CN216563033U

CN216563033U - Semiconductor wafer baking device

Info

Publication number: CN216563033U
Application number: CN202123220350.3U
Authority: CN
Inventors: 陆金发
Original assignee: Xi'an Xinmei Technology Co ltd
Current assignee: Xi'an Xinmei Technology Co ltd
Priority date: 2021-12-21
Filing date: 2021-12-21
Publication date: 2022-05-17
Anticipated expiration: 2031-12-21

Abstract

The utility model discloses a semiconductor wafer baking device, and particularly relates to the field of wafer baking. The utility model discloses at first the power box makes electrothermal tube self generate heat, and blow the top of pull board through the hot-air on electrothermal tube surface through first fan, the convenience toasts the wafer, and through the perforated plate, it is more even to make the steam distribution that gets into pull board top, and then make the stoving effect better, and prevent through the dust screen that sets up that the dust in the outside air from getting into the inside of toasting the case, play dirt-proof effect, and through the cooperation of bracing piece and slide bar, it is spacing to conveniently supporting the year flitch, and then conveniently take to the year flitch and place.

Description

Semiconductor wafer baking device

Technical Field

The utility model relates to the technical field of wafer baking, in particular to a semiconductor wafer baking device.

Background

Silicon is refined from quartz sand, and wafers are purified from silicon elements, and then these pure silicon are made into silicon crystal rods to be used as the material of quartz semiconductors for manufacturing integrated circuits.

However, in actual use, the heating plates are mostly adopted in the existing baking device for baking, and when a plurality of wafers are baked at the same time, the uniformity of each part on the surface of each heating plate cannot be guaranteed, so that the baking effect on the wafers is uneven, the edge of each wafer is warped, the wafer is damaged, and the wafer is inconvenient to dissipate heat and take.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above defects in the prior art, embodiments of the present invention provide a semiconductor wafer baking apparatus, which can make the baking effect more uniform through the matching of the material carrying plate, the pulling plate, the electric heating tube, and other structures, and can not cause local overheating to the wafer, which affects the baking effect, and can dissipate heat of the baked wafer, which is convenient for taking, so as to solve the problems proposed in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: a semiconductor wafer baking device comprises a baking oven, wherein an electric heating tube for baking is arranged on the right side of an inner cavity of the baking oven, a first fan for blowing air is arranged on the right side of the electric heating tube, a drawing plate is arranged on the left side of the baking oven, and a supporting side plate is fixedly connected to one side of the top of the drawing plate;

the top of the drawing plate is provided with a material carrying plate for preventing wafers;

and a second fan for radiating the baked wafer is arranged in the middle of the drawing plate.

In a preferred embodiment, a perforated plate is arranged on one side, away from the first fan, of the electric heating tube, a dustproof net is arranged on one side, away from the electric heating tube, of the first fan, a power supply box is fixedly connected to the bottom of the electric heating tube, an exhaust pipe is arranged at the top of an inner cavity of the baking box, and a one-way valve is arranged at the top of the exhaust pipe.

In a preferred embodiment, a sealing plate is arranged on the left side of the baking oven, the right side wall body of the sealing plate is fixedly connected with the wall bodies of the supporting side plate and the drawing plate, a battery box is arranged at the bottom of the sealing plate and electrically connected with a second fan, air holes are symmetrically formed in the upper side and the lower side of the drawing plate, and a dust screen is arranged on the surface of each air hole.

In a preferred embodiment, a supporting rod is fixedly connected to one side, close to the drawing plate, of the sealing plate, a sliding rod is fixedly connected to the top of the supporting rod, one end, far away from the supporting rod, of the sliding rod is fixed to the front end of the supporting side plate, the material carrying plate is arranged right above the sliding rod, a limiting strip is fixedly connected to the bottom of the material carrying plate, and the position of the limiting strip corresponds to the position of the sliding rod.

The utility model has the technical effects and advantages that:

1. according to the utility model, firstly, the electric heating tube is heated by the power supply box, hot air on the surface of the electric heating tube is blown to the top of the drawing plate through the first fan, so that the wafer is conveniently baked, hot air entering the top of the drawing plate is more uniformly distributed through the porous plate, the drying effect is better, dust in external air is prevented from entering the baking box through the arranged dustproof net, the dustproof effect is achieved, the material carrying plate is conveniently supported and limited through the matching of the supporting rod and the sliding rod, the material carrying plate is further conveniently taken and placed, and the material carrying plate can be limited through the matching of the sliding rod and the limiting strip, so that the material carrying plate is prevented from sliding in the moving process of the sealing plate and the drawing plate, and the stability of the wafer is prevented from being influenced;

2. when the pulling plate is moved out of the interior of the baking box through the second fan, the hot air at the top of the pulling plate is blown upwards by the second fan, so that the heat dissipation effect is better, meanwhile, the hot air remained in the baking box cannot diffuse from the edge of the sealing plate, the accidental injury to workers is caused, meanwhile, the heat dissipation can be rapidly carried out on the wafer on the surface of the bottom material carrying plate, the taking is convenient, the air is dispersed and softened through the arranged air holes, the wafer cannot be blown, and the heat dissipation effect is improved;

to sum up, through the above-mentioned interact of a plurality of effects, can make the effect of toasting more even, and can not cause local overheat to the wafer, influence the effect of toasting to can dispel the heat to the wafer after toasting, conveniently take.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic cross-sectional view of the drawing plate and the material carrying plate according to the present invention.

Fig. 3 is a schematic view of the connection structure of the pulling plate and the support rod of the utility model.

Fig. 4 is a schematic structural diagram of the material carrying plate of the present invention.

The reference signs are: 1. a baking oven; 2. an electric heating tube; 3. a first fan; 4. a drawing plate; 5. supporting the side plates; 6. a material carrying plate; 7. a second fan; 8. a perforated plate; 9. a dust screen; 10. a power supply box; 11. an exhaust duct; 12. a one-way valve; 13. a sealing plate; 14. a battery box; 15. air holes are formed; 16. a support bar; 17. a slide bar; 18. and (5) a limiting strip.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The semiconductor wafer baking device shown in the attached figures 1-4 comprises a baking oven 1, wherein an electric heating tube 2 for baking is arranged on the right side of an inner cavity of the baking oven 1, a first fan 3 for blowing air is arranged on the right side of the electric heating tube 2, a drawing plate 4 is arranged on the left side of the baking oven 1, and a supporting side plate 5 is fixedly connected to one side of the top of the drawing plate 4;

the top of the drawing plate 4 is provided with a material carrying plate 6 for preventing wafers;

the middle part of the pull plate 4 is provided with a second fan 7 for radiating the baked wafer.

As shown in the attached drawing 1, one side of the electric heating tube 2 far away from the first fan 3 is provided with a porous plate 8, one side of the electric heating tube 2 far away from the first fan 3 is provided with a dustproof net 9, the bottom fixedly connected with power box 10 of the electric heating tube 2, the inner cavity top of the baking box 1 is provided with an exhaust pipe 11, the top of the exhaust pipe 11 is provided with a one-way valve 12, so that the electric heating tube 2 generates heat by itself through the power box 10, and blow hot air on the surface of the electric heating tube 2 to the top of the drawing plate 4 through the first fan 3, so that the wafer is baked conveniently, and through the porous plate 8, the hot air distribution entering the top of the drawing plate 4 is more uniform, so that the drying effect is better, and the dust in the outside air is prevented from entering the inside of the baking box 1 through the dustproof net 9, and the dustproof effect is achieved.

As shown in the attached drawings 1-3, a sealing plate 13 is arranged on the left side of the baking oven 1, the right side wall body of the sealing plate 13 is fixedly connected with the wall bodies of the supporting side plate 5 and the drawing plate 4, a battery box 14 is arranged at the bottom of the sealing plate 13, the battery box 14 is electrically connected with a second fan 7, air holes 15 are symmetrically formed in the upper side and the lower side of the drawing plate 4, dust screens are arranged on the surfaces of the air holes 15 in the bottom, so that the drawing plate 4 and the supporting side plate 5 can be conveniently moved out of the baking oven 1 through the arranged sealing plate 13, and the wafer at the top of the drawing plate 4 can be cooled by air blowing through the second fan 7, and therefore the baking oven is convenient to take and improves the working efficiency.

