CN106154769A - Thin film circuit ceramics with holes photoetching vacuum fixture - Google Patents
Thin film circuit ceramics with holes photoetching vacuum fixture Download PDFInfo
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- CN106154769A CN106154769A CN201610724598.8A CN201610724598A CN106154769A CN 106154769 A CN106154769 A CN 106154769A CN 201610724598 A CN201610724598 A CN 201610724598A CN 106154769 A CN106154769 A CN 106154769A
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- vacuum
- ceramics
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- photoetching
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
Abstract
A kind of thin film circuit ceramics with holes photoetching vacuum fixture disclosed by the invention, it is desirable to provide a kind of convenient mounting and clamping, highly versatile, the high vacuum adsorption fixture of yield rate.The technical scheme is that: absorptive table (2) is formed with centered on gas port (4), walk around graticule end points vacuum absorption holes (17) on alignment mark line (6) free end, constitute the inner ring seal groove (12) of rectangle annular groove, inner ring seal groove is formed with orthogonal gas port in region, right-angled intersection air slot (14) with above-mentioned rectangle annular groove diagonal coincident radiation, four end points of right-angled intersection are formed with vacuum absorption holes (16), it is formed with the middle level air slot (15) being constituted shape annular groove by alignment mark line root square in inner ring seal groove (12) periphery, and outer layer inner ring seal groove (13) around described middle level air slot, vacuum absorption holes is distributed in the corner connection right-angled intersection air slot in ceramics Workpiece carrier face, the Corner Strapped ceramics workpiece of ceramics is held during work.
Description
Technical field
The present invention relates to a kind of MJB4 automatic photoetching vacuum equipment difference in functionality two-way vacuum suction plummer of being applicable to
Thin film circuit ceramics with holes photoetching vacuum fixture.
Background technology
Ceramic membrane circuit substrate manufacture process will be transferred to design configuration on plated film ceramics, thus reaches design drawing
Shape and the synchronization of product circuit figure, use a kind of technique crying photoetching to realize above-mentioned purpose.Current photoetching on a ceramic substrate
The method of erosion thin film circuit figure is to be carried out as resist, ceramic substrate upper surface by using ultraviolet sensitivity positive photoresist
The optical patterning of thin film circuit figure.Again through a series of subsequent technique process, ultimately form ceramic membrane circuit.Photoetching process
Comprise gluing, photoetching and three operations of development.Gluing is uniformly to coat one layer of photosensitive insulation on the ceramics surface of metal-coated membrane
Etchant resist, and it is allowed to the process of preliminary drying solidification.Gluing is to complete on the vacuum equipment such as spin coating, whirl coating at gluing or cry, and reaches to need
Thickness and the uniformity index wanted require, completing preliminary drying makes photoresist have light sensitivity not glue again.Subsequent handling is by after gluing
Ceramics is put into litho machine and is carried out photoetching.Most widely used at present is ultraviolet photolithographic machine, decomposes with UV energy or polymerization photoetching
Glue (according to the different differentiation of Other substrate materials, requires consistent being as the criterion, the district of thin film photolithography and PCB exposure with final graphics and design
Not collimation and the energy at emergent light, the collimation difference of PCB exposure, energy can be accomplished very big, and graph of a correspondence resolution ratio is not
High.Can not work in MJB4 mask aligner vacuum equipment simultaneously, the vacuum line not interlocked, work asynchronous.Thin film photolithography
In order to pursue raising graphics resolution, emphasize the collimation of emergent light, add a lot of lens and realize light ray parallel, export energy
More on the low side than PCB exposure ratio.
For meeting ceramic circuit requirement, thin-film technique needs to design repeatedly photoetching, manufactures different metal layer circuit respectively.?
Needing repeatedly contraposition during photoetching, therefore except plated through-hole in ceramics circuit, process area is also devised with alignment mark hole.At light
During quarter, ceramics workpiece needs to keep fixing in a device, it is ensured that the invariant position of equipment optical registration mechanism calibration.
