CN215261081U - Buffering formula heating device - Google Patents
Buffering formula heating device Download PDFInfo
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- CN215261081U CN215261081U CN202121782316.2U CN202121782316U CN215261081U CN 215261081 U CN215261081 U CN 215261081U CN 202121782316 U CN202121782316 U CN 202121782316U CN 215261081 U CN215261081 U CN 215261081U
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- heating
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Abstract
The utility model discloses a buffering formula heating device, include: the heating device comprises a corrugated heating plate, wherein at least one heat buffer groove is arranged on the corrugated heating plate, and supporting tables for supporting substrates to be heated are arranged on two sides of each heat buffer groove; the corrugated heating plate is arranged at the top of the heating shell; the heating device comprises a heating shell, a plurality of heating wires and a plurality of heating wires, wherein the heating wires are arranged in the heating shell and are uniformly distributed in the heating shell. The special corrugated heating plate is adopted in the invention, the uniformity of the heated product is improved, the effect of buffering the temperature is achieved through the heat buffering groove, the diluent in the photoresist can be fully volatilized, the problem that the diluent rapidly rushes out of the photoresist on the surface of the wafer due to the too fast temperature rise, and further a large number of dense bubbles and pits are formed is solved, the diluent of the photoresist can be volatilized for a sufficient time, the defects of the bubbles and the pits are reduced, and the drying effect is ensured.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor preparation, concretely relates to buffering formula heating device.
Background
The front and back baking is a key process in the photoetching manufacture of the chip semiconductor, and the requirement on photoetching is higher and higher as the characteristic size is smaller and smaller. The drying process before and after exposure greatly affects the line precision and the finished product yield, so that the overall performance and the manufacturing cost of the device are determined. Baking modes such as an oven, a tube furnace, a flat hot plate and the like are commonly used in industry.
When a traditional oven or a tubular furnace is used for baking, products are placed in the equipment, the equipment is filled with gas in the cavity, and the gas is uniformly heated on the products. However, the heat receiving mode of the product is from outside to inside, so that the volatile component thinner of the photoresist preferentially volatilizes from the outside of the photoresist and then hardens, and the volatilization of the internal thinner is blocked, thereby causing the problems of insufficient volatilization of the internal thinner of the photoresist and serious exposure line errors.
When the flat hot plate is baked, the mode of receiving heat of the product is directly changed into the mode from inside to outside, although the problem of volatilization uniformity of the diluent is improved. But most of the product sheets are thinner than 1mm in thickness. When the wafer is directly placed on a flat hot plate, the wafer can quickly reach the drying temperature, the thinner can quickly rush out the photoresist on the surface of the wafer, a large amount of dense bubbles and pits are easily formed, and the defects can be remained because the wafer reaches the hardening temperature. Finally, the precision of the optical scribing lines and the product yield are greatly influenced.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a buffering formula heating device.
The utility model discloses the technical scheme who adopts does: a buffer heating apparatus comprising:
the heating device comprises a corrugated heating plate, wherein at least one heat buffer groove is arranged on the corrugated heating plate, and supporting tables for supporting substrates to be heated are arranged on two sides of each heat buffer groove;
the corrugated heating plate is arranged at the top of the heating shell;
the heating device comprises a heating shell, a plurality of heating wires and a plurality of heating wires, wherein the heating wires are arranged in the heating shell and are uniformly distributed in the heating shell.
As an optional technical solution, the heat buffer grooves are provided in plurality, the intervals between two adjacent heat buffer grooves are equal, and the support table is arranged in the interval.
As an optional technical scheme, the maximum width of the heat buffer groove is 20-24mm, the depth of the heat buffer groove is 6-10mm, and the width of the top of the support table is 3-7 mm.
As a preferable technical solution, the maximum width of the heat buffer groove is 22mm, the depth of the heat buffer groove is 8.71mm, and the top width of the support table is 5 mm.
As an optional technical scheme, the size of the substrate to be heated is 2-4 inch.
As an optional technical solution, the cross section of the heat buffer groove is arc-shaped, rectangular or trapezoidal, and the distance between the bottom of the heat buffer groove and the top of the heating shell is 10-13 mm.
