CN214898379U

CN214898379U - Multi-size substrate wafer loading mechanism

Info

Publication number: CN214898379U
Application number: CN202022586656.XU
Authority: CN
Inventors: 吴永利
Original assignee: Xinmi Xiamen Semiconductor Equipment Co ltd
Current assignee: Xinmi Xiamen Semiconductor Equipment Co ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-11-26
Anticipated expiration: 2030-11-10

Abstract

The utility model relates to a multi-size substrate wafer loading mechanism, which comprises a main loading device, a secondary loading device, a supporting rod, a plurality of supporting columns and a rotating mechanism, wherein the rotating mechanism is positioned at the bottom center of the supporting rod, the supporting columns are positioned at the top end of the supporting rod, the supporting columns are close to the two sides of the supporting rod, the main loading device is positioned at the top end of one side of the supporting column, the secondary loading device is positioned at the bottom end of one side of the supporting column far away from the main loading device, the main loading device and the secondary loading device are both provided with a bearing platform, the bearing platform comprises a sensor, a first electric rail, a first motor, a transmission groove, an identifier and a transmission block, the substrate or wafer in the process of more rapid and efficient replacement of the main loading device and the secondary loading device is contacted with an induction substrate or wafer through the sensor, the damage of the substrate or the wafer caused by the contact force transition is prevented, and the substrate or the wafer is accurately identified through the identifier.

Description

Multi-size substrate wafer loading mechanism

Technical Field

The utility model relates to a loading equipment technical field specifically is many sizes base plate wafer loading mechanism.

Background

As is well known, the substrate in the semiconductor industry generally refers to a sheet material used for producing display devices and the like. The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and doped into a silicon crystal seed crystal, then the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely a wafer. At present, the domestic wafer production line is mainly based on 8 inches and 12 inches, the main processing modes of wafers are wafer processing and batch processing, namely 1 or more wafers are processed simultaneously, along with the characteristic dimension of semiconductors is smaller and smaller, the processing and measuring equipment is more and more advanced, so that the wafer processing has new data characteristics, meanwhile, the characteristic dimension is reduced, the influence of the particle number in the air on the quality and reliability of processed wafers is increased during the wafer processing, and along with the improvement of cleanness, the particle number also has new data characteristics, and in the existing production process.

If the patent is named as "wafer loading device" in the patent publication "CN 201720060492.2", it includes a loading chamber, a wafer box, a supporting device, a safety lock and a position sensor; wherein the wafer cassette is disposed within the loading chamber; the supporting device comprises a supporting shaft and a driving device, the supporting shaft supports the wafer box, and the driving device enables the wafer box to move along the axial direction of the supporting shaft; the safety lock can lock the supporting shaft to stop the wafer box from moving; the position sensor detects the position of the wafer box and sends the detected position of the wafer box to the driving device and the safety lock, the loading device can only load one wafer, bearing tables with other sizes need to be replaced, the cost and complexity required by manufacturing are increased, a loading device for substrates or wafers with different sizes is needed, and a loading mechanism for the correct technological process of the substrates and wafers with different sizes is guaranteed on the same device.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a loading attachment of unidimensional base plate or wafer has ensured the loading mechanism of the not correct technology processing procedure of unidimensional base plate wafer on the same equipment.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the multi-size substrate wafer loading mechanism comprises a main loading device, a slave loading device, a support rod, a support column and a rotating mechanism; the rotating mechanism is positioned at the center of the bottom end of the supporting rod; the supporting columns are positioned at two ends of the supporting rod, a plurality of supporting columns are arranged, the main loading device is positioned at one end of each supporting column, and the auxiliary loading devices are positioned at the other ends of the supporting columns; the main loading device and the auxiliary loading device are provided with bearing tables; the plummer includes sensor, first electric rail, first motor, transmission groove, recognizer and transmission piece, first motor is located the bottom of plummer, first electric rail is located the outside of first motor, the transmission groove is located one side of plummer, the transmission piece is located the top of plummer, just the transmission piece is located the top of transmission groove, first electric rail is connected the bottom of transmission piece, the sensor is located the inside of transmission piece, the recognizer is located the inside top of plummer, just the recognizer is close to the top of first motor, be equipped with circuit line connection between recognizer and the first motor, be equipped with circuit line connection between sensor and the first motor, first motor with be equipped with circuit line connection between the first electric rail.

For the length of convenient staff adjustment bracing piece, the utility model discloses the improvement has, be equipped with second electric rail, second motor and transfer line on the bracing piece, the second motor is located the inside central point of bracing piece puts, the transfer line is located the both sides of bracing piece, just the transfer line is close to the central point of bracing piece puts, the second electric rail is located the outside of transfer line, just the second electric rail with the inboard electric rail of bracing piece is connected, the second motor with be equipped with circuit line between the second electric rail and connect.