Current ceramic circuit manufactures photoetching automatic vacuum equipment, is provided with the vacuum suction plummer of two-way difference in functionality, makes
With middle this vacuum suction plummer of discovery, adaptability defect is existed for through hole ceramics.Such as, MJB4 mask aligner vacuum equipment is former
The objective table of the carrying two-way suction jig that factory provides, this fixture all designs two-way vacuum absorption holes in fixture loading surface
Between, it is only applicable to the photoetching of atresia ceramics workpiece and inapplicable ceramics with holes.Ceramics with holes, because of punching in the middle of it, can make absorption press from both sides
The hole that vacuumizes on tool surface leaks gas and makes ceramics can not be fixed by vacuum equipment microscope carrier vacuum suction, and vacuum suction lost efficacy, it is impossible to
Complete substrate and reticle figure contraposition work.If gluing ceramics workpiece with adhesive tape to fix, defect one is between tape thickness produces
Away from the pattern edge vignette making exposure, affect high-frequency circuit dimensional stability；Defect two is that adhesive tape is clipped in ceramics as protrusion
With between reticle, figure high-precision requirement litho machine uses hard contact mode, and vacuum equipment hoistable platform can rise porcelain automatically
Reticle resisted stubbornly by piece workpiece, and owing to reticle thickness is much larger than ceramics workpiece, damage is ceramics workpiece.
The vacuum fixture being currently known, in order to effectively control the consumption of source of the gas, is saved source of the gas, is stably adsorbed workpiece, improve raw
Produce efficiency, use clamping workpiece panel, inhale vacuum gas-tpe fitting, pressure measurement gas-tpe fitting, fixture shell, sealing strip, pass sealing
Plate and film, pass through PLC, start and inhale vacuum solenoid and pressurize magnetic valve during use, source of the gas passes through vacuum generator
To sealing cavity air-breathing, sealing cavity and forming negative pressure, when negative pressure reaches vacuum table setting value, PLC disconnects inhales vacuum
Magnetic valve and pressurize magnetic valve, when sealing negative pressure and cavity value and breaking vacuum table setting value by a fall, inhale vacuum solenoid with pressurize electromagnetism
Valve starts automatically, at absorption affinity processing part produced by negative pressure value.
Content of the invention
The present invention is directed to the problem that above-mentioned prior art exists, provide a kind of convenient mounting and clamping, highly versatile, yield rate is high,
Can reliably use the thin film circuit of the two-way difference in functionality vacuum suction plummer that MJB4 automatic mask aligner vacuum equipment carries
Ceramics photoetching vacuum fixture with holes, manufactures photoetching automatic vacuum equipment, two-way difference in functionality vacuum to solve current ceramic circuit
The difficult problem adapting to through hole ceramics of absorption plummer.
The above-mentioned purpose of the present invention can be reached by following measures: a kind of thin film circuit ceramics with holes photoetching vacuum clip
Tool, comprising: contraposition shunting chassis 1 and be positioned on angle of circumference bisector alignment mark line (6 and be arranged on described contraposition shunting
Absorptive table 2 in lower end, chassis, chassis 1 mounting groove 5, it is characterised in that: contraposition shunting chassis 1 is formed with by three different-diameters same
Two disks that heart circle platform is constituted, circle Platform center is formed with gas port 4 and is positioned at groove 11 and the shape thereof of gas port 4 both sides
The adsorption plane 7 becoming and sealing surface 8, be wherein positioned at the groove 11 of gas port 4 both sides and define and vacuum equipment mutually airtight two
Road gas circuit；The side of flange anchor ring 9 contiguous roots connecting concentric circles platform is formed with mobile contraposition gas port 3, opposite side system
There is sensor frame dead slot 10；Absorptive table 2 is formed with centered on gas port 4, walks around the graticule end points on alignment mark line 6 free end
Vacuum absorption holes 17, constitutes the inner ring seal groove 12 of rectangle annular groove, is formed with gas port in described inner ring seal groove 12 regional center
4, the right-angled intersection air slot 14 with above-mentioned rectangle annular groove diagonal coincident radiation, four end points of right-angled intersection are formed with true
Empty adsorption hole 16, is formed with the middle level air slot consisting of shape annular groove alignment mark line 6 root square in inner ring seal groove 12 periphery
15, and the outer layer inner ring seal groove 13 around described middle level air slot 15, vacuum absorption holes 16 is distributed in ceramics Workpiece carrier
The corner in face is through with right-angled intersection air slot 14 to be connected, and holds the Corner Strapped ceramics workpiece of ceramics during work.
