CN1841202A - Exposure worktable and exposure device - Google Patents
Exposure worktable and exposure device Download PDFInfo
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- CN1841202A CN1841202A CN 200610066090 CN200610066090A CN1841202A CN 1841202 A CN1841202 A CN 1841202A CN 200610066090 CN200610066090 CN 200610066090 CN 200610066090 A CN200610066090 A CN 200610066090A CN 1841202 A CN1841202 A CN 1841202A
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- 239000000758 substrate Substances 0.000 claims abstract description 277
- 238000004891 communication Methods 0.000 claims abstract description 45
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 238000001179 sorption measurement Methods 0.000 claims description 126
- 230000007246 mechanism Effects 0.000 claims description 98
- 238000009434 installation Methods 0.000 claims description 21
- 230000007723 transport mechanism Effects 0.000 claims description 21
- 238000013316 zoning Methods 0.000 claims description 21
- 238000010521 absorption reaction Methods 0.000 claims description 13
- 238000012423 maintenance Methods 0.000 abstract description 7
- 239000000976 ink Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- QFUKUPZJJSMEGE-UHFFFAOYSA-N 5-(hydroxymethyl)-1-(3-methylbutyl)pyrrole-2-carbaldehyde Chemical compound CC(C)CCN1C(CO)=CC=C1C=O QFUKUPZJJSMEGE-UHFFFAOYSA-N 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- 238000000059 patterning Methods 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
- 210000001138 tear Anatomy 0.000 description 1
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
To provide an exposure table which can suitably hold by suction even a thin substrate and can hold a substrate even in a state where a substrate peripheral edge is waving, and is superior in maintenance operability for replacement etc of the table, by simple constitution even when a mount surface of the table for the substrate wears and so on due to the use of the table, and an exposure device which makes a series of operations smooth and improves the quality of the substrate. The exposure table 7 has a mount plate 8 for a substrate, a table main body 9 which supports the mount plate, a plurality of suction holes provided in the mount plate, and a communication path which is formed in the table main body and communicates with the suction openings. The suction holes include first suction holes 8a and second suction holes 8b which are formed as holes 8b1 smaller than the first suction holes, the suction holes are also arranged adjacent to one another to form suction hole groups disposed at predetermined positions at designated intervals along at least one of the longitudinal and lateral sides of the peripheral edges of the substrate.
Description
Technical field
The present invention relates to a kind of exposure worktable and exposure device of substrate at when exposure mounting printed circuit board (PCB) etc., particularly can suitably corresponding exposure worktable and exposure device under the thin situation of substrate.
Background technology
Usually, along with popularizing of frivolous and short and small electronic equipment such as mobile phone, personal computer, the substrate of printed base plate etc. becomes extremely thin.And thin substrate because the intensity of periphery is low especially, presents the injured state of general plane mostly when forming pattern.Therefore, in the operation of formation patterns such as substrate surface is exposed, need how stably work hard on the fixing means of the substrate of fixing base periphery.
On the other hand, the exposure device of substrate roughly is divided into: the automatic exposure unit that is exposed continuously in the surface and the back side of substrate; The Manual exposure device that exposes by single face.No matter be any exposure device, all need the substrate that will handle be not shifted when the exposure, indeformable mode is fixed on the exposure desk (exposure worktable), therefore when carrying out exposure operation, adopt the substrate vacuum suction is fixed on method on the exposure desk.
For example, as shown in Figure 7, exposure desk 100 is to the parts of direction of arrow vacuum suction substrate (not shown) with fixing described substrate, keep on the face 102 at the substrate that is fixed on the platform main body 101, be formed with a plurality of vacuum holes 103, in platform main body 101 sides, be provided with vacuum that illustrated vacuum pump never etc. is communicated with described vacuum hole 103 with path 10 4.Because substrate and substrate keep the surface of face 102 to contact, so this exposure desk 100 has been implemented various ways, for example, the division setting regions, corresponding with the size of each substrate etc. with the vacuum hole 103 that is used in vacuum suction.In addition, often remain on the maintenance of clean conditions etc., to avoid soldering protective seam China ink foreign matters such as (solder resist ink) attached to the exposure desk upper surface.
Yet, in exposure desk 100, more than or equal to the setting of the substrate of 1mm, determine the aperture as the vacuum aperture of the main starting point with fixed thickness with structure shown in Figure 7.Therefore, if the substrate attenuation, then when the vacuum suction substrate, absorbed portion is inhaled into, its result, and near the substrate perk periphery of the edge part in vacuum suction hole, on the contrary, and the center in the vacuum suction hole, substrate falls in to the internal direction in vacuum suction hole.And substrate can not remain on most important planarity in the exposure owing to this distortion.
In addition, thin substrate, when when its surperficial middle section is installed soldering protective seam China ink or Copper Foil and other circuit blocks, it is poor to produce surface tension at the surface of substrate and the back side, so the balance at the substrate surface and the back side is destroyed, can dig to any direction.And, opposite with above-mentioned situation, at the periphery of substrate, owing to there not be to be provided with the key element cause the generation of the surface tension difference state of center material (almost near), so surface tension unrestricted (free), the surface tension that has produced on the contrary between substrate center zone and the substrate periphery is poor.Like this, substrate produces wavy nonplanar part in the banded scope of the Rack that is positioned at periphery.
Its result, the planarity of substrate reduces, and become planarity reduce near the reason of resolution reduction etc. of patterning.
In order to address the above problem, in the past for to guarantee that the result has carried out effort: strengthen the vacuum tightness of fixing base, the flatness precision of raising exposure desk side, perhaps pay attention to the maintenance of various exposure devices.And, as shown in Figure 8, such exposure desk had been proposed once, promptly, middle section at and the substrate adsorption plate 120 that adsorb opposed with substrate has adsorbing mechanism 115, around adsorbing mechanism 115, is formed with adsorption hole 112 (patent documentation 1) with constant interval.
