CN215264679U - Radiator with flat heat pipe and coolant plate composite structure - Google Patents
Radiator with flat heat pipe and coolant plate composite structure Download PDFInfo
- Publication number
- CN215264679U CN215264679U CN202120943152.0U CN202120943152U CN215264679U CN 215264679 U CN215264679 U CN 215264679U CN 202120943152 U CN202120943152 U CN 202120943152U CN 215264679 U CN215264679 U CN 215264679U
- Authority
- CN
- China
- Prior art keywords
- plate
- heat pipe
- liquid
- layer
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002826 coolant Substances 0.000 title claims abstract description 52
- 239000002131 composite material Substances 0.000 title claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 86
- 239000000110 cooling liquid Substances 0.000 claims abstract description 74
- 238000010276 construction Methods 0.000 claims abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 22
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 2
- 230000008676 import Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 15
- 230000010354 integration Effects 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract 2
- 238000011065 in-situ storage Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 73
- 238000012546 transfer Methods 0.000 description 31
- 230000017525 heat dissipation Effects 0.000 description 18
- 230000000694 effects Effects 0.000 description 9
- 229910000838 Al alloy Inorganic materials 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 229920006268 silicone film Polymers 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004663 powder metallurgy Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a radiator technical field, concretely relates to radiator with dull and stereotyped heat pipe and coolant liquid board composite construction, radiator include the base plate, the base plate includes cold liquid plate layer and sets up in the flat heat pipe layer of the up end of cold liquid plate layer and/or terminal surface down, the cold liquid plate is provided with the coolant liquid runner in situ. The radiator can realize the integration of the flat heat pipe and the cooling liquid plate, the flat heat pipe is in contact with the heating element and conducts heat, the cooling liquid in the cooling liquid plate takes away heat, the heat radiation performance is good, and the radiator is suitable for the heat radiation of electronic heating elements, particularly electronic elements which are ultrahigh in power density and are densely arranged.
Description
Technical Field
The utility model relates to a radiator technical field, concretely relates to radiator with dull and stereotyped heat pipe and coolant liquid board composite construction.
Background
The heat productivity of modern electronic chips represented by CPUs increases rapidly due to the continuous improvement of integration level, packaging density and working clock frequency, and if the heat dissipation and temperature control cannot be effectively realized, the chips are inevitably failed or collapsed due to high temperature. Research literature indicates that in some sensitive temperature ranges, the system reliability decreases by 50% for every 10 ℃ increase in the temperature of an individual semiconductor component. Aiming at the characteristics of heat dissipation of a CPU of a large-scale computer server, the heat dissipation effect can be effectively improved by optimizing the heat transfer structure of the heat radiator and improving the surface heat transfer coefficient of the heat dissipation fins, and if the heat pipe is embedded in the bottom surface of the heat radiator to carry out enhanced heat exchange through phase change, the efficiency can be improved on the basis of the original heat dissipation area. The principle is that heat generated by a high heat flow density device is conducted to a heat pipe, so that working media in the heat pipe are subjected to phase change to transfer the heat to a bottom plate, and then the heat is dissipated through forced convection of fins and air. The heat pipes are embedded in the bottom surface of the radiator in various arrangement modes, and the purpose is to enable the high heat flow density device to be in large-area contact with the evaporation section of the heat pipes as much as possible. However, the power density of the single CPU of today's supercomputers is already as high as 20W/cm2And a huge amount of heat energy must be timely removed from the CPU and the cabinet to ensure the normal work of the supercomputing center. The problem of dissipating the heat of the CPU into the air by using a fin heat exchanger has not been solved. This presents a serious challenge to the technology of heat dissipation and temperature control. At present, a liquid cooling mode is mainly adopted for heat dissipation of an ultra-computation CPU and a large-scale data center, namely heat is transported to the outdoor by cooling liquid, the liquid cooling mode comprises cold liquid plate type heat dissipation and immersed type heat dissipation, and the two modes respectively have advantages and disadvantages. The cold liquid plate is in contact with the surface of the CPU, and the cooling liquid flows inside the cold liquid plate and takes away heat. The cold liquid plate type heat dissipation facilitates debugging and maintenance of the system (after all, a large amount of debugging and maintenance is inevitable for exceeding the requirement), but the heat dissipation effect of the cold liquid plate is inferior to that of the immersion type heat dissipation. Although the latter has good heat dissipation and temperature control effects, the whole main board is immersed in the cooling liquid, and high requirements are put on the cooling liquid. The prior high-performance fluoridizing liquid is mainly adoptedBut are expensive and inconvenient for system debugging and maintenance.