The present invention has the advantages that compared to prior art
Convenient mounting and clamping.The present invention is directed to existing automatic photoetching vacuum equipment difference in functionality two-way vacuum suction plummer can only process
Given size atresia ceramics and genuine provide the fixture of somewhat complex design, and gas circuit processing must process hand with laser and other high energy
Section, it is impossible to be machined into completing, gas circuit absorption outlet all concentrates on clamp central region, screw fastening be only structurally for
" O " shape sealing ring of the internal two-way of compressing fixture, the problem that can be only achieved gas circuit sealing purpose, fully put automatic photoetching in order true
The principle of null device difference in functionality two-way vacuum suction plummer, by contraposition shunting chassis 1 be formed with by three different-diameters
Two disks that concentric circles platform is constituted, circle Platform center be formed with gas port 4 and the groove 11 being positioned at gas port 4 both sides and
The adsorption plane 7 being formed and sealing surface 8, it is achieved through hole side's ceramics is easy to setup, use contraposition shunting chassis 1 to combine with absorptive table 2
Structural clips facilitates gas circuit and seals processing, decreases processing capacity, it is to avoid domestic and international vacuum equipment producer can only adapt to atresia
The problem of ceramics.For applicable MJB4 litho machine, meet vacuum equipment working procedure and require, high side circuitry chip circuit via metal
Changing ceramics, dry method sputter coating prepares the technique of ceramic membrane plated through-hole circuit, puddle development operation vacuum turntable clip
Hold workpiece, it is ensured that ceramics fixing in vacuum equipment moving carriage and hoistable platform action, form high accuracy figure, make to give up
Product rate is directly reduced in normal permissible range.
Highly versatile.The present invention is on the basis of fully putting automatic photoetching vacuum equipment pipeline, function in order, for existing skill
The defect that can only process atresia ceramics that art exists, devises vacuum in process area and the vacuum equipment sensor blind area of ceramics
Vacuum absorption holes, by producing custom design, away from the circuit layout punching in ceramics indoor design region, is designed by adsorption hole position
In the no process area of operation and vacuum equipment sensor blind area, play the applicability of fixture and general to greatest extent
Property, no matter porose atresia ceramics workpiece all can be applied.Use contraposition photoetching and ensure the photoetching of photolithography plate and the coating of ceramics surface
Glue directly contacts, and reduces refraction, improves litho pattern precision, it is to avoid thin film circuit ceramics with holes direct vacuum fixing contact light
Cut blocks for printing.
Yield rate is high.The present invention is directed to that prior art exists can not the defect of fixed belt hole ceramics, on ceramics workpiece limit
Edge arranges two-way vacuum absorption holes in the clear area corresponding to vacuum equipment and technological operation, uses two-layer embedded structure convenient
Clamp for machining inner air path and sealing assembling, it is ensured that two-way adsorbs technical measures such as fixing ceramics, meets porose, atresia ceramics
Workpiece can adsorb contraposition and figure precision photolithography.The dispersion gas circuit vacuum absorption holes arranging at loading end edge changes existing
Technology fixture gas circuit and absorption position, have matched the vacuum system of automatic photoetching vacuum equipment, and in operation, the design with genuine is complete
Complete consistent, it is ensured that exposure process ceramics glue-coated surface can contact firmly with reticle surface, decreases vignette, it is ensured that figure
The stability of size and uniformity, improve working (machining) efficiency and yield rate.
