CN214672558U

CN214672558U - Rotating chuck for adsorbing fragile wafer

Info

Publication number: CN214672558U
Application number: CN202120294033.7U
Authority: CN
Inventors: 钟敏
Original assignee: Shanghai Lieth Precision Equipment Co ltd
Current assignee: Shanghai Lieth Precision Equipment Co ltd
Priority date: 2021-02-02
Filing date: 2021-02-02
Publication date: 2021-11-09
Anticipated expiration: 2031-02-02

Abstract

The utility model discloses a rotary chuck for adsorbing fragile wafers, which relates to the technical field of semiconductors and comprises a chuck main body, a negative pressure device, a rubber ring, a laser probe, a rotary mechanism, a nitrogen gas spraying module and a main controller, wherein, wafer clamping groove has been seted up at the middle part of chuck main part, wafer clamping groove's downside inner wall middle part is equipped with rotary mechanism, wafer clamping groove's downside inner wall outer fringe has been seted up annular groove, the rubber circle is located in the annular groove, the mounting groove has been seted up to wafer clamping groove's internal perisporium's downside, laser probe installs in the mounting groove, still be equipped with nitrogen gas erupts simultaneously and send the module in the mounting groove, the inside of chuck main part is equipped with vacuum apparatus and main control unit, a plurality of first absorption holes have been seted up on wafer clamping groove's the downside inner wall, a plurality of first absorption holes are connected with vacuum apparatus, laser probe, nitrogen gas erupts simultaneously and send the module, and vacuum apparatus is connected with main control unit respectively. The wafer clamping device can adsorb the warped and deformed wafer and also can prevent the wafer from cracking.

Description

Rotating chuck for adsorbing fragile wafer

Technical Field

The utility model relates to the semiconductor technology field especially involves a spin chuck for adsorbing breakable wafer.

Background

During semiconductor manufacturing, a large amount of stress inevitably builds up on the wafer, causing the wafer to warp partially or completely, and even causing the wafer to crack when the stress exceeds the limit that the wafer can withstand.

The exposure process needs to place the wafer on a sucker, fix the wafer by suction through a vacuum suction hole on the sucker, and then carry out photoetching on the wafer. The sucking disc is usually provided with a plurality of sucking holes so as to fix the wafer better, and when the wafer is flat or has slight warping deformation, the sucking disc can adsorb the wafer and reduce the warping degree of the wafer; however, when the wafer is seriously deformed, vacuum leakage is generated between the chuck and the wafer, so that the wafer cannot be adsorbed, and thus, the wafer is rejected, and the yield is greatly influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a spin chuck for adsorbing breakable wafer for solve above-mentioned technical problem.

The utility model adopts the technical scheme as follows:

the utility model provides a rotating chuck for adsorbing breakable wafer, includes chuck main part, vacuum device, rubber circle, laser probe, rotary mechanism, nitrogen gas spraying module and main control unit, wherein, wafer clamping groove has been seted up at the middle part of chuck main part, wafer clamping groove's downside inner wall middle part is equipped with rotary mechanism, the annular groove has been seted up to wafer clamping groove's downside inner wall outer fringe, the rubber circle is located in the annular groove, the mounting groove has been seted up to wafer clamping groove's internal perisporium's downside, laser probe install in the mounting groove, still be equipped with in the mounting groove nitrogen gas spraying module, the inside of chuck main part is equipped with vacuum device with main control unit, set up a plurality of first absorption holes on wafer clamping groove's the downside inner wall, a plurality of first absorption hole with vacuum device connects, laser probe, nitrogen gas spraying module and main control unit, The nitrogen spraying module and the negative pressure device are respectively connected with the main controller.

Preferably, the chuck further comprises a stress detector, wherein the stress detector is arranged in the chuck body and is in signal connection with the negative pressure device.

Preferably, the rotation mechanism comprises a rotational support.

Preferably, the nitrogen gas spraying module comprises four nitrogen gas nozzles and a nitrogen gas storage mechanism, wherein each nitrogen gas nozzle is respectively connected with the nitrogen gas storage mechanism, and the nitrogen gas storage mechanism is connected with the main controller.

Preferably, the upper surface of the rubber ring is flush with the upper surface of the wafer clamping groove.

Preferably, the negative pressure device comprises a vacuum generator, a main pipeline and branch pipelines, wherein each branch pipeline is respectively connected with the main pipeline and one first adsorption hole, the main pipeline is connected with the vacuum generator, and the vacuum generator is connected with the main controller.

As a further preference, the included angle between every two adjacent nitrogen nozzles is 45 degrees.

The technical scheme has the following advantages or beneficial effects:

(1) in the utility model, the stress acted on the surface of the wafer by the negative pressure device can be accurately controlled, and the situation that the stress exceeds the limit of the wafer and leads to the wafer to be cracked can be prevented;

(2) in the utility model, whether barriers exist in the wafer clamping groove can be detected in advance, and the barriers exist between the wafer and the wafer clamping groove, so that the wafer is broken in the process of applying negative pressure to the wafer;

(3) the utility model discloses in, can adjust the position of wafer in wafer draw-in groove, can realize adsorbing the wafer of deformation.

Drawings

Fig. 1 is a perspective view of a spin chuck for holding a fragile wafer according to the present invention;

fig. 2 is a top view of a spin chuck for holding a fragile wafer according to the present invention;

fig. 3 is a schematic view of the internal structure of the spin chuck for adsorbing fragile wafers according to the present invention;

fig. 4 is a diagram illustrating a state of use of the spin chuck for sucking a fragile wafer according to the present invention.

In the figure: 1. a chuck body; 11. a wafer clamping groove; 12. an annular groove; 13. mounting grooves; 14. a first adsorption hole; 15. a wafer; 2. a negative pressure device; 21. a vacuum generator; 22. a main pipeline; 23. a branch line; 24. an air tube; 3. a rubber ring; 31. a second adsorption hole; 4. a laser probe; 5. a rotation mechanism; 6. a main controller; 7. a stress detector; 8. a nitrogen nozzle; 9. a first suction cup; 10. and a second suction cup.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the indicated orientation or positional relationship thereof is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, but does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Fig. 1 is a perspective view of a spin chuck for holding a fragile wafer according to the present invention; fig. 2 is a top view of a spin chuck for holding a fragile wafer according to the present invention; fig. 3 is a schematic view of the internal structure of the spin chuck for adsorbing fragile wafers according to the present invention; fig. 4 is a diagram illustrating a state of use of the spin chuck for sucking a fragile wafer according to the present invention. Referring to fig. 1 to 4, a preferred embodiment is shown, which illustrates a spin chuck for adsorbing a fragile wafer, including a chuck body 1, a negative pressure device 2, a rubber ring 3, a laser probe 4, a rotating mechanism 5, a nitrogen gas spraying module and a main controller 6, wherein a wafer clamping groove 11 is formed in the middle of the chuck body 1, the rotating mechanism 5 is arranged in the middle of the lower inner wall of the wafer clamping groove 11, an annular groove 12 is formed in the outer edge of the lower inner wall of the wafer clamping groove 11, the rubber ring 3 is arranged in the annular groove 12, a mounting groove 13 is formed in the lower side of the inner peripheral wall of the wafer clamping groove 11, the laser probe 4 is mounted in the mounting groove 13, the nitrogen gas spraying module is further arranged in the mounting groove 13, the negative pressure device 2 and the main controller 6 are arranged in the chuck body 1, a plurality of first adsorption holes 14 are formed in the lower inner wall of the wafer clamping groove 11, the plurality of first adsorption holes 14 are connected to the negative pressure device 2, the laser probe 4, the nitrogen gas spraying module and the negative pressure device 2 are respectively connected with a main controller 6. In this embodiment, as shown in fig. 3, one side of mounting groove 13 communicates with the inside of chuck body 1, the opposite side does not communicate with chuck body 1, and laser probe 4 and nitrogen gas spraying module are all installed on the inner wall of the opposite side of mounting groove 13, wherein, whether laser probe 4 is used for detecting the barrier has on the downside inner wall of wafer slot 11, when detecting that there is the barrier, main controller 6(PLC controller) control nitrogen gas spraying module sprays nitrogen gas along certain angle, blow in chuck body 1 with the barrier on the downside inner wall of wafer slot 11, can set up in chuck body 1 and collect the box, be used for collecting the barrier that blows off. The upper surface of the rotating mechanism 5 in this embodiment is flush with the inner wall of the lower side of the wafer slot 11, and the diameter of the wafer slot 11 is 1mm larger than that of the wafer 15. The height of the mounting groove 13 in the longitudinal direction is much smaller than the thickness of the wafer 15. In this embodiment, the rubber ring 3 is used to protect the outer edge of the wafer 15, the outer edge of the wafer 15 is brittle and easy to crack, and the cracking of the outer edge of the wafer 15 can be avoided by the rubber ring 3. In this embodiment, the depth of the wafer slot 11 is the same as the thickness of the wafer 15 or the depth of the wafer slot 11 is larger than the thickness of the wafer 15.

Further, as a preferred embodiment, the chuck further comprises a stress detector 7, wherein the stress detector 7 is arranged in the chuck body 1, and the stress detector 7 is in signal connection with the negative pressure device 2.

Further, as a preferred embodiment, the rotation mechanism 5 comprises a rotational bearing. In this embodiment, when the wafer 15 is warped, the wafer 15 may be driven to rotate by the rotation support, so that the warped portion of the wafer 15 is absorbed by the first absorption hole 14. If the suction is not always performed, the wafer 15 may be pressed by an external force so that the wafer 15 is sucked at the warped portion.

Further, as a preferred embodiment, the nitrogen gas spraying module comprises four nitrogen gas spraying nozzles 8 and a nitrogen gas storage mechanism, wherein each nitrogen gas spraying nozzle 8 is connected with the nitrogen gas storage mechanism, and the nitrogen gas storage mechanism is connected with the main controller 6. In this embodiment, the main controller 6 controls the nitrogen storage mechanism to provide nitrogen for the nitrogen nozzle 8, and the nitrogen storage mechanism may be a nitrogen storage tank. The nitrogen gas storage mechanism may be provided inside the chuck body 1, or provided outside the chuck body 1.

Further, as a preferred embodiment, the upper surface of the rubber ring 3 is flush with the upper surface of the wafer slot 11.

Further, as a preferred embodiment, the negative pressure device 2 comprises a vacuum generator 21, a main pipeline 22 and a branch pipeline 23, wherein each pipeline is respectively connected with the main pipeline 22 and a first adsorption hole 14, the main pipeline 22 is connected with the vacuum generator 21, and the vacuum generator 21 is connected with the main controller 6. The negative pressure device 2 in this embodiment further includes an electromagnetic valve and a vacuum pressure gauge, wherein the electromagnetic valve is disposed on the main pipeline 22 and used for controlling the opening and closing of the main pipeline 22, and the vacuum pressure gauge is disposed on one side of the vacuum generator 21 and used for detecting a vacuum pressure value generated by the vacuum generator 21 and feeding back a vacuum pressure value signal to the stress detector 7. In this embodiment, still include light source subassembly and prism subassembly with stress detection machine 7 cooperation use, wherein, the light source subassembly is located 11 upsides of wafer slot, the prism subassembly is located on 11 downside inner walls of wafer slot, the upper surface of prism subassembly is less than the plane at 11 downside inner walls of wafer slot, and the prism subassembly is just right with stress detection machine 7, the light that light source group price jetted out passes wafer 15, and through the refraction of prism subassembly, stress detection machine 7 receives the light after the refraction, and compare through the light that has not passed the glass board refraction before, detect the stress value on wafer 15 surface, when the stress value on wafer 15 surface reaches the maximum stress value that wafer 15 itself can bear soon, stress detection machine 7 transmission control signal to main control unit 6, main control unit 6 control vacuum generator 21 stops working.

In this embodiment, when the vacuum generator 21 is operated, the first suction holes 14 generate suction force to suck the wafer 15.

Further, as a preferred embodiment, the included angle between every two adjacent nitrogen nozzles 8 is 45 °.

Further, as a preferred embodiment, the rubber ring 3 is further provided with a second suction hole 31, and the second suction hole 31 is connected to the main pipeline 22 through the air pipe 24, and the second suction hole 31 is arranged to suck the outer edge of the wafer 15.

Further, as a preferred embodiment, the device further comprises a first suction cup 9 and a second suction cup 10, wherein a first suction cup 9 is disposed in each first suction hole 14, the first suction cup 9 is connected to a respective pipeline, a second suction cup 10 is disposed in each second suction hole 31, and the second suction cup 10 is connected to the air pipe 24. In this embodiment, the first suction cup 9 and the second suction cup 10 are made of rubber materials, and the first suction cup 9 and the second suction cup 10 are arranged to facilitate the adsorption of the wafer 15. The upper surfaces of the first suction cup 9 and the second suction cup 10 are flush with the lower inner wall of the wafer 15 slot 11.

The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and those skilled in the art should be able to realize the equivalent alternatives and obvious variations of the present invention.

Claims

1. A rotary chuck for adsorbing fragile wafers is characterized by comprising a chuck main body, a negative pressure device, a rubber ring, a laser probe, a rotating mechanism, a nitrogen spraying module and a main controller, wherein a wafer clamping groove is formed in the middle of the chuck main body, the rotating mechanism is arranged in the middle of the lower inner wall of the wafer clamping groove, an annular groove is formed in the outer edge of the lower inner wall of the wafer clamping groove, the rubber ring is arranged in the annular groove, an installation groove is formed in the lower side of the inner peripheral wall of the wafer clamping groove, the laser probe is installed in the installation groove, the nitrogen spraying module is further arranged in the installation groove, the negative pressure device and the main controller are arranged in the chuck main body, a plurality of first adsorption holes are formed in the lower inner wall of the wafer clamping groove, and the first adsorption holes are connected with the negative pressure device, the laser probe, the nitrogen spraying module and the negative pressure device are respectively connected with the main controller.

2. The spin chuck according to claim 1, further comprising a stress detector disposed in the chuck body and in signal communication with the vacuum device.

3. The spin chuck according to claim 1, wherein the rotation mechanism comprises a rotational support.

4. The spin chuck according to claim 1, wherein the nitrogen gas injection module comprises four nitrogen gas injection heads and a nitrogen gas storage mechanism, wherein each nitrogen gas injection head is connected to the nitrogen gas storage mechanism, and the nitrogen gas storage mechanism is connected to the main controller.

5. The spin chuck according to claim 1, wherein an upper surface of the rubber ring is flush with an upper surface of the wafer pocket.

6. The spin chuck according to claim 1, wherein the negative pressure device comprises a vacuum generator, a main pipeline and branch pipelines, wherein each branch pipeline is connected to the main pipeline and the first suction hole, the main pipeline is connected to the vacuum generator, and the vacuum generator is connected to the main controller.

7. The spin chuck according to claim 4, wherein the angle between every two adjacent nitrogen nozzles is 45 °.