As shown in fig. 1-2, the heat transfer between the heat generating device (heat source, e.g., CPU) and the cooling fluid (heat sink) of the prior art cooling fluid plate is analyzed as follows: the heat Q generated by the CPU passes through the heat-conducting glue layer, then flows from the heat-conducting glue layer (silicone film) to the cooling liquid plate (comprising an upper cooling liquid plate and a lower cooling liquid plate), and then flows from the cooling liquid plate to the cooling liquid, wherein the cooling liquid plate is an aluminum plate.
The overall heat transfer coefficient U can be expressed as:
where U is the total heat transfer coefficient, δ1The thickness of the silicone grease film (10 μm-10 × 10)-6m)，λ1Is the thermal conductivity coefficient (5 Wm) of silicone grease-1K-1)，δ2Is made of aluminum plate (2mm 2 × 10)-3m)，λ2Thermal conductivity coefficient (237 Wm) of aluminum plate-1K-1)。h3Is the film heat transfer coefficient of the cooling liquid on the inner surface of the flow channel of the aluminum plate. Let the heat transfer area be the area A of the CPU 5X 5 25cm2＝25×10-4m2. Total heat transfer resistance 1/(UA), silicone grease film thermal resistance R1Thermal resistance R of aluminum plate2Thermal resistance R of cooling liquid heat transfer film (heat transfer boundary layer)3And (4) summing.
(1) Thermal resistance (R) of silicone film1) Thickness of silicone film delta1＝10μm＝10×10-6m, coefficient of thermal conductivity lambda1＝5W·m-1·K-1
(2) Thermal resistance (R) of aluminum plate2) Thickness of aluminum plate22mm, coefficient of thermal conductivity lambda2＝237W·m-1·K-1
(3) Liquid film heat transfer resistance (R) of cooling liquid3)，
Assuming that the flow velocity of the coolant in the flow path is 0.5 m.s-1The liquid film heat transfer coefficient can be calculated by the following equation. The calculation is omitted.
h3≈5000W·m-2·K-1
Thus, the total thermal resistance from the heat source to the heat sink is
R＝R1+R2+R3＝0.0008+0.0034+0.08＝0.0842K·W-1
According to the above calculation, the heat transfer resistance of the cooling liquid film is that of the aluminum plate (R)3/R2) Nearly 24 times that of silicone film (R)3/R1)100 times, the main heat transfer resistance comes from the heat transfer liquid film between the cooling liquid and the aluminum plate. Therefore, to enhance the heat dissipation effect of the cold liquid plate, it is critical to enhance the heat transfer between the cold liquid and the cold liquid plate. The turbulence intensity between the cooling liquid and the cold liquid plate can be enhanced by increasing the turbulence intensity of the cooling liquid, however, increasing the turbulence intensity means increasing the flow speed of the cooling liquid, which is extremely disadvantageous for large-scale cluster-type use (such as super-calculation) of the CPU. For example, 1 CPU increases the coolant flow rate by 1 time, and for an overcount of 1 cabinet, there are hundreds or thousands of CPUs, which means that the coolant flow is multiplied by hundreds or thousands!
Disclosure of Invention
In order to overcome the shortcoming and the not enough that exist among the prior art, the utility model aims to provide a radiator with dull and stereotyped heat pipe and coolant liquid board composite construction, this radiator can realize dull and stereotyped heat pipe and coolant liquid board integration, dull and stereotyped heat pipe and heating element contact and pass through the conduction heat transfer, take away the heat by the coolant liquid in the coolant liquid board, and heat dispersion is good, can be used to super high power density and the electronic component of intensive arrangement.
