JP2018167367A - Grinding device - Google Patents

Grinding device Download PDF

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Publication number
JP2018167367A
JP2018167367A JP2017067439A JP2017067439A JP2018167367A JP 2018167367 A JP2018167367 A JP 2018167367A JP 2017067439 A JP2017067439 A JP 2017067439A JP 2017067439 A JP2017067439 A JP 2017067439A JP 2018167367 A JP2018167367 A JP 2018167367A
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Prior art keywords
grinding
plate
outer peripheral
workpiece
holding table
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JP2017067439A
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Japanese (ja)
Inventor
舞 羽田
Mai Haneda
舞 羽田
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2017067439A priority Critical patent/JP2018167367A/en
Priority to KR1020180032017A priority patent/KR20180111542A/en
Priority to CN201810257274.7A priority patent/CN108687587B/en
Priority to TW107110776A priority patent/TW201838019A/en
Publication of JP2018167367A publication Critical patent/JP2018167367A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/07Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table
    • B24B7/08Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table having an abrasive wheel built in
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/02Frames; Beds; Carriages
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/04Headstocks; Working-spindles; Features relating thereto
    • B24B41/047Grinding heads for working on plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/20Drives or gearings; Equipment therefor relating to feed movement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

To prevent the occurrence of breakage of a plate-like work and grinding failure even when sucking and holding the plate-like work having warp by a holding table.SOLUTION: A grinding device 1 comprises: a central communication pipe 20 communicating a central sucking part 110 of a holding table 10 with a sucking source 6; an outer periphery communication pipe 21 communicating an outer periphery sucking part 111 of the holding table 10 with the sucking source 6; a pressure gage 23b measuring negative pressure in the outer periphery communication pipe 21; and a recognition part 24 for recognizing that an outer periphery part Wc of the plate-like work W held by the holding table 10 is in a state of floating up from a holding surface 11a when a negative pressure value in the outer periphery communication pipe 21, measured with the pressure gage 23b becomes larger than a previously set negative pressure value. With this, even when there is warp in the outer periphery part Wc of the plate-like work W, the recognition part 24 can recognize whether the outer periphery part Wc of the plate-like work W floats up from the holding surface 11a or not so as to prevent the occurrence of breakage of the plate-like work W and grinding failure.SELECTED DRAWING: Figure 1

Description

本発明は、板状ワークを吸引保持する保持テーブルを備える研削装置に関する。   The present invention relates to a grinding apparatus including a holding table that sucks and holds a plate-like workpiece.

研削装置などの加工装置は、板状ワークを吸引保持する保持テーブルを備えている。保持テーブルは、板状ワークを吸引保持する保持面を上面に有するポーラス板と、ポーラス板を収容する枠体とを少なくとも備えている。枠体には、保持面と吸引源とを連通させる吸引路が形成されており、この吸引路を通じて保持面に吸引作用を発揮させて板状ワークを吸引保持している。   A processing apparatus such as a grinding apparatus includes a holding table for sucking and holding a plate-like workpiece. The holding table includes at least a porous plate having a holding surface for sucking and holding a plate-like workpiece on the upper surface, and a frame body that houses the porous plate. The frame is formed with a suction path that allows the holding surface and the suction source to communicate with each other, and the plate-like workpiece is sucked and held by exerting a suction action on the holding surface through the suction path.

板状ワークに反りが発生している場合、保持テーブルで板状ワークを吸引保持しようとしても保持テーブルの保持面から浮き上がった部分から負圧がリークしてしまい、板状ワークを吸引保持できないことがある。例えば、下記の特許文献1において、保持テーブルの保持面よりも大きな面積を有する粘着テープを介して保持テーブルで板状ワークを吸引保持することにより、反りを有する板状ワークであっても保持面で吸引保持できるようにする方法が提案されている。   When warping occurs in a plate-like workpiece, negative pressure leaks from the part that floats from the holding surface of the holding table even if it tries to suck and hold the plate-like workpiece with the holding table, and the plate-like workpiece cannot be sucked and held. There is. For example, in Patent Document 1 below, even if a plate-like workpiece having warpage is held by sucking and holding the plate-like workpiece with a holding table via an adhesive tape having a larger area than the holding surface of the holding table, the holding surface A method for making it possible to suck and hold by using this is proposed.

特開2013−93383号公報JP 2013-93383 A

しかし、上記のような方法は、保持テーブルの吸引力が低下しないようにすることが目的であるため、板状ワークの外周部分に密接するべき保持面において吸引力が低下した場合の対処に関しては特に想定されていない。そのため、研削加工中に保持テーブルの吸引力が低下すると、外周部分に反りを有する板状ワークが保持テーブルから吹き飛ぶという問題がある。また、保持テーブルから板状ワークが吹き飛ばなかったとしても、板状ワークの外周部分が保持面から浮き上がっていることから、研削後の板状ワークの厚みが均一とならないという問題もある。   However, since the method as described above is intended to prevent the suction force of the holding table from being reduced, regarding the countermeasure when the suction force is reduced on the holding surface that should be in close contact with the outer peripheral portion of the plate-like workpiece. Not specifically assumed. Therefore, when the suction force of the holding table is reduced during the grinding process, there is a problem that a plate-like workpiece having a warp in the outer peripheral portion blows away from the holding table. In addition, even if the plate-shaped workpiece does not blow off from the holding table, there is a problem that the thickness of the plate-shaped workpiece after grinding is not uniform because the outer peripheral portion of the plate-shaped workpiece is lifted from the holding surface.

本発明は、上記の事情に鑑みてなされたもので、反りを有する板状ワークを保持テーブルで吸引保持した場合であっても、板状ワークの破損や研削不良が発生するのを防止できるようにすることを目的としている。   The present invention has been made in view of the above circumstances, and even when a plate-like workpiece having warpage is sucked and held by a holding table, the plate-like workpiece can be prevented from being broken or poorly ground. The purpose is to be.

本発明は、板状ワークを吸引保持する保持面を有する保持テーブルと、該保持テーブルが保持した板状ワークを研削砥石で研削する研削手段と、該研削手段を該保持テーブルに対して接近及び離反する方向に研削送りする研削送り手段と、を備える研削装置であって、該保持テーブルは、中央吸引部と、該中央吸引部の外周を囲む少なくとも1つの環状の外周吸引部と、該中央吸引部と該外周吸引部との間を仕切る少なくとも1つの環状の仕切部と、を備え、該研削装置には、該中央吸引部を吸引源に連通させる中央連通管と、該外周吸引部を該吸引源に連通させる外周連通管と、該外周連通管内の負圧を測定する圧力計と、該圧力計が測定した該外周連通管内の負圧値があらかじめ設定した負圧値より大きくなったら該保持テーブルが保持する板状ワークの外周部分が該保持面から浮き上がった状態であると認識する認識部と、を備えている。   The present invention includes a holding table having a holding surface for sucking and holding a plate-like workpiece, a grinding means for grinding the plate-like workpiece held by the holding table with a grinding wheel, and the grinding means approaching the holding table. A holding device, wherein the holding table includes a central suction part, at least one annular outer peripheral suction part surrounding the outer periphery of the central suction part, and the center. An at least one annular partition that partitions the suction portion and the outer peripheral suction portion, and the grinding device includes a central communication pipe that communicates the central suction portion with a suction source, and the outer peripheral suction portion. An outer peripheral communication pipe that communicates with the suction source, a pressure gauge that measures the negative pressure in the outer peripheral communication pipe, and a negative pressure value measured by the pressure gauge in the outer peripheral communication pipe that is greater than a preset negative pressure value The holding table holds That the outer peripheral portion of the plate workpiece is provided with a recognizing section to be a floating state from the holding surface.

