CN219321302U - Wafer back cleaning device capable of automatically detecting wafer notch - Google Patents

Abstract

The utility model discloses a wafer back cleaning device capable of automatically detecting wafer gaps, which comprises a rotatable bearing table, wherein the edge of the bearing table is provided with a jacking opening which is arranged in a penetrating manner; at least two clamping pins are arranged on the bearing table; the compound spray head is arranged in the bearing table and is used for spraying the liquid medicine to the back surface of the wafer after the wafer is adsorbed in a spaced mode; the guide rod is arranged in the jacking opening in a vertically lifting way through the lifting cylinder; the sensor is arranged at the top of the guide rod; when the lifting cylinder drives the sensor to extend out of the jacking opening top, the bearing table drives the sensor to rotate to sense a notch of the wafer; according to the utility model, the back surface of the wafer is cleaned by utilizing the liquid medicine channel in the composite spray head positioned in the bearing table, then the air separation adsorption of the wafer is realized through the air inlet channel, the compressed air cavity and the air outlet positioned on the upper surface of the bearing table, and the wafer does not rotate when the bearing table rotates, so that the sensor can conveniently sense the position of a notch on the wafer, and the clamping needle is ensured to clamp the wafer firmly.

Description

Wafer back cleaning device capable of automatically detecting wafer notch

Technical Field

The present utility model relates to a wafer backside cleaning device, and more particularly, to a wafer backside cleaning device capable of automatically detecting wafer notches.

Background

The Wafer needs to be cut into a small round opening at the edge in the production process, namely a Wafer notch, which can help the subsequent process to determine the placement position of Wafer, and the crystal orientation of single crystal growth is marked for positioning, so that the subsequent cutting and testing are convenient, and the cutting position is at the edge and is mostly an unusable area.

In the back cleaning process of the wafer, the wafer of upstream equipment ejection of compact is not fixed position, at present cleaning equipment is in order to guarantee the cleaning performance, reduce the contact surface, the pin is the smaller more do, so there is the possibility that the pin presss from both sides to the notch position, lead to wafer by "virtual" centre gripping, the centre gripping is infirm, when rotating at a high speed, there is danger, thereby the processing that leads to the wafer has unexpected situation to produce, the normal production technology of wafer has been influenced, so need can design a position that can the automatic identification breach, guarantee that the pin can not clamp the problem that the wafer centre gripping is infirm appears behind the breach.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provide the wafer back cleaning device which can determine the position of the wafer notch before cleaning the back of the wafer, ensure that the wafer can be firmly clamped after the clamping needle avoids the wafer notch, ensure that the wafer can be cleaned normally and automatically detect the wafer notch.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a wafer backside cleaning device capable of automatically detecting wafer gaps, comprising:

the rotary bearing table is provided with a jacking opening penetrating through the edge of the bearing table;

the clamping pins are arranged on the bearing table and used for clamping the wafer on the bearing table;

the compound spray head is arranged in the bearing table and is used for spraying the liquid medicine to the back surface of the wafer after the wafer is adsorbed at intervals;

the guide rod is arranged in the jacking opening in a vertically lifting way through a lifting cylinder;

the sensor is arranged at the top of the guide rod;

after the lifting cylinder drives the sensor to extend out of the top of the jacking opening, the bearing table drives the sensor to rotate to sense a notch of the wafer.

Further, the carrying table is rotated by a rotating motor.

Further, the composite spray head includes:

the spray head body is arranged in the bearing table;

the liquid medicine channel is arranged at the center of the spray head body and is communicated with the center through hole of the bearing table;

the air inlet channel is arranged around the liquid medicine channel and is communicated with the compressed air cavity in the bearing table; the compressed air cavity is communicated with an air outlet positioned on the upper surface of the bearing table.

Further, still be equipped with the protection subassembly outside the sensor, the protection subassembly includes:

the rotating mechanism is connected with the lifting cylinder;

the rotating plate is rotatably arranged at the top of the guide rod, and the sensor is arranged above the rotating plate;

a rotating rod arranged above the rotating plate, wherein a guide groove is formed in the rotating rod;

the liquid leakage preventing cover is arranged at the top of the rotating rod and covers the upper part of the sensor;

the guide positioning block is arranged in the bearing table, and is internally provided with a positioning pin pointing to the guide groove, wherein when the lifting cylinder ascends, the positioning pin drives the rotary rod to rotate through the guide groove;

the spring is sleeved in the rotary rod and is positioned between the guide positioning block and the rotary plate. Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

1. the position of the wafer gap is sensed through the sensor capable of ascending and descending, the clamping needle is prevented from being clamped at the gap, the wafer is ensured to be clamped firmly, and the anti-leakage cover for preventing the sensor from being corroded is arranged above the sensor for protection.

2. Through the compressed air cavity inside air inlet channel, plummer and the gas outlet that is located plummer upper surface, realize separating the sky absorption to the wafer, the wafer does not rotate when plummer rotates like this to the sensor of being convenient for responds to the position of breach on the wafer.