The present invention is directed to process area be processing ceramics circuit when technique for transport clamping, conductive electrode contact, design
The operating area of the purposes such as technique mark, the region not retained in the product after machining.Use two-way gas circuit airtight mutually
And two-way vacuum right-angled intersection air slot the 14th, the middle level air slot 15 that is connected with two vacuum holes of vacuum equipment, make gas circuit divide
Do not cover the centre position of the process area of the ceramics edge of work；Vacuum absorption holes 16 is distributed in the four of ceramics Workpiece carrier face
Angle is through with right-angled intersection air slot 14 to be connected, and holds the Corner Strapped ceramics workpiece of ceramics during work, and 4 absorption become three
Point absorption remains to keep the stable fixing of a face, avoids the drilled in middle bore region of ceramics workpiece, overcomes in real work,
Due to thin 0.127mm or 0.254mm of ceramics and crisp, often there is one jiao of situation broken in process area.Vacuum absorption holes
At the marginal surface of plummer, the vacuum absorption holes of crushing angle is easy to seal operation, thus ensures the suction of remaining vacuum absorption holes
Attached power.The two ends up and down being positioned on figure center line in Fig. 1 position, graticule end points vacuum absorption holes 17 is through with middle level air slot 15
It is connected, avoid vacuum equipment and arranged the position of contraposition camera at fixture left and right directions, accomplished that ceramics workpiece is upper and lower
Making full use of of process area, upper and lower two somes absorption, can effectively prevent ceramics workpiece from rotating when dragging.Holding of fixture
Section fluting 18, reduces the contact area with ceramics workpiece, is effectively reduced the impact of the mismachining tolerance accumulation of two planes,
When making work, on vacuum equipment workbench, the pressure on top does not concentrate on certain little region of ceramics workpiece, effectively prevents ceramics from breaking
Split.
The requirement of this fixture corresponding vacuum equipment operation devises corresponding vacuum hole and sealing surface, is pressed from both sides genuine by design
Corresponding two adsorption sites of the two-way gas circuit in position, central area for the tool, become in the blind area of corresponding vacuum equipment sensor and technique
Increasing in not using region and dragging two adsorption sites, four adsorption sites of photoetching, adsorption site position changes to the work of the ceramics edge of work
In skill region, simplify processing request by design and be easier to realize fixture assembly precision.The adsorption site position of jig Design
It owing to avoiding ceramics workpiece perforated area and technique marked region, is in again in process area, therefore to porose, atresia ceramics
Workpiece is all applicable.
The present invention is applicable to porose atresia ceramics contraposition and the exposure processing of ceramic circuit MJB4 automatic photoetching vacuum equipment.
Brief description
Fig. 1 is thin film circuit of the present invention ceramics with holes photoetching vacuum fixture top view.
Fig. 2 is the sectional view of Fig. 1.
Fig. 3 is the upward view of Fig. 1
Fig. 4 is the upward view of absorptive table 2.
Fig. 5 is the top view on contraposition shunting chassis 1
Fig. 6 is the sectional view of Fig. 5
In figure: 1 contraposition shunting chassis, 2 absorptive tables, 3 move contraposition gas port, 4 gas ports, 5 mounting grooves, 6 alignment mark lines, and 7
Adsorption plane, 8 sealing surfaces, 9 anchor rings, 10 sensor frame dead slots, 11 grooves, 12 inner ring seal grooves, 13 outer ring seal grooves, 14 air guides
Groove, 15 middle level air slots, 16 vacuum absorption holes, 17 graticule end points vacuum absorption holes, 18 annular grooves, 19 polymeric seal sticks.
Detailed description of the invention
In the embodiment shown in Fig. 1-Fig. 5, a kind of thin film circuit ceramics with holes photoetching vacuum fixture, comprising: contraposition divides
Stream chassis 1 and the alignment mark line 6 being positioned on angle of circumference bisector thereof are pacified with being arranged on described contraposition shunting lower end, chassis, chassis 1
Absorptive table 2 in tankage 5.Contraposition shunting chassis 1 is formed with two disks being made up of three different-diameter concentric circles platforms, circle
Platform center is formed with gas port 4 and the groove 11 being positioned at gas port 4 both sides and the adsorption plane 7 being formed thereof and sealing surface 8, Qi Zhongwei
Groove 11 in gas port 4 both sides defines the two-way gas circuit airtight mutually with vacuum equipment；Connect the flange of concentric circles platform
The side of anchor ring 9 contiguous roots is formed with mobile contraposition gas port 3, and opposite side is formed with sensor frame dead slot 10；Absorptive table 2 is formed with
Centered on gas port 4, walk around the graticule end points vacuum absorption holes 17 on alignment mark line 6 free end, constitute rectangle annular groove
Inner ring seal groove 12, is formed with gas port 4 in described inner ring seal groove 12 regional center, and overlap spoke with above-mentioned rectangle annular groove diagonal
Penetrate right-angled intersection air slot 14, four end points of right-angled intersection are formed with vacuum absorption holes 16, at inner ring seal groove 12
Periphery is formed with the middle level air slot 15 consisting of rectangle annular groove alignment mark line 6 root, and around described middle level air slot
The outer ring seal groove 13 of 15, the corner that vacuum absorption holes 16 is distributed in ceramics Workpiece carrier face is through with right-angled intersection air slot 14
It is connected, during work, hold the Corner Strapped ceramics workpiece of ceramics.