また、本発明は、上記研削砥石で上記保持テーブルが保持する板状ワークを研削する前に、上記認識部により上記保持面から板状ワークの外周部分の浮き上がりを認識したら、上記研削送り手段を停止させ、該研削砥石で該保持テーブルが保持する板状ワークの研削加工中に、該認識部により該保持面から板状ワークの外周部分の浮き上がりを認識したら、該研削送り手段による研削送りを停止させるか、または、該研削送り手段が該研削砥石の研削面を該保持テーブルが保持する板状ワークの上面から離す方向に移動させ、該圧力計が測定する該負圧値があらかじめ設定した負圧値以下になったら、該研削送り手段により該研削砥石を該保持テーブルが保持する板状ワークの上面に接近する方向に移動させる制御をする制御部を、備えている。   Further, the present invention provides the grinding feed means when the recognition unit recognizes the lifting of the outer peripheral portion of the plate-like workpiece from the holding surface before grinding the plate-like workpiece held by the holding table with the grinding wheel. During the grinding of the plate-like workpiece held by the holding table with the grinding wheel, when the recognition unit recognizes the lifting of the outer peripheral portion of the plate-like workpiece from the holding surface, the grinding feed by the grinding feed means is performed. The negative pressure value measured by the pressure gauge is set in advance by stopping or moving the grinding surface of the grinding wheel away from the upper surface of the plate-like workpiece held by the holding table. A control unit for controlling the grinding wheel to move in a direction approaching the upper surface of the plate-like workpiece held by the holding table by the grinding feed means when the negative pressure value is reached; .

本発明に係る研削装置は、板状ワークを吸引保持する保持面を有する保持テーブルと、保持テーブルが保持した板状ワークを研削砥石で研削する研削手段と、研削手段を保持テーブルに対して接近及び離反する方向に研削送りする研削送り手段とを備え、保持テーブルは、中央吸引部と、中央吸引部の外周を囲む少なくとも1つの環状の外周吸引部と、中央吸引部と外周吸引部との間を仕切る少なくとも1つの環状の仕切部とを備え、研削装置には、中央吸引部を吸引源に連通させる中央連通管と、外周吸引部を吸引源に連通させる外周連通管と、外周連通管内の負圧を測定する圧力計と、圧力計が測定した外周連通管内の負圧値があらかじめ設定した負圧値より大きくなったら保持テーブルが保持する板状ワークの外周部分が保持面から浮き上がった状態であると認識する認識部とを備えたため、
たとえ板状ワークの外周部分に反りがあっても、圧力計が測定した外周連通管の負圧値に基づいて、認識部が板状ワークの外周部分が保持面から浮き上がっているかどうかを認識することが可能となる。したがって、板状ワークが保持テーブルから吹き飛んで破損するのを防止することができるとともに、板状ワークが保持テーブルから吹き飛ばなかったとしても外周部分の浮き上がりに起因して外周部分が薄くなり、板状ワークの厚みが均一にならないという研削不良の発生を防止することができる。
A grinding apparatus according to the present invention includes a holding table having a holding surface for sucking and holding a plate-like workpiece, a grinding means for grinding the plate-like workpiece held by the holding table with a grinding wheel, and the grinding means approaching the holding table. The holding table includes a central suction part, at least one annular outer peripheral suction part surrounding the outer periphery of the central suction part, and a central suction part and an outer peripheral suction part. The grinding device includes a central communication pipe that communicates the central suction part with the suction source, an outer peripheral communication pipe that communicates the outer peripheral suction part with the suction source, and an inner peripheral communication pipe. When the negative pressure value in the outer peripheral pipe measured by the pressure gauge exceeds the negative pressure value set in advance, the outer peripheral part of the plate-like workpiece held by the holding table floats from the holding surface. Due to a the recognizing portion is a raised state,
Even if the outer periphery of the plate-shaped workpiece is warped, the recognition unit recognizes whether the outer periphery of the plate-shaped workpiece is lifted from the holding surface based on the negative pressure value of the outer peripheral communication tube measured by the pressure gauge. It becomes possible. Therefore, it is possible to prevent the plate-like workpiece from being blown off from the holding table and being damaged, and even if the plate-like workpiece is not blown off from the holding table, the outer peripheral portion is thinned due to the lifting of the outer peripheral portion, and the plate-like workpiece is thinned. It is possible to prevent the occurrence of grinding failure that the thickness of the workpiece is not uniform.

本発明に係る研削装置は、上記研削砥石で上記保持テーブルが保持する板状ワークを研削する前に、上記認識部により上記保持面から板状ワークの外周部分の浮き上がりを認識したら、上記研削送り手段を停止させ、研削砥石で保持テーブルが保持する板状ワークの研削加工中に、認識部により保持面から板状ワークの外周部分の浮き上がりを認識したら、研削送り手段による研削送りを停止させるか、または、研削送り手段が研削砥石の研削面を保持テーブルが保持する板状ワークの上面から離す方向に移動させ、圧力計が測定する負圧値があらかじめ設定した負圧値以下になったら、研削送り手段により研削砥石を保持テーブルが保持する板状ワークの上面に接近する方向に移動させる制御をする制御部を備えたため、認識部が板状ワークの外周部分の浮き上がりを認識したら、制御部によって研削砥石を板状ワークに接触させないように研削送り手段を制御することができ、上記同様、板状ワークの破損や研削不良の発生を防止することができる。   The grinding apparatus according to the present invention provides the grinding feed when the recognition unit recognizes the lifting of the outer peripheral portion of the plate-like workpiece from the holding surface before grinding the plate-like workpiece held by the holding table with the grinding wheel. If the recognition part recognizes the lifting of the outer peripheral part of the plate-like workpiece from the holding surface during grinding of the plate-like workpiece held by the holding table with the grinding wheel, is the grinding feed by the grinding feed means stopped? Or, if the grinding feed means moves the grinding surface of the grinding wheel away from the upper surface of the plate-like workpiece held by the holding table, and the negative pressure value measured by the pressure gauge is less than or equal to the preset negative pressure value, Since the control unit controls the movement of the grinding wheel in the direction approaching the upper surface of the plate-like workpiece held by the holding table by the grinding feed means, the recognition unit is a plate-like workpiece. If it is recognized that the outer peripheral part is lifted, the control unit can control the grinding feed means so that the grinding wheel does not come into contact with the plate-like workpiece, and as described above, the plate-like workpiece can be prevented from being damaged or poorly ground. Can do.

研削装置の一例の構成を示す斜視図である。It is a perspective view which shows the structure of an example of a grinding device. 保持テーブルの構成を示す分解斜視図である。It is a disassembled perspective view which shows the structure of a holding table. 保持テーブルの構成を示す断面図である。It is sectional drawing which shows the structure of a holding table. 保持テーブルで吸引保持した板状ワークの研削加工開始の状態を示す断面図である。It is sectional drawing which shows the state of the grinding process start of the plate-shaped workpiece | work sucked and hold | maintained with the holding table. 保持テーブルで吸引保持した板状ワークの研削加工中断の状態を示す断面図である。It is sectional drawing which shows the state of the grinding process interruption of the plate-shaped workpiece | work sucked and held by the holding table. 保持テーブルの変形例の構成を示す断面図である。It is sectional drawing which shows the structure of the modification of a holding table.

図1に示す研削装置1は、Y軸方向に延在する装置ベース2と、装置ベース2のY軸方向後部側に立設されたコラム3とを有している。研削装置1は、装置ベース2の上面に配設され板状ワークを吸引保持する保持テーブル10と、保持テーブル10に吸引保持された板状ワークを研削砥石37で研削する研削手段30と、保持テーブル10に対して接近及び離反する研削送り方向(Z軸方向)に研削手段30を研削送りする研削送り手段40と、保持テーブル10に吸引保持された板状ワークの厚みを測定する厚み測定手段50とを備えている。   A grinding apparatus 1 shown in FIG. 1 includes an apparatus base 2 extending in the Y-axis direction and a column 3 standing on the rear side of the apparatus base 2 in the Y-axis direction. The grinding apparatus 1 includes a holding table 10 disposed on the upper surface of the apparatus base 2 for sucking and holding a plate-like work, a grinding means 30 for grinding the plate-like work sucked and held by the holding table 10 with a grinding wheel 37, and holding. A grinding feed means 40 for grinding and feeding the grinding means 30 in a grinding feed direction (Z-axis direction) approaching and separating from the table 10, and a thickness measuring means for measuring the thickness of the plate-like workpiece sucked and held by the holding table 10. 50.

