CN215187588U

CN215187588U - Punching press formula ladder pad PCB

Info

Publication number: CN215187588U
Application number: CN202121272791.5U
Authority: CN
Inventors: 杨婵; 林均秀; 邵家坤
Original assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co ltd
Current assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co ltd
Priority date: 2021-06-08
Filing date: 2021-06-08
Publication date: 2021-12-14
Anticipated expiration: 2031-06-08

Abstract

The utility model provides a punching press formula ladder pad PCB can realize that partial PCB pad has the ladder difference in height to on the coplanar, can adopt conventional components and parts to realize the product design function after using this kind of PCB, avoid high components and parts to develop expense and time cost again. The utility model discloses a PCB substrate, the circuit of setting on the PCB substrate and covering hindering of circuit hinder printing ink or cover the membrane, the utility model discloses still include with the circuit electricity be connected and do not hinder a plurality of pad that printing ink or cover the membrane and cover, at least one pad is punching press formula ladder pad, and the higher authority of punching press formula ladder pad is equipped with the punching press boss, is equipped with the cavity corresponding with the punching press boss below punching press formula ladder pad, and it is protruding to be equipped with the substrate of filling in the cavity on the PCB substrate. The utility model discloses be applied to the technical field that PCB made.

Description

Punching press formula ladder pad PCB

Technical Field

The utility model relates to a PCB, in particular to punching press formula ladder pad PCB.

Background

With the development of electronic technology, PCBs used in electronic devices are more and more complex, and the PCBs generally need to be equipped with components for realizing complex functions. In some occasions, besides the beautiful board surface, what is more important is that special requirements are required for realizing the design function of a product, and the installation precision of some components is required to be brought forward, for example, some components require that one or more components are required to be ensured to be at the same height, such as some sensors and the like.

The components are usually produced according to a certain standard and have fixed height, thickness and other dimensions, and because the PCB pads are all planar, the PCB pads are at the same height, as shown in fig. 1 and 2. This may prevent certain components from meeting the height criteria. In this case, only components can be replaced or components can be separately manufactured. However, either method may affect the progress and cost of the project, and may even be difficult to solve.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that overcome prior art not enough, provide a punching press formula ladder pad PCB, can realize that partial PCB pad has the ladder difference in height to on the coplanar, can adopt conventional components and parts to realize the product design function after using this kind of PCB, avoid high components and parts redevelopment expense and time cost.

The utility model adopts the technical proposal that: the utility model discloses a PCB substrate, setting are in circuit and cover on the PCB substrate hinder printing ink or cover the membrane of hindering of circuit, a punching press formula ladder pad PCB still include with circuit electricity is connected and not quilt hinder the printing ink or cover a plurality of pad that the membrane covered, at least one the pad is punching press formula ladder pad, the higher authority of punching press formula ladder pad is equipped with the punching press boss, be equipped with below the punching press formula ladder pad with the corresponding cavity of punching press boss, be equipped with on the PCB substrate and fill in the substrate of cavity is protruding.

Further, the top of the stamping boss is flat-topped.

Furthermore, a nickel plating layer is arranged on the stamping boss.

Further, the thickness of the nickel plating layer is 10-15 um.

Furthermore, the circuit, the solder resist ink or the cover film covering the circuit, and the plurality of the welding pads which are electrically connected with the circuit and are not covered by the solder resist ink or the cover film are arranged on the two sides of the PCB substrate.

Further, the height of the stamping boss does not exceed 0.4 mm.

The utility model has the advantages that: because the utility model discloses a design of punching press formula, on the PCB who has made the cover film and has not yet surface plating, adopt the mould punching press to go out a boss with the pad punching press that will need the bed hedgehopping, then carry out the surface nickel plating once, the thickness of nickel is 10-15 um. And then the step bonding pad PCB with different heights can be obtained through the subsequent conventional procedures. And the height of the components can be increased by mounting the components, the height difference of the PCB bonding pad steps is adopted to make up the defect of insufficient height of the conventional components, and the component is prevented from being redeveloped by adopting lower cost.

Drawings

FIG. 1 is a schematic plan view of a PCB;

FIG. 2 is a schematic cross-sectional view of a PCB;

FIG. 3 is a schematic view of a two-sided sheet blank;

fig. 4 is a schematic view of a stamped boss.