Right-angled intersection air slot the 14th, middle level air slot 15 constitutes the tow channel gas being connected with two vacuum holes of vacuum equipment
Road, this two-way gas circuit is respectively overlay in the centre position of the process area of the ceramics edge of work, and described process area avoids porcelain
The drilled in middle bore region of piece workpiece, for transporting clamping, conductive electrode contact and technique marking purposes when being processing ceramics circuit
Operating area.
Vacuum absorption holes 16 and graticule end points vacuum absorption holes 17 extend through to be formed with on absorptive table 2 edge surface is easy to plane
Grind the concentric square annular groove 18 of the multiple tracks of correction debugging.
Graticule end points vacuum absorption holes 17 is through with middle level air slot 15 to be connected, and avoids vacuum equipment at fixture left and right directions
Arrange the position of contraposition camera.
It is formed with on contraposition shunting chassis 1 disc and be respectively completed fixture and adsorb pipeline extension with table top absorption and photoetching
The groove 11 that contact surface seals, effect is to make above-mentioned two planes be easier to grind formation same level.
Adsorption plane 7 and sealing surface 8 define the two-way vacuum hole position of covering vacuum equipment hoistable platform sealing surface.
Only being under pressure during fixture work, the up-down structure being designed to embed can not need any securing member, simplifies
Processing, first injects fluid sealant in inner ring seal groove, absorptive table 2 embeds the mounting groove 5 that contraposition shunting chassis 1 is formed with during assembling
In, pressurization, the fluid sealant injecting in inner ring seal groove is because of Action of Gravity Field meeting automatic-sealed contact surface, because of two contact surfaces of processing
Planarity requirements is high, and lateral flow is little, it is achieved that seal and bonding；Mobile contraposition gas port the 3rd, gas port 4 and alignment mark
The position relationship of line 6 is the data of actual measurement vacuum equipment, and the alignment mark line 6 of fixture aligns the mark of vacuum equipment planker
After line, mobile contraposition gas port the 3rd, gas port 4 two vacuum holes just to vacuum equipment respectively, operate planker according to vacuum equipment
During button, two the graticule end points vacuum absorption holes 17 being positioned at clamp central line produce absorption affinity, and ceramics workpiece is fixed on fixture
Surface is sent into vacuum equipment after completing ceramics clamping and is moved.Because of suction, pause after pushing ensures that ceramics is not sliding at chucking surface
Dynamic, now fixture is in above vacuum equipment self-powered platform；During photoetching work, vacuum equipment self-powered platform rises, contact folder
Tool adsorption plane 7 and sealing surface 8, adsorption plane 7 just seals the vacuum absorption holes of vacuum equipment lifting work table top periphery, adsorbed
Complete to fix, sealing surface 8 principal security vacuum equipment lifting work table top center true on vacuum equipment lifting work table top
Emptying aperture and fixture gas port 4 Butt sealing, make fixture corner vacuum absorption holes 16 produce enough suction, complete contraposition and light
Carve.
Mobile contraposition gas port 3 docks with vacuum equipment vacuum hole, the size of its position and size and vacuum equipment planker
Corresponding with location matches.
