CN207230650U - Electromagnetic oven - Google Patents
Electromagnetic oven Download PDFInfo
- Publication number
- CN207230650U CN207230650U CN201721240160.9U CN201721240160U CN207230650U CN 207230650 U CN207230650 U CN 207230650U CN 201721240160 U CN201721240160 U CN 201721240160U CN 207230650 U CN207230650 U CN 207230650U
- Authority
- CN
- China
- Prior art keywords
- heat
- igbt
- electromagnetic oven
- heat sink
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000006260 foam Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 230000006698 induction Effects 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000426 Microplastic Polymers 0.000 description 1
- 239000004990 Smectic liquid crystal Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model provides an induction cooker, including IGBT and temperature sensor, the IGBT subsides are equipped with first fin, are provided with first heat-conducting layer between temperature sensor and the first fin. The utility model provides an induction cooker through set up the heat-conducting layer between the fin that hugs closely at temperature sensor and with the IGBT, has improved the accuracy that temperature sensor detected the IGBT temperature that obtains.
Description
Technical field
It the utility model is related to household electrical appliance technical field, more particularly to a kind of electromagnetic oven.
Background technology
Insulated gate bipolar transistor (Insulated Gate Bipolar are disposed with the circuit board of electromagnetic oven product
Transistor, IGBT).IGBT is required Important Components in electromagnetic oven, for being high-frequency ac by DC power supply inversion
Electricity, so that the coil in electromagnetic oven produces induced field.The conversion work of IGBT high frequencies can produce huge heat, if warm
Degree is easily burnt more than a certain limit value.So need to detect the temperature of IGBT.
In order to detect the temperature of IGBT, at present, be provided with temperature sensor by the pin of IGBT, temperature sensor with
The pin connection of IGBT.When the temperature that temperature sensor detects the pin of IGBT exceedes a certain limit value, IGBT enters protection
Operating mode, intermittence heating or stopping heating.
But in such scheme, what temperature sensor detected is the temperature of IGBT pins, causes IGBT temperature to detect
Accuracy it is relatively low, and then have impact on the precise control of IGBT operating modes.
Utility model content
At least one in order to solve the problems, such as to mention in background technology, the utility model provides a kind of electromagnetic oven, by
Heat-conducting layer is set between temperature sensor and the heat sink being close to IGBT, improves the IGBT that temperature sensor detection obtains
The accuracy of temperature.
To achieve these goals, the utility model provides a kind of electromagnetic oven, including IGBT and temperature sensor, described
IGBT, which is sticked, the first heat sink, and the first heat-conducting layer is provided between the temperature sensor and first heat sink.
Electromagnetic oven as described above, passes through the first heat-conducting layer set between temperature sensor and the first heat sink, temperature
Sensor can be with the temperature of indirect detection IGBT bodies.The detection accuracy of IGBT temperature is improved, and then improves IGBT works
The accuracy of operation mode control.
In an embodiment of the utility model, the pin of the temperature sensor is connected with the pin of the IGBT.
Electromagnetic oven as described above, temperature sensor can not only detect the temperature of IGBT pins, but also can pass through first
Heat-conducting layer and the first heat sink indirect detection to IGBT bodies temperature, so as to obtain more accurately IGBT temperature, further
Improve the detection accuracy of IGBT temperature.
In an embodiment of the utility model, the temperature sensor is arranged on below first heat sink.
In an embodiment of the utility model, first heat-conducting layer is any one in following：Heat-conducting silicone grease is led
Thermosphere, heat conductive silica gel heat-conducting layer and heat conduction foam heat-conducting layer.
In an embodiment of the utility model, the second heat conduction is provided between the IGBT and first heat sink
Layer.
Electromagnetic oven as described above, by setting the second heat-conducting layer, heat caused by IGBT work can pass through second
Heat-conducting layer is rapidly transferred on the first heat sink, improves heat conduction velocity, and then temperature sensor can be detected quickly
To the temperature of IGBT bodies, the real-time that IGBT temperature detects further is improved.
In an embodiment of the utility model, the IGBT and the temperature sensor are set in the circuit board.
In an embodiment of the utility model, first through hole is provided with first heat sink, is set on the IGBT
The second through hole with the first through hole position correspondence is equipped with, is provided with the wiring board and the first through hole position correspondence
Third through-hole；
It is used to be inserted into fixing piece in the first through hole, second through hole and the third through-hole.