Shown in Fig. 8 (a) and (b), adsorbing mechanism 115 comprises: the vacuum leak that is formed by circular silicon rubber prevents lip (lip) 110; Be configured in this vacuum leak and prevent the adsorption plane 111 of the inboard of lip 110; And be arranged on a plurality of adsorption holes 112 on this adsorption plane 111.And the substrate adsorption plate 120 that is provided with this adsorbing mechanism 115 forms as one with base plate 118, and substrate adsorption plate 120 is from the back side and base plate 118 butts, and described base plate 118 has the communication passage 118a when vacuum suction forms the concave portion of concaveconvex shape.In addition, be formed at by O-ring seals 119 sealing base plate 118 a plurality of communication passage 118a around, as area inside, the suction connecting pipe 117 of vacuum draw pump 116 is communicated with communication passage 118a by O-ring seals 119 sealings.
Patent documentation 1:2002-317810 communique (the 0009th, 0010 section, Fig. 5, Fig. 6)
Yet, in the structure of existing exposure desk (below, be called exposure worktable), have following problem.
In existing exposure worktable, for extremely thin, for example thickness substrate smaller or equal to 0.1mm, the vacuum leak that is formed by silicon rubber prevents that lip when vacuum suction, is different from other regional flat states, and produce concavo-convex, unusual trouble.And, in existing exposure worktable, preventing the elastic force of lip by means of the vacuum leak that forms by silicon rubber, this vacuum leak prevents lip and substrate press contacts, thereby becomes the reason that can not successfully break away from the substrate adsorption plate.
In existing exposure worktable; because substrate adsorption plate and base plate are with fixing all-in-one-piece state formation; therefore when the plane precision of substrate adsorption plate changes because of use; for example when producing deterioration such as the adhering to of soldering protective seam China ink, wearing and tearing; in order to recover its plane precision; need to adjust a plurality of parts of exposure worktable, perhaps need to change most of parts of exposure worktable.
In existing exposure worktable; be configured in the size that vacuum leak prevents the adsorption hole of lip inboard and is formed at the adsorption hole of other parts with constant interval; form same size; therefore when being the type of being exposed in the two sides of substrate, might adsorb the soldering protective seam China ink that is coated on the face of being adsorbed etc. from adsorption hole.And, the configuration of set part of adsorption hole that is used to carry out face absorption is also very important, if just be configured in the middle body of substrate adsorption plate or be configured in Si Jiaochu,, can not carry out suitable absorption it is fixed at the high substrate as thin as a wafer of the possibility of substrate periphery perk.
In addition, in having the exposure device of exposure worktable, to put into continuously, positioning operation, exposure operation, until a series of operations of taking out of, but when can not be, then can occur making device temporarily to stop unnecessary operations such as operation with the removal substrate with substrate vacuum suction and remaining on the exposure worktable suitably.
Summary of the invention
The present invention proposes in view of the above problems, its purpose is to provide a kind of exposure worktable and exposure device, even also can carrying out suitable absorption, above-mentioned exposure worktable substrate as thin as a wafer keeps, in addition, even be in the substrate of the state of substrate periphery perk, also can under the situation that keeps plane precision reliably, keep, in addition, can tackle the substrate of a plurality of sizes, even the mounting surface of substrate is because of the use wearing and tearing etc., also can change etc. by simple structure, it is good therefore to maintain operability, above-mentioned exposure device can carry out a series of operation glibly, can improve the quality of substrate.
In order to achieve the above object, the present invention is exposure worktable and the exposure device shown in following.
That is, exposure worktable of the present invention is the exposure worktable that uses when rectangular substrate is exposed, and it comprises: the mounting plate, and it is used for the mounting aforesaid substrate; The worktable main body, it supports this mounting plate; A plurality of adsorption holes, they run through be formed at above-mentioned mounting plate with the opposed position of aforesaid substrate, be used for absorption and keep this substrate; Communication passage, it is formed at above-mentioned worktable main body in the mode that is communicated with in above-mentioned adsorption hole.And, the above-mentioned adsorption hole of this exposure worktable has first adsorption hole and second adsorption hole, above-mentioned first adsorption hole separates predetermined distance with predefined size and is configured, in addition, above-mentioned second adsorption hole forms the aperture group that a plurality of apertures are adjacent to gather, and above-mentioned hole-shaped becomes less than above-mentioned first adsorption hole, and, above-mentioned aperture group is along at least one side of the longitudinal edge and the horizontal edge of aforesaid substrate peripheral region, and arranged spaced is on predefined position in accordance with regulations.In addition, the above-mentioned communication passage of this exposure worktable has: first communication passage that is communicated with above-mentioned first adsorption hole and second communication passage that is communicated with above-mentioned second adsorption hole.
In having the exposure worktable of this structure, for example, when thickness smaller or equal to substrate-placing 0.1mm, as thin as a wafer on the mounting plate time, from first communication passage and second communication passage, by first adsorption hole and second adsorption hole, attract and the vacuum suction substrate along the mounting plate.When this substrate of vacuum suction, at second adsorption hole under the situation of for example horizontal edge of substrate configuration, even the horizontal edge of substrate periphery is heaved, set-up positions as any absorption substrate of the aperture group of the aggregate of aperture because of the projection of heaving the face that leaves the mounting plate, make projection begin face near the mounting plate, finally with smooth state vacuum suction and keep the projection of heaving of substrate from root portion.In addition, second adsorption hole by forming diameter less than first adsorption hole, even carry out vacuum draw with the power identical with first adsorption hole, can not aspirate with the power of the soldering protective seam China ink that can peel off substrate etc. yet.
