CN101196693A - Silicon slice fixing part - Google Patents
Silicon slice fixing part Download PDFInfo
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- CN101196693A CN101196693A CNA200710171208XA CN200710171208A CN101196693A CN 101196693 A CN101196693 A CN 101196693A CN A200710171208X A CNA200710171208X A CN A200710171208XA CN 200710171208 A CN200710171208 A CN 200710171208A CN 101196693 A CN101196693 A CN 101196693A
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Abstract
The invention discloses a silicon wafer fixing component, which comprises a plurality of vacuum absorption holes for absorbing silicon wafers, vacuum through holes for communicating the vacuum absorption holes and a plurality of concentric annular grooves for supporting the silicon wafer. The annular groove comprises a vacuum groove and an atmosphere groove arranged at interval in turn, the vacuum absorption hole is positioned in the vacuum groove. The silicon wafer fixing component is also provided with a technics hole isolating the vacuum through hole, the vacuum through hole is isolated after the technics hole is filled, when the technics hole internal side is communicated with the gas controlling device, the technics hole can be used for absorbing No. eight silicon wafer; when both the internal and external sides of the technical hole are communicated, the technics hole can be used for absorbing No. 12 silicon wafer. The atmosphere groove is also internally provided with an atmosphere through hole, the atmosphere through hole can discharge atmosphere between the silicon wafer and the absorption surface, so as to reduce the deformation of the silicon wafer. In addition, by considering the processing manufacturability, the annular groove can be designed into a trapezoid to reduce the processing deformation. The silicon fixing component adopts silicon carbide precision ceramic as the material, the technics performance of the silicon fixing component is improved and the service life is prolonged.
Description
Technical field
The present invention relates to the silicon chip platform on the exposure device in the semiconductor applications, specifically, relate to the silicon slice fixing part on a kind of silicon chip platform.
Background technology
In the exposure technology of silicon chip,, need accurately control the position of silicon chip for the surface at silicon chip forms accurate circuitous pattern.When exposing, silicon slice placed is fixed by the fixed part on the silicon chip platform on the silicon chip platform.In the prior art, the structure of fixed part is varied.United States Patent (USP) discloses a kind of design and production method of silicon chip platform for No. 6822730, the fixed part that relates in the document is a magnet absorption ring, the mode that the silicon chip platform compresses by magnet absorption ring is silicon chip fixedly, and this mode is not easy to grasp the size of pressure, damages silicon chip easily by pressure.
The exposure device that United States Patent (USP) discloses a kind of structure of silicon chip platform and comprised this silicon chip platform for No. 6710857, the fixed part that the document relates to is formed by ceramic post sintering, and the structure on the surface of absorption silicon chip is arranged for the rounded projections arranged dot matrix.But this fixed part only is applicable to band side cut type silicon chip, and can only adsorb the silicon chip of fixed measure, no size compatibility function.United States Patent (USP) discloses a kind of silicon chip platform unit, exposure device and design and production method for No. 6875987, the surface structure of the fixed part that the document relates to is the interior outer close dot matrix radial array layout of dredging, and 18 vacuum holes of absorption silicon chip divide three groups to be 120 ° of even distributions.Though this predetermined member is cell structure, has alleviated weight, has improved rigidity, also can only adsorb the silicon chip of fixed measure, no size compatibility function.
United States Patent (USP) discloses a kind of silicon chip platform of exposure device for No. 6583858, though the silicon slice fixing part that the document is mentioned on the silicon chip platform is provided with two place's fixed datums and place's moving reference point, can realize function that the silicon chip of different size is fixed, but but not have the description of concrete structure.
Summary of the invention
The technical matters that the present invention solves provides the silicon slice fixing part on a kind of silicon chip platform, and it can alleviate or avoid the damage of silicon chip and have the size compatibility function.
For solving the problems of the technologies described above, the invention provides a kind of new silicon slice fixing part.This silicon slice fixing part comprises the vacuum suction hole of several absorption silicon chips, the vacuum through hole that is communicated with the vacuum suction hole and some annular concentric grooves that extends from the surface of its absorption silicon chip.