Drawings

The technical scheme of the utility model is further described below with reference to the accompanying drawings:

FIG. 1 is a schematic diagram of an embodiment of the present utility model;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a partial cross-sectional view of B-B of FIG. 2;

FIG. 4 is a partial cross-sectional view of C-C of FIG. 2;

FIG. 5 is a partial cross-sectional view of a composite showerhead and carrier attached in accordance with one embodiment of the present utility model;

FIG. 6 is a schematic view of a structure in which a carrying platform, an air inlet channel and a liquid medicine pipeline are connected in an embodiment of the present utility model;

FIG. 7 is a schematic view of the connection of the guide rod, sensor and guard assembly according to an embodiment of the present utility model;

FIG. 8 is a partial cross-sectional view of FIG. 7;

FIG. 9 is a schematic perspective view of a leak-proof cover according to an embodiment of the utility model;

FIG. 10 is a schematic diagram of a three-dimensional structure of the clamping pins of FIG. 1 clamping a wafer;

wherein: the liquid-leakage-proof type shower head comprises a bearing table 1, a clamping needle 2, a composite shower head 3, a sensor 4, a protection component 5, a wafer 6, a rotating motor 10, a jacking port 11, a central through hole 12, a shower head body 30, a compressed air cavity 31, a liquid medicine channel 32, an air inlet channel 33, an air outlet 35, a guide rod 50, a rotating plate 51, a rotating rod 52, a liquid leakage-proof cover 53, a lifting cylinder 54, a rotating mechanism 55, a guide positioning block 56, a positioning pin 57, a spring 58 and a guide groove 520.

Detailed Description

The utility model will be described in further detail with reference to the accompanying drawings and specific examples.

Referring to fig. 1-3, a wafer back cleaning device capable of automatically detecting a wafer gap according to an embodiment of the present utility model includes a carrying platform 1, clamping pins 2, a composite nozzle 3, a guide rod 50 and a sensor 4, wherein four clamping pins 2 are arranged on the carrying platform 1, the four clamping pins 2 are used for clamping a wafer 6 in a mutually matched manner, a lifting opening 11 is arranged at the edge of the carrying platform 1, and the lifting opening 11 is far away from the clamping pins 2; meanwhile, the carrying platform 1 rotates through the rotating motor 10 below the carrying platform, the composite spray head 3 and the sensor 4 are arranged inside the carrying platform 1, the guide rod 50 can be lifted up and down to be arranged in the jacking port 11, and the sensor 4 is arranged at the top of the guide rod 50.

Referring to fig. 3-6, in the present embodiment, the compound nozzle 3 is used for spraying the chemical solution onto the back surface of the wafer 6, and the other is used for adsorbing the wafer at intervals, so that the wafer 6 does not rotate synchronously with the carrier 1.

Specifically, the composite spray head comprises a spray head body 30, a liquid medicine channel 32 is arranged at the center of the spray head body 30, the liquid medicine channel 32 is communicated with a central through hole 12 on the bearing table 1 and is used for conveying and discharging liquid medicine, a plurality of air inlet channels 33 are arranged around the liquid medicine channel 32, a compressed air cavity 31 is arranged in the bearing table 1, the compressed air cavity 31 is communicated with the air inlet channels 33, and the compressed air cavity 31 is communicated with an air outlet 35 on the upper surface of the bearing table 1, so that air flows into the compressed air cavity 31 from the air inlet channels 33 and is discharged from the air outlet 35, and therefore, after negative pressure is formed on the upper surface of the bearing table 1, wafers 6 on the bearing table 1 are adsorbed in a spaced mode.

The air outlet 35 in this embodiment is a circular air outlet, and the shape has a better effect on the vacuum adsorption of the wafer.

During operation, the air inlet channel 33 of the composite spray head 3 is connected with clean compressed air, and air sprayed from the back-shaped air outlet 35 forms cyclone to generate negative pressure by utilizing Bernoulli principle, so that the wafer 6 is adsorbed at intervals, and the wafer 6 and the upper surface of the bearing table 1 are kept at a certain distance L due to air flow, so that the wafer 6 can be restrained in the Z-axis direction, and the wafer 6 is not restrained in other directions, so that the wafer 6 can not rotate along with the bearing table 1 when the following bearing table 1 rotates.

Referring to fig. 1,7-9, in this embodiment, the sensor 4 is disposed in the lifting opening 11 in a manner that the sensor 4 can be lifted up and down by the guide rod 50, when the position of the notch 60 of the wafer 6 needs to be detected, the sensor 4 is driven by the lifting cylinder to extend from the lifting opening 11, and then the sensor 4 rotates along with the rotation of the carrying table 1, so that the notch is detected in a rotating manner, and the card needle 2 avoids the position of the notch through calculation by an algorithm.

Referring to fig. 5, since the liquid medicine in the liquid medicine passage 32 may corrode the sensor 4 after being ejected, thereby damaging the sensor 4, a protection component 5 is further provided outside the sensor 4 to protect the sensor 4, but the operation of the sensor 4 is not affected.

In this embodiment, the protection component 5 includes a rotating mechanism 55, the rotating mechanism 55 is connected with a lifting cylinder 54, a rotating plate 51 is rotatably arranged on the top of the guide rod 50, and the sensor 4 is arranged above the rotating plate; the rotating rod 52 is arranged above the rotating plate, and the rotating rod 52 is internally provided with a guide groove 520 which takes the shape of an arc; a liquid leakage preventing cover 53 is provided on the top of the rotating lever 52 and covers the upper side of the sensor 4; the guide positioning block 56 is arranged in the bearing table, and the guide positioning block 56 is internally provided with a positioning pin 56 which is clamped in the guide groove 520.

When the sensor 4 does not work, the sensor 4 is protected by the liquid leakage preventing cover 53, when the sensor 4 needs to work, the lifting cylinder 54 is lifted to drive the guide rod 50 to lift, the guide rod 50 is lifted to drive the rotary rod 52 to lift, the positioning pin 57 is arranged in the guide positioning block 56 and is not moved, the rotary rod 52 rotates along the guide groove 520, the liquid leakage preventing cover 53 rotates by 90 degrees when the guide rod 50 is lifted, the liquid leakage preventing cover 53 avoids the sensor 4, and the sensor 4 stretches out to automatically perform notch 60 position sensing on the wafer 6.

The rotating mechanism 55 in this embodiment may be a motor, or may be other components or mechanisms, as long as the guiding rod 50 can be driven to rotate, and the rotating mechanism 55 drives the sensor to rotate when being matched with the bearing table to rotate.

Referring to fig. 1 and 9, the cleaning device is used as follows:

the manipulator 1 sends the wafer 6 to the bearing platform 1 positioned in the cavity, and the clamping needle 2 on the bearing platform 1 is in an open state.

2 the compound spray head 3 is connected with clean compressed air, and the compound spray head 3 utilizes an air inlet channel, a compressed air cavity and an air outlet to realize the air separation and adsorption of the wafer by utilizing the Bernoulli principle.

3 when the sensor 4 rises through the lifting cylinder, the anti-leakage cover 53 automatically keeps away the position and stretches out, at the moment, the bearing table 1 drives the sensor 4 at a low speed to carry out the rotation detection on the notch position of the wafer, the notch position is avoided by the clamp needle through algorithm calculation, and then the bearing table stops rotating.

4, reducing the air inflow of compressed air, and cleaning the back surface of the wafer by utilizing that the weight is larger than the buoyancy force, the wafer descends to contact with the clamping needle, the clamping needle clamps the wafer, and the liquid medicine in the liquid medicine pipeline 32 in the composite spray head 3 is sprayed out from the central through hole.

The foregoing is merely a specific application example of the present utility model, and the protection scope of the present utility model is not limited in any way. All technical schemes formed by equivalent transformation or equivalent substitution fall within the protection scope of the utility model.

Claims (4)

1. A wafer backside cleaning device capable of automatically detecting wafer gaps, comprising:

the rotary bearing table is provided with a jacking opening penetrating through the edge of the bearing table;

the clamping pins are arranged on the bearing table and used for clamping the wafer on the bearing table;

the compound spray head is arranged in the bearing table and is used for spraying the liquid medicine to the back surface of the wafer after the wafer is adsorbed at intervals;

the guide rod is arranged in the jacking opening in a vertically lifting way through a lifting cylinder;

the sensor is arranged at the top of the guide rod;

after the lifting cylinder drives the sensor to extend out of the top of the jacking opening, the bearing table drives the sensor to sense a notch of the wafer.

2. The wafer backside cleaning apparatus capable of automatically detecting wafer gaps as recited in claim 1, wherein: the bearing table rotates through a rotating motor.

3. The wafer backside cleaning apparatus capable of automatically detecting wafer gaps as recited in claim 1, wherein said composite showerhead comprises:

the spray head body is arranged in the bearing table;

the liquid medicine channel is arranged at the center of the spray head body and is communicated with the center through hole of the bearing table;

the air inlet channel is arranged around the liquid medicine channel and is communicated with the compressed air cavity in the bearing table; the compressed air cavity is communicated with an air outlet positioned on the upper surface of the bearing table.

4. The wafer backside cleaning apparatus capable of automatically detecting wafer gaps as recited in claim 1, wherein a protection component is further provided outside the sensor, and the protection component comprises:

the rotating mechanism is connected with the lifting cylinder;

the rotating plate is rotatably arranged at the top of the guide rod, and the sensor is arranged above the rotating plate;

a rotating rod arranged above the rotating plate, wherein a guide groove is formed in the rotating rod;

the liquid leakage preventing cover is arranged at the top of the rotating rod and covers the upper part of the sensor;

the guide positioning block is arranged in the bearing table, and is internally provided with a positioning pin pointing to the guide groove, wherein when the lifting cylinder ascends, the positioning pin drives the rotary rod to rotate through the guide groove;

the spring is sleeved in the rotary rod and is positioned between the guide positioning block and the rotary plate.

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