It is positioned at the inner ring seal groove 12 of adsorption table face 2 bottom surface and outer ring seal groove 13 is filled with polymeric seal stick
19, absorptive table 2 weighting material pressurization, polymeric seal stick 19 under gravity, from inner ring seal groove the 12nd, outer ring seal groove
Trickling in 13 forms the flat seal of solidification bonding to mounting groove 5 surface.
Put into the photoetching vacuum fixture of vacuum equipment movable support bracket, the One On The Chassis contraposition of contraposition shunting of one of its assembly
Mark line 6 aligns mark line on vacuum equipment movable support bracket, and the One On The Chassis mobile contraposition gas port 3 of contraposition shunting sets with vacuum
On standby movable support bracket, vacuum hole overlaps.Place ceramics workpiece adsorption table face 2 surface of one of photoetching vacuum fixture assembly and with
Its boss profile is alignd, and when bracket enters litho machine, vacuum hole and therewith is opened and passed through on movable support bracket to vacuum equipment vacuum
Mobile contraposition gas port the 3rd, fixture inner middle layer air slot 15 passage overlapping, reaches chucking surface graticule end points vacuum absorption holes
17 vacuum suction entrances, adsorb ceramics workpiece middle edge on it for the fixed placement, and it is true that bracket drives fixture and ceramics to enter
Null device and after putting in place after, vacuum equipment movable support bracket vacuum line is closed, and starts lithographic procedures, vacuum equipment hoistable platform
Vacuum is opened, and hoistable platform rises adsorption plane 7 and the sealing surface 8 that contact fixture is separated by groove 11, and adsorption plane 7 is by hoistable platform
Secure fixtures to hoistable platform surface after the vacuum hole absorption of periphery, move with vacuum equipment platform.Sealing surface 8 makes gas port
4 overlap with the vacuum hole at vacuum equipment hoistable platform center and ensure that vacuum seals, and vacuum equipment vacuum line passes through gas port 4
Internal air slot 14 channel connection, reaches chucking surface vacuum absorption holes 16 vacuum suction entrance, adsorbs and be placed on fixture
The corner of the ceramics edge of work on it completes ceramics and fixes.Starting ceramics and reticle contraposition program, vacuum equipment table top is certainly
Dynamic decline a distance, make ceramics and reticle form gap, then ceramics because of vacuum fixed random vacuum equipment hoistable platform X Y
Axle moves and rotates with θ axle, makes ceramics workpiece complete the contraposition with reticle.Contraposition completes final vacuum equipment hoistable platform and rises,
Ceramics photomask surface glueds joint tactile reticle, UV soft exchange, self-clocking, completes exposure rear platform and declines, turns off vacuum.Mobile torr
Frame related photoetching vacuum fixture skids off, and takes out ceramics workpiece, proceeds to developing procedure.
The ceramics photolithography table surface function of MJB4 litho machine is divided into two steps to complete, and a step is slip planker, and ceramics presss from both sides
Tool is just placed on planker, pulls out planker, and fixture, can be with very convenient clamping and taking off away from the exposure mechanical device of vacuum equipment
Ceramics.Dragging gas circuit work when pushing ceramics, sensor frame dead slot 10 does not oppress the sensor on its position bottom plate, vacuum
The Mobile vacuum absorption gas circuit of equipment is opened, and the graticule end points vacuum absorption holes 17 of fixture fixes ceramics, and ceramics workpiece is not because dragging
The vibration displacement of shock that plate puts in place, the rear dragging that puts in place road of taking offence quits work.Two steps are that photoetching triggers, and in vacuum equipment, photoetching is true
While air road automatically opens up, Lifting platform rises, and the adsorption plane 7 of contact fixture and sealing surface 8, fixture adsorption plane 7 is by vacuum
The vacuum absorption holes being in periphery on equipment Lifting platform is fixed, and the gas port 4 at sealing surface 8 center has accessed the work of vacuum equipment
Part adsorbs pipeline, fixes workpiece by workpiece vacuum absorption holes 16, and now fixture anchor ring 9 disengaging contacts with planker surface.
