CN215011312U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN215011312U CN215011312U CN202121418477.3U CN202121418477U CN215011312U CN 215011312 U CN215011312 U CN 215011312U CN 202121418477 U CN202121418477 U CN 202121418477U CN 215011312 U CN215011312 U CN 215011312U
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- China
- Prior art keywords
- copper foil
- circuit board
- power device
- terminal surface
- paster
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Abstract
The utility model provides a circuit board, include: the circuit board body, be provided with multiunit copper foil group on the circuit board body, copper foil group includes first copper foil and second copper foil, the terminal surface is kept away from under the first copper foil second copper foil department is provided with a plurality of first paster power devices, the terminal surface is kept away from under the second copper foil first copper foil department is provided with a plurality of second paster power devices, first paster power device with the terminal surface all is provided with heat radiation fins under the second paster power device. As above, the utility model discloses a circuit board solves among the prior art device heat radiation fins compact welding, makes device during operation heat gathering, the unable radiating problem effectively, and reasonable in design is suitable for production and popularization and application.
Description
Technical Field
The utility model relates to a new forms of energy technical field especially relates to a circuit board.
Background
In the power part of the new energy power supply industry, high-power MOS or triode and diode devices are used, current needs to be controlled bidirectionally in many situations, a single MOS or a single group of MOS cannot effectively control the current, geminate transistors are used, but the geminate transistors are used, and most of the existing geminate transistors are packaged by using patches for the purpose of simplifying the production process.
Because the pair of tubes are generally welded in a back-to-back manner, the most important heat dissipation fins of the device are welded compactly, so that heat is gathered when the device works, and the device cannot dissipate heat effectively.
SUMMERY OF THE UTILITY MODEL
In view of the above shortcomings of the prior art, an object of the present invention is to provide a circuit board for solving the problem of heat dissipation in the prior art that the heat dissipation fins are compactly welded, so that the heat is accumulated when the device is in operation, and the heat dissipation is not effective.
To achieve the above and other related objects, the present invention provides a circuit board, including: the circuit board body, be provided with multiunit copper foil group on the circuit board body, copper foil group includes first copper foil and second copper foil, the terminal surface is kept away from under the first copper foil second copper foil department is provided with a plurality of first paster power devices, the terminal surface is kept away from under the second copper foil first copper foil department is provided with a plurality of second paster power devices, first paster power device with the terminal surface all is provided with heat radiation fins under the second paster power device.
As a preferred technical scheme, the first patch power device is connected with the circuit board body through a second welding pin and is connected with a second welding pin of the second patch power device.
As a preferred technical scheme, the second patch power device is connected with the circuit board body through a second welding pin and is connected with a second welding pin of the first patch power device.
As a preferred technical solution, the first patch power device is provided with five (or more, according to actual requirements).
As a preferred technical solution, the second patch power device is provided with five (or more, according to actual requirements).
Preferably, the first copper foil and the second copper foil are both provided with lead bolts.
As described above, the utility model relates to a circuit board has following beneficial effect: the first surface-mounted power device is far away from the second copper foil, the second surface-mounted power device is far away from the first copper foil, and the lower end faces of the first surface-mounted power device and the second surface-mounted power device are respectively provided with the radiating fins, namely the radiating fins for radiating the first copper foil and the second copper foil are arranged in the opposite direction, so that the problems of compact radiating fins and slow radiating are avoided.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board disclosed in an embodiment of the present invention;
wherein the reference numerals are specified as follows: 1. a first copper foil; 2. a second copper foil; 3. a first patch power device; 4. a second patch power device; 5. a second solder pin; 6. and a lead bolt.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
Referring to fig. 1, the present invention provides a circuit board, including: the circuit board body is provided with multiunit copper foil group on the circuit board body, and copper foil group includes first copper foil 1 and second copper foil 2, and the terminal surface is kept away from second copper foil 2 department and is provided with a plurality of first paster power device 3 under the first copper foil 1, and the terminal surface is kept away from first copper foil 1 department and is provided with a plurality of second paster power device 4 under the second copper foil 2, and terminal surface all is provided with heat radiation fin under first paster power device 3 and the second paster power device 4.
In the circuit board provided by this embodiment, the first chip power device 3 is connected to the circuit board body through the second soldering pin 5 and is connected to the second soldering pin of the second chip power device.
In the circuit board provided by this embodiment, the second chip power device 4 is connected to the circuit board body through the second soldering pin and is connected to the second soldering pin of the first chip power device.
In the circuit board provided in this embodiment, five first patch power devices 3 are provided.
In the circuit board provided in this embodiment, five second patch power devices 4 are provided.
In the circuit board provided by this embodiment, the first copper foil 1 and the second copper foil 2 are both provided with the lead bolts 6.
In a specific use: the first chip power device 3 is far away from the second copper foil 2, the second chip power device 4 is far away from the first copper foil 1, and the lower end faces of the first chip power device 3 and the second chip power device 4 are both provided with heat dissipation fins, namely the heat dissipation fins for dissipating heat of the first copper foil 1 and the second copper foil 2 are arranged in the opposite direction, so that the problems that the heat dissipation fins are compact together and the heat dissipation is slow are solved.
To sum up, the utility model relates to a circuit board solves among the prior art device heat radiation fins compact welding, makes device during operation heat gathering, the unable radiating problem that effectively, reasonable in design is suitable for production and popularization and application. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (6)
1. A circuit board, comprising: the circuit board body, be provided with multiunit copper foil group on the circuit board body, copper foil group includes first copper foil and second copper foil, the terminal surface is kept away from under the first copper foil second copper foil department is provided with a plurality of first paster power devices, the terminal surface is kept away from under the second copper foil first copper foil department is provided with a plurality of second paster power devices, first paster power device with the terminal surface all is provided with heat radiation fins under the second paster power device.
2. The circuit board of claim 1, wherein the first chip power device is connected to the circuit board body via a second solder pin and to a second solder pin of a second chip power device.
3. The circuit board of claim 2, wherein the second chip power device is connected to the circuit board body through a second solder pin and to the second solder pin of the first chip power device.
4. A circuit board according to claim 1, wherein there are five of said first patch power devices.
5. A circuit board according to claim 1, wherein there are five of said second patch power devices.
6. The circuit board of claim 1, wherein said first copper foil and said second copper foil are each provided with lead screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121418477.3U CN215011312U (en) | 2021-06-24 | 2021-06-24 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121418477.3U CN215011312U (en) | 2021-06-24 | 2021-06-24 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215011312U true CN215011312U (en) | 2021-12-03 |
Family
ID=79082800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121418477.3U Active CN215011312U (en) | 2021-06-24 | 2021-06-24 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215011312U (en) |
-
2021
- 2021-06-24 CN CN202121418477.3U patent/CN215011312U/en active Active
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