研削手段30は、コラム3の前方において研削送り手段40によって昇降可能に支持されている。研削手段30は、Z軸方向の軸心を有するスピンドル31と、スピンドル31の外周を囲繞するスピンドルハウジング32と、スピンドルハウジング32を保持するホルダ33と、スピンドル31の一端に取り付けられたモータ34と、マウント35を介してスピンドル31の下端に装着された研削ホイール36と、研削ホイール36の下部に円環状に固着された複数の研削砥石37とを備えている。モータ34がスピンドル31を回転させることにより、研削ホイール36を所定の回転速度で回転させることができる。   The grinding means 30 is supported by the grinding feed means 40 so as to be movable up and down in front of the column 3. The grinding means 30 includes a spindle 31 having an axis in the Z-axis direction, a spindle housing 32 that surrounds the outer periphery of the spindle 31, a holder 33 that holds the spindle housing 32, and a motor 34 that is attached to one end of the spindle 31. A grinding wheel 36 mounted on the lower end of the spindle 31 via the mount 35 and a plurality of grinding wheels 37 fixed in an annular shape to the lower part of the grinding wheel 36 are provided. When the motor 34 rotates the spindle 31, the grinding wheel 36 can be rotated at a predetermined rotational speed.

研削送り手段40は、Z軸方向に延在するボールネジ41と、ボールネジ41の一端に接続されたモータ42と、ボールネジ41と平行に延在する一対のガイドレール43と、内部に備えたナットがボールネジ41に螺合するとともに側部がガイドレール43に摺接する昇降板44とを備えている。昇降板44には、ホルダ33が固定されている。そして、モータ42がボールネジ41を回動させると、一対のガイドレール43に沿って昇降板44とともに研削手段30をZ軸方向に昇降させることができる。   The grinding feed means 40 includes a ball screw 41 extending in the Z-axis direction, a motor 42 connected to one end of the ball screw 41, a pair of guide rails 43 extending in parallel to the ball screw 41, and nuts provided therein. An elevating plate 44 is provided which is screwed into the ball screw 41 and whose side part is in sliding contact with the guide rail 43. A holder 33 is fixed to the lifting plate 44. When the motor 42 rotates the ball screw 41, the grinding means 30 can be moved up and down in the Z-axis direction along with the lift plate 44 along the pair of guide rails 43.

厚み測定手段50は、接触式の第1のハイトゲージ51と第2のハイトゲージ52とを備えている。厚み測定手段50では、第1のハイトゲージ51で保持テーブル10の上面高さを測定するとともに、第2のハイトゲージ52で保持テーブル10に保持される板状ワークの上面高さを測定して、それぞれの測定値の差を板状ワークの厚みとして算出することができる。   The thickness measuring means 50 includes a contact type first height gauge 51 and a second height gauge 52. The thickness measuring means 50 measures the upper surface height of the holding table 10 with the first height gauge 51, and measures the upper surface height of the plate-like workpiece held on the holding table 10 with the second height gauge 52, respectively. Can be calculated as the thickness of the plate-like workpiece.

保持テーブル10は、板状ワークを吸引保持する保持面11aを有するポーラス板11と、ポーラス板11を収容する枠体12と、枠体12が固定される基台13とを備えている。保持テーブル10の周囲はカバー4によって覆われている。保持テーブル10の下方には、図示してないが、保持テーブル10を回転させる回転手段と、保持テーブル10をカバー4とともにY軸方向に移動させる移動手段とが接続されている。   The holding table 10 includes a porous plate 11 having a holding surface 11a for sucking and holding a plate-like workpiece, a frame body 12 that houses the porous plate 11, and a base 13 on which the frame body 12 is fixed. The periphery of the holding table 10 is covered with a cover 4. Below the holding table 10, although not shown, a rotating means for rotating the holding table 10 and a moving means for moving the holding table 10 together with the cover 4 in the Y-axis direction are connected.

図2は、保持テーブル10が分解された状態の構成を示している。ポーラス板11は、円盤状に形成されており、ポーラスセラミックス等の多孔質部材によって構成されている。ポーラス板11は、中央吸引部110と、中央吸引部110の外周を囲む少なくとも1つの環状の外周吸引部111と、中央吸引部110と外周吸引部111との間を仕切る少なくとも1つの環状の仕切部112とを備え、ポーラス板11の保持面11aは、仕切部112によって、ポーラス板11の中心を中心にして同心円状に2つの吸引エリアに仕切られて構成されている。中央吸引部110は、径の小さい板状ワークを吸引保持するための吸引エリアであり、例えば直径200mmに設定されている。一方、外周吸引部111は、径の大きい板状ワークを吸引保持するための吸引エリアであり、例えば直径300mmに設定されている。なお、仕切部112の数は、1つのみに限られず、適宜増やして吸引エリアを2つ以上にしてもよい。また、加工対象となる板状ワークの径に応じて、中央吸引部110と外周吸引部111との大きさを適宜設定することができる。   FIG. 2 shows a configuration in which the holding table 10 is disassembled. The porous plate 11 is formed in a disc shape and is made of a porous member such as porous ceramics. The porous plate 11 includes a central suction part 110, at least one annular outer peripheral suction part 111 surrounding the outer periphery of the central suction part 110, and at least one annular partition that partitions between the central suction part 110 and the outer peripheral suction part 111. The holding surface 11a of the porous plate 11 is divided into two suction areas concentrically around the center of the porous plate 11 by the partitioning portion 112. The central suction part 110 is a suction area for sucking and holding a plate-like workpiece having a small diameter, and is set to have a diameter of 200 mm, for example. On the other hand, the outer periphery suction part 111 is a suction area for sucking and holding a plate-shaped workpiece having a large diameter, and is set to have a diameter of 300 mm, for example. In addition, the number of the partition parts 112 is not restricted to one, You may increase suitably and may make two or more suction areas. Further, the sizes of the central suction part 110 and the outer peripheral suction part 111 can be appropriately set according to the diameter of the plate-like workpiece to be processed.

枠体12には、リング状の凸部121が形成されており、凸部121の内側の領域がポーラス板11の形状に応じて形成された凹部120となっている。凸部121の上面は、ポーラス板11の保持面11aと同じ高さを有する基準面121aとなっており、図1に示した第1のハイトゲージ51が基準面121aに接触したときの高さ位置が保持面11aの高さとして測定される。枠体12の凹部120の内径は、ポーラス板11の外径よりも僅かに大きく形成され、凹部120にポーラス板11を嵌め込むことが可能となっている。枠体12の外周縁には、図3に示すネジ5を貫通させるための複数のネジ貫通孔126が枠体12の上下面を貫通して形成されている。   A ring-shaped convex portion 121 is formed on the frame body 12, and a region inside the convex portion 121 is a concave portion 120 formed according to the shape of the porous plate 11. The upper surface of the projection 121 is a reference surface 121a having the same height as the holding surface 11a of the porous plate 11, and the height position when the first height gauge 51 shown in FIG. 1 contacts the reference surface 121a. Is measured as the height of the holding surface 11a. The inner diameter of the recess 120 of the frame 12 is formed slightly larger than the outer diameter of the porous plate 11, and the porous plate 11 can be fitted into the recess 120. A plurality of screw through holes 126 for penetrating the screws 5 shown in FIG. 3 are formed in the outer peripheral edge of the frame body 12 so as to penetrate the upper and lower surfaces of the frame body 12.

凹部120の底面120aは、ポーラス板11を水平に固定するために平坦面に形成されている。凹部120の底面120aには、ポーラス板11の中央吸引部110に連通する吸引溝122と、吸引溝122に連通し枠体12の上下面を貫通した中央吸引孔124と、ポーラス板11の外周吸引部111に連通するリング状の外周吸引溝123と、外周吸引溝123に連通し枠体12の上下面を貫通した外周吸引孔125とを備えている。なお、図示の例では、中央吸引孔124や外周吸引孔125は、それぞれ1つのみ形成されているが、中央吸引孔124や外周吸引孔125の数や位置は限定されない。   The bottom surface 120a of the recess 120 is formed as a flat surface in order to fix the porous plate 11 horizontally. In the bottom surface 120 a of the recess 120, a suction groove 122 communicating with the central suction portion 110 of the porous plate 11, a central suction hole 124 communicating with the suction groove 122 and penetrating the upper and lower surfaces of the frame body 12, and the outer periphery of the porous plate 11 A ring-shaped outer peripheral suction groove 123 communicating with the suction part 111 and an outer peripheral suction hole 125 communicating with the outer peripheral suction groove 123 and penetrating the upper and lower surfaces of the frame body 12 are provided. In the illustrated example, only one central suction hole 124 and one outer peripheral suction hole 125 are formed, but the number and position of the central suction holes 124 and the outer peripheral suction holes 125 are not limited.