Opening to bit switch, Lifting platform declines certain distance automatically makes workpiece ceramics surface disengage reticle, can operate light
Learning positioning mechanism and the technology hole of reticle alignment mark and ceramics being carried out contraposition, contraposition is closed to bit switch after completing,
It is automatically performed exposure.The developing process finally utilizing maturation completes development.
Above-described is only the preferred embodiments of the present invention.It should be pointed out that, and those of ordinary skill in the art is come
Saying, under the premise without departing from the principles of the invention, can also make some deformation and improve, these alterations and modifications should be regarded as belonging to
In protection scope of the present invention.
Claims (10)
1. thin film circuit ceramics photoetching vacuum fixture with holes, comprising: contraposition shunting chassis 1 and be positioned at angle of circumference bisector
On alignment mark line (6) and the absorptive table (2) being arranged in described contraposition shunting lower end, chassis, chassis 1 mounting groove (5), it is special
Levy and be: contraposition shunting chassis (1) is formed with two disks being made up of three different-diameter concentric circles platforms, circle Platform center
It is formed with gas port (4) and be positioned at the groove (11) in gas port (4) outside and the adsorption plane (7) of formation thereof and sealing surface (8), wherein
The groove (11) being positioned at gas port (4) both sides defines the two-way gas circuit airtight mutually with vacuum equipment；Connect concentric circles platform
The side of flange anchor ring (9) contiguous roots be formed with mobile contraposition gas port (3), opposite side is formed with sensor frame dead slot
(10)；Absorptive table (2) is formed with centered on gas port (4), walks around the graticule end points vacuum on alignment mark line (6) free end and inhales
Attached hole (17), constitutes the inner ring seal groove (12) of rectangle annular groove, is formed with gas port in described inner ring seal groove (12) regional center
(4), the right-angled intersection air slot (14) with above-mentioned rectangle annular groove diagonal coincident radiation, makes on four end points of right-angled intersection
There is vacuum absorption holes (16), be formed with in inner ring seal groove (12) periphery and constitute shape annular groove by alignment mark line (6) root square
Middle level air slot (15), and the outer ring seal groove (13) around described middle level air slot (15), vacuum absorption holes (16) is distributed
Corner in ceramics Workpiece carrier face is through with right-angled intersection air slot (14) to be connected, and holds the Corner Strapped porcelain of ceramics during work
Piece workpiece.
2. thin film circuit ceramics with holes photoetching vacuum fixture as claimed in claim 1, it is characterised in that: vacuum absorption holes (16)
Extend through the concentric square annular groove of the multiple tracks being formed with on absorptive table (2) edge surface with graticule end points vacuum absorption holes (17)
(18)。
3. thin film circuit ceramics with holes photoetching vacuum fixture as claimed in claim 1, it is characterised in that: contraposition shunts chassis
(1) it is formed with the groove of the contact surface sealing being respectively completed fixture and table top absorption and photoetching absorption pipeline extension on disc
(11)。
4. thin film circuit ceramics with holes photoetching vacuum fixture as claimed in claim 1, it is characterised in that: adsorption plane (7) and close
Front cover (8) defines the sealing surface of the two-way vacuum hole position of covering vacuum equipment hoistable platform.
5. thin film circuit ceramics with holes photoetching vacuum fixture as claimed in claim 1, it is characterised in that: mobile contraposition gas port
(3) docking with vacuum equipment vacuum hole, its position and size are corresponding with the size of vacuum equipment planker and location matches.
6. thin film circuit ceramics with holes photoetching vacuum fixture as claimed in claim 1, it is characterised in that: it is positioned at adsorption table face
(2) it is filled with polymeric seal stick (19), in absorptive table (2) in the inner ring seal groove (12) of bottom surface and outer ring seal groove (13)
Weighting material pressurizes, and polymeric seal stick (19) under gravity, flows from inner ring seal groove (12), outer ring seal groove (13)
Drop down mounting groove (5) and form the flat seal of solidification bonding.
7. thin film circuit ceramics with holes photoetching vacuum fixture as claimed in claim 1, it is characterised in that: contraposition shunts chassis
(1) alignment mark line (6) aligns mark line on vacuum equipment movable support bracket, and the mobile contraposition in contraposition shunting chassis (1) is led
Pore (3) overlaps with vacuum hole on vacuum equipment movable support bracket.