As an optional technical scheme, the distance between two adjacent heating wires is 20-24 mm.
As an optional technical solution, the corrugated heating plate is made of an aluminum alloy material.
As an optional technical scheme, the side wall of the corrugated heating plate is provided with an anti-scald guardrail.
As an optional technical scheme, the bottom of the heating shell is provided with a bearing pad foot.
The utility model has the advantages that: the special corrugated heating plate is adopted in the invention, the uniformity of the heated product is improved, the effect of buffering the temperature is achieved through the heat buffering groove, the diluent in the photoresist can be fully volatilized, the problem that the diluent rapidly rushes out of the photoresist on the surface of the wafer due to the too fast temperature rise, and further a large number of dense bubbles and pits are formed is solved, the diluent of the photoresist can be volatilized for a sufficient time, the defects of the bubbles and the pits are reduced, and the drying effect is ensured.
Drawings
Fig. 1 is a schematic structural view of the buffer type heating device of the present invention.
Fig. 2 is a plan view of the corrugated heating plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The present invention will be further described with reference to the accompanying drawings and specific embodiments.
Example (b):
as shown in fig. 1 and 2, a buffer type heating apparatus includes:
the heating device comprises a corrugated heating plate 1, wherein at least one heat buffer groove 101 is arranged on the corrugated heating plate 1, and supporting tables 102 which support a substrate 2 to be heated are arranged on two sides of each heat buffer groove 101;
the heating shell 3 is provided with the corrugated heating plate 1 at the top of the heating shell 3;
a plurality of heater strips 4, a plurality of heater strips 4 are located in heating shell 3 and evenly distributed in heating shell 3.
As an alternative embodiment, a plurality of heat buffer grooves 101 are provided, and the interval between two adjacent heat buffer grooves 101 is equal, and the support table 102 is provided in the interval.
As an alternative embodiment, the maximum width D1 of the heat buffer tank 101 is 20-24mm, the depth D2 of the heat buffer tank 101 is 6-10mm, and the top width D3 of the supporting table 102 is 3-7 mm.
In a preferred embodiment, the maximum width D1 of the heat buffer tank 101 is 22mm, the depth D2 of the heat buffer tank 101 is 8.71mm, and the top width D3 of the support base 102 is 5 mm.
As an alternative embodiment, the substrate 2 to be heated has a size of 2-4 inch.
In an alternative embodiment, the cross section of the heat buffer tank 101 is arc-shaped, rectangular or trapezoid, the distance D4 between the bottom of the heat buffer tank 101 and the top of the heating housing 3 is 10-13mm, and in a preferred embodiment, the distance D4 between the bottom of the heat buffer tank 101 and the top of the heating housing 3 is 11.29 mm.
As an alternative embodiment, the distance D5 between two adjacent heating wires 4 is 20-24mm, and as a preferred embodiment, the distance D5 between two adjacent heating wires 4 is 22.52 mm. Wherein, the heating wires 4 are vertical to the corrugated heating plate 1, and the heating wires 4 are wavy.
As an alternative embodiment, the corrugated heating plate 1 is made of aluminum alloy.
As an optional embodiment, the side wall of the corrugated heating plate 1 is provided with an anti-scald guard bar 5.
As an alternative embodiment, the bottom of the heating shell 3 is provided with a bearing foot pad 6.
In this embodiment, when heating, the substrate 2 to be heated of different sizes (2 or 4 inch) is placed on the corrugated heating plate 1, and the substrate 2 to be heated is brought into contact with the support table 102. The heat is uniformly transferred to the heating plate 1 by the heating wire 4, then transferred to the support table 102, and transferred to the substrate 2 to be heated by the support table 102, and the direct contact heat transfer mode accelerates the volatilization of the internal thinner, and avoids the problem of insufficient volatilization of the internal thinner of the photoresist; however, if the contact area between the supporting platform 102 and the substrate 2 to be heated is too large, the temperature may reach the drying temperature quickly, which may cause the thinner to rush out the photoresist on the surface of the substrate, and a large amount of dense bubbles and pits may be formed, therefore, the width of the supporting platform 102 needs to be limited, preferably 3-7mm, and most preferably 5 mm. Simultaneously, the heat of hot plate 1 still can transmit for waiting to heat substrate 2 through the air in heat dashpot 101, from on hot plate 1 through the air buffering transmit to waiting to heat substrate 2, wait to heat substrate 2 and receive from the heat supply up down, the buffering is heated, lets the thinner of photoresist have sufficient time to volatilize, reduces bubble, pit defect, guarantees the stoving effect. And, this application has increased the scald preventing guardrail 5 of flute form hot plate 1, scalds when effectively preventing the operation, promotes the security.
