CN214936127U - Heat radiation structure and water purification unit - Google Patents
Heat radiation structure and water purification unit Download PDFInfo
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- CN214936127U CN214936127U CN202120532809.4U CN202120532809U CN214936127U CN 214936127 U CN214936127 U CN 214936127U CN 202120532809 U CN202120532809 U CN 202120532809U CN 214936127 U CN214936127 U CN 214936127U
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Abstract
The utility model discloses a heat radiation structure and water purification unit, this heat radiation structure includes: the water channel plate comprises a plurality of water flow channels of the water purifying equipment, and is provided with a water inlet and a water outlet which are communicated with any water flow channel on the water channel plate; one end of the heat dissipation pipeline is connected with the water inlet of the water circuit board, and the other end of the heat dissipation pipeline is connected with the water outlet of the water circuit board; the chip is connected with the heat dissipation pipeline; the heat generated by the chip during working is transferred to the heat dissipation pipeline, and water flows into the heat dissipation pipeline after the water channel plate is filled with water to take away the heat on the heat dissipation pipeline. This technical scheme can dispel the heat to the chip better, improves the life of chip, avoids the too high and damage that causes of chip operating temperature, and above-mentioned heat radiation structure volume is less, can save water purification unit's inner space to make the spatial arrangement of each part in the water purification unit more reasonable, and reduce water purification unit complete machine volume, practice thrift the exterior space convenience of customers and put.
Description
Technical Field
The utility model relates to a water purification unit technical field especially relates to a heat radiation structure and water purification unit.
Background
The existing water purifying equipment, in order to solve the technical problems that the heating temperature can not be continuously controlled by the fixed power of the heating module, the heating temperature is slow, etc., a power adjusting module is added for controlling the power of the heating module, however, because the power adjusting module can generate great heat, the surface temperature of a power adjusting IC (chip) can be very high due to the heat, the service life of the IC can be reduced even the IC can be irreversibly damaged due to the very high temperature, therefore, a radiator is needed to be added for radiating the power adjusting IC, at present, the heat radiation of the power adjusting IC adopts two traditional heat radiation modes of natural cooling or air cooling, the two traditional heat radiation modes both have to adopt radiators with larger volume, however, the larger radiators have certain limits corresponding to the internal space layout and the whole machine arrangement of the water purifying equipment, and the heat radiation effects of the two radiators are not obvious all the time, often causing the power conditioning IC to be damaged by overheating.
SUMMERY OF THE UTILITY MODEL
The embodiment of the disclosure provides a heat dissipation structure and water purification unit. The technical scheme is as follows:
according to a first aspect of the embodiments of the present disclosure, there is provided a heat dissipation structure, including:
the water purification device comprises a water purification device and a water circuit board, wherein the water circuit board comprises a plurality of water flow channels of the water purification device, a water inlet and a water outlet are formed in the water circuit board, and the water inlet and the water outlet are communicated with any water flow channel on the water circuit board;
one end of the heat dissipation pipeline is connected with the water inlet of the water circuit board, and the other end of the heat dissipation pipeline is connected with the water outlet of the water circuit board;
the chip is connected with the heat dissipation pipeline;
the heat generated by the chip during working is transferred to the heat dissipation pipeline, and water flows into the heat dissipation pipeline after the water is supplied to the water channel plate so as to take away the heat on the heat dissipation pipeline.
In one embodiment, the heat dissipation pipe comprises a water inlet elbow, a water outlet elbow and a heat dissipation pipe, wherein:
the one end of elbow of intaking with the water inlet of water route board is connected, the other end of elbow of intaking with the one end of cooling tube is connected, the other end of cooling tube with the one end of outlet elbow is connected, the other end of outlet elbow with the delivery port of water route board is connected.
In one embodiment, the heat radiator further comprises a heat radiating block, the chip is connected with the heat radiating pipe through the heat radiating block, and the heat radiating block comprises a plurality of heat radiating fins;
wherein, the periphery part or whole of cooling tube with the radiating block is inconsistent, the chip with the radiating block is inconsistent.
In one embodiment, the heat dissipation block is provided with a placing groove; the chip is fixed in the placing groove and is abutted against the inner wall of the placing groove.