基台13の上面13aは、枠体12が水平に固定される被装着面となっている。基台13の上面13aには、基台13の上面13aから下面13bにかけて貫通し枠体12の中央吸引孔124に連通可能とする中央吸引孔130と、枠体12の外周吸引孔125に連通可能とするリング状の外周吸引溝131と、外周吸引溝131に連通し基台13の上面13aから下面13bにかけて貫通した外周吸引孔132と、複数のネジ貫通孔126の位置に対応して形成された複数の雌ネジ孔133とを備えている。   The upper surface 13a of the base 13 is a mounting surface on which the frame body 12 is fixed horizontally. The upper surface 13 a of the base 13 communicates with a central suction hole 130 that penetrates from the upper surface 13 a to the lower surface 13 b of the base 13 and communicates with the central suction hole 124 of the frame 12, and the outer peripheral suction hole 125 of the frame 12. A ring-shaped outer peripheral suction groove 131 that can be formed, an outer peripheral suction hole 132 that communicates with the outer peripheral suction groove 131 and penetrates from the upper surface 13a to the lower surface 13b of the base 13, and a plurality of screw through holes 126 are formed. A plurality of female screw holes 133 are provided.

ポーラス板11を枠体12に収容する場合は、凹部120の底面120aに例えば接着材を塗布してから、ポーラス板11を凹部120に嵌め込んで、底面120aにポーラス板11の下面を接着固定させる。ポーラス板11が収容された枠体12を基台13に固定する場合は、枠体12の各ネジ貫通孔126を各雌ネジ孔133の位置にそれぞれ合わせて、枠体12を基台13の上面13aに載置する。その後、図3に示すように、各ネジ貫通孔126を貫通させたネジ5を雌ネジ孔133に螺合させることにより、基台13に枠体12を固定する。このようにして構成された保持テーブル10は、図1に示した研削装置1に搭載されて使用される。枠体12を基台13から取り外す場合は、全てのネジ5をネジ貫通孔126から取り外した後、枠体12を基台13から取り外せばよい。   When the porous plate 11 is accommodated in the frame body 12, for example, an adhesive is applied to the bottom surface 120a of the recess 120, and then the porous plate 11 is fitted into the recess 120, and the lower surface of the porous plate 11 is bonded and fixed to the bottom surface 120a. Let When the frame body 12 in which the porous plate 11 is accommodated is fixed to the base 13, the screw holes 126 of the frame body 12 are aligned with the positions of the female screw holes 133, and the frame body 12 is fixed to the base 13. Place on the top surface 13a. Thereafter, as shown in FIG. 3, the frame 12 is fixed to the base 13 by screwing the screws 5 that have passed through the screw through holes 126 into the female screw holes 133. The holding table 10 thus configured is used by being mounted on the grinding apparatus 1 shown in FIG. When removing the frame 12 from the base 13, all the screws 5 may be removed from the screw through holes 126 and then the frame 12 may be removed from the base 13.

研削装置1には、図3に示すように、基台13の下方側にポーラス板11の中央吸引部110を吸引源6に連通させる中央連通管20と、ポーラス板11の外周吸引部111を吸引源6に連通させる外周連通管21と、中央連通管20内の負圧を測定する圧力計23aと、外周連通管21内の負圧を測定する圧力計23bと、圧力計23bが測定した外周連通管21内の負圧値があらかじめ設定した負圧値よりも大きくなったら保持テーブル10が保持する板状ワークの外周部分が保持面11aから浮き上がった状態であると認識する認識部24とを備えている。   As shown in FIG. 3, the grinding apparatus 1 includes a central communication pipe 20 that communicates the central suction part 110 of the porous plate 11 with the suction source 6 on the lower side of the base 13, and an outer peripheral suction part 111 of the porous plate 11. The outer peripheral communication pipe 21 communicated with the suction source 6, the pressure gauge 23a for measuring the negative pressure in the central communication pipe 20, the pressure gauge 23b for measuring the negative pressure in the outer peripheral communication pipe 21, and the pressure gauge 23b were measured. A recognizing unit 24 for recognizing that the outer peripheral portion of the plate-like workpiece held by the holding table 10 is lifted from the holding surface 11a when the negative pressure value in the outer peripheral communication tube 21 becomes larger than a preset negative pressure value. It has.

中央連通管20には、吸引源6とポーラス板11の中央吸引部110とを連通させるバルブ22aが配設されている。吸引源6の作動とともにバルブ22aを開くと、吸引源6と中央吸引部110とが連通し、中央吸引孔124を通じて吸引溝122に負圧を発生させることで、中央吸引部110に吸引作用を発揮させることができる。また、外周連通管21には、吸引源6とポーラス板11の外周吸引部111とを連通させるバルブ22bが配設されている。吸引源6の作動とともにバルブ22bを開くと、吸引源6と外周吸引部111とが連通し、外周吸引孔125を通じて外周吸引溝123に負圧を発生させることで、外周吸引部111に吸引作用を発揮させることができる。   The central communication pipe 20 is provided with a valve 22a that allows the suction source 6 and the central suction part 110 of the porous plate 11 to communicate with each other. When the valve 22 a is opened together with the operation of the suction source 6, the suction source 6 and the central suction part 110 communicate with each other, and a negative pressure is generated in the suction groove 122 through the central suction hole 124. It can be demonstrated. In addition, a valve 22 b that connects the suction source 6 and the outer peripheral suction portion 111 of the porous plate 11 is disposed in the outer peripheral communication pipe 21. When the valve 22 b is opened together with the operation of the suction source 6, the suction source 6 and the outer peripheral suction part 111 communicate with each other, and a negative pressure is generated in the outer peripheral suction groove 123 through the outer peripheral suction hole 125. Can be demonstrated.

圧力計23aは、バルブ22aの近傍の位置で基台13側の中央連通管20に配設されており、中央吸引部110において板状ワークを吸引保持しているときの中央連通管20内の負圧を測定することができる。また、圧力計23bは、バルブ22bの近傍の位置で基台13側の外周連通管21に配設されており、外周吸引部111において板状ワークを吸引保持しているときの外周連通管21内の負圧を測定することができる。本実施形態に示す認識部24は、最も外側(保持テーブル10の外周側)に位置する圧力計23bに接続されている。かかる認識部24で外周連通管21内の負圧値を常に監視することにより、外周連通管21内の負圧値が、認識部24にあらかじめ設定した負圧値の判断基準値を超えた場合に、板状ワークの外周部分が保持面11aから浮き上がった状態であると認識することができる。なお、圧力計23a,23bは、負圧を測定できればよく、その構成は限定されない。   The pressure gauge 23a is disposed in the central communication pipe 20 on the base 13 side at a position in the vicinity of the valve 22a. The pressure gauge 23a is provided in the central communication pipe 20 when the plate-like workpiece is sucked and held in the central suction part 110. Negative pressure can be measured. The pressure gauge 23b is disposed in the outer peripheral communication pipe 21 on the base 13 side at a position near the valve 22b, and the outer peripheral communication pipe 21 when the plate-like workpiece is sucked and held in the outer peripheral suction portion 111. The negative pressure inside can be measured. The recognition unit 24 shown in the present embodiment is connected to a pressure gauge 23b located on the outermost side (the outer peripheral side of the holding table 10). When the negative pressure value in the outer communication pipe 21 is constantly monitored by the recognition unit 24, the negative pressure value in the outer communication pipe 21 exceeds the judgment reference value of the negative pressure value preset in the recognition unit 24. Furthermore, it can be recognized that the outer peripheral portion of the plate-like workpiece is in a state of being lifted from the holding surface 11a. Note that the pressure gauges 23a and 23b only need to be able to measure negative pressure, and their configurations are not limited.

