CN214313175U - Crystal enlarging device - Google Patents
Crystal enlarging device Download PDFInfo
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- CN214313175U CN214313175U CN202120737933.4U CN202120737933U CN214313175U CN 214313175 U CN214313175 U CN 214313175U CN 202120737933 U CN202120737933 U CN 202120737933U CN 214313175 U CN214313175 U CN 214313175U
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- linear driving
- axis linear
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Abstract
The embodiment of the utility model discloses expand brilliant device for solve the current wafer platform that expands among the brilliant device and can't carry out position adjustment, lead to the lower technical problem of work efficiency. The embodiment of the utility model comprises a base, an X-axis linear driving module, a Y-axis linear driving module, a bearing plate and a wafer platform; the X-axis linear driving module is installed on the base, the Y-axis linear driving module is connected to the X-axis linear driving module, the X-axis linear driving module can drive the Y-axis linear driving module to move along the X-axis direction, the bearing plate is connected to the Y-axis linear driving module, the Y-axis linear driving module can drive the bearing plate to move along the Y-axis direction, the wafer platform is rotationally connected to the bearing plate, the rotary driving module is installed on the bearing plate, the rotary driving module is connected with the wafer platform, and the rotary driving module can drive the wafer platform relative to the bearing plate.
Description
Technical Field
The utility model relates to an expand brilliant device technical field, especially relate to an expand brilliant device.
Background
In the prior art, the wafer is generally placed on the wafer platform of the wafer expanding device and then the subsequent wafer picking process is carried out, because the position of the wafer platform can not be adjusted, some wafers with more deviated positions can not be picked by the picking device, and a worker can only take out the wafer and adjust the angle of the wafer and then place the wafer into the wafer platform so that the wafer at a remote position can be picked by the picking device. According to the process, the position of the wafer needs to be adjusted by hands in the wafer picking process, and the working efficiency is seriously influenced.
Therefore, in order to solve the above-mentioned technical problems, it is an important issue to be studied by those skilled in the art to find a wafer-expanding apparatus capable of adjusting the position of a wafer stage.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model discloses expand brilliant device for solve the current wafer platform that expands among the brilliant device and can't carry out position adjustment, lead to the lower technical problem of work efficiency.
The embodiment of the utility model provides a wafer expanding device, which comprises a base, an X-axis linear driving module, a Y-axis linear driving module, a bearing plate and a wafer platform;
the X-axis linear driving module is installed on the base, the Y-axis linear driving module is connected to the X-axis linear driving module, the X-axis linear driving module can drive the Y-axis linear driving module to move along the X-axis direction, the bearing plate is connected to the Y-axis linear driving module, the Y-axis linear driving module can drive the bearing plate to move along the Y-axis direction, the wafer platform is rotationally connected to the bearing plate, the rotary driving module is installed on the bearing plate, the rotary driving module is connected with the wafer platform, and the rotary driving module can drive the wafer platform relative to the bearing plate.
Optionally, the X-axis linear driving module is a screw-driven or belt-driven linear driving module.
Optionally, the Y-axis linear driving module is a screw-driven or belt-driven linear driving module.
Optionally, the rotary driving module comprises a first motor, a driving pulley and a transmission belt;
the first motor is fixedly installed on the bearing plate, an output shaft of the first motor is connected with the driving belt pulley, and the driving belt pulley is connected with the bottom of the wafer platform through the transmission belt.
Optionally, the rotary drive module further comprises a first auxiliary wheel and a second auxiliary wheel;
the first auxiliary wheel and the second auxiliary wheel are both rotationally connected to the bearing plate, and the first auxiliary wheel and the second auxiliary wheel are respectively arranged on two opposite sides of the driving belt pulley;
the transmission belt passes through the first auxiliary wheel and the second auxiliary wheel and then is connected with the bottom of the wafer platform.
Optionally, a lifting assembly is further mounted on the supporting plate;
the lifting assembly comprises a lifting ring and at least one lifting module;
the lifting ring is sleeved on the wafer platform, the lifting module is fixed on the bearing plate and connected with the lifting ring, the lifting module can drive the lifting ring to lift along the wafer platform, a mounting plate is arranged on the side face, close to the feeding end of the wafer platform, of the lifting ring, and material guide plates are arranged on two opposite sides of the mounting plate.
Optionally, the lifting module comprises a second motor, a screw and a nut;
the second motor is fixedly arranged on the bearing plate, the nut is connected inside the second motor, the screw is in threaded connection with the nut, the second motor drives the nut to rotate so as to enable the screw to stretch, and the screw is fixedly connected with the lifting ring.