The Cross section Design of described ring groove reduces the contact area of silicon chip and absorption surface in echelon.
Described ring groove comprises the vacuum tank and the atmospheric groove of alternately arranging, and described vacuum suction hole is arranged in the described vacuum tank, and described atmospheric exhaust hole is arranged in the atmospheric groove.Further, described vacuum tank is identical with the atmospheric groove degree of depth, but the atmospheric groove transverse width is greater than the transverse width of vacuum tank correspondence position.
Described vacuum suction hole has 36, is divided into 3 groups and is 120 ° of radially evenly distributions, and described vacuum through hole correspondence is provided with 3, is used to be communicated with the vacuum suction hole in the corresponding group; Described silicon slice fixing part also comprises one group of 10 radially equally distributed atmospheric exhaust hole and the big vent hole that is communicated with described atmospheric exhaust hole.
Described silicon slice fixing part also is provided with fabrication hole and the connecting hole that communicates with the vacuum through hole, wherein the vacuum through hole of correspondence can be cut off behind the fill process hole; Described connecting hole is positioned at the inside and outside both sides of fabrication hole and is used for connecting with the gas control equipment of silicon slice fixing part, and when inboard connecting hole was connected, only the vacuum suction hole of fabrication hole inboard can be used for the small size silicon chip as 8 " silicon chips; When inside and outside both sides connecting hole was all connected, the vacuum suction hole of fabrication hole medial and lateral all can be used for adsorbing large-sized silicon wafers as 12 " silicon chips.
What the material of described silicon slice fixing part adopted is the silit high technology ceramics.
Compared with prior art, the present invention is designed to ring groove by the absorption surface with fixed part, has reduced the contact area with silicon chip, reduces the deformation of silicon chip itself; By atmospheric exhaust hole and big vent hole are set, the time of having accelerated unloading piece, improved work efficiency; By the atmospheric exhaust mouth is arranged in ring groove, reduced the influence of atmosphere to the silicon chip position; By the fabrication hole that can separate the vacuum through hole is set, realize the silicon chip of different size is fixed; Adopt the manufacturing of silit high technology ceramics, improved the manufacturability of silicon slice fixing part, prolonged serviceable life.
Description of drawings
Fig. 1 is the stereographic map of silicon slice fixing part of the present invention.
Fig. 2 a is the upward view of silicon slice fixing part.
Fig. 2 b is the structural representation of the gas control equipment of silicon slice fixing part connection.
Fig. 3 is the vertical view of silicon slice fixing part.
Fig. 4 is the cut-open view of A-A direction among Fig. 3.
Fig. 5 is the partial enlarged drawing of circle part M among Fig. 4.
Embodiment
By being described, can further understand purpose of the present invention, specific structural features and advantage below in conjunction with the embodiment of accompanying drawing to silicon slice fixing part of the present invention.
Fig. 1 is the stereographic map of silicon slice fixing part 1 provided by the invention.See also Fig. 1 and in conjunction with Fig. 3 to Fig. 4, the surface (being defined as adsorption plane) 10 of this silicon slice fixing part 1 absorption silicon chip is provided with several equally distributed annular concentric grooves 2.The degree of depth of described ring groove 2 is identical, and xsect all is designed to trapezoidally, and all adopting the base angle in the present embodiment is isosceles trapezoid about 45 °.This concavo-convex alternate structure has reduced the distortion of silicon slice fixing part 1 itself, and is convenient to processing.Trapezoidal by xsect is arranged to, further reduced the contact area of adsorption plane 10 with silicon chip, in exposure technology, reduced like this because suction causes the deformation of silicon chip itself.Described ring groove 2 comprises the vacuum tank 21 and the atmospheric groove 22 (in conjunction with Fig. 3 and Fig. 5) of alternately arranging, and wherein the transverse width of atmospheric groove 22 is greater than vacuum tank 21.