図1に示す研削装置1は、研削送り手段40を制御する制御部25を備えている。制御部25は、CPU及びメモリなどの記憶素子を少なくとも備え、認識部24に接続されている。例えば、研削砥石37で保持テーブル10が保持する板状ワークを研削する前に、認識部24が板状ワークの外周部分の浮き上がりを認識した情報を制御部25に送ると、制御部25は研削送り手段40による研削手段30の研削送りを停止させる制御をする。また、例えば、研削砥石37で保持テーブル10が保持する板状ワークの研削加工中に、認識部24が板状ワークの外周部分の浮き上がりを認識した情報を制御部25に送ると、制御部25は研削送り手段40による研削手段30の研削送りを停止させるか、または、研削送り手段40が研削砥石37の研削面を保持テーブル10が保持する板状ワークの上面から離反する方向に移動させ、図2に示す圧力計23bが測定する負圧値があらかじめ設定した負圧値以下になったら、研削送り手段40により研削砥石37を保持テーブル10が保持する板状ワークの上面に接近する方向に移動させる制御をする。このように、保持テーブル10で外周部分に反りを有する板状ワークを吸引保持する場合であっても、制御部25によれば、認識部24の認識した情報に基づいて研削加工を中断することもできるし、研削加工を再開することもできる。   The grinding apparatus 1 shown in FIG. 1 includes a control unit 25 that controls the grinding feed means 40. The control unit 25 includes at least a storage element such as a CPU and a memory, and is connected to the recognition unit 24. For example, before the plate-shaped workpiece held by the holding table 10 is ground by the grinding wheel 37, if the recognition unit 24 sends information indicating that the outer peripheral portion of the plate-shaped workpiece is lifted to the control unit 25, the control unit 25 performs the grinding. Control to stop the grinding feed of the grinding means 30 by the feed means 40 is performed. Further, for example, when the recognition unit 24 sends information that the lifting of the outer peripheral portion of the plate-shaped workpiece is recognized to the control unit 25 during grinding of the plate-shaped workpiece held by the holding table 10 with the grinding wheel 37, the control unit 25. The grinding feed of the grinding means 30 by the grinding feed means 40 is stopped, or the grinding feed means 40 moves the grinding surface of the grinding wheel 37 away from the upper surface of the plate-like workpiece held by the holding table 10, When the negative pressure value measured by the pressure gauge 23b shown in FIG. 2 becomes equal to or lower than the negative pressure value set in advance, the grinding wheel 37 is moved closer to the upper surface of the plate-like workpiece held by the holding table 10 by the grinding feed means 40. Control to move. As described above, even when the holding table 10 sucks and holds a plate-like workpiece having a warped outer peripheral portion, the control unit 25 interrupts the grinding process based on the information recognized by the recognition unit 24. You can also resume grinding.

次に、研削装置1の動作例について説明する。図4に示す板状ワークWは、円形板状の被加工物の一例である。板状ワークWの上面Waは、研削砥石37によって研削される被加工面となっている。一方、上面Waと反対側の下面Wbには、デバイスチップ等が形成されており、保護テープが貼着される。本実施形態に示す板状ワークWは、径の大きい板状ワーク(例えば12インチ)であり、板状ワークWの外周部分Wcは、デバイスチップを封止樹脂で封止する際に生じる熱の影響等によって反りが発生しているものとする。研削加工を開始する際には、板状ワークWが保持テーブル10の外周吸引部111に適正に吸引保持されているときの外周連通管21内における負圧値の判断基準値をあらかじめ認識部24に設定しておく。   Next, an operation example of the grinding apparatus 1 will be described. A plate-like workpiece W shown in FIG. 4 is an example of a circular plate-like workpiece. The upper surface Wa of the plate-like workpiece W is a work surface to be ground by the grinding wheel 37. On the other hand, a device chip or the like is formed on the lower surface Wb opposite to the upper surface Wa, and a protective tape is attached. The plate-like workpiece W shown in the present embodiment is a plate-like workpiece having a large diameter (for example, 12 inches), and the outer peripheral portion Wc of the plate-like workpiece W is the heat generated when the device chip is sealed with the sealing resin. It is assumed that warping has occurred due to the influence. When starting the grinding process, the recognition unit 24 recognizes in advance the judgment reference value of the negative pressure value in the outer peripheral communication pipe 21 when the plate-like workpiece W is properly sucked and held by the outer suction unit 111 of the holding table 10. Set to.

板状ワークWを保持テーブル10で吸引保持する場合には、図4に示すように、板状ワークWの下面Wb側を保持テーブル10の保持面11aに載置した後、バルブ22aを開いて吸引源6と中央吸引部110と連通させるとともに、バルブ22bを開いて吸引源6と外周吸引部111とを連通させ、吸引力が作用した中央吸引部110及び外周吸引部111の保持面11aで板状ワークWを吸引保持する。次いで、図示しない回転手段によって保持テーブル10を回転させつつ研削手段30の下方に移動させる。なお、保持テーブル10の保持面11aは、その中心部分から外周側にかけて下方に傾斜した円錐面となっているが、実際には肉眼で認識することができない程度の僅かな傾斜である。   When the plate-like workpiece W is sucked and held by the holding table 10, as shown in FIG. 4, after the lower surface Wb side of the plate-like workpiece W is placed on the holding surface 11a of the holding table 10, the valve 22a is opened. The suction source 6 and the central suction part 110 are communicated with each other, and the valve 22b is opened to allow the suction source 6 and the outer peripheral suction part 111 to communicate with each other. The plate-like workpiece W is sucked and held. Next, the holding table 10 is rotated by a rotating means (not shown) and moved below the grinding means 30. Note that the holding surface 11a of the holding table 10 is a conical surface inclined downward from the central portion to the outer peripheral side, but is actually a slight inclination that cannot be recognized with the naked eye.

ここで、研削砥石37で板状ワークWを研削する前に、圧力計23bによって外周連通管21内の負圧値を測定し、測定結果を認識部24に送る。認識部24は、圧力計23bが測定した負圧値が、認識部24に設定された判断基準値を超えている(正圧方向に判断基準値を超えている)ときは、板状ワークWの外周部分Wcが外周吸引部111の保持面11aから浮き上がっている状態であると認識して、その情報を制御部25に送る。この場合、制御部25は、研削送り手段40による研削手段30の研削送りを停止させる。その後は、研削加工を開始せずに、例えば反りのある板状ワークWを保持テーブル10から取り外し、次の板状ワークWを保持テーブル10に搬送するとよい。   Here, before the plate-like workpiece W is ground with the grinding wheel 37, the negative pressure value in the outer peripheral communication pipe 21 is measured by the pressure gauge 23 b, and the measurement result is sent to the recognition unit 24. When the negative pressure value measured by the pressure gauge 23b exceeds the determination reference value set in the recognition unit 24 (exceeds the determination reference value in the positive pressure direction), the recognition unit 24 recognizes the plate-like workpiece W. Is recognized as being in a state of being lifted from the holding surface 11 a of the outer peripheral suction part 111, and the information is sent to the control part 25. In this case, the control unit 25 stops the grinding feed of the grinding means 30 by the grinding feed means 40. Thereafter, without starting the grinding process, for example, the warped plate workpiece W may be removed from the holding table 10 and the next plate workpiece W may be conveyed to the holding table 10.

