CN214675835U

CN214675835U - Electronic device module

Info

Publication number: CN214675835U
Application number: CN202120170320.7U
Authority: CN
Inventors: 汲德明; 雷子乐; 黄金金
Original assignee: Dimension Corp
Current assignee: Dimension Corp; Vertiv Corp
Priority date: 2021-01-21
Filing date: 2021-01-21
Publication date: 2021-11-09
Anticipated expiration: 2031-01-21

Abstract

The utility model discloses an electronic device module, which comprises a top layer PCB, a bottom layer PCB, an intermediate PCB group, a heating element and a temperature sensor, wherein the top layer PCB, the intermediate PCB group and the bottom layer PCB are stacked, the heating element is provided with pins, the pins are arranged on the top layer PCB, the intermediate PCB group and the bottom layer PCB in a penetrating way, the electronic device module also comprises a heat conduction layer, the heat conduction layer is attached on one surface of the top layer PCB or the bottom layer PCB towards the intermediate PCB group, and the pins are arranged on the heat conduction layer in a penetrating way; the temperature sensor is attached to the other surface of the top layer PCB or the bottom layer PCB. This electron device module is through giving the heat-conducting layer with heat conduction, then uses temperature sensor on top layer PCB board or bottom PCB board to this indirect temperature of reading heating element reduces the area of the PCB board that temperature sensor took, can also play the electrical isolation effect.

Description

Electronic device module

Technical Field

The utility model belongs to the technical field of the electron, concretely relates to electron device module.

Background

The switching power supply module product is an electronic device module which protects a switching device (MOSFET/IGBT) from being damaged due to over-temperature, and the switching power supply module product needs to indirectly detect the temperature of a radiator so as to protect the switching device. In the prior art, an in-line temperature sensor is usually adhered to a heat sink to detect the temperature of the heat sink.

The mode of detecting the temperature by using the direct-insert type temperature sensor needs to occupy a certain surface area of the top layer PCB; the surface of the direct-insertion type temperature sensor is easy to blow dust from the air inlet, so that the detection precision is influenced; in addition, the direct-insert temperature sensor needs manual glue dispensing and is stuck on the radiator, and the consistency of glue dispensing and adhesion is poor.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide an save electronic device module that cut straightly shared PCB board area of formula temperature sensor.

In order to solve the technical problem, the utility model provides a technical scheme does:

an electronic device module comprises a top layer PCB, a bottom layer PCB, a middle PCB group, a heating element and a temperature sensor, wherein the top layer PCB, the middle PCB group and the bottom layer PCB are arranged in a stacked mode; the temperature sensor is attached to the other surface of the top layer PCB or the bottom layer PCB.

Further, the middle PCB board group includes a first middle PCB board, and the first middle PCB board is stacked between the top layer PCB board and the bottom layer PCB board.

Further, the heat conduction layer is attached to the upper surface of the bottom PCB, and the temperature sensor is attached to the lower surface of the bottom PCB.

Further, the heat conduction layer is attached to the lower surface of the top layer PCB, and the temperature sensor is attached to the upper surface of the top layer PCB.

Further, the middle PCB group further includes a second middle PCB, the second middle PCB and the first middle PCB are stacked, wherein the first middle PCB is close to the top PCB, and the second middle PCB is far from the top PCB.

Further, the temperature sensor is a patch type NTC thermistor.

Further, the heat conduction layer is a copper layer.

Further, the heating element is one or more of a radiator, a power inductor and a transformer.

The utility model has the advantages that:

this electron device module wears to establish on the heat-conducting layer through the pin with heating element, gives the heat-conducting layer with the heat conduction, then uses temperature sensor on top layer PCB board or bottom PCB board to this indirect temperature of reading heating element reduces the area of the PCB board that temperature sensor occupy, can also play the electrical isolation effect.

Drawings

Fig. 1 is a side view of an electronics module of the present invention in a preferred embodiment.

The reference numerals include:

100-PCB Assembly 110-Top PCB 120-bottom PCB

130-middle PCB board group 131-first middle PCB board

132-second intermediate PCB 200-heating element

210-pin 300-temperature sensor

400-heat conducting layer

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1, in order to provide a preferred embodiment of the present invention, the electronic device module includes a top PCB 110, a bottom PCB 120, a middle PCB 130, a heating element 200 and a temperature sensor 300, wherein the top PCB 110, the middle PCB 130 and the bottom PCB 120 are stacked, the heating element 200 is provided with a pin 210, the pin 210 is disposed on the top PCB 110, the middle PCB 130 and the bottom PCB 120, the electronic device module further includes a heat conducting layer 400, the heat conducting layer 400 is attached to one surface of the top PCB 110 or the bottom PCB 120 facing the middle PCB 130, and the pin 210 is also disposed on the heat conducting layer 400; the temperature sensor 300 is attached to the other surface of the top PCB 110 or the bottom PCB 120.

This electronic device module is through wearing to establish pin 210 of heating element 200 on heat-conducting layer 400, with heat conduction for heat-conducting layer 400, then uses temperature sensor 300 on top layer PCB board 110 or bottom PCB board 120 to this indirect temperature of reading heating element 200 reduces the area of the PCB board that temperature sensor 300 occupy, can also play the electrical isolation effect. The temperature sensor 300 does not need to directly detect the temperature of the heating element 200, but performs temperature sampling in a smart isolated heat conduction manner, and simultaneously optimizes the layout of each component to the maximum extent and saves the use space of an electronic device module. The above components are described in further detail below.