And, in above-mentioned exposure worktable, above-mentioned second adsorption hole constitutes: under the situation that the longitudinal edge along aforesaid substrate is provided with, form so vertically long aggregate, that is, the aperture of vertical arrangement of above-mentioned aperture group is configured to more than transversely arranged aperture; Under the situation that the horizontal edge along aforesaid substrate is provided with, form so laterally long aggregate, that is, above-mentioned aperture group's transversely arranged aperture is more than the aperture of vertically arranging.
By this structure, exposure worktable, longitudinal edge at the substrate periphery produces under the situation of the protrusion state of heaving, along second adsorption hole of its longitudinal edge configuration owing to be the vertical aperture aggregate of length, therefore adsorb with any of the corresponding vertically long aperture of the set-up positions of the projection of heaving, the height of projection begins to reduce gradually from the root side of projection, finally with smooth state along mounting plate vacuum suction and the projection that keeps all to heave.
In addition, in above-mentioned exposure worktable, above-mentioned mounting plate has corresponding to the size of substrate and will be divided into two dividing region zones in the mounting surface at least, above-mentioned first adsorption hole and above-mentioned second adsorption hole are by each above-mentioned zoning configuration, above-mentioned first communication passage and above-mentioned second communication passage are connected with pump unit by the switch unit that switches above-mentioned communication passage according to each zoning.
Exposure worktable with this structure, when the size of substrate is big, second adsorption hole that forms along either party by substrate periphery as longitudinal edge and horizontal edge at this large-size, carry out vacuum suction and keep substrate, and switch each communication passage, in order to avoid second adsorption hole from other zones and be positioned at from first adsorption hole of the zoning of the outstanding position of substrate and carry out vacuum suction by switch unit.In addition, at substrate size hour, by at the periphery of this small size substrate along second adsorption hole that the either party as longitudinal edge and horizontal edge forms, come vacuum suction and keep substrate, in other zones, do not switch two communication passage communicatively with vacuum pump by switch unit.
And, in above-mentioned exposure worktable, above-mentioned mounting plate and above-mentioned worktable main body are at opposed assigned position, has the installation recess that is used to set the installation site the either party, have the installation protuberance chimeric the opposing party with this installation recess, above-mentioned installation recess and above-mentioned installation protuberance are bonded with each other in the mode that can engage, get loose, and above-mentioned in addition mounting plate and above-mentioned worktable main body have the planar portions of the mutual butt that is provided with respectively on the periphery at least of opposed faces.
The exposure worktable of Gou Chenging like this, for example be arranged on the mounting plate in that protuberance will be installed, recess will be installed be arranged on the worktable main body, and make and protuberance is installed is entrenched in and installs in the recess, under such state, be arranged on the state that each planar portions on mounting plate and the worktable main body is in butt.Therefore in the vacuum suction substrate, the mounting plate is in and the tight state of contact of worktable main body.In addition, under the situation that mounting plate and other mounting plates are changed, because mounting plate and worktable main body just are bonded with each other with the chimeric of recess is installed by protuberance is installed, and therefore as long as the mounting plate is mentioned from the worktable main body, just can unload the mounting plate down simply.
And the exposure device that rectangular substrate is exposed comprises: put into mechanism, its aforesaid substrate is put into this device; Exposure worktable, itself and this put into mechanism's disposed adjacent, and be used for the mounting aforesaid substrate; Exposure mechanism, it is to being positioned in the substrate on this exposure worktable, and irradiation comprises the ultraviolet light of provision wavelengths; Transport mechanism, the above-mentioned aforesaid substrate of putting into mechanism and above-mentioned exposure worktable of its conveyance.And above-mentioned exposure worktable comprises: mounting plate, its mounting aforesaid substrate; The worktable main body, it supports this mounting plate; A plurality of adsorption holes, its run through be formed at above-mentioned mounting plate with the opposed position of aforesaid substrate, be used for absorption and keep this substrate; Communication passage, it is formed at above-mentioned worktable main body in the mode that is communicated with described adsorption hole.In addition, in this exposure worktable, above-mentioned adsorption hole has first adsorption hole and second adsorption hole, above-mentioned first adsorption hole is configured in accordance with regulations at interval with predefined size, and above-mentioned second adsorption hole forms the aperture group that a plurality of apertures are adjacent to gather, and above-mentioned aperture group forms less than above-mentioned first adsorption hole, and, above-mentioned aperture group is along at least one side of the longitudinal edge and the horizontal edge of aforesaid substrate periphery, and arranged spaced is on predefined position in accordance with regulations.In addition, in this exposure worktable, above-mentioned communication passage has first communication passage that is communicated with above-mentioned first adsorption hole and second communication passage that is communicated with above-mentioned second adsorption hole.
Exposure device with said structure, at first, when substrate was put into mechanism, substrate was stopped behind assigned position by conveyance, was equipped with first detent mechanism if having, and then carried out pre-determined bit.Then, put into the substrate of putting into mechanism by transport mechanism conveyances such as conveying device to exposure worktable and mounting on the mounting plate.Afterwards, be positioned in the substrate on the mounting plate of exposure worktable, by first adsorption hole and second adsorption hole by vacuum suction and remain on the mounting plate.Under this situation about keeping by vacuum suction, because the aperture group who second adsorption hole is formed aperture is adjacent to gather, even therefore for example the substrate periphery produces the state of heaving, by beginning to adsorb successively by the root side of heaving the projection of state from conduct as the aperture of second adsorption hole, even periphery is in the substrate of the state of heaving, also can be along the mounting plate with smooth state vacuum suction and maintenance.Exposure device, when substrate remains on the exposure worktable, carry out and mask between the adjustment operation, comprise the ultraviolet light of provision wavelengths by exposure mechanism from light source irradiation then, to carry out exposure operation.
Exposure worktable of the present invention and exposure device have excellent results as follows.
