CN215299281U

CN215299281U - LED multilayer dispensing packaging structure

Info

Publication number: CN215299281U
Application number: CN202121281853.9U
Authority: CN
Inventors: 陈卓然
Original assignee: Chongqing Xianguang Lighting Technology Co ltd
Current assignee: Chongqing Xianguang Lighting Technology Co ltd
Priority date: 2021-06-09
Filing date: 2021-06-09
Publication date: 2021-12-24
Anticipated expiration: 2031-06-09

Abstract

The utility model discloses a packaging structure is glued to emitting diode multilayer point, which comprises a pin, the last fixed surface of pin is connected with the connector, the surface sliding connection of connector has the encapsulation piece, the inside of encapsulation piece is provided with the connecting block, the right fixed surface of connecting block is connected with the lead wire, the one end fixedly connected with diode of connecting block is kept away from to the lead wire, the last sliding surface of encapsulation piece is connected with the light modulation piece, the lower fixed surface of light modulation piece is connected with the connecting rod. The utility model discloses, through design connector and pin, realize changing when the pin fracture, can carry out the quick replacement diode when the diode damages, need not to weld again, through design connecting rod, light modulation piece, realize changing the illumination region of diode, reach the purpose of adjusting luminance to the diode.

Description

LED multilayer dispensing packaging structure

Technical Field

The utility model relates to a diode field especially relates to a packaging structure is glued to emitting diode multilayer point.

Background

The packaging of the light emitting diode is the packaging of a light emitting chip, which is greatly different from the packaging of an integrated circuit, and the packaging of the light emitting diode not only requires the protection of a lamp wick, but also requires the sufficient light transmittance. The LED packaging mode is diversified according to the functions of actual application occasions, different appearance dimensions, heat dissipation plans, light emission and the like. TOP-LED and Side-LED are suitable for dispensing packaging. The dispensing package has high requirements on the operation level, and the main difficulty is the control of the dispensing amount because epoxy becomes thick in the using process.

1. When the pins of the traditional LED multilayer dispensing packaging structure are damaged, the LED can be damaged and cannot be used;

2. the prior LED multilayer dispensing packaging structure has the defect that once the LED is packaged, the shape of the outer side of the LED cannot be changed, so that the irradiation area of the LED cannot be changed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a light-emitting diode multilayer dispensing packaging structure.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a packaging structure is glued to emitting diode multilayer point, includes the pin, the last fixed surface of pin is connected with the connector, the surface sliding connection of connector has the encapsulation piece, the inside of encapsulation piece is provided with the connecting block, the right fixed surface of connecting block is connected with the lead wire, the one end fixedly connected with diode of connecting block is kept away from to the lead wire, the last fixed surface of encapsulation piece sliding connection has the light modulation piece, the lower fixed surface of light modulation piece is connected with the connecting rod.

As a further description of the above technical solution:

the pin, the connector and the lead are all made of metal materials.

As a further description of the above technical solution:

the number of the connectors is two and the connectors are arranged in a bilateral symmetry mode.

As a further description of the above technical solution:

and a certain damping is arranged between the connector and the packaging block.

As a further description of the above technical solution:

and a damping is arranged between the connecting rod and the packaging block.

As a further description of the above technical solution:

the connecting block is contacted with the connecting head.

As a further description of the above technical solution:

and the right surface of the diode is fixedly connected with the lead.

As a further description of the above technical solution:

the number of the connecting rods is multiple, and the connecting rods extend to the inner part of the packaging block.

The utility model discloses following beneficial effect has:

1. compared with the prior art, this packaging structure is glued to emitting diode multilayer point through design connector and pin, realizes can changing when the pin fracture, can carry out quick replacement diode when the diode damages, need not to weld again.

2. Compared with the prior art, the LED multilayer dispensing packaging structure realizes the change of the illumination area of the diode through the design of the connecting rod and the light adjusting block, and achieves the purpose of adjusting the light of the diode.

