CN113316316A

CN113316316A - Reinforced stepped welding pad PCB and manufacturing technology

Info

Publication number: CN113316316A
Application number: CN202110636995.0A
Authority: CN
Inventors: 徐景浩; 杨婵; 林均秀; 邵家坤
Original assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co ltd
Current assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co ltd
Priority date: 2021-06-08
Filing date: 2021-06-08
Publication date: 2021-08-27

Abstract

The invention discloses and provides a reinforced stepped welding pad PCB and a manufacturing technology thereof, which can realize that part of PCB welding pads have stepped height difference and are not on the same plane, and after the PCB is applied, conventional components can be adopted to realize product design functions, thereby avoiding high component redevelopment cost and time cost. The utility model provides a reinforcement formula ladder pad PCB, includes the PCB substrate, sets up the circuit on the PCB substrate and covers the hindering of circuit and weld printing ink or cover the membrane, a reinforcement formula ladder pad PCB still includes and is connected and is not hindered a plurality of pad that printing ink or cover the membrane and cover with the circuit electricity, is provided with the stiffening plate around at least one pad, and a cavity is enclosed to the stiffening plate that the pad set up all around, is provided with the tin cream in the cavity, and the tin cream is connected with the pad electricity of cavity bottom. The manufacturing technology mainly comprises the steps of PCB manufacturing, reinforcing, curing, appearance, tin paste printing and the like. The invention is applied to the technical field of PCB.

Description

Reinforced stepped welding pad PCB and manufacturing technology

Technical Field

The invention relates to a PCB and a manufacturing technology, in particular to a reinforced stepped pad PCB and a manufacturing technology.

Background

With the development of electronic technology, PCBs used in electronic devices are more and more complex, and the PCBs generally need to be equipped with components for realizing complex functions. In some occasions, besides the beautiful board surface, what is more important is that special requirements are required for realizing the design function of a product, and the installation precision of some components is required to be brought forward, for example, some components require that one or more components are required to be ensured to be at the same height, such as some sensors and the like.

The components are usually produced according to a certain standard and have fixed height, thickness and other dimensions, and because the PCB pads are all planar, the PCB pads are at the same height, as shown in fig. 1 and 2. This may prevent certain components from meeting the height criteria. In this case, only components can be replaced or components can be separately manufactured. However, either method may affect the progress and cost of the project, and may even be difficult to solve.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a reinforced stepped pad PCB and a manufacturing technology thereof, which can realize that part of PCB pads have stepped height difference and are not on the same plane, and after the PCB is applied, conventional components can be adopted to realize the product design function, thereby avoiding the high component redevelopment cost and time cost.

The technical scheme adopted by the invention is as follows: the utility model provides a reinforcement formula ladder pad PCB, includes the PCB substrate, sets up circuit on the PCB substrate and cover hinder printing ink or cover the membrane that hinders of circuit, a reinforcement formula ladder pad PCB still include with circuit electricity is connected and not quilt hinder printing ink or cover a plurality of pad that the membrane covered, at least one be provided with the stiffening plate around the pad, the pad sets up all around the stiffening plate encloses a cavity, be provided with the tin cream in the cavity, the tin cream with the cavity bottom the pad electricity is connected.

Further, the bottom of the solder paste is electrically connected with the bonding pad at the bottom of the cavity, and the top of the solder paste is not higher than the top of the cavity.

Furthermore, a window which exposes the bonding pad is arranged on the reinforcing plate.

Further, the size of the window is 0-0.2 mm larger than the size of the welding pad on one side.

Further, the material of the reinforcing plate is PI or FR 4.

Furthermore, the bottom of the reinforcing plate is provided with an adhesive or a thermosetting adhesive film or a prepreg.

The manufacturing technology of the reinforced stepped welding pad PCB comprises the following steps:

a. manufacturing a PCB with a bonding pad;

b. manufacturing a reinforcing plate: processing a window on the reinforcing plate according to the shape of the heightened pad, wherein the size of the window is 0-0.2 mm larger than the size of the pad of the PCB on one side;

c. attaching the reinforcing plate to a PCB pad to be raised manually or by a machine, and exposing the PCB pad from a window pre-opened on the reinforcing plate;

d. printing solder paste on the surface of the PCB, wherein the solder paste enters the bonding pad through an opening on the steel mesh when the solder paste is printed; the solder pad that needs to be heightened is because there is the stiffening plate to block all around, and the tin cream can only fill the cavity of reinforcement and can not spill over to the next door, according to the high printing number of times of adjustment tin cream of reinforcement, until the cavity of reinforcement is filled up to the tin cream.

In step c, the reinforcing plate is stuck with the PCB after false pasting, pressing and curing.

The method also comprises the following steps between the step c and the step d: the subsequent process requires partial or complete manufacture of the PCB appearance.