(1) even the periphery of thin substrate is the state of heaving, exposure worktable also can be by second adsorption hole with smooth state the aforesaid substrate vacuum suction and remain on the mounting plate.And,, therefore can not interrupt a series of operation action owing to can keep substrate reliably by the vacuum suction substrate.Thereby exposure worktable can be kept the adjustment operation of mask and substrate and the precision of exposure operation, can move glibly, and can improve the quality of the substrate that has exposed significantly.
(2) even under the state that the plane precision of the periphery of substrate changes easily, exposure worktable is by vertical long and laterally enterprising vacuum adsorbed at real estate than the arbitrary aperture among the aperture group of long aperture aggregate with the conduct of second adsorption hole, can be with the projection of substrate that leaves mounting surface from the nearly mounting surface of root layback, thus can carry out vacuum suction reliably and keep.
(3) exposure worktable is corresponding to the size of substrate vacuum suction and remain on the substrate that is positioned on the mounting plate suitably.
(4) when situations such as the mounting plate that is used for the mounting substrate weares and teares because of use or made dirty took place, exposure worktable can maintain or change by simply unload the mounting plate from the worktable main body simple in structurely.Thereby, can carry out the positioning operation and the exposure operation of substrate all the time accurately.
(5) exposure device can keep the bearing accuracy and the exposure accuracy of substrate, and can carry out glibly continuously from putting into positioning operation, exposure operation, a series of operations of taking out of.And, even substrate as thin as a wafer can keep the bearing accuracy and the exposure accuracy of substrate too, and can carry out a series of operations continuously glibly.Therefore, exposure device can improve the quality of substrate significantly.In addition, in exposure device, even thickness smaller or equal to 0.3mm or smaller or equal to the thin substrate of 0.1mm, also can high precision and carry out a series of operation glibly, and help improving productive capacity.
Description of drawings
Fig. 1 is the side view that schematically shows the integral body of exposure device of the present invention.
Fig. 2 (a) and (b) are the vertical view and the local amplification plan view of exposure worktable of the present invention.
Fig. 3 is the cut-open view that schematically shows the relation of the mounting plate of exposure worktable of the present invention and worktable main body.
Fig. 4 is formed at first adsorption hole on the mounting plate of exposure worktable of the present invention and the cut-open view of second adsorption hole for expression.
Fig. 5 (a) to (d) is the synoptic diagram of the state of the absorption of second adsorption hole in the mounting plate that schematically shows exposure worktable of the present invention substrate.
Fig. 6 (a) and (b) are the synoptic diagram that schematically shows the state of the mounting plate of changing exposure worktable of the present invention.
Fig. 7 is the cut-open view that schematically shows existing exposure worktable.
Fig. 8 (a) and (b) are the cut-open view of the major part of the existing exposure worktable of expression, and vertical view.
Label declaration
1: exposure device; 2: put into mechanism; 2a: put into mouth; 2b: conveyance roller; 2c: pre-determined bit mechanism; 3: face exposure mechanism; 3a: light source; 3b: optical system; 3c: mask maintaining part; 4: switching mechanism; 4a: roller; Put into mechanism at 5: the second; 6: back-exposure mechanism; 6a: light source; 6b: optical system; 6c: mask maintaining part; 7: exposure worktable; 8: the mounting plate; 8a: first adsorption hole; 8b: second adsorption hole; 8b
1: aperture; 8c: protuberance is installed; 8d: opposed faces (planar portions); 9: the worktable main body; 9a: first communication passage; 9b: second communication passage; 9c: recess is installed; 9d: carrying plane (planar portions); 9e: communication passage; 9f: switch unit; 9g: vacuum pump (pump unit); 10: adjusting mechanism; 11: elevating mechanism; 21: transport mechanism; 22: transport mechanism; 23: transport mechanism; 24: transport mechanism; M: mask; W: substrate; Wb: the back side; Wa: surface.
Has embodiment
Below, with reference to accompanying drawing, the preferred forms that is used to implement exposure worktable of the present invention and exposure device is described.In addition, here, exposure device is that an example describes with the double-sided exposure device that is exposed in the surface and the back side of substrate, but can certainly be the exposure device that the single face to substrate exposes.Fig. 1 is for schematically showing the synoptic diagram of the integral body of exposure device from the side, and Fig. 2 is the vertical view of exposure worktable.
As shown in Figure 1, exposure device 1 device for being used for being exposed in the surface and the back side of substrate W, it comprises: put into mechanism 2 to what substrate W carried out pre-determined bit; Face exposure mechanism 3, itself and this put into mechanism 2 be adjacent to the configuration, be used for the surperficial Wa of substrate W is exposed; Switching mechanism 4, itself and this face exposure mechanism 3 is adjacent to configuration, is used to make surface and the back side upset of substrate W; Put into mechanism 5, itself and this switching mechanism 4 is adjacent to configuration, and pre-determined bit is carried out at the back side of substrate W; Back-exposure mechanism 6, itself and this put into mechanism 5 be adjacent to the configuration, be used for the back side Wb of substrate W is exposed.In addition, exposure device 1 is being put between mechanism 2 and the face exposure mechanism 3, between face exposure mechanism 3 and the switching mechanism 4 and put between mechanism 5 and the back-exposure mechanism 6, is being had the transport mechanism 21,22,23,24 that is used for conveyance substrate W.