According to the technical solution provided by the utility model, the embodiment of the utility model has the following advantage:
the embodiment of the utility model provides a wafer expanding device, which comprises a base, an X-axis linear driving module, a Y-axis linear driving module, a bearing plate and a wafer platform; the X-axis linear driving module is installed on the base, the Y-axis linear driving module is connected to the X-axis linear driving module, the X-axis linear driving module can drive the Y-axis linear driving module to move along the X-axis direction, the bearing plate is connected to the Y-axis linear driving module, the Y-axis linear driving module can drive the bearing plate to move along the Y-axis direction, the wafer platform is rotationally connected to the bearing plate, the rotary driving module is installed on the bearing plate, the rotary driving module is connected with the wafer platform, and the rotary driving module can drive the wafer platform relative to the bearing plate. In this embodiment, the adjustment of X axle direction, Y axle direction and rotation angle can be accomplished to the wafer platform under the drive of X axle linear driving module, Y axle linear driving module, rotation driving module, through this design, can make the wafer on the wafer platform more quickly by the pick-up wafer, has promoted work efficiency greatly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a crystal expansion apparatus provided by the present invention;
fig. 2 is a schematic structural view of a wafer stage of a wafer expanding apparatus according to the present invention;
fig. 3 is a schematic view of a first view angle structure of a wafer stage of a wafer expanding apparatus according to the present invention;
fig. 4 is a schematic view of a second view structure of a wafer stage of the wafer expanding apparatus according to the present invention;
illustration of the drawings: a base 1; an X-axis linear driving module 2; a Y-axis linear driving module 3; a support plate 4; a mounting plate 5; a material guide plate 6; a wafer stage 7; a wafer table feed end 701; a lifting ring 8; a lifting module 9; a first electric motor 10; a driving pulley 11; a drive belt 12; a first auxiliary wheel 13; a second auxiliary wheel 14.
Detailed Description
The embodiment of the utility model discloses expand brilliant device for solve the current wafer platform that expands among the brilliant device and can't carry out position adjustment, lead to the lower technical problem of work efficiency.
In order to make the technical field better understand the solution of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 4, a crystal expansion apparatus provided in the present embodiment includes:
the device comprises a base 1, an X-axis linear driving module 2, a Y-axis linear driving module 3, a bearing plate 4 and a wafer table 7;
x axle linear driving module 2 install in on the base 1, Y axle linear driving module 3 connect in on the X axle linear driving module 2, X axle linear driving module 2 can drive Y axle linear driving module 3 removes along the X axle direction, bearing board 4 connect in on the Y axle linear driving module 3, Y axle linear driving module 3 can drive bearing board 4 removes along the Y axle direction, brilliant round platform 7 rotate connect in on the bearing board 4, install the rotation driving module on the bearing board 4, the rotation driving module with brilliant round platform 7 is connected, the rotation driving module can drive brilliant round platform 7 for bearing board 4 rotates.
In this embodiment, the wafer stage 7 can be driven by the X-axis linear driving module 2, the Y-axis linear driving module 3 and the rotation driving module to adjust the X-axis direction, the Y-axis direction and the rotation angle, so that the wafer on the wafer stage 7 can be picked up more quickly, thereby greatly improving the working efficiency.
Further, the X-axis linear driving module 2 is a screw-driven or belt-driven linear driving module.
It should be noted that, in the embodiment, the transmission manner of the X-axis linear driving module 2 is not limited, and a designer may select an appropriate transmission manner for the X-axis linear driving module 2 according to requirements.
Further, the Y-axis linear driving module 3 is a screw-driven or belt-driven linear driving module.
It should be noted that, in the embodiment, the transmission manner of the X-axis linear driving module 2 is not limited, and a designer may select an appropriate transmission manner for the X-axis linear driving module 2 according to requirements.
Further, the rotary driving module comprises a first motor 10, a driving pulley 11 and a transmission belt 12;
the first motor 10 is fixedly installed on the supporting plate 4, an output shaft of the first motor 10 is connected with the driving belt pulley 11, and the driving belt pulley 11 is connected with the bottom of the wafer table 7 through the transmission belt 12.
The first motor 10 drives the driving pulley 11 to rotate, and the driving pulley 11 drives the wafer table 7 to rotate relative to the support plate 4 through the transmission belt 12.
Furthermore, the rotary driving module also comprises a first auxiliary wheel and a second auxiliary wheel;
the first auxiliary wheel and the second auxiliary wheel are both rotationally connected to the bearing plate 4, and the first auxiliary wheel and the second auxiliary wheel are respectively arranged on two opposite sides of the driving belt pulley 11;
the transmission belt 12 passes through the first auxiliary wheel and the second auxiliary wheel and then is connected with the bottom of the wafer table 7.
It should be noted that, with the above design, the driving belt 12 can be more smooth during the driving process.
Furthermore, a lifting assembly is also arranged on the bearing plate 4;
the lifting assembly comprises a lifting ring 8 and at least one lifting module 9;
the lifting ring 8 is sleeved on the wafer table 7, the lifting module 9 is fixed on the supporting plate 4, the lifting module 9 is connected with the lifting ring 8, the lifting module 9 can drive the lifting ring 8 to lift along the wafer table 7, the side face, close to the feeding end of the wafer table 7, of the lifting ring 8 is provided with the mounting plate 5, and the two opposite sides of the mounting plate 5 are provided with the material guide plates 6.