As shown in fig. 1-4, one side of the sealing plate 13 close to the drawing plate 4 is fixedly connected with a supporting rod 16, the top of the supporting rod 16 is fixedly connected with a sliding rod 17, one end of the sliding rod 17 far away from the supporting rod 16 is fixed at the front end of the supporting side plate 5, the material carrying plate 6 is arranged right above the sliding rod 17, the bottom of the material carrying plate 6 is fixedly connected with a limit strip 18, the position of the limit strip 18 corresponds to the position of the sliding rod 17, so that the material carrying plate 6 is supported and placed through the supporting rod 16 and the sliding rod 17, the stability of a wafer at the top of the material carrying plate 6 is improved, and meanwhile, through the matching of the sliding rod 17 and the limit strip 18, the material carrying plate 6 can be limited, the material carrying plate 6 is prevented from sliding in the moving process, and the use effect is influenced.

The working principle of the utility model is as follows: when the wafer-positioning limiting device is used, the wafer is placed at the top of the material carrying plate 6, then the material carrying plate 6 is placed at the top of the sliding rod 17, and the position of the limiting strip 18 and the position of the sliding rod 17 are staggered, so that the material carrying plate 6 can be limited;

then the sealing plate 13 is pushed, the drawing plate 4 and the material carrying plate 6 can be pushed into the baking oven 1, then the electric heating tube 2 and the first fan 3 are started, the first fan 3 can filter external air through the dustproof net 9 and enter the baking oven 1, heat generated by the electric heating tube 2 is blown into the top of the drawing plate 4, hot air is blocked by the porous plate 8 and is uniformly dispersed to the top of the drawing plate 4, and wafers on the top of the material carrying plate 6 are uniformly baked;

because the hot air rises, the air generated after the hot air passes through the material loading plate 6 and the wafer and is baked is exhausted through the exhaust pipe 11 and the one-way valve 12, and external dust cannot enter the baking box 1 to pollute the wafer;

the opening only needs to be baked and the sealing plate 13 is pulled, the pull plate 4 and the material carrying plate 6 are moved out from the inside of the baking oven 1, the second fan 7 is started at the moment, gas can be cooled through air cooling of the material carrying plate 6 and the wafer at the top of the material carrying plate 6 through the dispersion of the air holes 15, and therefore the wafer can be conveniently discharged and completed.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the utility model, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the utility model can be combined with each other without conflict;

and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.

Claims

1. A semiconductor wafer baking apparatus includes a baking oven (1), characterized in that: an electric heating tube (2) for baking is arranged on the right side of an inner cavity of the baking box (1), a first fan (3) for blowing is arranged on the right side of the electric heating tube (2), a drawing plate (4) is arranged on the left side of the baking box (1), and a supporting side plate (5) is fixedly connected to one side of the top of the drawing plate (4);

the top of the drawing plate (4) is provided with a material carrying plate (6) for preventing wafers;

and a second fan (7) for radiating the baked wafer is arranged in the middle of the drawing plate (4).

2. The apparatus of claim 1, wherein: a perforated plate (8) is arranged on one side, away from the first fan (3), of the electric heating pipe (2), a dustproof net (9) is arranged on one side, away from the electric heating pipe (2), of the first fan (3), and a power supply box (10) is fixedly connected to the bottom of the electric heating pipe (2).

3. The apparatus of claim 1, wherein: the inner chamber top of toasting case (1) is provided with exhaust pipe (11), the top of exhaust pipe (11) is provided with check valve (12).

4. The apparatus of claim 1, wherein: bake out the left side of case (1) and be provided with closing plate (13), the right side wall body of closing plate (13) and the wall body fixed connection who supports curb plate (5) and pull board (4), the bottom of closing plate (13) is provided with battery box (14), battery box (14) are connected with second fan (7) electricity.

5. The apparatus of claim 1, wherein: air holes (15) are symmetrically formed in the upper side and the lower side of the drawing plate (4), and dust screens are arranged on the surfaces of the air holes (15) at the bottom.

6. The apparatus of claim 4, wherein: one side fixedly connected with bracing piece (16) that closing plate (13) is close to pull board (4), the top fixedly connected with slide bar (17) of bracing piece (16), the front end at support curb plate (5) is fixed to the one end that bracing piece (16) were kept away from in slide bar (17).

7. The apparatus of claim 1, wherein: the material carrying plate (6) is arranged right above the sliding rod (17), the bottom of the material carrying plate (6) is fixedly connected with a limiting strip (18), and the position of the limiting strip (18) corresponds to the position of the sliding rod (17).