Putting into mechanism 2 is the mechanisms that are used for substrate W is put into device.According to the structure of putting into mechanism 2, what have has a 2c of pre-determined bit mechanism that substrate W is carried out pre-determined bit.This is put into mechanism 2 and comprises: mouthful 2a that puts into that puts into substrate W; Conveyance roller 2b, its mounting from this put into substrate W that mouthful 2a puts into and with its conveyance to assigned position; The 2c of pre-determined bit mechanism, its at least two end faces to the substrate W on the above-mentioned conveyance roller 2b are pushed, thereby with substrate W pre-determined bit on predefined position.In addition, the 2c of pre-determined bit mechanism constitutes: between the turning axle (not shown) of (front and back position along the throughput direction of substrate W of substrate W) and conveyance roller 2b between the conveyance roller 2b (substrate W along with the position, the left and right sides of the throughput direction quadrature of substrate W), be provided with the end face that can directly push substrate W with freely haunting by pad, keep this main body that presses pin to move in orbit towards substrate W.Putting into mechanism 2, finishing the substrate W of pre-determined bit, arriving face exposure mechanism 3 by being configured in transport mechanisms such as conveying device 21 conveyances of putting between mechanism 2 and the face exposure mechanism 3.
The 3 mounting substrate W of face exposure mechanism and to its carry out and mask M between positioning operation, and carry out the exposure operation of the surperficial Wa of substrate W.This face exposure mechanism 3 mainly comprises with inferior parts: the exposure worktable 7 that keeps substrate W; Mask maintaining part 3c, it is used to keep being configured in the mask M of these exposure worktable 7 tops; Light source 3a, it comprises ultraviolet light by optical system 3b such as catoptron irradiation.In addition, face exposure mechanism 3 can be arbitrary structure of following structure, that is: when the positioning operation that carries out between substrate W and the mask M, exposure worktable 7 sides are adjusted mobile structure on XY θ direction; And when the positioning operation that carries out between substrate W and the mask M, mask maintaining part 3 sides are adjusted mobile structure on XY θ direction, here, are to make exposure worktable 7 adjust the structure that moves.In addition, at the optical system 3b that comprises the ultraviolet light time of provision wavelengths from light source 3a irradiation, as long as can be, then having or not of configuration, quantity or the fly's-eye lens (fly eye lens) of its reflection scape etc. be not particularly limited substrate W irradiation light as directional light.
As shown in Figures 2 and 3, exposure worktable 7 has as lower member: the mounting plate 8 of mounting workpiece W; Support the worktable main body 9 of this mounting plate 8; Adjust the adjusting mechanism 10 that moves the positioning operation that carries out substrate W by making this worktable main body 9.
When relatively thin and one avris surpassed certain certain-length as substrate W, even produce the perk state, by the flexibility of substrate, concavo-convex being absorbed that forms because of perk became not obvious.Therefore, here, in zoning S1, S2, the second adsorption hole 8b be configured in as the minor face of substrate W, with the horizontal edge side of conveyance direction quadrature.And, on one side substrate W is shorter than under the situation of certain certain-length at it, be subjected to the influence of middle section, can keep flatness under the situation mostly.Therefore, in the S3 of zoning, dispose the second adsorption hole 8b in longitudinal edge side as the long limit of substrate W.
As shown in Figure 2, the second adsorption hole 8b is configured as the aperture group, and described aperture group makes a plurality of aperture 8b that form less than the first adsorption hole 8a
1Adjacent and the aggregate that forms.This second adsorption hole 8b forms such aperture group under the situation that the horizontal edge along substrate W forms, make aperture 8b that is:
1Transversely arranged aperture 8b along horizontal edge
1Quantity than the aperture 8b that vertically arranges
1Quantity many, be laterally long aggregate.And the second adsorption hole 8b forms such aperture group under the situation that the longitudinal edge along substrate W forms, make aperture 8b that is:
1 Aperture 8b along vertical arrangement of longitudinal edge
1Quantity than transversely arranged aperture 8b
1Quantity many, be vertically long aggregate.Like this, the second adsorption hole 8b is by forming laterally long or vertical aperture group of long aggregate, even the longitudinal edge of the peripheral region of substrate W or horizontal edge become the perk state and produce the projection that separates with the mounting surface of mounting plate 8, also can be from root (full front of a Chinese gown open country) side of the set-up positions that becomes its projection, vacuum suction substrate W.
In addition, as shown in Figure 4, the first adsorption hole 8a has conical surface 8T at the opening portion of mounting plate 8, and the second adsorption hole 8b is at each aperture 8b
1In, at the opening portion of mounting plate 8, have conical surface 8t respectively.Each conical surface 8T, 8t for when the vacuum suction substrate W not the abutment portion of wounded substrate W form.In addition,, compare, can increase vacuum adsorption force with the situation that does not have the conical surface by forming each conical surface 8T, 8t.Each conical surface 8T, 8t form the angle of inclination less than 60 degree, are preferably formed in the scope of 50～30 degree.Described conical surface 8T～8t also can form plane, perhaps forms the curved surface shape.In addition, as an example, here, aperture 8b
1Form 1mm smaller or equal to Φ.
As shown in Figure 3, mounting plate 8 with worktable main body 9 opposed opposed faces 8d, form the plane here, so as with the carrying plane 9d butt of worktable main body 9 described later.The opposed faces 8d of this mounting plate 8, all faces except protuberance 8c is installed all form the plane, but as long as install at least protuberance 8c outer edge side form the plane on every side.
In addition, the installation protuberance 8c of mounting plate 8 forms with the installation recess 9c of worktable main body 9 described later chimeric.In addition, the installation protuberance 8c of mounting plate 8 is formed with 4 places in four jiaos position near mounting plate 8.And, protuberance 8c is installed comprises: the base portion of column; The conical surface, tapered plane or curved surface constitute along with close top by the top at base portion.
As shown in Figure 3, worktable main body 9 comprises: the first communication passage 9a and the second communication passage 9b, and they are formed at respectively on the position corresponding with the first adsorption hole 8a of mounting plate 8 and the second adsorption hole 8b; Recess 9c is installed, is formed on the position corresponding with the installation protuberance 8c of mounting plate 8; Carrying plane 9d is formed on the position with the opposed faces 8d butt of mounting plate 8.