It should be noted that the lifting module 9 can drive the lifting ring 8 to lift along the wafer stage 7, when the wafer is loaded, the lifting module 9 drives the lifting ring 8 to lift, so that the material guide plate 6 and the feed end of the wafer stage 7 are at the same height, the wafer directly enters the wafer stage 7 through the material guide plate 6 on the mounting plate 5 along with the transmission assembly, and after the loading of the wafer is finished, the lifting module 9 drives the lifting ring 8 to descend to the original position.
Further, the lifting module 9 includes a second motor, a screw rod and a nut;
the second motor is fixedly arranged on the bearing plate 4, the nut is connected inside the second motor, the screw is in threaded connection with the nut, the second motor drives the nut to rotate so as to enable the screw to stretch, and the screw is fixedly connected with the lifting ring 8.
It should be noted that the second motor can drive the screw rod to extend and contract, so as to lift the lifting ring 8.
The above is to the crystal expansion device provided by the present invention is introduced in detail, to the general technical personnel in the field, according to the utility model discloses the thought of embodiment all has the change part on concrete implementation and application scope, to sum up, this description content should not be understood as right the utility model discloses a restriction.
Claims (7)
1. A wafer expanding device is characterized by comprising a base, an X-axis linear driving module, a Y-axis linear driving module, a bearing plate and a wafer platform;
the X-axis linear driving module is installed on the base, the Y-axis linear driving module is connected to the X-axis linear driving module, the X-axis linear driving module can drive the Y-axis linear driving module to move along the X-axis direction, the bearing plate is connected to the Y-axis linear driving module, the Y-axis linear driving module can drive the bearing plate to move along the Y-axis direction, the wafer platform is rotationally connected to the bearing plate, the rotary driving module is installed on the bearing plate, the rotary driving module is connected with the wafer platform, and the rotary driving module can drive the wafer platform relative to the bearing plate.
2. The crystal expansion apparatus according to claim 1, wherein said X-axis linear driving module is a screw-driven or belt-driven linear driving module.
3. The crystal expansion apparatus according to claim 1, wherein the Y-axis linear driving module is a screw-driven or belt-driven linear driving module.
4. The wafer expander according to claim 1, wherein said rotary driving module comprises a first motor, a driving pulley and a transmission belt;
the first motor is fixedly installed on the bearing plate, an output shaft of the first motor is connected with the driving belt pulley, and the driving belt pulley is connected with the bottom of the wafer platform through the transmission belt.
5. The crystal expansion device according to claim 4, wherein said rotation driving module further comprises a first auxiliary wheel and a second auxiliary wheel;
the first auxiliary wheel and the second auxiliary wheel are both rotationally connected to the bearing plate, and the first auxiliary wheel and the second auxiliary wheel are respectively arranged on two opposite sides of the driving belt pulley;
the transmission belt passes through the first auxiliary wheel and the second auxiliary wheel and then is connected with the bottom of the wafer platform.
6. The wafer expander according to claim 1, wherein a lifting assembly is further mounted on said support plate;
the lifting assembly comprises a lifting ring and at least one lifting module;
the lifting ring is sleeved on the wafer platform, the lifting module is fixed on the bearing plate and connected with the lifting ring, the lifting module can drive the lifting ring to lift along the wafer platform, a mounting plate is arranged on the side face, close to the feeding end of the wafer platform, of the lifting ring, and material guide plates are arranged on two opposite sides of the mounting plate.
7. The crystal expansion device according to claim 6, wherein the lifting module comprises a second motor, a screw rod and a nut;
the second motor is fixedly arranged on the bearing plate, the nut is connected inside the second motor, the screw is in threaded connection with the nut, the second motor drives the nut to rotate so as to enable the screw to stretch, and the screw is fixedly connected with the lifting ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120737933.4U CN214313175U (en) | 2021-04-12 | 2021-04-12 | Crystal enlarging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120737933.4U CN214313175U (en) | 2021-04-12 | 2021-04-12 | Crystal enlarging device |
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| Publication Number | Publication Date |
|---|---|
| CN214313175U true CN214313175U (en) | 2021-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202120737933.4U Active CN214313175U (en) | 2021-04-12 | 2021-04-12 | Crystal enlarging device |
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| CN (1) | CN214313175U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114700285A (en) * | 2022-03-31 | 2022-07-05 | 深圳市联得自动化装备股份有限公司 | Chip sorting device, equipment and method |
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2021
- 2021-04-12 CN CN202120737933.4U patent/CN214313175U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114700285A (en) * | 2022-03-31 | 2022-07-05 | 深圳市联得自动化装备股份有限公司 | Chip sorting device, equipment and method |
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