In one embodiment, the heat dissipation block is provided with a contact groove, and the heat dissipation tube is at least partially accommodated in the contact groove and is abutted against the inner wall of the contact groove.
In one embodiment, the heat dissipation pipe is a heat conducting metal member, and the heat dissipation block is a heat conducting metal member.
In one embodiment, the water circuit board is provided with a fixing piece; the fixing piece is used for fixing the radiating block on the water circuit board, wherein the fixing piece enables the radiating block to be partially suspended when being fixed.
In one embodiment, the chip comprises a power regulating chip for regulating the heating power of a heating module on the water purification apparatus.
According to a second aspect of the embodiments of the present disclosure, there is provided a water purifying apparatus including any one of the heat dissipation structures described above.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
the heat radiation structure that this embodiment provided sets up a heat dissipation pipeline on the water route board, connects this heat dissipation pipeline through the chip, so gives the heat dissipation pipeline with the heat transfer that the chip produced, is taken away by the rivers of water route inboard circulation heat on the heat dissipation pipeline to reduce the temperature of heat dissipation pipeline, and then reduce the temperature of chip, accelerate the heat dissipation of chip, in order to guarantee that the operating temperature of chip is in controllable range, in order to improve the heat dispersion of chip, and then improved the life of chip, can avoid the too high damage that causes of chip operating temperature. And above-mentioned heat radiation structure volume is less, can save water purification unit's inner space to make the spatial arrangement of each part in the water purification unit more reasonable, and reduce water purification unit complete machine volume, practice thrift the exterior space convenience of customers and put.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram illustrating a heat dissipation structure according to an exemplary embodiment.
Fig. 2 is an exploded view of a heat dissipation structure according to an exemplary embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The present disclosure provides a heat dissipation structure, fig. 1 is a schematic view of a heat dissipation structure shown according to an exemplary embodiment, and fig. 2 is a schematic view of a heat dissipation structure shown according to an exemplary embodiment.
As shown in fig. 1, the heat dissipation structure includes: a water board 11, a heat dissipation pipeline 12 and a chip 13.
Here, this water route board 11 is water purification unit's water route carrier, including water purification unit's a plurality of rivers passageways, some corresponding water purification filter cores of connection of these rivers passageways, some water inlet outlet of connecting water purification unit, corresponding rivers passageway will circulate at water purification unit during operation, the water of treating that flows in from this water purification unit water inlet will be through the corresponding water purification filter core of each rivers passageway flow direction, after each water purification filter core purifies, can flow to through the rivers passageway flow direction of play water purification unit's delivery port flows for the user uses. As shown in fig. 2, the water path plate 11 provided in this embodiment is further provided with a water inlet 111 and a water outlet 112, and the water inlet 111 and the water outlet 112 are communicated with any water flow channel on the water path plate; one end of the heat dissipation pipeline 12 is connected with the water inlet 111 of the water circuit board 11, and the other end of the heat dissipation pipeline 12 is connected with the water outlet 112 of the water circuit board 11; when the heat dissipation pipe 12 is installed, the heat dissipation pipe 12 can be directly inserted into the water inlet 111 and the water outlet 112 of the waterway plate 11, so that the installation is convenient and fast, and the cost is low; thus, when the waterway of the waterway plate 11 is circulated, and the water flow channel a communicating the water inlet 111 and the water outlet 112 is circulated, part of the water flow in the water flow channel a is shunted into the heat dissipation pipeline 12 from the water inlet 111 of the waterway plate 11, and then flows to the water flow channel a from the water outlet 112.
The chip 13 is connected with the heat dissipation pipeline 12; for example, as shown in fig. 1, the chip 13 may be connected to the heat dissipation pipe 12 by other devices, and of course, the chip 13 may also be directly connected to the heat dissipation pipe 12, which is not limited herein.