See also Fig. 1 and Fig. 3 to Fig. 5, described silicon slice fixing part 1 also is provided with 36 vacuum suction hole 210 and 10 atmospheric exhaust holes 220 that are arranged in the atmospheric groove 22 of being arranged in the vacuum tank 21, and the diameter in vacuum suction hole 210 is less than the diameter in atmospheric exhaust hole 220.Described 36 vacuum suction holes 210 minutes are 120 ° for 3 groups and radially evenly distribute (as Fig. 4), and described 10 atmospheric exhaust holes 220 are 1 group radially evenly distribute (as Fig. 1).The angle of the center line in described atmospheric exhaust hole 220 and the center line in nearest one group of vacuum suction hole 210 is roughly 30 °.In addition, atmospheric exhaust mouth 220 is arranged in the ring groove 2, thereby the atmosphere that can discharge between silicon chip and the absorption surface reduces the deformation that atmosphere causes silicon chip, the influence that when also reducing exhaust the silicon chip position is caused.
Described silicon slice fixing part 1 also is provided with 3 vacuum through holes 3 and 1 big vent hole 4.Article three, vacuum through hole 3 labels are respectively 3a, 3b, 3c, and a vacuum through hole is communicated with one group of vacuum suction hole 210.Described big vent hole 4 is communicated with 10 atmospheric exhaust holes 220.Silicon slice fixing part 1 is defined as installed surface 11 (see figure 3)s with adsorption plane 10 facing surfaces.See also Fig. 2 a and Fig. 3, this silicon slice fixing part 1 be provided with from installed surface 11 upwardly extending on same circumference equally distributed three dowel holes 5 and three fabrication holes 6.Dowel hole 5 and fabrication hole 6 are provided with at interval.By dowel hole 5 and vacuum suction fixed part 1 is fixed on the silicon chip platform, makes the levelling gear on itself and the silicon chip platform not have relative motion.Fabrication hole 6 runs through corresponding vacuum through hole 3, by fill barriers in fabrication hole 6 vacuum through hole 3 is separated.Be understandable that, can be as required fixedly the size of silicon chip a plurality of above-mentioned fabrication holes are set, thereby realize the silicon chip of more sizes is fixed.In addition, each fabrication hole 6 radially both sides also is provided with two connecting holes 8,9, and it is extended upward with corresponding vacuum through hole 3 by installed surface 11 and communicates.
See also Fig. 2 b, this silicon slice fixing part 1 is connected with gas control equipment 7, and it comprises lateral 70a, 70b, 70c, trunk line 71, controlling plumbing fixtures 72a, 72b, 72c.Described each lateral 70a, 70b, 70c have two branch road 701a, 702a, 701b, 702b, 701c, 702c respectively, wherein branch road 701a, 701b, 701c are connected with connecting hole 9,702a, 702b, 702c are connected with connecting hole 8, thereby realize communicating with vacuum through hole 3a, 3b, 3c; Controlling plumbing fixtures 72a, 72b, 72c connect vacuum pump, atmospheric pump, vacuum chamber respectively, and control switching by valve v1, v2, v3.In addition, an end of vacuum chamber is connected with vacuum pump.Gas control equipment 7 is realized to vacuum through hole 3a, 3b, 3c air feed by the connecting hole on the silicon slice fixing part 8,9 or is bled.
After adopting barriers to block fabrication hole 6, each vacuum through hole 3a, 3b, 3c are separated out, closing control branch road 701a, valve v11, the v21 of 701b, 701c, v31, open control branch road 702a, valve v12, the v22 of 702b, 702c, v32, in this case, have only the vacuum suction hole 210 of close center can adsorb silicon chip, promptly can adsorb 8 " silicon chips in the present embodiment.When all valve v11-v32 of control branch road all opened, silicon chip can be adsorbed in the vacuum suction hole 210 of all positions, promptly can adsorb 12 " silicon chips in the present embodiment.According to foregoing description as can be known, fabrication hole can also be set the vacuum through hole being divided into multiterminal and a plurality of connecting hole, thereby realize the compatibility of more size silicon chips is used in a plurality of positions of vacuum through hole.