Another object of the utility model is to provide a manufacturing method of radiator with dull and stereotyped heat pipe and coolant liquid board composite construction, this method easy operation, control is convenient, and production efficiency is high, can be used to large-scale production, and the radiator product quality of production is stable, and long service life has good heat dispersion.
The purpose of the utility model is realized through the following technical scheme: a radiator with a composite structure of a flat heat pipe and a cooling liquid plate comprises a substrate, wherein the substrate comprises a cooling liquid plate layer and a flat heat pipe layer arranged on the upper end surface and/or the lower end surface of the cooling liquid plate layer, and a cooling liquid flow channel is arranged in the cooling liquid plate layer;
furthermore, a plurality of parallel arranged holes are arranged in the flat-plate type heat pipe layer.
Furthermore, the inner wall of the row of holes is provided with a porous medium layer.
Furthermore, sealed end caps are arranged at two ends of the hole arrangement channel and used for sealing two ends of the hole arrangement channel.
Furthermore, a plurality of cooling liquid flow channels arranged in parallel are arranged in the cooling liquid plate layer, and the row holes are arranged in parallel with the cooling liquid flow channels.
Furthermore, both ends of the cold liquid plate layer are provided with end covers, and the end covers are provided with a cooling liquid inlet and a cooling liquid outlet.
Further, the substrate is an aluminum substrate, and the cold liquid plate layer and the flat plate type heat pipe layer are integrally formed.
Further, a radiating fin is arranged in the cooling liquid flow channel.
Furthermore, the substrate comprises a cold liquid plate layer and a flat plate type heat pipe layer arranged on the lower end face of the cold liquid plate layer.
Furthermore, the upper end surface and the lower end surface of the cold liquid plate layer are both provided with flat plate type hot tube layers.
The utility model has the advantages that: the utility model discloses a radiator with dull and stereotyped heat pipe and coolant liquid board composite construction, this radiator can realize dull and stereotyped heat pipe and coolant liquid board integration, dull and stereotyped heat pipe and heating element contact and pass through the conduction heat transfer, take away the heat by the coolant liquid in the coolant liquid board, and heat dispersion is good, applicable in electron heating element especially super high power density and the intensive heat dissipation of arranging's electronic component.
Drawings
FIG. 1 is a cross-sectional side view of a prior art coolant plate;
FIG. 2 is a sectional top view taken along A-A of FIG. 1;
FIG. 3 is a cross-section of a substrate of example 1;
FIG. 4 is a schematic view of the aluminum powder of example 1 filled into a flat heat pipe array hole;
fig. 5 is a sectional side view of the heat sink of embodiment 1;
fig. 6 is a top view of the heat sink of embodiment 1;
FIG. 7 is a schematic cross-sectional view of example 1;
FIG. 8 is a cross section of a substrate of example 2;
FIG. 9 is an enlarged view of a section of the flat tube layer and the coolant plate layer of example 2;
the reference signs are: 11. a cold liquid feeding plate; 12. a lower cold liquid plate; 13. a cold liquid chamber; 14. fixing the bolt; 15. a heating element; 16. a heat-conducting adhesive layer; 17. a coolant flow passage; 18. a flat plate heat pipe layer; 19. an end cap; 20. a substrate; 21. inserting a pin; 22. arranging holes; 23. a heat dissipating fin; 24. a condensation zone; 25. an evaporation zone; 26. a porous dielectric layer; 27. a steam channel; 28. and (6) sealing the plug.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying drawings, which are not intended to limit the present invention.
Example 1
As shown in fig. 3 to 7, a heat sink with a composite structure of flat heat pipes and a coolant plate includes a substrate 20, where the substrate 20 includes a cold plate layer and two flat heat pipe layers 18 disposed on an upper end surface and a lower end surface of the cold plate layer, and a coolant flow channel 17 is disposed in the cold plate layer. The flat heat pipe layer 18 is used for contacting with an electronic component, such as a CPU or other electronic components, to dissipate heat of the electronic component.
Further, the substrate 20 is an aluminum substrate 20, and the cold liquid plate layer and the flat plate type heat pipe layer 18 are integrally formed. The radiator is a composite radiator with a composite structure of flat heat pipes and a cooling liquid plate, and a cooling liquid plate layer provided with the cooling liquid plate and a flat heat pipe layer 18 provided with the flat heat pipes are integrally arranged.