The present invention is not limited to the above-mentioned optional embodiments, and any other products in various forms can be obtained by anyone under the teaching of the present invention, and any changes in the shape or structure thereof, all the technical solutions falling within the scope of the present invention, are within the protection scope of the present invention.
Claims (10)
1. A buffer-type heating apparatus, comprising:
the heating device comprises a corrugated heating plate, wherein at least one heat buffer groove is arranged on the corrugated heating plate, and supporting tables for supporting substrates to be heated are arranged on two sides of each heat buffer groove;
the corrugated heating plate is arranged at the top of the heating shell;
the heating device comprises a heating shell, a plurality of heating wires and a plurality of heating wires, wherein the heating wires are arranged in the heating shell and are uniformly distributed in the heating shell.
2. The buffer heating apparatus as claimed in claim 1, wherein: the heat buffer grooves are provided with a plurality of adjacent heat buffer grooves, the intervals between every two adjacent heat buffer grooves are equal, and the supporting tables are arranged in the intervals.
3. The buffer heating apparatus according to claim 2, wherein: the maximum width of the heat buffer groove is 20-24mm, the depth of the heat buffer groove is 6-10mm, and the width of the top of the support table is 3-7 mm.
4. The buffer heating apparatus according to claim 3, wherein: the maximum width of heat dashpot is 22mm, the degree of depth of heat dashpot is 8.71mm, the top width of brace table is 5 mm.
5. The buffer heating apparatus as claimed in claim 1, wherein: the size of the substrate to be heated is 2-4 inch.
6. The buffer heating apparatus as claimed in claim 1, wherein: the cross section of the heat buffer groove is arc-shaped, rectangular or trapezoidal, and the distance between the bottom of the heat buffer groove and the top of the heating shell is 10-13 mm.
7. The buffer heating apparatus as claimed in claim 1, wherein: the distance between two adjacent heating wires is 20-24 mm.
8. The buffer heating apparatus as claimed in claim 1, wherein: the corrugated heating plate is made of aluminum alloy.
9. The buffer heating apparatus as claimed in claim 1, wherein: and the side wall of the corrugated heating plate is provided with an anti-scald guardrail.
10. The buffer heating apparatus as claimed in claim 1, wherein: and the bottom of the heating shell is provided with a bearing pad foot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121782316.2U CN215261081U (en) | 2021-08-02 | 2021-08-02 | Buffering formula heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121782316.2U CN215261081U (en) | 2021-08-02 | 2021-08-02 | Buffering formula heating device |
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| Publication Number | Publication Date |
|---|---|
| CN215261081U true CN215261081U (en) | 2021-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121782316.2U Active CN215261081U (en) | 2021-08-02 | 2021-08-02 | Buffering formula heating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117835790A (en) * | 2024-03-06 | 2024-04-05 | 四川科尔威光电科技有限公司 | Semiconductor refrigerator substrate metallization method and semiconductor refrigerator metallization substrate |
-
2021
- 2021-08-02 CN CN202121782316.2U patent/CN215261081U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117835790A (en) * | 2024-03-06 | 2024-04-05 | 四川科尔威光电科技有限公司 | Semiconductor refrigerator substrate metallization method and semiconductor refrigerator metallization substrate |
| CN117835790B (en) * | 2024-03-06 | 2024-06-04 | 四川科尔威光电科技有限公司 | Semiconductor refrigerator substrate metallization method and semiconductor refrigerator metallization substrate |
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