In addition, when unloading, Open valve v3,, valve-off v1, v3, gas enter the adsorption plane 10 of silicon chip and silicon slice fixing part 1, under the help of mobile device (not shown), finish silicon chip unloading like this.Because silicon slice fixing part 1 is provided with above-mentioned big vent hole 4 and atmospheric exhaust hole 10, gas can enter adsorption plane 10 very soon when unloading like this, and then saves the time of unloading.
The material of silicon slice fixing part 1 adopts the silit high technology ceramics.Because silit high technology ceramics material has characteristics such as thermal expansivity is little, good stability, good processability, hardness height, natural vibration frequency height, therefore this silicon slice fixing part 1 has well heat-resisting, anti-collision, corrosion-resistant, anti abrasive characteristic, in use be difficult for deforming, and keep long-term stability, improved the serviceable life of silicon slice fixing part.
Foregoing description; only being the specific descriptions to preferred embodiment of the present invention, is not to any qualification of the present invention, for the person of ordinary skill of the art; can carry out simple modification, interpolation, conversion according to above-mentioned disclosure, and all belong to the content of protecting in claims.
Claims (12)
1. silicon slice fixing part, it is provided with the vacuum suction hole of several absorption silicon chips and the vacuum through hole that is communicated with the vacuum suction hole, it is characterized in that: described silicon slice fixing part is provided with some concentric ring grooves that extend from the surface of its absorption silicon chip, and described vacuum suction hole is arranged in the described ring groove.
2. silicon slice fixing part as claimed in claim 1 is characterized in that: the cross section of described ring groove is trapezoidal.
3. silicon slice fixing part as claimed in claim 2 is characterized in that: described trapezoidal be that the base angle is 45 ° a isosceles trapezoid.
4. silicon slice fixing part as claimed in claim 1 is characterized in that: described ring groove comprises the vacuum tank and the atmospheric groove of alternately arranging, and described vacuum suction hole is arranged in the described vacuum tank; Described fixed part also is provided with atmospheric exhaust hole that is arranged in the atmospheric groove and the big vent hole that is communicated with the atmospheric exhaust hole.
5. silicon slice fixing part as claimed in claim 4 is characterized in that: described vacuum suction hole is divided into 3 groups and is 120 ° of radially evenly distributions, and described vacuum through hole correspondence is provided with 3, is used to be communicated with the vacuum suction hole in the corresponding group; Described atmospheric exhaust hole is 1 group and radially evenly distributes that described big vent hole has 1, is used to be communicated with described 1 group of atmospheric exhaust hole.
6. silicon slice fixing part as claimed in claim 5 is characterized in that: described vacuum suction hole has 36,12 every group; Described atmospheric exhaust hole has 10.
7. silicon slice fixing part as claimed in claim 4 is characterized in that: described atmospheric groove transverse width is greater than the transverse width of described vacuum tank correspondence position.
8. silicon slice fixing part as claimed in claim 7 is characterized in that: the degree of depth of described atmospheric groove and vacuum tank is identical.
9. silicon slice fixing part as claimed in claim 4 is characterized in that: the diameter in described vacuum suction hole is less than the diameter in atmospheric exhaust hole.
10. as claim 1 or 5 described silicon slice fixing parts, it is characterized in that: described silicon slice fixing part also is provided with fabrication hole and the connecting hole that communicates with the vacuum through hole, wherein the vacuum through hole of correspondence can be cut off behind the fill process hole; Described connecting hole is positioned at the inside and outside both sides of fabrication hole and is used for connecting with the gas control equipment of silicon slice fixing part, and when inboard connecting hole was connected, only the vacuum suction hole of fabrication hole inboard can be used for adsorbing silicon chip; When inside and outside both sides connecting hole was all connected, the vacuum suction hole of fabrication hole medial and lateral all can be used for adsorbing silicon chip.
11. silicon slice fixing part as claimed in claim 10 is characterized in that: described fabrication hole evenly distributes on the same circumference of wafer.