Further, a plurality of parallel arranged rows of holes 22 are arranged in the flat plate heat pipe layer 18. The inner wall of the row of holes 22 is provided with a porous medium layer 26. Due to the arrangement of the structure, a plurality of flat heat pipes distributed in parallel are formed in the flat heat pipe layer 18. The porous medium layer 26 is a thin layer which is attached to the inner wall surface of the row hole 22, is made of porous medium and has a capillary action. The thickness of the porous medium layer 26 is 0.5-1 mm.
Furthermore, both ends of the hole row 22 are provided with a sealing plug 28, and the sealing plugs 28 are used for sealing both ends of the hole row 22. The discharge holes 22 are used for containing low boiling point working medium, preferably but not limited to acetone and R134 a. And the cooling liquid flow channel 17 is internally provided with a radiating fin 23, so that the radiating effect is enhanced.
As shown in fig. 1-2, the cooling liquid plate in the prior art includes an upper cooling liquid plate 11 and a lower cooling liquid plate 12, where the upper cooling liquid plate 11 and the lower cooling liquid plate 12 are fixed by a fixing bolt 14, and a cooling liquid cavity 13 and a cooling liquid flow channel 17 are formed between the upper cooling liquid plate 11 and the lower cooling liquid plate. The heat transfer analysis of the coolant plate in use was as follows: the heat Q generated by the heating element 15 (e.g., CPU) passes through the thermal conductive adhesive layer 16, then from the thermal conductive adhesive layer 16 (silicone film) to the coolant plate (including the upper coolant plate 11 and the lower coolant plate 12), and then from the coolant plate to the coolant, where the coolant plate is an aluminum plate and the thermal conductive adhesive layer 16 is a silicone film. The heat dissipation effect of the above-mentioned liquid cooling plate needs to be improved.
The utility model combines a flat heat pipe and a cold liquidThe integrated radiator of the board is used for the temperature control of electronic elements with ultrahigh power density and densely arranged, such as a CPU (central processing unit) and a circuit board of a super-computation center cabinet. The effective heat transfer area of the cooling liquid and the cold liquid plate is increased, and the heat transfer and heat dissipation effects of the cold liquid plate are improved. The solution of integrating the flat-plate heat pipe and the cooling liquid plate is provided. Theoretically estimated that the heat transfer resistance can be reduced to 0.01 K.W under the condition of greatly reducing the flow rate of the cooling liquid-1Nearby. Can ensure the heat transmission density to be as high as 70W-cm-2。
Calculation of the mass flow rate of water: the heat generated by a CPU is 500W (500J/s), which must be equal to the heat carried away by the flowing water, in order to stabilize the temperature of the CPU from rising.
Wherein Q is the heating power of the CPU,
is the mass flow rate of water, cpThe specific heat capacity of water (═ 4.2J · g)-1·K-1) The above calculations show that a mass flow rate of 24 grams per second of cooling water will meet the CPU temperature control requirements.
The cross-sectional area of the coolant flow path 17 of the cold plate is assumed to be 5cm from 10cm × 0.5cm2The flow rate of the cooling water required is
Wherein ρ is the density of cooling water (1 g. cm)-3) And S is the cross-sectional area (5 cm) of the cooling liquid flow passage 17 of the cold liquid plate2). It can be seen that in this range of flow rates, the flow is laminar. The low flow rate can effectively reduce the energy consumption required for pumping cooling water.
In this embodiment, the heat sink has three layers, the uppermost layer and the lowermost layer are both flat heat pipe layers 18, the flat heat pipe layers 18 are provided with a plurality of rows of holes 22, porous medium layers 26 are arranged in the rows of holes 22, the porous medium layers 26 form liquid absorption cores arranged in the rows of holes 22, and the flat heat pipe layers 18 contact with the electronic heating element 15 (such as a CPU) to transfer heat generated by the electronic heating element; the other layer is a cooling liquid channel 17 with a built-in radiating fin 23 structure, and the heat transmitted by the flat heat pipe is taken away by the cooling liquid. The composite radiator is made of metal with good heat conductivity (such as aluminum or aluminum alloy).
