CN214736217U - 一种制备半绝缘碳化硅单晶的装置 - Google Patents
一种制备半绝缘碳化硅单晶的装置 Download PDFInfo
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- CN214736217U CN214736217U CN202120944141.4U CN202120944141U CN214736217U CN 214736217 U CN214736217 U CN 214736217U CN 202120944141 U CN202120944141 U CN 202120944141U CN 214736217 U CN214736217 U CN 214736217U
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- single crystal
- module
- silicon carbide
- semi
- carbide single
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- 239000013078 crystal Substances 0.000 title claims abstract description 70
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 43
- 238000002955 isolation Methods 0.000 claims abstract description 51
- 238000002360 preparation method Methods 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 25
- 239000011261 inert gas Substances 0.000 claims abstract description 20
- 239000012774 insulation material Substances 0.000 claims abstract description 16
- 239000002994 raw material Substances 0.000 claims abstract description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 18
- 230000006698 induction Effects 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 10
- 230000007704 transition Effects 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 238000012423 maintenance Methods 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims 1
- 239000012535 impurity Substances 0.000 abstract description 7
- 238000000605 extraction Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000011863 silicon-based powder Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 108010066278 cabin-4 Proteins 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN202120645519 | 2021-03-30 | ||
CN2021206455190 | 2021-03-30 |
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CN214736217U true CN214736217U (zh) | 2021-11-16 |
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CN202120944141.4U Active CN214736217U (zh) | 2021-03-30 | 2021-04-29 | 一种制备半绝缘碳化硅单晶的装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114908420A (zh) * | 2022-05-16 | 2022-08-16 | 哈尔滨晶彩材料科技有限公司 | 高纯碳化硅多晶粉料的制备方法 |
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2021
- 2021-04-29 CN CN202120944141.4U patent/CN214736217U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114908420A (zh) * | 2022-05-16 | 2022-08-16 | 哈尔滨晶彩材料科技有限公司 | 高纯碳化硅多晶粉料的制备方法 |
CN114908420B (zh) * | 2022-05-16 | 2023-08-22 | 哈尔滨晶彩材料科技有限公司 | 高纯碳化硅多晶粉料的制备方法 |
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Effective date of registration: 20220210 Address after: 311200 room 205-2, building 1, Information Port Phase V, No. 733, Jianshe Third Road, Xiaoshan District, Hangzhou, Zhejiang Province Patentee after: Hangzhou Qianjing Semiconductor Co.,Ltd. Address before: No. 733, Jianshe 3rd road, Xiaoshan District, Hangzhou, Zhejiang 311200 Patentee before: ZJU-Hangzhou Global Scientific and Technological Innovation Center |
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EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Suzhou Heyu Finance Leasing Co.,Ltd. Assignor: Hangzhou Qianjing Semiconductor Co.,Ltd. Contract record no.: X2023980048824 Denomination of utility model: A device for preparing semi insulating silicon carbide single crystals Granted publication date: 20211116 License type: Exclusive License Record date: 20231201 |
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EE01 | Entry into force of recordation of patent licensing contract | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A device for preparing semi insulating silicon carbide single crystals Effective date of registration: 20231206 Granted publication date: 20211116 Pledgee: Suzhou Heyu Finance Leasing Co.,Ltd. Pledgor: Hangzhou Qianjing Semiconductor Co.,Ltd. Registration number: Y2023980069375 |
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Address after: Building 1, No. 78 Donggang Eighth Road, Quzhou City, Zhejiang Province 324000 Patentee after: Zhejiang Caizi Technology Co.,Ltd. Country or region after: China Address before: 311200 room 205-2, building 1, Information Port Phase V, No. 733, Jianshe Third Road, Xiaoshan District, Hangzhou, Zhejiang Province Patentee before: Hangzhou Qianjing Semiconductor Co.,Ltd. Country or region before: China |
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