一方、認識部24は、圧力計23bが測定した負圧値が、認識部24に設定された判断基準値以下(負圧方向に判断基準値を超えている)のときは、板状ワークWの外周部分Wcが外周吸引部111において適正に吸引保持されていると認識して、その情報を制御部25に送る。この場合、制御部25は、図4に示すように、研削送り手段40により研削砥石37を保持テーブル10が保持する板状ワークWの上面Waに対して接近する方向に移動させる制御をする。研削送り手段40によって研削手段30を下降させつつ、研削手段30は、スピンドル31を回転させることにより、研削ホイール36を例えば矢印A方向に回転させ、研削砥石37で上面Waを押圧しながら板状ワークWを所定の厚みに至るまで研削加工する。回転する研削砥石37は、板状ワークWの上面Waの中心を通って正面視における半径部分に接触する。板状ワークの研削中は、図示しない研削水供給源から研削砥石37に向けて研削水を供給し続ける。研削水としては、例えば純水が用いられる。   On the other hand, when the negative pressure value measured by the pressure gauge 23b is equal to or less than the determination reference value set in the recognition unit 24 (exceeds the determination reference value in the negative pressure direction), the recognition unit 24 detects the plate-like workpiece W. It is recognized that the outer peripheral portion Wc is properly sucked and held in the outer peripheral suction portion 111, and the information is sent to the control portion 25. In this case, as shown in FIG. 4, the control unit 25 controls the grinding wheel 37 to move in a direction approaching the upper surface Wa of the plate-like workpiece W held by the holding table 10 by the grinding feed means 40. While the grinding means 30 is lowered by the grinding feed means 40, the grinding means 30 rotates the spindle 31 to rotate the grinding wheel 36 in the direction of the arrow A, for example, and presses the upper surface Wa with the grinding wheel 37 to form a plate shape. The workpiece W is ground to a predetermined thickness. The rotating grinding wheel 37 passes through the center of the upper surface Wa of the plate-like workpiece W and comes into contact with the radius portion in the front view. During the grinding of the plate workpiece, the grinding water is continuously supplied from the grinding water supply source (not shown) toward the grinding wheel 37. For example, pure water is used as the grinding water.

板状ワークWの研削加工中においても圧力計23bにより外周連通管21内の負圧値を測定して、板状ワークWの外周部分Wcが外周吸引部111において適正に吸引保持されているかどうかを監視する。認識部24は、圧力計23bが測定した負圧値が、認識部24に設定された判断基準値を超えているときは、図5に示すように、板状ワークWの外周部分Wcが外周吸引部111の保持面11aから浮き上がっている状態であると認識して、その情報を制御部25に送る。図5の部分拡大図に示すように、板状ワークWの外周部分Wcが外周吸引部111の保持面11aから浮き上がって板状ワークWと外周吸引部111との間に隙間ができると、保持面11aから負圧がリークしてしまうため、板状ワークWが保持テーブル10から吹き飛ぶか、または、板状ワークWが保持テーブル10から吹き飛ばなかったとしても、研削加工後の板状ワークWの厚みにばらつきが生じる。この場合、制御部25は、研削送り手段40による研削手段30の研削送りを停止させる制御をして、研削加工を中断する。   Whether or not the outer peripheral portion Wc of the plate-shaped workpiece W is properly sucked and held by the outer peripheral suction portion 111 by measuring the negative pressure value in the outer peripheral communication tube 21 with the pressure gauge 23b even during the grinding of the plate-shaped workpiece W. To monitor. When the negative pressure value measured by the pressure gauge 23b exceeds the judgment reference value set in the recognition unit 24, the recognizing unit 24 determines that the outer peripheral portion Wc of the plate-like workpiece W is the outer peripheral as shown in FIG. Recognizing that the surface is lifted from the holding surface 11 a of the suction unit 111, the information is sent to the control unit 25. As shown in the partial enlarged view of FIG. 5, when the outer peripheral portion Wc of the plate-like workpiece W is lifted from the holding surface 11 a of the outer periphery suction portion 111 and a gap is formed between the plate-like workpiece W and the outer periphery suction portion 111, the holding is performed. Since the negative pressure leaks from the surface 11a, even if the plate-like workpiece W blows off from the holding table 10 or the plate-like workpiece W does not blow off from the holding table 10, the plate-like workpiece W after grinding is processed. Variation in thickness occurs. In this case, the control unit 25 controls to stop the grinding feed of the grinding means 30 by the grinding feed means 40 and interrupts the grinding process.

また、板状ワークWから研削砥石37を一時的に離反させることにより、研削加工中に使用される研削水の水圧によって板状ワークWの外周部分Wcの浮き上がりが解消されることがあるため、研削加工を再開することが可能となる。この場合、制御部25は、研削送り手段40が研削砥石37の研削面を保持テーブル10が保持する板状ワークWの上面Waから離反する方向に移動させ、圧力計23bが測定する負圧値があらかじめ設定した判断基準値以下になった時点で、研削送り手段40により研削砥石37を保持テーブル10が保持する板状ワークWの上面Waに接近する方向に移動させる制御をして研削加工を再開する。さらに、制御部25は、圧力計23bが測定する外周連通管21内の負圧値が判断基準値以下になるまで研削手段30の上昇と下降とを繰り返すように研削送り手段40を制御してもよい。   Further, by temporarily separating the grinding wheel 37 from the plate-like workpiece W, the floating of the outer peripheral portion Wc of the plate-like workpiece W may be eliminated by the hydraulic pressure of the grinding water used during the grinding process. Grinding can be resumed. In this case, the control unit 25 causes the grinding feed means 40 to move the grinding surface of the grinding wheel 37 away from the upper surface Wa of the plate-like workpiece W held by the holding table 10, and the negative pressure value measured by the pressure gauge 23b. Is controlled to move the grinding wheel 37 in a direction approaching the upper surface Wa of the plate-like workpiece W held by the holding table 10 by the grinding feed means 40 at the time when becomes below the predetermined judgment reference value. Resume. Further, the control unit 25 controls the grinding feed means 40 so as to repeat the raising and lowering of the grinding means 30 until the negative pressure value in the outer peripheral communication pipe 21 measured by the pressure gauge 23b becomes equal to or less than the judgment reference value. Also good.

このように、本発明に係る研削装置1は、板状ワークWを吸引保持する保持面11aを有する保持テーブル10を備え、保持テーブル10は、中央吸引部110と、中央吸引部110の外周を囲む少なくとも1つの環状の外周吸引部111と、中央吸引部110と外周吸引部111との間を仕切る少なくとも1つの環状の仕切部112とを備え、中央吸引部110を吸引源6に連通させる中央連通管20と、外周吸引部111を吸引源6に連通させる外周連通管21と、外周連通管21内の負圧を測定する圧力計23bと、圧力計23bが測定した外周連通管21内の負圧値があらかじめ設定した負圧値より大きくなったら保持テーブル10が保持する板状ワークWの外周部分Wcが保持面11aから浮き上がった状態であると認識する認識部24とを備えたため、板状ワークWの外周部分Wcに反りがあっても、圧力計23bが測定した外周連通管21の負圧値に基づいて、認識部24が板状ワークWの外周部分Wcが保持面11aから浮き上がっているかどうかを認識することが可能となる。したがって、板状ワークWが保持テーブル10から吹き飛んで破損するのを防止することができるとともに、板状ワークWが保持テーブル10から吹き飛ばなかったとしても外周部分Wcの浮き上がりに起因して外周部分Wcが薄くなり、板状ワークWの厚みが均一にならないという研削不良の発生を防止することができる。
また、研削装置1は、研削加工前に認識部24により保持面11aから板状ワークWの外周部分Wcの浮き上がりを認識したら研削送り手段40を停止させ、研削加工中に認識部24により保持面11aから板状ワークWの外周部分Wcの浮き上がりを認識したら研削送り手段40を停止させるか、または、研削砥石37の研削面を板状ワークWの上面Waから離す方向に移動させ、圧力計23bが測定する負圧値があらかじめ設定した負圧値以下になったら、研削送り手段40により研削砥石37を板状ワークWの上面Waに接近する方向に移動させる制御をする制御部25を備えたため、認識部24が板状ワークWの外周部分Wcの浮き上がりを認識したら、制御部25によって研削砥石37を板状ワークWに接触させないように研削送り手段40を制御することができ、上記同様、板状ワークWの破損や研削不良の発生を防止することができる。
Thus, the grinding apparatus 1 according to the present invention includes the holding table 10 having the holding surface 11a for sucking and holding the plate-like workpiece W. The holding table 10 has a central suction part 110 and an outer periphery of the central suction part 110. A central portion that includes at least one annular outer peripheral suction portion 111 and at least one annular partition portion 112 that partitions between the central suction portion 110 and the outer peripheral suction portion 111, and communicates the central suction portion 110 with the suction source 6. The communication pipe 20, the outer peripheral communication pipe 21 for communicating the outer peripheral suction part 111 with the suction source 6, the pressure gauge 23b for measuring the negative pressure in the outer peripheral communication pipe 21, and the inner diameter of the outer peripheral communication pipe 21 measured by the pressure gauge 23b Recognition that the outer peripheral portion Wc of the plate-like workpiece W held by the holding table 10 is lifted from the holding surface 11a when the negative pressure value becomes larger than the preset negative pressure value. 24, the recognizing unit 24 can detect the outer peripheral portion of the plate-like workpiece W based on the negative pressure value of the outer peripheral communication tube 21 measured by the pressure gauge 23b even if the outer peripheral portion Wc of the plate-like workpiece W is warped. It becomes possible to recognize whether Wc is lifted from the holding surface 11a. Accordingly, it is possible to prevent the plate-like workpiece W from being blown off from the holding table 10 and being damaged, and even if the plate-like workpiece W is not blown off from the holding table 10, the outer peripheral portion Wc is caused by the rising of the outer peripheral portion Wc. Therefore, it is possible to prevent the occurrence of poor grinding that the thickness of the plate-like workpiece W is not uniform.
Further, the grinding device 1 stops the grinding feed means 40 when the recognition unit 24 recognizes the lifting of the outer peripheral portion Wc of the plate-like workpiece W from the holding surface 11a before the grinding process, and the recognition unit 24 performs the holding surface during the grinding process. When the lifting of the outer peripheral portion Wc of the plate-like workpiece W is recognized from 11a, the grinding feed means 40 is stopped, or the grinding surface of the grinding wheel 37 is moved away from the upper surface Wa of the plate-like workpiece W, and the pressure gauge 23b When the negative pressure value to be measured becomes equal to or less than the negative pressure value set in advance, the control unit 25 is provided for controlling the grinding wheel 37 to move in the direction approaching the upper surface Wa of the plate-like workpiece W by the grinding feed means 40. When the recognition unit 24 recognizes the lifting of the outer peripheral portion Wc of the plate-like workpiece W, the control unit 25 performs grinding and feeding so that the grinding wheel 37 does not contact the plate-like workpiece W. Can control the unit 40, the same, it is possible to prevent breakage of or grinding failure of the plate-shaped workpiece W.