Electromagnetic oven as described above, by setting position pair respectively on the first heat sink, on IGBT and on wiring board
First through hole, the second through hole and the third through-hole answered, are inserted into the corresponding first through hole in position, the second through hole and third through-hole
Fixing piece, can fix the relative position between the first heat sink, IGBT and wiring board.
In an embodiment of the utility model, bridge heap is additionally provided with the wiring board, the bridge embossed decoration is equipped with second
Heat sink.
Electromagnetic oven as described above, IGBT and bridge heap lock on two different heat sinks respectively, in the circuit board shape
Into two separated heating regions.Since two separated heating regions have certain interval, IGBT and the work of bridge heap
Caused heat can be distributed preferably so that the Temperature Distribution on wiring board is more reasonable, avoids electromagnetic oven
The excessive hot environment of temperature is formed on wiring board, protects the component on wiring board.
In an embodiment of the utility model, the minimum range between first heat sink and second heat sink
More than or equal to 50 millimeters.
Electromagnetic oven as described above, it is contemplated that the size and heat dissipation effect of wiring board, when the first heat sink and second dissipate
, can further improving radiating effect when minimum range between backing is more than or equal to 50 millimeters so that on wiring board
Temperature Distribution is more reasonable.
In an embodiment of the utility model, the 3rd heat conduction is provided between the bridge heap and second heat sink
Layer.
Electromagnetic oven as described above, can be by bridge heap by setting the 3rd heat-conducting layer between bridge heap and the second heat sink
Heat caused by work is rapidly conducted to the second heat sink by the 3rd heat-conducting layer, improves heat conduction velocity, so that into
One step improves the heat dissipation effect of heat sink.
In an embodiment of the utility model, the temperature sensor is NTC temperature sensors.
The construction of the utility model and its other purpose of utility model and beneficial effect will be in conjunction with the accompanying drawings
Description of preferred embodiments and it is more obvious understandable.
Brief description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings in the following description are
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is the structure diagram of existing IGBT temperature measurement circuits；
Fig. 2 is the structure diagram for the electromagnetic oven that the utility model embodiment provides；
Fig. 3 is the sectional view for the electromagnetic oven that the utility model embodiment provides；
Fig. 4 is the decomposition texture schematic diagram for the electromagnetic oven that the utility model embodiment provides.
Description of reference numerals：
1：IGBT；
2：Thermistor；
3：Pcb board；
11：Wiring board；
12：IGBT；
13：First heat sink；
14：Temperature sensor；
15：First heat-conducting layer；
16：Second through hole；
17：Bridge heap；
18：Second heat sink；
19：Pin；
20：Pin；
21：Fifth hole.
Embodiment
Electromagnetic oven is also known as electromagnetic stove, is the product of modern kitchen revolution.The principle of electromagnetic oven is electromagnetic induction phenomenon, profit
The changing alternating magnetic field in direction is produced by coil with alternating current, the inside of the conductor in alternating magnetic field will go out
Existing vortex current, the joule heating effect of vortex current makes conductor heat up, so as to fulfill heating.Due to adding without naked light or conduction-type
Heat and allow heat directly to be produced in the bottom of a pan, therefore the thermal efficiency is greatly improved.
Electromagnetic oven is mainly made of two large divisions, first, the electronics systems of high-frequency alternating magnetic field can be produced, second,
For fixing electronics systems and carrying the structural shell of cookware.
Electronics systems can include：Mainboard, lamp plate, Qiao Dui, IGBT, coil panel, fan component, power cord etc..
Wherein, mainboard can include high pressure main substrate and low pressure main substrate, and high pressure main substrate is used to form main current loop, the main base of low pressure
Plate is used for realization microprocessor control.Lamp plate can be light emitting diode (Light Emitting Diode, LED) wiring board,
For showing the working status of electromagnetic oven and transmitting operational order.It is DC power supply that bridge heap, which is used for mains electric rectification,.
It is high-frequency alternating current that IGBT, which is used for DC power supply inversion, so that coil produces induced field.Coil panel is used to hand over high frequency
Time-dependent current is converted into alternating magnetic field.Fan component is used to radiate to reduce the temperature of electromagnetic oven internal component.
Structural shell can include：Furnace panel, upper and lower covers, coil bracket etc..Wherein, furnace panel can be porcelain plate
Or black brilliant plate, for carrying cookware.Upper and lower covers are used to protect electromagnetic oven internal structure.Coil bracket is used for fixed coil
Disk.
Electromagnetic oven has fire or without fiery conduction heating kitchen tools compared to traditional, and firing rate is fast, temperature control is accurate, safety
Property height, energy conservation and environmental protection, easy to use, easy cleaning, are more and more widely used.
Fig. 1 is the structure diagram of existing IGBT temperature measurement circuits.As shown in Figure 1, Authorization Notice No. is
The utility model patent of CN202177471U discloses a kind of IGBT temperature measuring circuit used for induction cooker.The electromagnetic oven is examined with IGBT temperature
Slowdown monitoring circuit includes：Thermistor 2 and the divider resistance connected with the thermistor, the thermistor are welded on close on pcb board 3
The position of the E poles pin of IGBT1, the ground terminal pin of the thermistor and the E poles pin of IGBT connect, the heat that IGBT is sent
The thermistor is delivered to by its E poles pin.It uses new-type thermistor mounting process, by the ground terminal of thermistor
The E poles of pin and IGBT are welded directly together, and realize IGBT temperature transmission, can directly use plug-in unit or surface-assembled skill
Art (Surface Mount Technology, SMT) technique is automatically performed the welding of temperature measurement circuit, eliminates extra auxiliary zero
Part, is not required to manually participate in, improves production efficiency, reduce production cost.
But the pin of the pin of thermistor and IGBT connect in above-mentioned temperature measurement circuit, thermistor detection is
The temperature of IGBT pins, causes the accuracy that IGBT temperature detects relatively low.
The electromagnetic oven that the utility model embodiment provides, it is intended to solve IGBT temperature in currently available technology detect it is accurate
The relatively low technical problem of property.
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, those of ordinary skill in the art's all other embodiments obtained without making creative work, belongs to
The scope of the utility model protection.
Term " first ", " second ", " the 3rd " in the description and claims of this application and above-mentioned attached drawing, "
The (if present)s such as four " are for distinguishing similar object, without for describing specific order or precedence.It should manage
The data that solution so uses can exchange in the appropriate case, so as to embodiments herein described herein for example can with except
Order beyond those for illustrating or describing herein is implemented.In addition, term " comprising " and " having " and theirs is any
Deformation, it is intended that cover it is non-exclusive include, for example, containing the process of series of steps or unit, method, system, production
Product or equipment are not necessarily limited to those steps clearly listed or unit, but may include not list clearly or for this
The intrinsic other steps of a little process, method, product or equipment or unit.
Fig. 2 is the structure diagram for the electromagnetic oven that the utility model embodiment provides, and Fig. 3 carries for the utility model embodiment
The sectional view of the electromagnetic oven of confession, Fig. 4 are the decomposition texture schematic diagram for the electromagnetic oven that the utility model embodiment provides.As Fig. 2~
Shown in Fig. 4, electromagnetic oven provided in this embodiment, can include：IGBT12 and temperature sensor 14, IGBT12, which is sticked, has first to dissipate
Backing 13.
Wherein, it is provided with the first heat-conducting layer 15 between 14 and first heat sink 13 of temperature sensor.
In the present embodiment, IGBT12, which is sticked, the first heat sink 13.IGBT12 at work, can be inverse by DC power supply
It is changed into high-frequency alternating current, high-frequency alternating current is coupled to the bottom of cookware by the coil panel of coiling in electromagnetic oven, in cookware bottom
Swirl shape electric current is produced, so that the quick heat of cookware.IGBT12 will produce amount of heat when working, and IGBT12, which is sticked, first
Heat sink 13, by the first heat sink 13 IGBT12 can be worked caused by heat conduct, so as to reduce IGBT12
Operating temperature.
The first heat-conducting layer 15 is provided between 14 and first heat sink 13 of temperature sensor.What IGBT12 was produced at work
Heat can be delivered on the first heat sink 13 by the conduction of heat of the first heat sink 13.First heat sink 13 constantly absorbs
The heat of IGBT12, the temperature of the first heat sink 13 are identical with the temperature of IGBT12 bodies.By in the first heat sink 13 and temperature
The conduction of heat of the first heat-conducting layer 15 set between degree sensor 14, heat on the first heat sink 13 again can be for delivery to
On temperature sensor 14.So temperature sensor 14 can be arrived by the first heat-conducting layer 15 and 13 indirect detection of the first heat sink
The temperature of IGBT12 bodies.The temperature that temperature sensor 14 obtains can reflect the true temperature of IGBT12 bodies, so as to obtain
More accurately IGBT temperature was obtained, improves the detection accuracy of IGBT temperature.
As it can be seen that electromagnetic oven provided in this embodiment, by set between temperature sensor and the first heat sink first
Heat-conducting layer, temperature sensor can be with the temperature of indirect detection IGBT bodies.Detection IGBT pins are only capable of in compared with the prior art
Temperature, improve the detection accuracy of IGBT temperature, so improve IGBT operating modes control accuracy.
It should be noted that the present embodiment is not limited for the structure, type and model of IGBT12 and temperature sensor 14
It is fixed, any one existing IGBT and temperature sensor can be used.For example, temperature sensor 14 can be negative temperature coefficient
(Negative Temperature Coefficient, NTC) temperature sensor.Alternatively, temperature sensor 14 can be positive temperature
Spend coefficient (Positive Temperature Coefficient, PTC) temperature sensor.
It should be noted that the present embodiment is not limited for the position between 14 and first heat sink 13 of temperature sensor
It is fixed.For example, temperature sensor 14 can be located at the side of the first heat sink 13.In another example temperature sensor 14 can be arranged on
The lower section of first heat sink 13.At this time, it is followed successively by from the bottom up in vertical direction：Temperature sensor 14, the first heat-conducting layer 15
With the first heat sink 13.The upper surface of first heat-conducting layer 15 and the lower surface of the first heat sink 13 completely attach to, the first heat-conducting layer
15 lower surface is completely attached to temperature sensor 14.
Wherein, in order to obtain more accurately temperature, the first heat-conducting layer 15 can cover the pin 20 of temperature sensor 14.
Specifically, the first heat-conducting layer 15 has heat-conductive characteristic.The pin 20 of temperature sensor 14 is metal, and metal also has
There is excellent heat-conductive characteristic.The pin 20 of temperature sensor 14 is covered by the first heat-conducting layer 15, on the first heat sink 13
Heat can be quickly conducted to the pin 20 of temperature sensor 14 by the first heat-conducting layer 15, the pin of temperature sensor 14
20 temperature is identical with the temperature of IGBT12 bodies, further improves the detection accuracy and real-time of IGBT temperature.
Optionally, the pin 19 of the pin of temperature sensor 14 and IGBT12 connect.
Specifically, the pin of temperature sensor 14 and the pin 19 of IGBT12 connect, temperature sensor 14 can both detect
To the temperature of IGBT12 pins 19, and the first heat-conducting layer 15 and 13 indirect detection of the first heat sink to IGBT12 bodies can be passed through
Temperature.The temperature that temperature sensor 14 obtains can reflect the true temperature of IGBT12 bodies, so as to obtain more accurate
IGBT temperature, further improve the detection accuracy of IGBT temperature.
It should be noted that the present embodiment for IGBT12 pin 19 and temperature sensor 14 pin 20 connection side
Formula does not limit.
Optionally, the pin 19 of IGBT12 and the pin 20 of temperature sensor 14 can be welded directly together.
Optionally, IGBT12 and temperature sensor 14 are arranged on the wiring board 11 in electromagnetic oven.The pin of IGBT12
19 and the pin 20 of temperature sensor 14 weld in assist side 11.The pin 19 of IGBT12 and the pin of temperature sensor 14
20 are connected by wiring board 11 (such as copper sheet of wiring board).
It should be noted that the pin 19 of limiting temperature sensor 14 is not connected with which pin of IGBT12 for this implementation,
It can be configured according to the position of IGBT12 and temperature sensor 14.
It should be noted that the present embodiment is not limited for the material of the first heat-conducting layer 15.Optionally, the first heat-conducting layer
15 can be it is following in any one：Heat-conducting silicone grease heat-conducting layer, heat conductive silica gel heat-conducting layer and heat conduction foam heat-conducting layer.
Wherein, heat-conducting silicone grease is commonly called as thermal grease, is using organic silicone as primary raw material, adds heat-resisting, excellent thermal conductivity
Material and manufactured heat-conducting type organosilicon smectic compound, be mainly used for power amplifier, transistor, electron tube, centre
The heat conduction and heat dissipation of the electronic components such as device (Central Processing Unit, CPU) are managed, so as to ensure electronic instrument, instrument
The stability of the electric property of table etc..
Heat conductive silica gel is a kind of heat conduction compound, has high-adhesion can be with superpower heat-conducting effect.Heat conductive silica gel and lead
Hot silicone grease is compared, and heat conductive silica gel can cure, and has preferable adhesive property.
Heat conduction foam belongs to one kind of foam, has good heat-conductive characteristic.Foam is the material that plastic pellet foamed
Material, builds up foam.Foam have elastic, light-weight, quick pressure-sensitive fixation, easy to use, bending freely, the spy such as volume is ultra-thin
Point.
Wherein, in order to further lift thermal conduction effect, the second heat conduction is provided between IGBT12 and the first heat sink 13
Layer (not shown).
By setting the second heat-conducting layer, heat caused by IGBT12 work can rapidly be transmitted by the second heat-conducting layer
To the first heat sink 13, heat conduction velocity is improved, and then temperature sensor 14 can quickly detect IGBT12 bodies
Temperature, further improve IGBT temperature detection real-time.Wherein, the present embodiment is not done for the material of the second heat-conducting layer
Limit, may refer to the description of the first heat-conducting layer.
Optionally, the side of the upper remote wiring boards 11 of IGBT12, which is sticked, the first heat sink 13.
Wherein, in order to which the first heat sink 13 and IGBT12 are fixed in assist side 11, as shown in figure 4, the first heat sink
First through hole (not shown) is provided with 13, the second through hole 16 with first through hole position correspondence, circuit are provided with IGBT12
The third through-hole (not shown) with first through hole position correspondence is provided with plate 11.
It is used to be inserted into fixing piece in first through hole, the second through hole 16 and third through-hole.
Specifically, by setting position correspondence respectively on the first heat sink 13, on IGBT12 and on wiring board 11
First through hole, the second through hole 16 and third through-hole, are inserted into the corresponding first through hole in position, the second through hole 16 and third through-hole
Fixing piece, IGBT12 can be fixed in assist side 11, the first heat sink 13 is fixed on IGBT12, so as to secure the
Relative position between one heat sink 13, IGBT12 and wiring board 11.
The present embodiment is not limited for the specific location and shape of first through hole, the second through hole 16 and third through-hole, root
It is configured according to needs.
The present embodiment is not limited for the implementation of fixing piece, such as can be bolt or screw.
It should be noted that the present embodiment is not limited for other components contacted with the first heat sink 13.For example,
It is also provided with bridge heap on wiring board 11, bridge heap is sticked the first heat sink 13.Bridge heap is the Important Components in electromagnetic oven, is used
In being DC power supply by mains electric rectification, component, function module and the circuit to be arranged on wiring board in electromagnetic oven carry
For input voltage and operating voltage.
Wherein, bridge heap can also produce amount of heat at work, in order to reduce the temperature of IGBT and bridge heap, avoid in circuit
The region of an extreme temperatures is formed on plate, bridge heap 17, which can be sticked, the second heat sink 18.
Specifically, IGBT12, which is sticked, the first heat sink 13, bridge heap 17, which is sticked, the second heat sink 18.IGBT12 and Qiao Dui
17 lock on two different heat sinks respectively, form two separated heating regions in the circuit board.Due to two separation
Heating region there is certain interval, therefore IGBT12 and bridge heap 17 work caused by heat can preferably give out
Go so that the Temperature Distribution on wiring board is more reasonable, avoids and the excessive high temperature ring of temperature is formed on the wiring board of electromagnetic oven
Border, the component on wiring board will not be damaged because of being operated in hot environment, protect the component on wiring board.
It is to be appreciated that the present embodiment is not limited for the shape, material, structure of the first heat sink 13 and the second heat sink 18
It is fixed.
Wherein, for further improving radiating effect, the fast characteristic of aluminium material exotherm rate, the first heat sink 13 are utilized
And/or second heat sink 18 can be aluminium radiator fin.
It is to be appreciated that the present embodiment is not done for the first heat sink 13 and the position in 18 assist side 11 of the second heat sink
Limit.
Wherein, for further improving radiating effect, the minimum range between the first heat sink 13 and the second heat sink 18
50 millimeters can be more than or equal to.
Specifically, in view of the size and heat dissipation effect of wiring board 11, when the first heat sink 13 and the second heat sink 18
Between minimum range when being more than or equal to 50 millimeters, can further improving radiating effect so that the temperature on wiring board
Distribution is more reasonable.
Wherein, in order to further lift thermal conduction effect, the 3rd heat conduction is provided between 17 and second heat sink 18 of bridge heap
Layer (not shown).
By set the 3rd heat-conducting layer, bridge heap 17 work caused by heat can rapidly be transmitted by the 3rd heat-conducting layer
To the second heat sink 18, heat conduction velocity is improved, so as to further improve the heat dissipation effect of heat sink.Wherein, this reality
The material that example is applied for the 3rd heat-conducting layer does not limit, and may refer to the description of the first heat-conducting layer.
Optionally, the side away from wiring board 11 is sticked and has the second heat sink 18 on bridge heap 17.
Wherein, in order to which the second heat sink 18 and bridge heap 17 are fixed in assist side 11, as shown in figure 4, the second heat sink
Fourth hole is provided with 18, be provided with bridge heap 17 with the fifth hole of fourth hole position correspondence 21, set on wiring board 11
It is equipped with the 6th through hole with fourth hole position correspondence.
It is used to be inserted into fixing piece in fourth hole, 21 and the 6th through hole of fifth hole.
Specifically, by setting position correspondence respectively on the second heat sink 18, on bridge heap 17 and on wiring board 11
Fourth hole, 21 and the 6th through hole of fifth hole, are inserted into the corresponding fourth hole in position, 21 and the 6th through hole of fifth hole
Fixing piece, can fix bridge heap 17 in assist side 11, and the second heat sink 18 is fixed on bridge heap 17, so as to secure
The relative position of two heat sinks 18, bridge heap 17 and wiring board 11.
The present embodiment is not limited for the specific location and shape of fourth hole, 21 and the 6th through hole of fifth hole, root
It is configured according to needs.
The present embodiment is not limited for the implementation of fixing piece, such as can be bolt or screw.
Present embodiments provide a kind of electromagnetic oven, including IGBT and temperature sensor, temperature sensor and the first heat sink
Between be provided with the first heat-conducting layer.Electromagnetic oven provided in this embodiment, by being set between temperature sensor and the first heat sink
The first heat-conducting layer put, temperature sensor can be with the temperature of indirect detection IGBT bodies.The detection for improving IGBT temperature is accurate
Property, and then improve the accuracy of IGBT operating modes control.
One of ordinary skill in the art will appreciate that：Realizing all or part of step of above-mentioned each method embodiment can lead to
The relevant hardware of programmed instruction is crossed to complete.Foregoing program can be stored in a computer read/write memory medium.The journey
Sequence upon execution, execution the step of including above-mentioned each method embodiment；And foregoing storage medium includes：ROM, RAM, magnetic disc or
Person's CD etc. is various can be with the medium of store program codes.
Finally it should be noted that：Various embodiments above only illustrating the technical solution of the utility model embodiment, rather than
It is limited；Although the utility model embodiment is described in detail with reference to foregoing embodiments, this area it is common
Technical staff should be understood：It can still modify the technical solution described in foregoing embodiments, or to wherein
Some or all of technical characteristic carries out equivalent substitution；And these are changed or are replaced, the essence of appropriate technical solution is not made
Depart from the scope of the utility model embodiment technical solution.
Claims (11)
1. a kind of electromagnetic oven, including insulated gate bipolar transistor IGBT (12) and temperature sensor (14), the IGBT (12)
Being sticked has the first heat sink (13), it is characterised in that is set between the temperature sensor (14) and first heat sink (13)
It is equipped with the first heat-conducting layer (15).
2. electromagnetic oven according to claim 1, it is characterised in that the pin of the temperature sensor (14) and the IGBT
(12) pin connection.
3. electromagnetic oven according to claim 1, it is characterised in that the temperature sensor (14) is arranged on described first and dissipates
Below backing (13).
4. electromagnetic oven according to claim 1, it is characterised in that first heat-conducting layer (15) is any one in following
Kind：Heat-conducting silicone grease heat-conducting layer, heat conductive silica gel heat-conducting layer and heat conduction foam heat-conducting layer.
5. electromagnetic oven according to claim 1, it is characterised in that the IGBT (12) and first heat sink (13) it
Between be provided with the second heat-conducting layer.
6. electromagnetic oven according to any one of claims 1 to 5, it is characterised in that the IGBT (12) and the temperature pass
Sensor (14) is set in assist side (11).
7. electromagnetic oven according to claim 6, it is characterised in that it is logical that first is provided with first heat sink (13)
Hole, the second through hole with the first through hole position correspondence is provided with the IGBT (12), is set on the wiring board (11)
There is the third through-hole with the first through hole position correspondence；
It is used to be inserted into fixing piece in the first through hole, second through hole and the third through-hole.
8. electromagnetic oven according to claim 6, it is characterised in that bridge heap (17) is additionally provided with the wiring board (11),
The bridge heap (17) is sticked and has the second heat sink (18).
9. electromagnetic oven according to claim 8, it is characterised in that first heat sink (13) and second heat sink
(18) minimum range between is more than or equal to 50 millimeters.
10. electromagnetic oven according to claim 8, it is characterised in that the bridge heap (17) and second heat sink (18)
Between be provided with the 3rd heat-conducting layer.
11. electromagnetic oven according to any one of claims 1 to 5, it is characterised in that the temperature sensor (14) is subzero temperature
Spend coefficient NTC temperature sensors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721240160.9U CN207230650U (en) | 2017-09-26 | 2017-09-26 | Electromagnetic oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721240160.9U CN207230650U (en) | 2017-09-26 | 2017-09-26 | Electromagnetic oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207230650U true CN207230650U (en) | 2018-04-13 |
Family
ID=61864288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721240160.9U Expired - Fee Related CN207230650U (en) | 2017-09-26 | 2017-09-26 | Electromagnetic oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207230650U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108592099A (en) * | 2018-05-11 | 2018-09-28 | 陈永航 | a kind of electromagnetic oven |
| CN114938657A (en) * | 2019-12-05 | 2022-08-23 | 法雷奥热系统公司 | Fluid heating device, in particular for a vehicle |
| CN114938657B (en) * | 2019-12-05 | 2024-04-19 | 法雷奥热系统公司 | Fluid heating device, in particular for a vehicle |
-
2017
- 2017-09-26 CN CN201721240160.9U patent/CN207230650U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108592099A (en) * | 2018-05-11 | 2018-09-28 | 陈永航 | a kind of electromagnetic oven |
| CN114938657A (en) * | 2019-12-05 | 2022-08-23 | 法雷奥热系统公司 | Fluid heating device, in particular for a vehicle |
| CN114938657B (en) * | 2019-12-05 | 2024-04-19 | 法雷奥热系统公司 | Fluid heating device, in particular for a vehicle |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207398123U (en) | Radiator, layout structure and the electromagnetic heating utensil of power device | |
| CN207230650U (en) | Electromagnetic oven | |
| CN100581336C (en) | Radiation elimination device for electromagnetic furnace without radiation | |
| CN205864941U (en) | A kind of heat-radiating device of electric component | |
| CN206100745U (en) | Forced air cooling circuit isolation structure | |
| CN207230649U (en) | Electromagnetic oven | |
| CN204480154U (en) | A kind of computer cabinet | |
| CN206402122U (en) | A kind of air-cooled high frequency electric source | |
| CN207300442U (en) | The temperature measurement structure and inverter of electronic component | |
| CN206610387U (en) | The independent air guiding heat dissipation device of all-in-one | |
| JP2009081100A (en) | Induction heating cooker | |
| CN206361734U (en) | Electromagnetic oven | |
| CN202561835U (en) | Electromagnetic oven with fanless oven body | |
| CN207118193U (en) | It is high-power without air-cooled high-reliability electrical source | |
| JPH06229844A (en) | Heat generation apparatus | |
| CN208954975U (en) | Heat radiation structure and cooking utensil | |
| CN101287312A (en) | Irradiation eliminating apparatus of non-radiation electromagnetic oven | |
| CN212933399U (en) | Microcomputer protection device suitable for low-temperature environment | |
| CN108336047A (en) | A kind of device carrying out electronic element radiating using phase change heat storage material | |
| CN219248079U (en) | Novel anti-aging and damaged heater | |
| CN211859965U (en) | Power adapter with self-checking function | |
| CN202206562U (en) | Electric heating chassis and electric kettle | |
| CN213957816U (en) | Heat radiation structure of microwave oven camera | |
| CN103632779B (en) | Power thick-film resistor | |
| CN203708522U (en) | Subsection-type heating induction cooker |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180413 |