Detailed Description

Fig. 3 is a simplified schematic diagram of a double-sided board semi-finished product, showing only the substrate, the bonding pads and the cover film, as shown in fig. 3 and 4. The double sided board is according to conventional preparation can, for increasing maneuverability, the die-cut appearance of PCB finished product can not cut into the singleton, in this embodiment, the utility model discloses a PCB substrate 1, setting are in circuit 2 and the cover on the PCB substrate 1 what circuit 2 hinders and welds printing ink or cover membrane 3, a punching press formula ladder pad PCB still include with 2 electricity of circuit are connected and not quilt hinder and weld printing ink or cover a plurality of pad 4 that membrane 3 covered, at least one pad 4 is punching press formula ladder pad, the higher authority of punching press formula ladder pad is equipped with punching press boss 5, be equipped with below punching press formula ladder pad with punching press boss 5 corresponding cavity 6, be equipped with on the PCB substrate 1 and fill in the protruding 7 of substrate in cavity 6, thereby guaranteed punching press boss 5's stability.

In this embodiment, the top of the stamping boss 5 is a flat top, which is beneficial to mounting components.

In this embodiment, the circuit 2, the solder resist ink or the cover film 3 covering the circuit 2, and the pads 4 electrically connected to the circuit 2 and not covered by the solder resist ink or the cover film 3 are disposed on both sides of the PCB substrate 1.

In this embodiment, the height of the stamped boss 5 does not exceed 0.4 mm.

The manufacturing technology of the stamped stepped pad PCB comprises the following steps:

a. manufacturing a PCB with a bonding pad;

b. manufacturing a stamping die: the die adopts a male-female die structure and is used for punching a boss on the bonding pad to heighten the bonding pad;

c. stamping: stamping the back of the bonding pad to be heightened, and applying pressure to the back of the bonding pad through a die punch to generate a boss on the surface of the bonding pad;

d. and electroplating nickel after the die stamping is finished so as to increase the strength of the boss.

Fig. 4 is a die stamping boss. According to the position and the shape of the bonding pad needing to be heightened, a stamping die is designed and manufactured in advance and used for stamping a boss on the bonding pad to heighten the bonding pad. The die adopts a male-female die structure, and the fit clearance and the boss height of the die are adjusted according to the stamping effect so as to obtain an ideal heightening effect on the bonding pad of the PCB.

When punching, punching is carried out from the back of the bonding pad needing to be heightened, and the die punch head applies pressure to the back of the bonding pad, so that the surface of the bonding pad can generate a boss. And adjusting the stamping parameters to obtain the pad boss meeting the requirements, and avoiding the fracture of the copper foil of the pad after stamping. In order to avoid the height of the broken boss of the copper foil from being too high, the height is preferably not more than 0.4 mm.

In this embodiment, the nickel electroplating is performed to a thickness of 10-15um after the die stamping is completed, so as to increase the boss strength.

After the above processes are completed, the subsequent processes are completed according to the conventional method to obtain the PCB with the step bonding pad.

In conclusion, the technology provides a stepped pad PCB manufacturing technology, local pads of the PCB can be increased, conventional components are used, and development cost of non-standard components is avoided.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not intended to limit the scope of the invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims

1. A stamped step pad PCB comprising a PCB substrate (1), a line (2) disposed on said PCB substrate (1) and a solder resist ink or cover film (3) covering said line (2), said stamped step pad PCB further comprising a plurality of pads (4) electrically connected to said line (2) and not covered by said solder resist ink or said cover film (3), characterized in that: at least one pad (4) are punching press formula ladder pad, be equipped with punching press boss (5) above the punching press formula ladder pad, be equipped with below the punching press formula ladder pad with corresponding cavity (6) of punching press boss (5), be equipped with on PCB substrate (1) and fill in protruding (7) of substrate in cavity (6).

2. The stamped step pad PCB of claim 1, wherein: the top of the stamping boss (5) is flat-topped.

3. The stamped step pad PCB of claim 1, wherein: and a nickel plating layer is arranged on the stamping boss (5).

4. A stamped step pad PCB as claimed in claim 3, wherein: the thickness of the nickel plating layer is 10-15 um.

5. The stamped step pad PCB of claim 1, wherein: the two sides of the PCB base material (1) are provided with the circuit (2), solder resist ink or a cover film (3) covering the circuit (2), and a plurality of the solder pads (4) which are electrically connected with the circuit (2) and are not covered by the solder resist ink or the cover film (3).

6. The stamped step pad PCB of claim 1, wherein: the height of the stamping boss (5) is not more than 0.4 mm.