In order to increase the accuracy of recognizer, the utility model discloses the improvement has, the top of recognizer is equipped with miniature discernment camera, miniature discernment camera with be equipped with circuit line connection between the recognizer.

In order to prevent that miniature discernment camera from colliding with the damage, the utility model discloses the improvement has, the miniature discernment camera outside is equipped with the protective housing.

In order to prevent to collide with when the transmission piece removes and damage base plate or wafer, the utility model discloses the improvement has, the outside of transmission piece is equipped with soft glue film.

In order to facilitate the operation of the mechanism, the utility model discloses the improvement have, first electric rail and the type of second electric rail is electronic linear slide rail.

In order to reduce the cost of manufacture, the utility model discloses improve to have, increase the work efficiency of this mechanism, the utility model discloses the improvement has, first motor and the inside of second motor is equipped with the motor jar.

In order to reduce the use space, the utility model discloses the improvement has, the type of motor jar is small-size motor jar.

(III) advantageous effects

Compared with the prior art, the utility model provides a many sizes base plate wafer loading mechanism possesses following beneficial effect:

this loading mechanism, through main loading attachment and from the base plate or the wafer in the change process of loading attachment efficiency more, carry out contact induction base plate or wafer through the sensor, prevent that the contact force transition from leading to base plate or wafer to damage, carry out accurate discernment base plate or wafer through the recognizer, make the transmission piece carry out the inboard removal to the plummer through first electric rail, with accurate fixed base plate or wafer, make things convenient for next process normal clear, moreover, the steam generator is simple in structure, make things convenient for staff to maintain, therefore, the manufacturing cost is low, it is troublesome to have solved the unnecessary because of the size difference brings.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a front view of the present invention;

FIG. 3 is an enlarged top half-plan view of the main or slave loading unit of FIG. 1 according to the present invention;

fig. 4 is an enlarged front half-plane view of the main loader or the slave loader of fig. 1 according to the present invention.

In the figure: 1. a main loading device; 2. a slave loading device; 3. a sensor; 4. a bearing table; 5. a first power rail; 6. a first motor; 7. a transmission groove; 8. a transmission block; 9. a soft adhesive layer; 10. a support bar; 11. A support pillar; 12. a rotating mechanism; 13. a second power rail; 14. a second motor; 15. an identifier; 16. and a transmission rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention relates to a multi-sized substrate wafer loading mechanism, which comprises a main loading device 1, a sub-loading device 2, a support rod 10, a support column 11 and a rotating mechanism 12; the rotating mechanism 12 is positioned at the bottom center of the support rod 10; the supporting columns 11 are positioned at two ends of the supporting rod 10, a plurality of supporting columns 11 are arranged, the main loading device 1 is positioned at one end of the supporting columns 11, and the auxiliary loading device 2 is positioned at the other end of the supporting columns 11; the master loading apparatus 1 and the slave loading apparatus 2 are each provided with a loading table 4.

The bearing table 4 comprises a sensor 3, a first electric rail 5, a first motor 6, a transmission groove 7, an identifier 15 and a transmission block 8, the first motor 6 is positioned at the bottom end of the bearing table 4, the first electric rail 5 is positioned at the outer side of the first motor 6, the transmission groove 7 is positioned at one side of the bearing table 4, the transmission block 8 is positioned at the top end of the bearing table 4, the transmission block 8 is positioned above the transmission groove 7, the first electric rail 5 is connected with the bottom end of the transmission block 8, the sensor 3 is positioned inside the transmission block 8, the identifier 15 is positioned at the top end inside the bearing table 4, the identifier 15 is close to the top end of the first motor 6, a circuit line connection is arranged between the identifier 15 and the first motor 6, a circuit line connection is arranged between the sensor 3 and the first motor 6, and a circuit line is arranged between the first motor and the first power rail 5.

In summary, when the loading mechanism is used, a worker connects the loading mechanism to a power supply, inputs operation parameters through connecting other devices, and accurately identifies a substrate or a wafer through the identifier 15, the identifier 15 is a conventional identifier in the market, the identifier 15 transmits information to the first motor 6 through a circuit line, the first motor 6 starts the first electric rail 5 through a circuit line, the first electric rail 5 moves the transmission block 8, the transmission block 8 moves towards the inner side of the bearing table 4 through the transmission groove 7, the sensor 3 makes contact with the substrate or the wafer, the sensor 3 transmits information to the first motor 6 to stop the first electric rail 5 to accurately fix the substrate or the wafer, the substrate or the wafer is prevented from being damaged due to transitional contact force, the substrate or the wafer is replaced through the main loading device 1 and the loading device 2, make things convenient for next process to normally go on, control second electric rail 13 through second motor 14, make bracing piece 10 remove on second electric rail 13, get into the inside of bracing piece 10 through transfer line 16, realize the flexible removal to bracing piece 10, make things convenient for the staff to adjust the position according to usage space and when placing base plate or wafer, make things convenient for staff or other equipment to place base plate or wafer, the manual adjustment time that has significantly reduced, make things convenient for staff's operation, it is more convenient to produce, moreover, the steam generator is simple in structure, make things convenient for staff's maintenance, low in manufacturing cost, it is troublesome to have solved the unnecessary that brings because of the size difference.