The first communication passage 9a can be corresponding with the first adsorption hole 8a and structure that form singly in addition, also can be in each zoning S1, S2, S3, and the structure of formation corresponding with the first adsorption hole 8a in the certain limit.And the second communication passage 9b can be the aperture 8b with the second adsorption hole 8b
1The aperture group corresponding and structure that form singly also can be in addition in each zoning S1, S2, S3, and the structure of formation corresponding in the mode that is communicated with the second adsorption hole 8b in the certain limit.And, the first communication passage 9a and the second communication passage 9b by other formation communication passage 9e and be used to switch the switch unit 9f of each passage, 9g is connected with vacuum pump (pump unit).
In addition, switch unit 9f switches each communication passage 9e and makes atmosphere leak into the device of passage outside.This switch unit 9f has transfer valve and leak valve (leak valve) etc., as long as this switch unit can be used in the vacuum draw that produces by the action by vacuum pump 9g with the situation of substrate W vacuum suction on mounting plate 8, then there is no particular limitation to its structure.
At this, the effect of exposure worktable 7 is described.
As shown in Figure 1, when carrying out pre-determined bit, also pass through transport mechanism 21 conveyances to the mounting plate 8 of exposure worktable 7 by putting into 2 couples of substrate W of mechanism, as shown in Figure 3, exposure worktable 7 makes vacuum pump 9g work by not shown sensor etc., thus, carry out vacuum suction by the first adsorption hole 8a among the predefined zoning S1 and the second adsorption hole 8b, thereby substrate W is remained on the mounting plate 8.At this, upward describe for example to being set in zoning S1.Therefore, the second communication passage 9b of zoning S2, S3 is in the state of cut-out by switch unit 9f.
Substrate W by the situation of second adsorption hole 8b absorption under, for example, when existing with mounting plate 8 separated portions in the peripheral side perk of substrate W (for example, the state of Fig. 5 (a)), substrate W is adsorbed as shown in Figure 5.In addition, becoming when heaving state at the peripheral side of substrate W, is to form along being in this longitudinal edge of heaving state or horizontal edge mostly under the situation.
Shown in Fig. 5 (a) and (b), at first, adsorb action by the first adsorption hole 8a and the second adsorption hole 8b, the major part of substrate W by vacuum suction on mounting plate 8.And, shown in Fig. 5 (b),, produce when being in the projection of the state of heaving the aperture 8b of the second adsorption hole 8b when periphery at substrate W
1Attract and absorption be near the position of cardinal extremity face, as the position A1 that erects part of the projection of substrate W.
Like this, shown in Fig. 5 (b) because the position A1 of substrate W is adsorbed, therefore with the set-up positions A1 position adjacent A2 of substrate W near aperture 8b
1Thereby, can further adsorb the position A2 of substrate W.Next, shown in Fig. 5 (c) because the position A2 of substrate W is by vacuum suction, thus the projection of substrate W from mounting surface position A3 farthest near aperture 8b
1Therefore, shown in Fig. 5 (d), the position A3 of final substrate W is also by aperture 8b
1Vacuum suction, thus substrate W remains on the mounting plate 8 with the absorption of plane precision good state.
In addition, because aperture 8b
1Be the vertically long or horizontal aperture group than long aggregate of conduct along formed horizontal edge or longitudinal edge formation, therefore the state of heaving that produces corresponding to the peripheral side of substrate W, can little by little carry out vacuum suction from the set-up positions of projection, very convenient.
Like this, when on the mounting plate 8 of substrate W vacuum suction at exposure worktable 7, substrate W undertaken by adjusting mechanism 10 and mask M between positioning operation.
Next, return Fig. 1, other structures of exposure device 1 are described.
Adjusting mechanism 10 has the absorption of making and keeps the mounting plate 8 of substrate W and worktable main body 9 to the XY on plane θ direction (any one rectilinear direction on the plane, with the rectilinear direction of this rectilinear direction quadrature, around the sense of rotation of Z-axis) mobile X moving part 10a, Y moving part 10b, the θ moving part 10c of adjustment.And exposure worktable 7 has the lifting unit 11 that makes mounting plate 8 rise and move to mask M side at least below adjusting mechanism 10.As long as this lifting unit 11 can make substrate W rise with near or butt mask M and can make substrate W get back to original position, then unqualified to its structure.
In addition, adjusting mechanism 10 is taken the position of the adjustment mark (not shown) between substrate W and the mask M by not shown camera system, and the result who differs distance that calculates transmitted by signal, by the signal of this transmission, substrate W is adjusted move to suitable position.
And face exposure mechanism 3 is provided with the mask maintaining part 3c that keeps mask M directly over the mounting plate 8 of mounting substrate W.And face exposure mechanism 3 has: comprise the light source 3a of the ultraviolet light of provision wavelengths to mask M and substrate W irradiation, and make the optical system 3b that becomes directional light from the light of this light source 3a.
Second puts into mechanism 5 has identical structure with the mechanism 2 that puts into that has illustrated, second puts into mechanism 5 has: conveyance roller 5b, and substrate W that its mounting is put into and conveyance are to assigned position; The 5c of pre-determined bit mechanism, it pushes at least two end faces of the substrate W on this conveyance roller 5b, and substrate W pre-determined bit to predefined position.By this second substrate W that puts into the scheduled position of mechanism 5, by transport mechanism 23 conveyances to back-exposure mechanism 6.
As shown in Figure 1, back-exposure mechanism 6 carries out the positioning operation of the back side Wb of substrate W, and, the back side Wb of substrate W is carried out exposure operation.This back-exposure mechanism 6 mainly has with lower member etc.: the exposure worktable 7 that keeps substrate W; Mask maintaining part 6c, its maintenance is arranged on the mask M of these exposure worktable 7 tops; Light source 6a, it comprises ultraviolet light by optical system 6b such as catoptron irradiation.