12. silicon slice fixing part as claimed in claim 1 is characterized in that: what the material of described silicon slice fixing part adopted is the silit high technology ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710171208XA CN100535762C (en) | 2007-11-28 | 2007-11-28 | Silicon slice fixing part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710171208XA CN100535762C (en) | 2007-11-28 | 2007-11-28 | Silicon slice fixing part |
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| Publication Number | Publication Date |
|---|---|
| CN101196693A true CN101196693A (en) | 2008-06-11 |
| CN100535762C CN100535762C (en) | 2009-09-02 |
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| CNB200710171208XA Active CN100535762C (en) | 2007-11-28 | 2007-11-28 | Silicon slice fixing part |
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| CN102496587A (en) * | 2011-11-25 | 2012-06-13 | 清华大学 | Wafer in-situ detecting device and wafer in-situ detecting method |
| CN103217133A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Stand-column type manual thickness measuring equipment for surface mounted technology (SMT) stencil |
| CN103389044A (en) * | 2013-08-09 | 2013-11-13 | 昆山允可精密工业技术有限公司 | Manual single-measure-head contact-type measuring method for veneer board thickness |
| CN103389045A (en) * | 2013-08-09 | 2013-11-13 | 昆山允可精密工业技术有限公司 | Contact type measuring unit for thickness of manual single measure head veneer board |
| CN104425335A (en) * | 2013-08-28 | 2015-03-18 | Ap系统股份有限公司 | Equipment used for holding substrate |
| CN104538333A (en) * | 2014-12-16 | 2015-04-22 | 瑞德兴阳新能源技术有限公司 | Tray for eliminating warping of wafer |
| CN104898379A (en) * | 2015-06-10 | 2015-09-09 | 兰州大学 | Sample table for overlaying special samples by laser direct writing machine |
| CN105092904A (en) * | 2014-05-04 | 2015-11-25 | 无锡华润上华半导体有限公司 | MEMS silicon wafer fixing device, fixing method and testing method |
| CN105332992A (en) * | 2014-07-30 | 2016-02-17 | 睿励科学仪器（上海）有限公司 | Vacuum sucker |
| CN105382601A (en) * | 2015-12-15 | 2016-03-09 | 东南大学 | Multi-dimensional vacuum clamp applicable to thin-slice shaped workpiece |
| CN106154769A (en) * | 2016-08-25 | 2016-11-23 | 中国电子科技集团公司第十研究所 | Thin film circuit ceramics with holes photoetching vacuum fixture |
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| CN109545698A (en) * | 2018-11-02 | 2019-03-29 | 中国电子科技集团公司第十研究所 | A kind of device for positioning and securing and the method to silicon-based tellurium-cadmium mercury disk testing flatness |
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| CN110456613A (en) * | 2019-07-08 | 2019-11-15 | 苏州源卓光电科技有限公司 | A kind of sucker applied to write-through exposure machine |
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| US4131267A (en) * | 1978-06-02 | 1978-12-26 | Disco Kabushiki Kaisha | Apparatus for holding workpiece by suction |
| JPH0521584A (en) * | 1991-07-16 | 1993-01-29 | Nikon Corp | Retaining equipment |
| US6164633A (en) * | 1999-05-18 | 2000-12-26 | International Business Machines Corporation | Multiple size wafer vacuum chuck |
| JP4288694B2 (en) * | 2001-12-20 | 2009-07-01 | 株式会社ニコン | Substrate holding apparatus, exposure apparatus, and device manufacturing method |
| EP1431825A1 (en) * | 2002-12-20 | 2004-06-23 | ASML Netherlands B.V. | Lithographic apparatus, device manufacturing method, and substrate holder |
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| CN102496587A (en) * | 2011-11-25 | 2012-06-13 | 清华大学 | Wafer in-situ detecting device and wafer in-situ detecting method |
| CN103217133A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Stand-column type manual thickness measuring equipment for surface mounted technology (SMT) stencil |
