pipe card. 7. A board chip air-cooled liquid-cooled coupling heat dissipation structure according to claim 1, characterized in that horizontal bars are fixedly connected to both sides of the lower part of the heat dissipation body, and several pin shafts are integrally formed on the horizontal bars, and the two sides There are several air deflectors between the horizontal bars on the side. The two ends of the air deflectors are provided with pin holes, and the pin shafts are connected with the pin holes. Install it on one side of the chip, and adjust the angle of the air deflector to dissipate heat from the chip. 8. A board chip air-cooled liquid-cooled coupling heat dissipation structure according to any one of claims 1-7, characterized in that the upper part of the U-shaped seat is rotatably connected to a fixed shaft, and on the fixed shaft A number of eccentric wheels are fixedly connected, and when the eccentric wheel is pressed against the upper surface of the board, the outer edge of the large diameter of the eccentric wheel is against the board; both ends of the fixed shaft are fixedly connected with connecting rods, and the connecting rods on both sides pass through Press the lever to connect. 9 . The board chip air-cooled liquid-cooled coupling heat dissipation structure according to claim 8 , wherein a buffer pad is provided at the bottom of the U-shaped seat, and the eccentric wheel is made of plastic. 10. The board chip air-cooled liquid-cooled coupling heat dissipation structure according to claim 8, characterized in that a buckle is provided on one side of the longitudinal rod, and a notch is provided on one side of the buckle, after the pressing rod is lifted Snap inside the clasp.

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