Drawings

Fig. 1 is a schematic view of an internal structure of a multi-layer dispensing package structure of a light emitting diode according to the present invention;

FIG. 2 is an enlarged view of the structure at A in FIG. 1;

fig. 3 is a bottom view of the multi-layer dispensing package structure of the light emitting diode of the present invention;

fig. 4 is a schematic view of an overall structure of a multi-layer dispensing package structure of a light emitting diode according to the present invention.

Illustration of the drawings:

1. a pin; 2. a connector; 3. connecting blocks; 4. a light adjusting block; 5. packaging the block; 6. a lead wire; 7. a connecting rod; 8. and a diode.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the utility model provides a packaging structure is glued to emitting diode multilayer point: the LED packaging structure comprises a pin 1, wherein the upper surface of the pin 1 is fixedly connected with a connector 2, the connector 2 is used for connection, the number of the connectors 2 is two, the connectors 2 are arranged symmetrically left and right, a certain damping is arranged between the connectors 2 and a packaging block 5, the outer surface of the connector 2 is connected with the packaging block 5 in a sliding manner, the packaging block 5 is used for protecting the inside, the inside of the packaging block 5 is provided with a connecting block 3, the connecting block 3 is in contact with the connector 2, the right surface of the connecting block 3 is fixedly connected with a lead 6, the lead 6 is used for conducting electricity, the pin 1, the connector 2 and the lead 6 are all made of metal materials, one end of the lead 6, which is far away from the connecting block 3, is fixedly connected with a diode 8, the right surface of the diode 8 is fixedly connected with the lead 6, the upper surface of the packaging block 5 is connected with a light modulation block 4 in a sliding manner, the region for light modulation block 4 is changed, and the lower surface of the light modulation block 4 is fixedly connected with a connecting rod 7, damping is arranged between the connecting rods 7 and the packaging blocks 5, the number of the connecting rods 7 is multiple, and the connecting rods 7 extend to the inside of the packaging blocks 5.

The working principle is as follows: will have the connector 2 of pin 1 to insert the inside of encapsulation piece 5, when pin 1 damages, directly change connector 2, avoid whole device can't use, with the position of pin 1 welding in needs, when diode 8 damages, can directly change encapsulation piece 5, avoid needing to weld again, change diode 8's irradiation range as needs, insert the inside of encapsulation piece 5 with light modulation piece 4, can change the illumination range.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a packaging structure is glued to emitting diode multilayer point, includes pin (1), its characterized in that: the last fixed surface of pin (1) is connected with connector (2), the surface sliding connection of connector (2) has encapsulation piece (5), the inside of encapsulation piece (5) is provided with connecting block (3), the right fixed surface of connecting block (3) is connected with lead wire (6), the one end fixedly connected with diode (8) of connecting block (3) are kept away from in lead wire (6), the last fixed surface sliding connection of encapsulation piece (5) has light modulation piece (4), the lower fixed surface of light modulation piece (4) is connected with connecting rod (7).

2. The led multilayer dispensing package structure of claim 1, wherein: the pin (1), the connector (2) and the lead (6) are all made of metal materials.

3. The led multilayer dispensing package structure of claim 1, wherein: the number of the connectors (2) is two and the connectors are arranged in a bilateral symmetry mode.

4. The led multilayer dispensing package structure of claim 1, wherein: and a certain damping is arranged between the connector (2) and the packaging block (5).

5. The led multilayer dispensing package structure of claim 1, wherein: and a damper is arranged between the connecting rod (7) and the packaging block (5).

6. The led multilayer dispensing package structure of claim 1, wherein: the connecting block (3) is in contact with the connector (2).

7. The led multilayer dispensing package structure of claim 1, wherein: the right surface of the diode (8) is fixedly connected with the lead (6).

8. The led multilayer dispensing package structure of claim 1, wherein: the number of the connecting rods (7) is multiple, and the connecting rods (7) extend to the inner part of the packaging block (5).