Here, when the water purifying apparatus starts to operate, the chip 13 will also start to operate, and the water channel in the water channel plate 11 starts to circulate to produce water. Because the chip 13 is connected with the heat dissipation pipeline 12, the heat generated by the chip 13 during working can be transferred to the heat dissipation pipeline 12, after the water board 11 is filled with water, the water flow in the corresponding water flow channel can enter the heat dissipation pipeline 12 to take away the heat on the heat dissipation pipeline 12, the temperature of the heat dissipation pipeline 13 is reduced, the temperature of the chip 13 is further reduced, the heat dissipation of the chip 13 is accelerated, the working temperature of the chip 13 is ensured to be within a controllable range, the heat dissipation performance of the chip 13 is improved, the service life of the chip 13 is prolonged, and the damage caused by the overhigh working temperature of the chip 13 can be avoided. Moreover, the water flowing through the heat dissipation pipeline 12 can flow into the corresponding water flow channel through the water outlet 112, and continue to circulate for producing water.
The heat radiation structure that this embodiment provided sets up a heat dissipation pipeline on the water route board, connects this heat dissipation pipeline through the chip, so gives the heat dissipation pipeline with the heat transfer that the chip produced, is taken away by the rivers of water route inboard circulation heat on the heat dissipation pipeline to reduce the temperature of heat dissipation pipeline, and then reduce the temperature of chip, accelerate the heat dissipation of chip, in order to guarantee that the operating temperature of chip is in controllable range, in order to improve the heat dispersion of chip, and then improved the life of chip, can avoid the too high damage that causes of chip operating temperature. And above-mentioned heat radiation structure volume is less, can save water purification unit's inner space to make the spatial arrangement of each part in the water purification unit more reasonable, and reduce water purification unit complete machine volume, practice thrift the exterior space convenience of customers and put.
In one possible embodiment, as shown in fig. 2, the heat dissipation pipe 12 includes a water inlet elbow 121, a water outlet elbow 123 and a heat dissipation pipe 122, wherein: the one end of elbow 121 of intaking with the water inlet 111 of water route board 11 is connected, the other end of elbow 121 of intaking with the one end of cooling tube 122 is connected, the other end of cooling tube 122 with the one end of delivery elbow 123 is connected, the other end of delivery elbow 123 with the delivery port 112 of water route board 11 is connected. Thus, the water flow in the corresponding water flow channel of the waterway plate 11 can flow to the inlet elbow 121 through the inlet 111 of the waterway plate 11, and then flow to the outlet 112 of the waterway plate 11 through the inlet elbow 121, the heat dissipation pipe 122 and the outlet elbow 123.
In this embodiment, the heat dissipation pipe 12 is formed by assembling the water inlet elbow 121, the water outlet elbow 123 and the heat dissipation pipe 122, and is simple to implement and low in cost.
In a possible embodiment, as shown in fig. 2, the heat dissipation structure further includes a heat dissipation block 14, the chip 13 is connected to the heat dissipation tube 122 through the heat dissipation block 14, and the heat dissipation block 14 includes a plurality of heat dissipation fins 141; for example, as shown in fig. 2, the chip 13 may be mounted on the heat dissipating block 14 by screws, so as to realize the abutting connection between the chip 13 and the heat dissipating block 14, and at this time, a connecting member may be disposed on the waterway plate 11 to fix the chip 13 on the waterway plate 11, so as to fix the chip 13 more stably. Thus, the heat generated by the chip 13 can be transferred to the heat dissipation tube 122 through the heat dissipation plate 14 for heat dissipation, and the heat dissipation block 14 can also absorb the heat generated by the chip 13 and dissipate the heat by the heat dissipation plate 141, so as to further reduce the temperature of the chip 13 during operation and improve the heat dissipation efficiency of the heat dissipation structure for the chip 13.
In a possible embodiment, the heat dissipation block 14 is provided with a placement groove; the chip is fixed in the placement groove and is abutted against the inner wall of the placement groove, and here, the chip can be fixed on the heat dissipation block through a connecting member such as a screw. So, can improve the stability of being connected between chip and the radiating block on the one hand, on the other hand can increase the area of contact of chip and radiating block to improve the efficiency of chip to the radiating block heat transfer, further accelerate the temperature that reduces the chip during operation, improve this heat radiation structure to the radiating efficiency of this chip.
In one possible embodiment, as shown in fig. 2, the heat dissipating block 14 is provided with a contact groove 142, the heat dissipating tube 122 is at least partially accommodated in the contact groove 142 and abuts against the inner wall of the contact groove 142, so that the heat dissipating block 14 can transfer the heat generated by the operation of the chip 13 to the heat dissipating tube 122 through the contact groove 142, and the contact groove 142 can increase the contact area between the heat dissipating block 14 and the heat dissipating tube 122, thereby increasing the heat exchange capacity between the heat dissipating block 14 and the heat dissipating tube 122.