Further, a plurality of cooling liquid flow channels 17 arranged in parallel are arranged in the cooling liquid plate layer, and the row holes 22 are arranged in parallel with the cooling liquid flow channels 17. Both ends of the cold liquid plate layer are provided with end covers 19, the end covers 19 are provided with a cooling liquid inlet and a cooling liquid outlet, and a distributor is arranged in the cooling liquid inlet.
The cold liquid plate layer of the present embodiment is set as an intermediate layer, the cold liquid plate layer is provided with a plurality of parallel coolant flow subchambers, and a plurality of coolant flow channels 17 are formed, wherein the cold liquid plate layer plays a role equivalent to the heat dissipation fins 23, and covers the whole area where the flat plate type heat pipe is located, i.e. the effective heat transfer area of the cold liquid plate to the coolant is enlarged. As shown in fig. 6 and 7. The radiator is provided at both ends with end caps 19 and liquid inlet and outlet ports for the inflow and outflow of the cooling liquid, and the cooling liquid is uniformly distributed to the cooling liquid flow passage 17 by the distributor.
The porous medium layer 26 of the present invention is made of aluminum powder or aluminum alloy powder through a powder metallurgy sintering process. During manufacturing, a contact pin 21 is inserted into the center of each row hole 22 along the axial direction, and the cross section area of each contact pin 21 is set to be a gap of 0.5-1mm with the inner wall surface of each row hole 22; vertically placing the aluminum substrate 20 inserted with the pins 21, and filling the aluminum powder or the aluminum alloy powder into the rest gap of each row of holes 22; the width of the gap is preferably 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1 mm; as shown in fig. 4, the particulate matter in fig. 4 is aluminum powder or aluminum alloy powder, and sintering aids, such as tin powder and magnesium powder, may be added to the aluminum powder or aluminum alloy powder, or no sintering aid is added to the aluminum powder or aluminum alloy powder; the insertion pin 21 is a square pin or a cylindrical pin with a circular section. Further, the porosity of the porous medium layer 26 is 40-50%.
Example 2
The present embodiment is different from embodiment 1 in that: as shown in fig. 8-9, a heat sink with a composite structure of flat heat pipes and a coolant plate includes a substrate 20, where the substrate 20 includes a cold plate layer and a flat heat pipe layer 18 disposed on a lower end surface of the cold plate layer, and a coolant flow channel 17 is disposed in the cold plate layer. In this embodiment, the heat sink is provided with two layers, one layer is a flat heat pipe layer 18, the flat heat pipe layer 18 is provided with a plurality of rows of holes 22, porous medium layers 26 are arranged in the rows of holes 22, the porous medium layers 26 form liquid absorption cores arranged in the rows of holes 22, and the flat heat pipe layer 18 contacts with the electronic heating element 15 (such as a CPU) to transfer heat generated by the electronic heating element; the other layer is a cooling liquid channel 17 with a radiating fin 23 structure, and the heat transmitted by the flat heat pipe is taken away by the cooling liquid. The composite radiator is made of metal with good heat conductivity (such as aluminum or aluminum alloy).
The utility model discloses a when the radiator uses, the theory of operation as follows:
taking a two-layer structure of the heat sink as an example, as shown in fig. 9; the substrate 20 is an aluminum substrate 20, a layer of aluminum-based powder metallurgy sintered porous medium is attached to the inner wall of the row holes 22 of the aluminum-based flat plate type heat pipe layer 18 to form a porous medium layer 26, and a steam channel 27 is formed in the middle of the pipeline of the row holes 22. The aluminum-based powder metallurgy sintered porous medium layer 26 is also called a liquid absorption core, and inner pore channels thereof are connected with each other; the heat pipe contains working medium with low boiling point, and the inside of the pipe is in a negative pressure state. When the heat pipe works, at the position of a heat source, the working medium is evaporated and boiled, absorbs latent heat of evaporation and flows to the cold end along the steam channel 27. The steam is condensed and separated out at the cold end, and the latent heat of condensation is released; and then quickly returns to the location of the heat source by capillary action of the wick. The heat sink forms a condensation zone 24 and an evaporation zone 25. The heat quantity and the speed thereof transported by the evaporation and condensation of the working medium enable the heat pipe to have the heat conductivity coefficient which is more than 10 times higher than that of a homogeneous metal conductor. The temperature difference between the heat pipe and the heat source (evaporation end) is less than 0.1K, namely the whole flat heat pipe has excellent temperature uniformity.