8. thin film circuit ceramics with holes photoetching vacuum fixture as claimed in claim 1, it is characterised in that: right-angled intersection air slot
(14), middle level air slot (15) constitutes the two-way gas circuit being connected with two vacuum holes of vacuum equipment, and this two-way gas circuit is covered respectively
Covering the centre position of process area at the ceramics edge of work, described process area avoids the drilled in middle porose area of ceramics workpiece
Territory, for transporting the operating area of clamping, conductive electrode contact and technique marking purposes when being processing ceramics circuit.
9. thin film circuit ceramics with holes photoetching vacuum fixture as claimed in claim 1, it is characterised in that: graticule end points vacuum is inhaled
Attached hole (17) is through with middle level air slot (15) to be connected, and avoids vacuum equipment and has arranged contraposition camera at fixture left and right directions
Position.
10. thin film circuit ceramics with holes photoetching vacuum fixture as claimed in claim 1, it is characterised in that: vacuum equipment vacuum
Open and by vacuum hole on movable support bracket and the mobile contraposition gas port (3) coinciding with, fixture inner middle layer air slot
(15) passage, reaches chucking surface graticule end points vacuum absorption holes (17) vacuum suction entrance, and absorption fixed placement is on it
Ceramics workpiece middle edge, bracket drive fixture and ceramics to enter vacuum equipment and put in place after after, vacuum equipment movable support bracket is true
Blank pipe road is closed, and starts lithographic procedures, and the vacuum of vacuum equipment hoistable platform is opened, and hoistable platform rises contact fixture by groove
(11) adsorption plane (7) separating and sealing surface (8), adsorption plane (7) is solid by fixture after being adsorbed by the vacuum hole of hoistable platform periphery
It is scheduled on hoistable platform surface, move with vacuum equipment platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610724598.8A CN106154769A (en) | 2016-08-25 | 2016-08-25 | Thin film circuit ceramics with holes photoetching vacuum fixture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610724598.8A CN106154769A (en) | 2016-08-25 | 2016-08-25 | Thin film circuit ceramics with holes photoetching vacuum fixture |
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| CN106154769A true CN106154769A (en) | 2016-11-23 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107831063A (en) * | 2017-10-28 | 2018-03-23 | 庄明忠 | A kind of construction material intensity detecting device |
| CN108687587A (en) * | 2017-03-30 | 2018-10-23 | 株式会社迪思科 | Grinding attachment |
| CN111132539A (en) * | 2020-01-17 | 2020-05-08 | 安徽博微长安电子有限公司 | Tool and method for nondestructive mounting of chip in gel box by manual dispensing chip mounter |
| CN114200777A (en) * | 2021-12-21 | 2022-03-18 | 中国科学院光电技术研究所 | Square substrate clamping device |
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| CN104810315A (en) * | 2014-01-29 | 2015-07-29 | 上海微电子装备有限公司 | Clamping device for LED substrate exposure |
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| CN101196693A (en) * | 2007-11-28 | 2008-06-11 | 上海微电子装备有限公司 | Silicon slice fixing part |
| CN101794726A (en) * | 2009-02-02 | 2010-08-04 | 优志旺电机株式会社 | Workpiece stage and exposure apparatus using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108687587A (en) * | 2017-03-30 | 2018-10-23 | 株式会社迪思科 | Grinding attachment |
| CN108687587B (en) * | 2017-03-30 | 2021-08-17 | 株式会社迪思科 | Grinding device |
| CN107831063A (en) * | 2017-10-28 | 2018-03-23 | 庄明忠 | A kind of construction material intensity detecting device |
| CN111132539A (en) * | 2020-01-17 | 2020-05-08 | 安徽博微长安电子有限公司 | Tool and method for nondestructive mounting of chip in gel box by manual dispensing chip mounter |
| CN114200777A (en) * | 2021-12-21 | 2022-03-18 | 中国科学院光电技术研究所 | Square substrate clamping device |
| CN114200777B (en) * | 2021-12-21 | 2023-06-13 | 中国科学院光电技术研究所 | Square substrate clamping device |
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