The electronic device module in the application comprises a switching power supply module product, and the switching device can be protected from being damaged due to over-temperature. The switch device is a controllable and uncontrollable semiconductor device such as a patch type power diode, a MOSFET, an IGBT and the like. The electronics module includes a top layer PCB board 110, a bottom layer PCB board 120, a middle set of PCB boards 130, a heat generating element 200, a temperature sensor 300, and a thermally conductive layer 400. A thermally conductive layer 400 is attached to the middle PCB panel set 130.

The heating element 200 is one or more of a radiator, a power inductor, a transformer and other heating electromagnetic components. The heat generating element 200 is provided with pins 210, and the pins 210 are used to electrically connect the heat generating element 200 with the top layer PCB 110, the middle PCB plate group 130, the heat conducting layer 400 and the bottom layer PCB 120. Specifically, the pins 210 are disposed through the top PCB 110, the middle PCB plate group 130, the heat conducting layer 400 and the bottom PCB 120, that is, the pins 210 penetrate through the top PCB 110, the middle PCB plate group 130, the heat conducting layer 400 and the bottom PCB 120.

The top PCB 110, the middle PCB group 130 and the bottom PCB 120 are sequentially stacked. The heating element 200 is disposed on the upper surface of the top PCB 110, and the pins 210 of the heating element 200 sequentially pass through the top PCB 110, the middle PCB group 130, and the bottom PCB 120 from top to bottom.

The middle PCB assembly 130 includes a first middle PCB 131, and the first middle PCB 131 is stacked between the top PCB 110 and the bottom PCB 120.

It is to be understood that the present application is not limited to the specific number of intermediate PCB boards included in the intermediate PCB board group 130, and the number thereof may be one or more. Preferably, the intermediate PCB group 130 includes two intermediate PCB boards, that is, the intermediate PCB group 130 includes a second intermediate PCB board 132 in addition to the first intermediate PCB board 131, and the second intermediate PCB board 132 is stacked with the first intermediate PCB board 131. Specifically, the first intermediate PCB 131 is disposed close to the top PCB 110, and the second intermediate PCB 132 is disposed far from the top PCB 110. In a preferred embodiment of the present application, the heat conductive layer 400 is attached to the upper surface of the bottom PCB 120, and the temperature sensor 300 is attached to the lower surface of the bottom PCB 120. The temperature sensor 300 is attached to the lower surface of the bottom PCB 120, so that the condition that the temperature sensor 300 is not accurately sampled due to blowing of dust and a fan can be avoided.

In another preferred embodiment of the present application, the heat conductive layer 400 is attached to the lower surface of the top PCB 110, and the temperature sensor 300 is attached to the upper surface of the top PCB 110.

Preferably, the temperature sensor 300 is a patch type NTC thermistor, and it is understood that the temperature sensor 300 may be other types of temperature sensors. The thermally conductive layer 400 is made of a thermally conductive material, such as a metal, e.g., copper.

The above description is only a preferred embodiment of the present invention, and many changes can be made in the detailed description and the application scope according to the idea of the present invention for those skilled in the art, which all belong to the protection scope of the present invention as long as the changes do not depart from the concept of the present invention.

Claims

1. An electronic device module, includes top layer PCB board (110), bottom PCB board (120), middle PCB board group (130), heating element (200) and temperature sensor (300), top layer PCB board (110), middle PCB board group (130) and bottom PCB board (120) stromatolite set up, heating element (200) are equipped with pin (210), pin (210) wear to establish on top layer PCB board (110), middle PCB board group (130) and bottom PCB board (120), its characterized in that: the electronic device module further comprises a heat conduction layer (400), wherein the heat conduction layer (400) is attached to one surface, facing the middle PCB group (130), of the top PCB (110) or the bottom PCB (120), and the pins (210) are also arranged on the heat conduction layer (400) in a penetrating mode; the temperature sensor (300) is attached to the other surface of the top layer PCB (110) or the bottom layer PCB (120).

2. The electronics module of claim 1, wherein: the middle PCB board group (130) comprises a first middle PCB board (131), and the first middle PCB board (131) is overlapped between the top layer PCB board (110) and the bottom layer PCB board (120).

3. The electronics module of claim 2, wherein: the heat conduction layer (400) is attached to the upper surface of the bottom PCB (120), and the temperature sensor (300) is attached to the lower surface of the bottom PCB (120).

4. The electronics module of claim 2, wherein: the heat conduction layer (400) is attached to the lower surface of the top layer PCB (110), and the temperature sensor (300) is attached to the upper surface of the top layer PCB (110).

5. The electronics module of claim 2, wherein: the middle PCB board group (130) further comprises a second middle PCB board (132), the second middle PCB board (132) and the first middle PCB board (131) are arranged in a laminated mode, the first middle PCB board (131) is close to the top layer PCB board (110) and arranged, and the second middle PCB board (132) is far away from the top layer PCB board (110).

6. The electronics module of claim 1, wherein: the temperature sensor (300) is a patch type NTC thermistor.

7. The electronics module of claim 1, wherein: the heat conducting layer (400) is a copper layer.

8. The electronics module of claim 1, wherein: the heating element (200) is one or more of a radiator, a power inductor and a transformer.