Here, when the contact groove 142 may be a semicircular groove as shown in fig. 2, only a portion of the outer wall of the radiating pipe 122 abuts against the inner wall of the contact groove 142, thus facilitating the installation of the radiating block 14 and the radiating pipe 122. Of course, the contact groove may be a tubular through groove, and at this time, the outer wall of the heat dissipation pipe 122 may be completely abutted against the inner wall of the contact groove 142, the contact area between the heat dissipation pipe 122 and the heat dissipation block 14 is the largest, the heat exchange capability between the heat dissipation pipe 122 and the heat dissipation block 14 is better, and the heat dissipation efficiency is higher.
It should be noted that, during assembly, the heat dissipating pipe 122 may be inserted into the contact groove 142 of the heat dissipating block 14, then the heat dissipating pipe 12 may be assembled with the water inlet elbow 121 and the water outlet elbow 123, and then the heat dissipating pipe 12 may be directly inserted into the water inlet 111 and the water outlet 112 of the water circuit board 11.
In one possible embodiment, the heat dissipation pipe is a heat conductive metal member, and the heat dissipation block is a heat conductive metal member.
Here, the metal member has better heat transfer efficiency, so that the heat of the chip can be transferred to the heat dissipation block 14 more efficiently, the heat dissipation block 14 can realize faster heat dissipation, and transfer the heat to the heat dissipation pipe 122, and the heat is absorbed by the water flowing in the heat dissipation pipe 122, so that the heat dissipation of the chip 13 can be better realized, and the temperature of the chip 13 can be reduced more quickly.
In a possible embodiment, the water circuit board is provided with a fixing member 15; the fixing member 15 is configured to fix the heat dissipation block 14 on the water circuit board 11, wherein the fixing member 15 makes the heat dissipation block 14 partially suspend when being fixed, so that the heat dissipation block 14 can achieve faster heat dissipation.
In a possible embodiment, the chip comprises a power regulating chip for regulating the heating power of a heating module on the water purification device.
Here, when the user got the hot water and uses, the last heating module of this water purification unit need begin to heat work, this power adjustment chip also can begin to work, adjust the heating power of this heating module, at this moment, the power adjustment chip of work can produce great heat, the temperature easily reaches more than 80 ℃, if not control the temperature of power adjustment chip, easily lead to the local high temperature at power adjustment chip position in the water purification unit, and the water purification unit normal water is carried through the silicone tube, local too high temperature, and be close to this silicone tube and easily lead to out the water peculiar smell, influence user experience. Adopt foretell heat radiation structure can give the cooling tube 122 with the heat transfer that the during operation of power adjustment chip produced, take away this corresponding heat by the rivers in the cooling tube 122, can dispel the heat to this power adjustment chip well and cool down, not only protect this power adjustment chip, also guarantee user's water experience.
The embodiment also provides a water purification unit, which comprises any one of the heat dissipation structures.
Here, the water purifying apparatus may be a water purifying apparatus provided with a heating module, the chip in the heat dissipation structure may be a power adjustment chip, the water purifying apparatus is mainly used for filtering and heating raw water, and may include a plurality of filter elements, a water circuit board, a temperature controller, a heating module, and any one of the heat dissipation structures, the water circuit board is used for conveying the raw water to each filter element for filtering, the heating module is used for heating purified water conveyed by the water circuit board after being purified, the temperature controller is used for detecting the temperature of the water heated by the heating module, and the power adjustment chip is used for adjusting the heating power of the heating module according to the temperature detected by the temperature controller and the temperature required by a user.
Here, when the user gets hot water for use, the heating module on the water purification unit needs to start heating, the power adjustment chip also starts to operate, the heating power of the heating module is adjusted, at this time, the power adjustment chip that operates can generate large heat, any of the above-mentioned heat dissipation structures can transmit the heat generated by the power adjustment chip during operation to the heat dissipation pipe 122, the corresponding heat is taken away by the water flow in the heat dissipation pipe 122, and the heat dissipation and cooling of the power adjustment chip can be well performed. In addition, the water flow in the heat dissipation pipe 122 can enter the corresponding water flow channel of the water path plate 11 through the water outlet 112 of the water path plate 11, the heat taken away from the heat dissipation pipe 122 by the water flow entering the water path plate has a certain temperature, and the water can flow to the heating module for heating after being filtered, so that the heat generated by the chip 13 can heat the water conveyed to the heating module, the temperature of the water is increased, the heat generated by the chip 13 is recycled, and the electric energy loss of the heating operation of the heating module can be reduced.
The embodiment uses above-mentioned heat radiation structure on water purification unit, can give the cooling tube with the heat transfer that the chip produced, rivers in the cooling tube are taken away, with the temperature that reduces the chip, and then accelerate the heat dissipation of chip, with the heat dispersion that improves the chip, and then the life of chip has been improved, with the fault rate that reduces water purification unit, and above-mentioned heat radiation structure volume is less, water purification unit's inner space can be saved, so that the spatial arrangement of each part in water purification unit is more reasonable, and reduce water purification unit complete machine volume, practice thrift exterior space convenience of customers and put.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (9)
1. A heat dissipation structure, comprising:
the water purification device comprises a water purification device and a water circuit board, wherein the water circuit board comprises a plurality of water flow channels of the water purification device, a water inlet and a water outlet are formed in the water circuit board, and the water inlet and the water outlet are communicated with any water flow channel on the water circuit board;
one end of the heat dissipation pipeline is connected with the water inlet of the water circuit board, and the other end of the heat dissipation pipeline is connected with the water outlet of the water circuit board;
the chip is connected with the heat dissipation pipeline;
the heat generated by the chip during working is transferred to the heat dissipation pipeline, and water flows into the heat dissipation pipeline after the water is supplied to the water channel plate so as to take away the heat on the heat dissipation pipeline.
2. The heat dissipating structure of claim 1, wherein the heat dissipating pipe comprises a water inlet elbow, a water outlet elbow, and a heat dissipating pipe, wherein:
the one end of elbow of intaking with the water inlet of water route board is connected, the other end of elbow of intaking with the one end of cooling tube is connected, the other end of cooling tube with the one end of outlet elbow is connected, the other end of outlet elbow with the delivery port of water route board is connected.
3. The heat dissipating structure of claim 2, further comprising a heat slug, wherein the chip is connected to the heat dissipating tube via the heat slug, and wherein the heat slug comprises a plurality of fins;
wherein, the periphery part or whole of cooling tube with the radiating block is inconsistent, the chip with the radiating block is inconsistent.
4. The heat dissipation structure according to claim 3, wherein a placement groove is provided on the heat dissipation block; the chip is fixed in the placing groove and is abutted against the inner wall of the placing groove.
5. The heat dissipating structure of claim 3, wherein the heat dissipating block is provided with a contact groove, and the heat dissipating pipe is at least partially received in the contact groove and abuts against an inner wall of the contact groove.
6. The heat dissipating structure of claim 3, wherein the heat dissipating pipe is a heat conductive metal member and the heat dissipating block is a heat conductive metal member.
7. The heat dissipating structure of claim 3, wherein the water passage plate is provided with a fixing member; the fixing piece is used for fixing the radiating block on the water circuit board, wherein the fixing piece enables the radiating block to be partially suspended when the radiating block is fixed.
8. The heat dissipation structure of claim 1, wherein the chip comprises a power conditioning chip for conditioning heating power of a heating module on the water purification apparatus.
9. A water purifying apparatus, characterized by comprising the heat dissipating structure of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120532809.4U CN214936127U (en) | 2021-03-15 | 2021-03-15 | Heat radiation structure and water purification unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120532809.4U CN214936127U (en) | 2021-03-15 | 2021-03-15 | Heat radiation structure and water purification unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214936127U true CN214936127U (en) | 2021-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120532809.4U Active CN214936127U (en) | 2021-03-15 | 2021-03-15 | Heat radiation structure and water purification unit |
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|---|---|
| CN (1) | CN214936127U (en) |
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2021
- 2021-03-15 CN CN202120532809.4U patent/CN214936127U/en active Active
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