In addition, the exposure worktable 7 of back-exposure mechanism 6 has identical structure with the exposure worktable that has illustrated, therefore will omit its explanation here.Back-exposure mechanism 6 can have following arbitrary structures, that is: with substrate W vacuum suction on mounting plate 8 and carry out and mask M between positioning operation the time, exposure worktable 7 sides are adjusted mobile on XY θ direction; With substrate W vacuum suction on mounting plate 8 and carry out and mask M between positioning operation the time, mask maintaining part 6c side is adjusted mobile on XY θ direction.But here be to make exposure worktable 7 adjust mobile structure.In addition, at the optical system 6b when light source 6a shines, as long as can be to the light of substrate W irradiation, then to using fly's-eye lens etc., the particularly configuration of its catoptron, quantity, structure etc. not to limit as directional light.Finish the substrate W of the exposure operation of back side Wb by this back-exposure mechanism 6, taken out of by transport mechanism 24.
At this, transport mechanism 24 has conveying device or conveyance roller, is used for substrate W is passed out to the device outside, does not limit its structure is special.
Next, use the exposure method of the exposure device 1 explanation substrate W that had illustrated.
As shown in Figure 1, at first, exposure device 1, from putting into mouthful 2a to putting into mechanism 2 when putting into substrate W, conveyance roller 2b rotation, and move to assigned position with the state of mounting substrate W.Then, exposure device 1 carries out the pre-determined bit operation, so that substrate W is positioned predefined position by push the end face of the substrate W that moves on the assigned position with the 2c of pre-determined bit mechanism.Finish the post-job substrate W of pre-determined bit by transport mechanism 21 by conveyance to the exposure worktable 7 of face exposure mechanism 3.
When on the mounting plate 8 of substrate W vacuum suction at exposure worktable 7, rising by exposure worktable 7 is moved, substrate W on the mounting plate 8 and the approaching or butt of mask M that remains on the mask maintaining part 3c, and then substrate W and mask M are in by the state of not shown vacuum suction mechanism vacuum suction.Then, take the telltale mark (not shown) of substrate W and mask M, and adjust mobile distance, suitably carry out the positioning operation of substrate W and mask M according to captured image calculation substrate W by not shown camera system.In addition, at this, because that substrate W adjusts is mobile, so exposure device 1 removes the vacuum tight contact condition of substrate W and mask M, and exposure worktable 7 is descended, and it is mobile by adjusting mechanism 10 substrate W to be adjusted on XY θ direction.Then, make substrate W and mask M be in the vacuum tight contact condition once more, and in permissible range, confirm not shown telltale mark, comprise ultraviolet light by light source 3a irradiation afterwards, thereby finish the exposure operation of the surperficial Wa of substrate W by camera head.
The substrate W that surface Wa is exposed arrives switching mechanism 4 by transport mechanism 22 conveyances.In addition, as shown in Figure 1, give switching mechanism 4 with substrate W here by the conveyance roller.The switching mechanism 4 of having accepted substrate W makes surface and the back side upset of substrate W, sends and gives second by conveying roller 4a with substrate W then and put into mechanism 5.
Received second of substrate W from switching mechanism 4 and put into mechanism 5, made conveyance roller 5b rotation and move to assigned position with the state of mounting substrate W.Then, exposure device 1 is by the 5c of pre-determined bit mechanism, pushes the end face that moves to the substrate W behind the assigned position, carries out the pre-determined bit operation, so that substrate W is positioned predefined position.The substrate W that has finished the pre-determined bit operation gives the exposure worktable 7 of back-exposure mechanism 6 by transport mechanism 23 conveyances.In addition, when giving transport mechanism 23, also can be following structure, promptly transport mechanism 23 is temporary transient by maintenance of mounting roller and conveyance substrate W.
As shown in Figure 1, conveyance to the substrate W of back-exposure mechanism 6 with following state mounting: surperficial Wa that has exposed and the mounting plate of exposure worktable 78 opposed states, the i.e. back side Wb of substrate W and the opposed state of mask M.And, when substrate W is positioned on the mounting plate 8, as shown in Figure 3, carry out vacuum draw action by vacuum pump 9g, substrate W by the first adsorption hole 8a and the second adsorption hole 8b by vacuum suction, thereby remain on the mounting plate 8 with smooth state.At this moment, heave state even produce in the horizontal edge side at the periphery of substrate W, as Fig. 5 has illustrated, also can be along mounting plate 8 with smooth state vacuum suction and keep substrate W.Then, carry out the positioning operation between back side Wb and the mask M, carry out exposure operation thereafter.After this, finish the substrate W of the exposure operation of two face Wa, Wb, take out of the auto levelizer outside by transport mechanism 24.In addition, transport mechanism 24 also can be following structure, that is, to mounting roller conveyance substrate W, make the conveyance roller that substrate W is taken out of the auto levelizer outside from exposure worktable 7.
In addition, under for example corresponding situation of substrate W size with zoning S2, in exposure worktable 7,7, closing the communication passage 9e that is configured in the second adsorption hole 8b among zoning S1, the S3 by switch unit 9f and closing under the state of the communication passage 9e that is configured in the first adsorption hole 8a among the S1 of zoning, making vacuum pump 9g work.Equally, under the size of the substrate W situation corresponding, under the state of the first adsorption hole 8a that closes zoning S1, S2 by switch unit 9f and the second adsorption hole 8b, make vacuum pump 9g work with zoning S3.
As previously discussed, even under the extremely thin situation of substrate W, also can be by the first adsorption hole 8a and the second adsorption hole 8b of mounting plate 8, with smooth state vacuum suction and keep substrate W, therefore when positioning operation and exposure operation, can carry out high-precision operation.Thereby,, can improve the quality of the substrate W after the exposure significantly even under the extremely thin situation of substrate W, also can suitably tackle.