| CN103389044A (en) * | 2013-08-09 | 2013-11-13 | 昆山允可精密工业技术有限公司 | Manual single-measure-head contact-type measuring method for veneer board thickness |
| CN103389045A (en) * | 2013-08-09 | 2013-11-13 | 昆山允可精密工业技术有限公司 | Contact type measuring unit for thickness of manual single measure head veneer board |
| CN104425335A (en) * | 2013-08-28 | 2015-03-18 | Ap系统股份有限公司 | Equipment used for holding substrate |
| CN105092904A (en) * | 2014-05-04 | 2015-11-25 | 无锡华润上华半导体有限公司 | MEMS silicon wafer fixing device, fixing method and testing method |
| CN105092904B (en) * | 2014-05-04 | 2018-04-10 | 无锡华润上华科技有限公司 | MEMS fixing device for silicon piece, fixing means and method of testing |
| CN105332992A (en) * | 2014-07-30 | 2016-02-17 | 睿励科学仪器（上海）有限公司 | Vacuum sucker |
| CN104538333A (en) * | 2014-12-16 | 2015-04-22 | 瑞德兴阳新能源技术有限公司 | Tray for eliminating warping of wafer |
| CN104898379B (en) * | 2015-06-10 | 2017-11-21 | 兰州大学 | A kind of sample stage of laser direct-writing machine particular sample alignment |
| CN104898379A (en) * | 2015-06-10 | 2015-09-09 | 兰州大学 | Sample table for overlaying special samples by laser direct writing machine |
| US10898972B2 (en) | 2015-11-03 | 2021-01-26 | Samsung Display Co., Ltd. | Laser crystallizing apparatus |
| KR20170052753A (en) * | 2015-11-03 | 2017-05-15 | 삼성디스플레이 주식회사 | Laser crystalling apparatus |
| KR102440560B1 (en) * | 2015-11-03 | 2022-09-06 | 삼성디스플레이 주식회사 | Laser crystalling apparatus |
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| CN107034513B (en) * | 2015-11-03 | 2021-04-20 | 三星显示有限公司 | Laser crystallization device |
| CN105382601A (en) * | 2015-12-15 | 2016-03-09 | 东南大学 | Multi-dimensional vacuum clamp applicable to thin-slice shaped workpiece |
| CN105382601B (en) * | 2015-12-15 | 2017-11-28 | 东南大学 | A kind of more size vacuum fixtures suitable for slice work-piece |
| CN106154769A (en) * | 2016-08-25 | 2016-11-23 | 中国电子科技集团公司第十研究所 | Thin film circuit ceramics with holes photoetching vacuum fixture |
| CN108305848A (en) * | 2018-01-12 | 2018-07-20 | 昆山成功环保科技有限公司 | A kind of wafer automatic station-keeping system and the loading machine including it |
| CN109545698B (en) * | 2018-11-02 | 2021-09-03 | 中国电子科技集团公司第十一研究所 | Positioning and fixing device and method for testing flatness of silicon-based tellurium-cadmium-mercury wafer |
| CN109545698A (en) * | 2018-11-02 | 2019-03-29 | 中国电子科技集团公司第十研究所 | A kind of device for positioning and securing and the method to silicon-based tellurium-cadmium mercury disk testing flatness |
| CN110052370A (en) * | 2019-05-15 | 2019-07-26 | 苏州美图半导体技术有限公司 | Sol evenning machine vacuum spin coating device |
| CN110052370B (en) * | 2019-05-15 | 2024-04-02 | 苏州美图半导体技术有限公司 | Vacuum glue homogenizing device of glue homogenizing machine |
| CN110456613A (en) * | 2019-07-08 | 2019-11-15 | 苏州源卓光电科技有限公司 | A kind of sucker applied to write-through exposure machine |
| CN110456613B (en) * | 2019-07-08 | 2021-12-07 | 苏州源卓光电科技有限公司 | Be applied to sucking disc of direct-write exposure machine |
| CN111069947A (en) * | 2019-12-04 | 2020-04-28 | 中国工程物理研究院机械制造工艺研究所 | Universal split vacuum reducing suction tool |
| CN113029236A (en) * | 2021-03-05 | 2021-06-25 | 苏州市中辰昊科技有限公司 | Flexible transmission device applied to photovoltaic solar silicon plate printing machine |
| CN113029236B (en) * | 2021-03-05 | 2021-11-26 | 苏州市中辰昊科技有限公司 | Flexible transmission device applied to photovoltaic solar silicon plate printing machine |
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| CN100535762C (en) | 2009-09-02 |
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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |