CN113316317A - Stamped stepped bonding pad PCB and manufacturing technology - Google Patents

Abstract

The invention discloses and provides a stamping type stepped welding disc PCB and a manufacturing technology thereof, which can realize that part of PCB welding discs have stepped height difference and are not on the same plane, and after the PCB is applied, conventional components can be adopted to realize the product design function, thereby avoiding the high redevelopment cost and time cost of the components. The PCB comprises a PCB substrate, a circuit arranged on the PCB substrate, solder resist ink or a cover film for covering the circuit, and a plurality of bonding pads which are electrically connected with the circuit and are not covered by the solder resist ink or the cover film, wherein at least one bonding pad is a stamping type stepped bonding pad, a stamping boss is arranged on the stamping type stepped bonding pad, a concave cavity corresponding to the stamping boss is arranged below the stamping type stepped bonding pad, and a substrate bulge filled in the concave cavity is arranged on the PCB substrate. The manufacturing technology is mainly characterized in that a lug boss is punched on a PCB which is provided with a cover film and is not subjected to surface electroplating by adopting a die to punch a bonding pad needing to be heightened. The invention is applied to the technical field of PCB manufacturing.

Description

Stamped stepped bonding pad PCB and manufacturing technology

Technical Field

The invention relates to a PCB and a manufacturing technology, in particular to a stamping type stepped welding disc PCB and a manufacturing technology.

Background

With the development of electronic technology, PCBs used in electronic devices are more and more complex, and the PCBs generally need to be equipped with components for realizing complex functions. In some occasions, besides the beautiful board surface, what is more important is that special requirements are required for realizing the design function of a product, and the installation precision of some components is required to be brought forward, for example, some components require that one or more components are required to be ensured to be at the same height, such as some sensors and the like.

The components are usually produced according to a certain standard and have fixed height, thickness and other dimensions, and because the PCB pads are all planar, the PCB pads are at the same height, as shown in fig. 1 and 2. This may prevent certain components from meeting the height criteria. In this case, only components can be replaced or components can be separately manufactured. However, either method may affect the progress and cost of the project, and may even be difficult to solve.

Disclosure of Invention

The technical problem to be solved by the invention is to overcome the defects of the prior art, and provide a stamping type stepped pad PCB and a manufacturing technology thereof, which can realize that part of PCB pads have step height difference and are not on the same plane, and after the PCB is applied, the product design function can be realized by adopting conventional components, thereby avoiding the high component redevelopment cost and time cost.

The technical scheme adopted by the invention is as follows: the stamping stepped welding pad PCB comprises a PCB base material, a circuit arranged on the PCB base material, solder resist ink or a covering film covering the circuit, and a plurality of welding pads which are electrically connected with the circuit and are not covered by the solder resist ink or the covering film, wherein at least one welding pad is a stamping stepped welding pad, a stamping boss is arranged on the stamping stepped welding pad, a concave cavity corresponding to the stamping boss is arranged below the stamping stepped welding pad, and a base material bulge filled in the concave cavity is arranged on the PCB base material.

Further, the top of the stamping boss is flat-topped.

Furthermore, a nickel plating layer is arranged on the stamping boss.

Further, the thickness of the nickel plating layer is 10-15 um.

Furthermore, the circuit, the solder resist ink or the cover film covering the circuit, and the plurality of the welding pads which are electrically connected with the circuit and are not covered by the solder resist ink or the cover film are arranged on the two sides of the PCB substrate.

Further, the height of the stamping boss does not exceed 0.4 mm.

The manufacturing technology of the stamped stepped pad PCB comprises the following steps:

a. manufacturing a PCB with a bonding pad;

b. manufacturing a stamping die: the die adopts a male-female die structure and is used for punching a boss on the bonding pad to heighten the bonding pad;

c. stamping: stamping the back of the bonding pad to be heightened, and applying pressure to the back of the bonding pad through a die punch to generate a boss on the surface of the bonding pad;

d. and electroplating nickel after the die stamping is finished so as to increase the strength of the boss.

Further, in step d, the thickness of the electroplated nickel is 10-15 um.

Further, in step a, the PCB finished product is punched and shaped, and cannot be cut into single pieces.

The invention has the beneficial effects that: because the invention adopts the stamping design, on the PCB which is provided with the covering film and has not been subjected to surface electroplating, a lug boss is stamped on the bonding pad needing to be heightened by adopting die stamping, and then surface nickel plating is carried out once, wherein the thickness of nickel is 10-15 mu m. And then the step bonding pad PCB with different heights can be obtained through the subsequent conventional procedures. And the height of the components can be increased by mounting the components, the height difference of the PCB bonding pad steps is adopted to make up the defect of insufficient height of the conventional components, and the component is prevented from being redeveloped by adopting lower cost.

Drawings

FIG. 1 is a schematic plan view of a PCB;

FIG. 2 is a schematic cross-sectional view of a PCB;

FIG. 3 is a schematic view of a two-sided sheet blank;

fig. 4 is a schematic view of a stamped boss.

Detailed Description

Fig. 3 is a simplified schematic diagram of a double-sided board semi-finished product, showing only the substrate, the bonding pads and the cover film, as shown in fig. 3 and 4. The double-sided board is manufactured conventionally, in order to increase operability and achieve punched appearance of a PCB finished product, the double-sided board cannot be cut into single pieces, in the embodiment, the double-sided board comprises a PCB base material 1, a circuit 2 arranged on the PCB base material 1 and solder resist ink or a covering film 3 covering the circuit 2, the punched stepped pad PCB further comprises a plurality of pads 4 which are electrically connected with the circuit 2 and are not covered by the solder resist ink or the covering film 3, at least one pad 4 is a punched stepped pad, a punched boss 5 is arranged on the punched stepped pad, a concave cavity 6 corresponding to the punched boss 5 is arranged below the punched stepped pad, and a base material bulge 7 filled in the concave cavity 6 is arranged on the PCB base material 1, so that the stability of the punched boss 5 is guaranteed.

In this embodiment, the top of the stamping boss 5 is a flat top, which is beneficial to mounting components.

In this embodiment, the circuit 2, the solder resist ink or the cover film 3 covering the circuit 2, and the pads 4 electrically connected to the circuit 2 and not covered by the solder resist ink or the cover film 3 are disposed on both sides of the PCB substrate 1.

In this embodiment, the height of the stamped boss 5 does not exceed 0.4 mm.

The manufacturing technology of the stamped stepped pad PCB comprises the following steps:

a. manufacturing a PCB with a bonding pad;

b. manufacturing a stamping die: the die adopts a male-female die structure and is used for punching a boss on the bonding pad to heighten the bonding pad;

c. stamping: stamping the back of the bonding pad to be heightened, and applying pressure to the back of the bonding pad through a die punch to generate a boss on the surface of the bonding pad;

d. and electroplating nickel after the die stamping is finished so as to increase the strength of the boss.

Fig. 4 is a die stamping boss. According to the position and the shape of the bonding pad needing to be heightened, a stamping die is designed and manufactured in advance and used for stamping a boss on the bonding pad to heighten the bonding pad. The die adopts a male-female die structure, and the fit clearance and the boss height of the die are adjusted according to the stamping effect so as to obtain an ideal heightening effect on the bonding pad of the PCB.

When punching, punching is carried out from the back of the bonding pad needing to be heightened, and the die punch head applies pressure to the back of the bonding pad, so that the surface of the bonding pad can generate a boss. And adjusting the stamping parameters to obtain the pad boss meeting the requirements, and avoiding the fracture of the copper foil of the pad after stamping. In order to avoid the height of the broken boss of the copper foil from being too high, the height is preferably not more than 0.4 mm.

In this embodiment, the nickel electroplating is performed to a thickness of 10-15um after the die stamping is completed, so as to increase the boss strength.

After the above processes are completed, the subsequent processes are completed according to the conventional method to obtain the PCB with the step bonding pad.

In conclusion, the technology provides a stepped pad PCB manufacturing technology, local pads of the PCB can be increased, conventional components are used, and development cost of non-standard components is avoided.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the present invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims (9)

1. A stamped step pad PCB comprising a PCB substrate (1), a line (2) disposed on said PCB substrate (1) and a solder resist ink or cover film (3) covering said line (2), said stamped step pad PCB further comprising a plurality of pads (4) electrically connected to said line (2) and not covered by said solder resist ink or said cover film (3), characterized in that: at least one pad (4) are punching press formula ladder pad, be equipped with punching press boss (5) above the punching press formula ladder pad, be equipped with below the punching press formula ladder pad with corresponding cavity (6) of punching press boss (5), be equipped with on PCB substrate (1) and fill in protruding (7) of substrate in cavity (6).

2. The stamped step pad PCB of claim 1, wherein: the top of the stamping boss (5) is flat-topped.

3. The stamped step pad PCB of claim 1, wherein: and a nickel plating layer is arranged on the stamping boss (5).

4. A stamped step pad PCB as claimed in claim 3, wherein: the thickness of the nickel plating layer is 10-15 um.

5. The stamped step pad PCB of claim 1, wherein: the two sides of the PCB base material (1) are provided with the circuit (2), solder resist ink or a cover film (3) covering the circuit (2), and a plurality of the solder pads (4) which are electrically connected with the circuit (2) and are not covered by the solder resist ink or the cover film (3).

6. The stamped step pad PCB of claim 1, wherein: the height of the stamping boss (5) is not more than 0.4 mm.

7. A technique of manufacturing a stamped step pad PCB as claimed in claim 1, wherein: the manufacturing technique comprises the following steps:

a. manufacturing a PCB with a bonding pad;

b. manufacturing a stamping die: the die adopts a male-female die structure and is used for punching a boss on the bonding pad to heighten the bonding pad;

c. stamping: stamping the back of the bonding pad to be heightened, and applying pressure to the back of the bonding pad through a die punch to generate a boss on the surface of the bonding pad;

d. and electroplating nickel after the die stamping is finished so as to increase the strength of the boss.

8. The manufacturing technique according to claim 7, wherein: in step d, the thickness of the electroplated nickel is 10-15 um.

9. The manufacturing technique according to claim 7, wherein: in step a, the PCB finished product is punched and shaped, and cannot be cut into single pieces.

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