Since the flat heat pipes are integrally connected with the cold liquid plate, for the cooling liquid (i.e. the cold source), this characteristic causes the heat transfer area from the high-temperature heat source to the low-temperature heat source to extend from the position of the CPU (i.e. the dashed square in fig. 6) to the position of the whole flat heat pipe, as shown in fig. 6 (the cross-sectional side view of the heat sink with the three-layer structure) and fig. 6.
Generally, a hollow heat pipe without a wick must be inclined at a certain angle when in use. The heat source is arranged at the lower end, and the cold source is arranged at the upper end. The condensed wages flow back to the hot source side by gravity. The flat heat pipe with the liquid absorption core can automatically return to the heat source end from the cold source end by virtue of the capillary action, so that the internal circulation of the working medium is formed, and the flat heat pipe can normally work no matter the flat heat pipe is placed at any angle or not.
A plurality of cooling liquid flow channels 17 arranged in parallel are arranged in the cooling liquid plate layer, and the row holes 22 are arranged in parallel with the cooling liquid flow channels 17; the two ends of the composite radiator are provided with end caps 19 and liquid inlet and outlet ports for the inflow and outflow of the cooling liquid and for the uniform distribution of the cooling liquid to the cooling liquid flow passage 17.
When the heat radiator is used, the flat heat pipe is in close contact with a high-density power heating device. The heat is transferred from the heating element 15 to the flat heat pipe, transferred from the flat heat pipe to the coolant, and then carried to the outside by the coolant. The cooling liquid is pumped back to the cold liquid plate for recycling after being cooled.
Through the setting of above-mentioned structure, strengthened the heat transfer from electron heating element 15 to between the coolant liquid to reduced from the heat source to the thermal resistance between the cold source, it is visible the utility model discloses not for strengthening the heat transfer between CPU and the cold liquid board, reduce thermal resistance R1But rather enhances the heat transfer between the cold plate and the coolant, i.e. the targeted reduction of R in the above calculations3。
The utility model adopts the above-mentioned cold liquid board radiator, the heat transfer effect from cold liquid board to coolant liquid will improve greatly (theoretical calculation, the cold liquid board thermal resistance of no heat pipe is 0.0842K W-1The heat resistance of the radiator containing the cold liquid plate embedded with the heat pipe array is 0.03-0.04 K.W-1About 50% of the original thermal resistance); due to the effect of actual heat transferIncreasing, the size of cold liquid board can be reduced to such size from the size of original monoblock circuit mainboard: the width is approximately equal to or slightly larger than the CPU, and the length is equivalent to the circuit main board, namely, the width is reduced to about 1/3 of the original cold liquid board.
The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.
Claims (10)
1. The utility model provides a radiator with dull and stereotyped heat pipe and coolant liquid board composite construction which characterized in that: the cooling liquid flow channel structure comprises a substrate, wherein the substrate comprises a cold liquid plate layer and a flat plate type heat pipe layer arranged on the upper end surface and/or the lower end surface of the cold liquid plate layer, and a cooling liquid flow channel is arranged in the cold liquid plate layer.
2. A heat sink having a composite structure of a flat heat pipe and a liquid coolant plate as claimed in claim 1, wherein: and a plurality of parallel arranged holes are arranged in the flat-plate type heat pipe layer.
3. A heat sink having a composite structure of a flat heat pipe and a liquid coolant plate as claimed in claim 2, wherein: and a porous medium layer is arranged on the inner wall of the row holes.
4. A heat sink having a composite structure of a flat heat pipe and a liquid coolant plate as claimed in claim 2, wherein: and sealing plugs are arranged at two ends of the hole arrangement pore passage.
5. A heat sink having a composite structure of a flat heat pipe and a liquid coolant plate as claimed in claim 2, wherein: the cold liquid plate layer is internally provided with a plurality of cooling liquid flow channels which are arranged in parallel, and the row holes are arranged in parallel with the cooling liquid flow channels.
6. The heat sink having a composite structure of a flat heat pipe and a liquid coolant plate as claimed in claim 5, wherein: the both ends of cold liquid plate layer all are provided with the end cover, the end cover is provided with coolant liquid import and coolant liquid export.
7. The heat sink having a composite structure of a flat heat pipe and a liquid coolant plate as claimed in claim 5, wherein: and heat radiating fins are arranged in the cooling liquid flow channel.
8. A heat sink having a composite structure of a flat heat pipe and a liquid coolant plate as claimed in claim 1, wherein: the substrate is an aluminum substrate, and the cold liquid plate layer and the flat plate type heat pipe layer are integrally formed.
9. A heat sink having a composite structure of a flat heat pipe and a liquid coolant plate as claimed in claim 1, wherein: the substrate comprises a cold liquid plate layer and a flat plate type hot tube layer arranged on the upper end face of the cold liquid plate layer.
10. A heat sink having a composite structure of a flat heat pipe and a liquid coolant plate as claimed in claim 1, wherein: and the upper end surface and the lower end surface of the cold liquid plate layer are both provided with flat plate type hot tube layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120943152.0U CN215264679U (en) | 2021-04-30 | 2021-04-30 | Radiator with flat heat pipe and coolant plate composite structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120943152.0U CN215264679U (en) | 2021-04-30 | 2021-04-30 | Radiator with flat heat pipe and coolant plate composite structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215264679U true CN215264679U (en) | 2021-12-21 |
Family
ID=79454088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120943152.0U Expired - Fee Related CN215264679U (en) | 2021-04-30 | 2021-04-30 | Radiator with flat heat pipe and coolant plate composite structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215264679U (en) |
-
2021
- 2021-04-30 CN CN202120943152.0U patent/CN215264679U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8737071B2 (en) | Heat dissipation device | |
| US6966359B1 (en) | Radiator plate rapid cooling apparatus | |
| US8713957B2 (en) | Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s) | |
| US7876564B2 (en) | Method and apparatus for cooling computer memory | |
| CN101141871A (en) | Integration designed heat radiator with flat heat pipe spreader | |
| CN101762196A (en) | Multi-channel wick-embedded flat plate heat pipe | |
| US20120018128A1 (en) | Slim type pressure-gradient-driven low-pressure thermosiphon plate | |
| US20220107137A1 (en) | Phase-change heat dissipation device | |
| CN101500394A (en) | Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus | |
| CN209045535U (en) | Micropin rib cluster array microchannel micro heat exchanger | |
| CN105517424B (en) | The two-way anti-failure heat pipe temperature uniforming heat radiation devices and methods therefor of complementary electronic device substrate | |
| CN108461461A (en) | A kind of porous conductive material filled-type heat-pipe radiator | |
| CN104142725A (en) | Novel notebook computer heat dissipation device and method | |
| WO2022227220A1 (en) | Heat dissipation device having flat heat pipe and cooling liquid plate composite structure and manufacturing method for heat dissipation device | |
| CN215264679U (en) | Radiator with flat heat pipe and coolant plate composite structure | |
| CN208434247U (en) | A kind of heat-radiating device of electric component with soaking plate | |
| CN201119229Y (en) | Flat plate thermal tube integrated heat radiation device | |
| CN105552049A (en) | Integrated liquid cooling heat sink device of power module and bottom plate used by power module | |
| CN214852491U (en) | Heat radiator for electronic equipment | |
| CN103807835A (en) | Plate-shaped heat pipe insertion type heat dissipation device of large-power LED | |
| CN201160359Y (en) | Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus | |
| CN108419416A (en) | A kind of high heat dissipation capacity heat-pipe radiator of IGBT | |
| CN210900093U (en) | Fin radiator | |
| CN112880449A (en) | High-efficiency novel radiator | |
| CN110582189A (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211221 |