図6に示す保持テーブル10Aは、上記保持テーブル10の変形例である。保持テーブル10Aのポーラス板11Aは、中央吸引部110の外周を囲む環状の第1の外周吸引部114と、第1の外周吸引部114の外周を囲む環状の第2の外周吸引部115と、中央吸引部110と第1の外周吸引部114との間を仕切る環状の仕切部112と、第1の外周吸引部114と第2の外周吸引部115との間を仕切る環状の仕切部113とを備え、ポーラス板11Aの保持面11aは、仕切部112,113によって、ポーラス板11Aの中心を中心にして同心円状に3つの吸引エリアに仕切られて構成されている。保持テーブル10Aにおいて、保持テーブル10と同様の構成部分については共通の符号を付している。   A holding table 10 </ b> A illustrated in FIG. 6 is a modification of the holding table 10. The porous plate 11A of the holding table 10A includes an annular first outer periphery suction part 114 surrounding the outer periphery of the central suction part 110, an annular second outer periphery suction part 115 surrounding the outer periphery of the first outer periphery suction part 114, An annular partition 112 that partitions the central suction portion 110 and the first outer periphery suction portion 114; an annular partition 113 that partitions the first outer periphery suction portion 114 and the second outer periphery suction portion 115; The holding surface 11a of the porous plate 11A is configured to be divided into three suction areas concentrically around the center of the porous plate 11A by the partition portions 112 and 113. In the holding table 10A, the same components as those of the holding table 10 are denoted by common reference numerals.

枠体12Aには、第1の外周吸引部114に連通するリング状の第1の外周吸引溝123aと、第1の外周吸引溝123aに連通し枠体12Aの上下面を貫通した第1の外周吸引孔125aと、第2の外周吸引部115に連通するリング状の第2の外周吸引溝123bと、第2の外周吸引溝123bに連通し枠体12Aの上下面を貫通した第2の外周吸引孔125bとを備えている。基台13Aには、第1の外周吸引孔125aに連通するリング状の第1の外周吸引溝131aと、第1の外周吸引溝131aに連通し基台13Aの上下面を貫通した第1の外周吸引孔132aと、第2の外周吸引孔125bに連通するリング状の第2の外周吸引溝131bと、第2の外周吸引溝131bに連通し基台13Aの上下面を貫通した第2の外周吸引孔132bとを備えている。   The frame body 12A includes a ring-shaped first outer periphery suction groove 123a that communicates with the first outer periphery suction portion 114, and a first body that communicates with the first outer periphery suction groove 123a and penetrates the upper and lower surfaces of the frame body 12A. The outer peripheral suction hole 125a, the ring-shaped second outer peripheral suction groove 123b communicating with the second outer peripheral suction portion 115, and the second outer peripheral suction groove 123b communicating with the second outer peripheral suction groove 123b and penetrating the upper and lower surfaces of the frame body 12A. And an outer peripheral suction hole 125b. The base 13A includes a ring-shaped first outer peripheral suction groove 131a that communicates with the first outer peripheral suction hole 125a, and a first through the upper and lower surfaces of the base 13A that communicates with the first outer peripheral suction groove 131a. The outer peripheral suction hole 132a, the ring-shaped second outer peripheral suction groove 131b communicating with the second outer peripheral suction hole 125b, and the second outer peripheral suction groove 131b communicating with the second outer peripheral suction groove 131b and penetrating the upper and lower surfaces of the base 13A. And an outer peripheral suction hole 132b.

基台13Aの下方側には、ポーラス板11Aの第1の外周吸引部114を吸引源6に連通させる第1の外周連通管26と、ポーラス板11Aの第2の外周吸引部115を吸引源6に連通させる第2の外周連通管27と、第1の外周連通管26内の負圧を測定する圧力計23bと、第2の外周連通管27内の負圧を測定する圧力計23cと、圧力計23cが測定した第2の外周連通管27内の負圧値があらかじめ設定した負圧値よりも大きくなったら保持テーブル10Aが保持する板状ワークの外周部分が保持面11aから浮き上がったことを認識する認識部24Aとを備えている。   On the lower side of the base 13A, a first outer peripheral communication pipe 26 that communicates the first outer peripheral suction portion 114 of the porous plate 11A with the suction source 6 and a second outer peripheral suction portion 115 of the porous plate 11A are provided as the suction source. 6, a second outer peripheral communication pipe 27 that communicates with the first outer peripheral communication pipe 26, a pressure gauge 23 b that measures the negative pressure in the first outer peripheral communication pipe 26, and a pressure gauge 23 c that measures the negative pressure in the second outer peripheral communication pipe 27. When the negative pressure value in the second outer peripheral communication pipe 27 measured by the pressure gauge 23c becomes larger than the preset negative pressure value, the outer peripheral portion of the plate-like workpiece held by the holding table 10A is lifted from the holding surface 11a. A recognizing unit 24A for recognizing this.

第1の外周連通管26には、吸引源6と第1の外周吸引部114とを連通させるバルブ22bが配設されている。吸引源6の作動とともにバルブ22bを開くと、吸引源6と第1の外周吸引部114とが連通し、第1の外周吸引孔125aを通じて第1の外周吸引溝123aに負圧を発生させることで、第1の外周吸引部114に吸引作用を発揮させることができる。また、第2の外周連通管27には、吸引源6と第2の外周吸引部115とを連通させるバルブ22cが配設されている。吸引源6の作動とともにバルブ22cを開くと、吸引源6と第2の外周吸引部115とが連通し、第2の外周吸引孔125bを通じて第2の外周吸引溝123bに負圧を発生させることで、第2の外周吸引部115に吸引作用を発揮させることができる。   The first outer peripheral communication pipe 26 is provided with a valve 22b that allows the suction source 6 and the first outer peripheral suction portion 114 to communicate with each other. When the valve 22b is opened along with the operation of the suction source 6, the suction source 6 and the first outer peripheral suction portion 114 communicate with each other, and a negative pressure is generated in the first outer peripheral suction groove 123a through the first outer peripheral suction hole 125a. Thus, the first outer peripheral suction portion 114 can exert a suction action. In addition, the second outer peripheral communication tube 27 is provided with a valve 22c that allows the suction source 6 and the second outer peripheral suction portion 115 to communicate with each other. When the valve 22c is opened along with the operation of the suction source 6, the suction source 6 and the second outer peripheral suction portion 115 communicate with each other, and a negative pressure is generated in the second outer peripheral suction groove 123b through the second outer peripheral suction hole 125b. Thus, the second outer peripheral suction portion 115 can exert a suction action.

圧力計23bは、バルブ22bの近傍の位置で基台13A側の第1の外周連通管26に取り付けられており、第1の外周吸引部114において板状ワークを吸引保持しているときの第1の外周連通管26内の負圧を測定することができる。また、圧力計23cは、バルブ22cの近傍の位置で基台13A側の第2の外周連通管27に取り付けられており、第2の外周吸引部115において板状ワークを吸引保持しているときの第2の外周連通管27内の負圧を測定することができる。認識部24Aは、最も外側(保持テーブル10Aの外周側)に位置する圧力計23cに接続されている。認識部24Aで第2の外周連通管27内の負圧値を常に監視することにより、第2の外周連通管27内の負圧値が認識部24Aにあらかじめ設定した負圧値の判断基準値を超えたときに、板状ワークの外周部分が保持面11aから浮き上がった状態であると認識することができる。このように構成される保持テーブル10Aで外周部分に反りのある板状ワークを吸引保持しても、上記同様、板状ワークの破損や研削不良の発生を防止することができる。   The pressure gauge 23b is attached to the first outer peripheral communication pipe 26 on the base 13A side at a position near the valve 22b, and the first outer peripheral suction part 114 sucks and holds the plate-like workpiece. The negative pressure in one outer peripheral communication pipe 26 can be measured. The pressure gauge 23c is attached to the second outer peripheral communication pipe 27 on the base 13A side at a position in the vicinity of the valve 22c, and the second outer peripheral suction part 115 sucks and holds the plate-like workpiece. The negative pressure in the second outer peripheral communication pipe 27 can be measured. The recognition unit 24A is connected to a pressure gauge 23c located on the outermost side (the outer peripheral side of the holding table 10A). By constantly monitoring the negative pressure value in the second outer peripheral communication pipe 27 by the recognition unit 24A, the negative pressure value in the second outer peripheral communication pipe 27 is determined in advance in the recognition unit 24A. Can be recognized as the state where the outer peripheral portion of the plate-like workpiece is lifted from the holding surface 11a. Even if the holding table 10A configured as described above sucks and holds a plate-like workpiece having a warped outer peripheral portion, it is possible to prevent the plate-like workpiece from being broken or from being poorly ground.

1:研削装置 2:装置ベース 3:コラム 4:カバー 5:ネジ 6:吸引源
10,10A:保持テーブル 11,11A:ポーラス板
110:中央吸引部 111:外周吸引部 112,113:仕切部
114:第1の外周吸引部 115:第2の外周吸引部
12,12A:枠体 120:凹部 121:凸部 122:吸引溝
123:外周吸引溝 124:中央吸引孔 125:外周吸引孔 126:ネジ貫通孔
13,13A:基台 130:中央吸引孔 131:外周吸引溝 132:外周吸引孔
133:雌ネジ孔
20:中央連通管 21:外周連通管 22a,22b,22c:バルブ
23a,23b,23c:圧力計 24,24A:認識部 25:制御部
26:第1の外周連通管 27:第2の外周連通管
30:研削手段 31:スピンドル 32:スピンドルハウジング 33:ホルダ
34:モータ 35:マウント 36:研削ホイール 37:研削砥石
40:研削送り手段 41:ボールネジ 42:モータ 43:ガイドレール
44:昇降板
50:厚み測定手段 51:第1のハイトゲージ 52:第2のハイトゲージ
1: Grinding device 2: Device base 3: Column 4: Cover 5: Screw 6: Suction source 10, 10A: Holding table 11, 11A: Porous plate 110: Central suction part 111: Outer peripheral suction part 112, 113: Partition part 114 : 1st outer periphery suction part 115: 2nd outer periphery suction part 12, 12A: Frame 120: Concave part 121: Convex part 122: Suction groove 123: Outer periphery suction groove 124: Center suction hole 125: Outer periphery suction hole 126: Screw Through holes 13, 13A: base 130: central suction hole 131: outer peripheral suction groove 132: outer peripheral suction hole 133: female screw hole 20: central communication pipe 21: outer peripheral communication pipe 22a, 22b, 22c: valves 23a, 23b, 23c : Pressure gauge 24, 24A: Recognition unit 25: Control unit 26: First outer peripheral communication tube 27: Second outer peripheral communication tube 30: Grinding means 31: Spindle 32: Spindle Housing 33: Holder 34: Motor 35: Mount 36: Grinding wheel 37: Grinding wheel 40: Grinding feed means 41: Ball screw 42: Motor 43: Guide rail 44: Elevating plate 50: Thickness measuring means 51: First height gauge 52: Second height gauge

Claims (2)

板状ワークを吸引保持する保持面を有する保持テーブルと、該保持テーブルが保持した板状ワークを研削砥石で研削する研削手段と、該研削手段を該保持テーブルに対して接近及び離反する方向に研削送りする研削送り手段と、を備える研削装置であって、
該保持テーブルは、中央吸引部と、
該中央吸引部の外周を囲む少なくとも1つの環状の外周吸引部と、
該中央吸引部と該外周吸引部との間を仕切る少なくとも1つの環状の仕切部と、を備え、
該研削装置には、該中央吸引部を吸引源に連通させる中央連通管と、
該外周吸引部を該吸引源に連通させる外周連通管と、
該外周連通管内の負圧を測定する圧力計と、
該圧力計が測定した該外周連通管内の負圧値があらかじめ設定した負圧値より大きくなったら該保持テーブルが保持する板状ワークの外周部分が該保持面から浮き上がった状態であると認識する認識部と、を備えた研削装置。
A holding table having a holding surface for sucking and holding the plate-like workpiece, a grinding means for grinding the plate-like workpiece held by the holding table with a grinding wheel, and a direction in which the grinding means approaches and separates from the holding table A grinding device comprising a grinding feed means for feeding by grinding,
The holding table includes a central suction part,
At least one annular outer peripheral suction portion surrounding the outer periphery of the central suction portion;
At least one annular partition that partitions between the central suction portion and the outer periphery suction portion;
In the grinding apparatus, a central communication pipe for communicating the central suction part with a suction source;
An outer peripheral communication pipe for communicating the outer peripheral suction part with the suction source;
A pressure gauge for measuring a negative pressure in the outer communication pipe;
When the negative pressure value measured by the pressure gauge in the outer communication pipe becomes larger than a preset negative pressure value, it is recognized that the outer peripheral portion of the plate-like workpiece held by the holding table is lifted from the holding surface. A grinding apparatus comprising: a recognition unit;
前記研削砥石で前記保持テーブルが保持する板状ワークを研削する前に、前記認識部により前記保持面から板状ワークの外周部分の浮き上がりを認識したら、前記研削送り手段を停止させ、
該研削砥石で該保持テーブルが保持する板状ワークの研削加工中に、該認識部により該保持面から板状ワークの外周部分の浮き上がりを認識したら、該研削送り手段による研削送りを停止させるか、または、該研削送り手段が該研削砥石の研削面を該保持テーブルが保持する板状ワークの上面から離す方向に移動させ、該圧力計が測定する該負圧値があらかじめ設定した負圧値以下になったら、該研削送り手段により該研削砥石を該保持テーブルが保持する板状ワークの上面に接近する方向に移動させる制御をする制御部を、備えた請求項1記載の研削装置。
Before the plate-like workpiece held by the holding table is ground by the grinding wheel, when the recognition unit recognizes the lifting of the outer peripheral portion of the plate-like workpiece from the holding surface, the grinding feed means is stopped,
During the grinding process of the plate-like workpiece held by the holding table with the grinding wheel, if the recognition unit recognizes the lifting of the outer peripheral portion of the plate-like workpiece from the holding surface, the grinding feed by the grinding feed means is stopped. Or the grinding feed means moves the grinding surface of the grinding wheel away from the upper surface of the plate-like workpiece held by the holding table, and the negative pressure value measured by the pressure gauge is a preset negative pressure value. The grinding apparatus according to claim 1, further comprising a control unit that performs control to move the grinding wheel in a direction approaching the upper surface of the plate-like workpiece held by the holding table by the grinding feed unit.
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