The invention has the beneficial effects that: because the invention adopts the design of step reinforcement, the reinforcement plates are arranged around the bonding pad, the reinforcement plates arranged around the bonding pad enclose a cavity, the solder paste is arranged in the cavity and is electrically connected with the bonding pad at the bottom of the cavity, thus realizing that part of PCB bonding pads have step height difference and are not on the same plane, realizing the product design function by adopting conventional components after the PCB is applied, and avoiding the high redevelopment cost and time cost of the components.

Drawings

FIG. 1 is a schematic plan view of a PCB;

FIG. 2 is a schematic cross-sectional view of a PCB;

FIG. 3 is a schematic plan view of a PCB reinforcement;

FIG. 4 is a schematic cross-sectional view of a reinforcement of a PCB;

FIG. 5 is a schematic cross-sectional view after printing solder paste.

Detailed Description

As shown in fig. 3, fig. 4 and fig. 5, in this embodiment, a reinforced step pad PCB includes a PCB substrate 1, a circuit 2 disposed on the PCB substrate 1, and a solder resist ink or a cover film 3 covering the circuit 2, the reinforced step pad PCB further includes a plurality of pads 4 electrically connected to the circuit 2 and not covered by the solder resist ink or the cover film 3, at least one of the pads 4 is provided with a reinforcing plate 5 around, the reinforcing plate 5 disposed around the pad 4 encloses a cavity 6, the cavity 6 is provided with a solder paste 7 inside, and the solder paste 7 is electrically connected to the pads 4 at the bottom of the cavity 6.

In this embodiment, the bottom of the solder paste 7 is electrically connected to the pad 4 at the bottom of the cavity 6, and the top of the solder paste 7 is flush with the top of the cavity 6.

In this embodiment, the reinforcing plate 5 is provided with a window 8 for exposing the pad 4.

In the present embodiment, the size of the window 8 is one side 0mm, or 0.1mm, or 0.2mm larger than the size of the pad 4.

In the present embodiment, the material of the stiffening plate 5 is PI or FR 4.

In this embodiment, an adhesive or a thermosetting adhesive film or a prepreg is disposed at the bottom of the reinforcing plate 5.

In this embodiment, the manufacturing technique of the reinforced step pad PCB includes the following steps:

a. manufacturing a PCB with a bonding pad;

c. attaching a reinforcing plate to a PCB pad to be raised manually or by a machine, exposing the PCB pad from a window pre-opened on the reinforcing plate, and sticking the reinforcing plate to the PCB after false attaching, pressing and curing;

After the solder paste is printed, components are carried after the solder paste is checked to be correct, and the components can be carried by a machine and manually placed. After the components are welded behind the reflow oven, the purpose of heightening the components by heightening the PCB bonding pad is realized. And continuing the subsequent flow to finish the surface mounting process.

Aiming at different heights of the step bonding pad, the requirements of reinforcement height selection, tin paste steel mesh, printing, reflow parameters and the like can be adjusted according to actual conditions so as to meet the design requirements.

In conclusion, the technology provides a stepped pad PCB manufacturing technology, local pads of the PCB can be increased, conventional components are used, and development cost of non-standard components is avoided.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the present invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims

1. A reinforcement formula ladder pad PCB, includes PCB substrate (1), sets up circuit (2) on PCB substrate (1) and cover hinder and weld ink or cover membrane (3) of circuit (2), a reinforcement formula ladder pad PCB still include with circuit (2) electricity is connected and not by hinder and weld ink or cover a plurality of pad (4) that membrane (3) covered, its characterized in that: at least one be provided with stiffening plate (5) around pad (4), pad (4) set up all around stiffening plate (5) enclose a cavity (6), be provided with tin cream (7) in cavity (6), tin cream (7) with cavity (6) bottom pad (4) electricity is connected.

2. A reinforced stepped solder pad PCB as claimed in claim 1 wherein: the bottom of the solder paste (7) is electrically connected with the bonding pad (4) at the bottom of the cavity (6), and the top of the solder paste (7) is not higher than the top of the cavity (6).

3. A reinforced stepped solder pad PCB as claimed in claim 1 wherein: and a window (8) exposing the welding pad (4) is arranged on the reinforcing plate (5).

4. A reinforced stepped solder pad PCB as claimed in claim 1 wherein: the size of the window (8) is 0-0.2 mm larger than the size of the bonding pad (4) on one side.

5. A reinforced stepped solder pad PCB as claimed in claim 1 wherein: the material of the reinforcing plate (5) is PI or FR 4.

6. A reinforced stepped solder pad PCB as claimed in claim 1 wherein: and an adhesive or a thermosetting adhesive film or a prepreg is arranged at the bottom of the reinforcing plate (5).

7. A manufacturing technique of a reinforced step land PCB as claimed in claim 1, wherein: the manufacturing technique comprises the following steps:

a. manufacturing a PCB with a bonding pad;

8. A reinforced stepped pad PCB manufacturing technique as claimed in claim 7, wherein: in step c, the reinforcing plate is stuck with the PCB after false pasting, pressing and curing.

9. A reinforced stepped pad PCB manufacturing technique as claimed in claim 7, wherein: the method also comprises the following steps between the step c and the step d: the subsequent process requires partial or complete manufacture of the PCB appearance.