In this embodiment, be equipped with second electric rail 13, second motor 14 and transfer line 16 on the bracing piece 10, second motor 14 is located the inside central point of bracing piece 10 puts, transfer line 16 is located the both sides of bracing piece 10, just transfer line 16 is close to the central point of bracing piece 10 puts, second electric rail 13 is located the outside of transfer line 16, just second electric rail 13 with the inboard electric rail of bracing piece 10 is connected, second motor 14 with be equipped with circuit line connection between the second electric rail 13, make things convenient for the staff to adjust the length of bracing piece.

In this embodiment, the top of recognizer 15 is equipped with miniature discernment camera, miniature discernment camera with be equipped with circuit line connection between recognizer 15, increase the accuracy of recognizer.

In this embodiment, the miniature discernment camera outside is equipped with the protective housing, prevents that miniature discernment camera from colliding with the damage.

In this embodiment, the outside of transmission block 8 is equipped with soft glue layer 9, and damage base plate or wafer are collided with when preventing that the transmission block from removing.

In this embodiment, the first power rail 5 and the second power rail 13 are electric linear slide rails, which is convenient for the mechanism to operate.

In this embodiment, the first motor 6 and the second motor 14 are provided with motor cylinders therein, so that the manufacturing cost is reduced, and the working efficiency of the mechanism is increased.

In this embodiment, the type of the motor cylinder is a small motor cylinder, which reduces the use space.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The multi-size substrate wafer loading mechanism is characterized by comprising a main loading device (1), a secondary loading device (2), a support rod (10), a support column (11) and a rotating mechanism (12); the rotating mechanism (12) is positioned at the center of the bottom end of the supporting rod (10); the supporting columns (11) are positioned at two ends of the supporting rod (10), a plurality of supporting columns (11) are arranged, the main loading device (1) is positioned at one end of each supporting column (11), and the auxiliary loading device (2) is positioned at the other end of each supporting column (11); the main loading device (1) and the auxiliary loading device (2) are both provided with bearing tables (4); the bearing platform (4) comprises a sensor (3), a first electric rail (5), a first motor (6), a transmission groove (7), an identifier (15) and a transmission block (8), the first motor (6) is positioned at the bottom end of the bearing platform (4), the first electric rail (5) is positioned at the outer side of the first motor (6), the transmission groove (7) is positioned at one side of the bearing platform (4), the transmission block (8) is positioned at the top end of the bearing platform (4), the transmission block (8) is positioned above the transmission groove (7), the first electric rail (5) is connected with the bottom end of the transmission block (8), the sensor (3) is positioned in the transmission block (8), the identifier (15) is positioned at the inner top end of the bearing platform (4), and the identifier (15) is close to the top end of the first motor (6), be equipped with the circuit line between recognizer (15) and first motor (6) and be connected, be equipped with the circuit line between sensor (3) and first motor (6) and be connected, first motor with be equipped with the circuit line between first electric rail (5) and be connected.

2. The mechanism of claim 1, wherein a second electric rail (13), a second motor (14) and a transmission rod (16) are disposed on the support rod (10), the second motor (14) is located at an inner center of the support rod (10), the transmission rod (16) is located at two sides of the support rod (10), the transmission rod (16) is close to the center of the support rod (10), the second electric rail (13) is located at an outer side of the transmission rod (16), the second electric rail (13) is connected to an inner electric rail of the support rod (10), and a circuit line connection is disposed between the second motor (14) and the second electric rail (13).

3. The mechanism of claim 1, wherein the identifier (15) is provided with a micro recognition camera at the top end, and a circuit line connection is provided between the micro recognition camera and the identifier (15).

4. The multi-sized substrate wafer loading mechanism according to claim 3, wherein a protective shell is provided outside the micro recognition camera.

5. The mechanism of claim 1, wherein the transmission block (8) is provided with a soft adhesive layer (9) on the outer side.

6. The multi-sized substrate wafer loading mechanism according to claim 2, wherein the first and second electrical rails (5, 13) are of the type of motorized linear slide.

7. The multi-size substrate wafer loading mechanism of claim 2, wherein the first motor (6) and the second motor (14) are internally provided with motor cylinders.

8. The multi-size substrate wafer loading mechanism of claim 7, wherein the motor cylinder is of the small motor cylinder type.