Surface at the mounting plate 8 of mounting substrate W; made dirty because of being attached with soldering protective seam China ink,, perhaps occur needing to change under the situation of miscellaneous part perhaps because of using wearing and tearing to lose flatness; by changing the operation of mounting plate 8, guarantee best positioning operation, exposure operation.
As shown in Figure 6, under the situation that will unload mounting plate 8, at first, the action of vacuum pump 9g and the action of other mechanisms are stopped.Then, the operator mentions mounting plate 8 from worktable main body 9, thereby mounting plate 8 is unloaded from worktable main body 9.Mounting plate 8 has the simple structure that just engages by following two states, and this two states is: the state among the installation recess 9c that protuberance 8c is entrenched in worktable main body 9 is installed; The state of the carrying plane 9d butt of the opposed faces 8d of this mounting plate 8 and worktable 9.Therefore, the operator just can carry out field-strip simply by mentioning mounting plate 8 upward.In addition, when vacuum pump 9g worked, mounting plate 8 was attracted on the worktable main body 9, thereby mounting plate 8 is in the state that is fixed on worktable main body 9 sides all the time.
Therefore, the mounting plate 8 that is removed is owing to cleaning its surface etc., and is therefore very convenient under following situation: as need not worry other structures, just clean, remove the situation attached to maintenances such as the substrate fragments of breaking smallly on the mounting plate 8.And exposure worktable 7 is under the situation of changing mounting plate 8, and is main by dismantling like that of having illustrated, and other mounting plates 8 are installed are got final product, and can change operation simply, very convenient.
In addition, though it is not shown, in exposure worktable, also the installation recess can be set on the mounting plate, and the installation protuberance is set in the worktable main body, perhaps also can on the mounting plate, be provided with and protuberance is installed and recess is installed, and the installation recess is set and protuberance is installed in the worktable main body accordingly therewith.
In addition, though not shown, in exposure worktable, also second adsorption hole can be configured in the both sides of longitudinal edge and horizontal edge, perhaps also can be configured to adjacent continuously band shape to the aperture of second adsorption hole.In addition, in exposure worktable, though not shown, the zoning can be two division or four partition structures.
Claims (5)
1. exposure worktable, it uses when rectangular substrate is exposed, it is characterized in that,
Comprise: the mounting plate, it is used for the mounting aforesaid substrate; The worktable main body, it supports this mounting plate; A plurality of adsorption holes, they run through be formed at above-mentioned mounting plate with the opposed position of aforesaid substrate, be used for absorption and keep this substrate; Communication passage, it is formed at above-mentioned worktable main body in the mode that is communicated with above-mentioned adsorption hole,
Above-mentioned adsorption hole has first adsorption hole and second adsorption hole,
Above-mentioned first adsorption hole separates predetermined distance with predefined size and is configured,
Above-mentioned second adsorption hole forms the aperture group that a plurality of apertures are adjacent to gather, and above-mentioned hole-shaped becomes less than above-mentioned first adsorption hole, and above-mentioned aperture group is along at least one side of the longitudinal edge and the horizontal edge of aforesaid substrate peripheral region, arranged spaced is on predefined position in accordance with regulations
Above-mentioned communication passage has: first communication passage that is communicated with above-mentioned first adsorption hole and second communication passage that is communicated with above-mentioned second adsorption hole.
2. exposure worktable according to claim 1 is characterized in that,
Under the situation that the longitudinal edge along aforesaid substrate is provided with, above-mentioned second adsorption hole forms so vertically long aggregate, that is, the aperture of vertical arrangement of above-mentioned aperture group is configured to more than transversely arranged aperture; Under the situation that the horizontal edge along aforesaid substrate is provided with, above-mentioned second adsorption hole forms so laterally long aggregate, that is, above-mentioned aperture group's transversely arranged aperture is configured to more than the aperture of vertical arrangement.
3. exposure worktable according to claim 1 and 2 is characterized in that,
Above-mentioned mounting plate has corresponding to the size of aforesaid substrate and will be divided into two dividing region zones in the mounting surface at least, and above-mentioned first adsorption hole and above-mentioned second adsorption hole dispose by above-mentioned zoning,
Above-mentioned first communication passage and above-mentioned second communication passage are connected with pump unit by the switch unit that switches this communication passage by above-mentioned zoning.
4. according to each described exposure worktable of claim 1 to 3, it is characterized in that,
Above-mentioned mounting plate and above-mentioned worktable main body, assigned position at opposed, has the installation recess that is used to set the installation site the either party, have the installation protuberance chimeric the opposing party with this installation recess, above-mentioned installation recess and above-mentioned installation protuberance are bonded with each other in the mode that can engage, get loose, and above-mentioned mounting plate and above-mentioned worktable main body have the planar portions of the mutual butt that the peripheral region at least in opposed faces is provided with respectively.
5. exposure device, it exposes to rectangular substrate, it is characterized in that,
Comprise: put into mechanism, it puts into said apparatus with aforesaid substrate; Exposure worktable, itself and this put into mechanism and be adjacent to configuration, and mounting aforesaid substrate; Exposure mechanism, it is to being positioned in the aforesaid substrate on this exposure worktable, and irradiation comprises the ultraviolet light of provision wavelengths; Transport mechanism, the above-mentioned aforesaid substrate of putting into mechanism and above-mentioned exposure worktable of its conveyance,
Above-mentioned exposure worktable comprises: mounting plate, its mounting aforesaid substrate; The worktable main body, it supports this mounting plate; A plurality of adsorption holes, they run through be formed at above-mentioned mounting plate with the opposed position of aforesaid substrate, be used for absorption and keep aforesaid substrate; Communication passage, it is formed at above-mentioned worktable main body in the mode that is communicated with above-mentioned adsorption hole,
Above-mentioned adsorption hole has first adsorption hole and second adsorption hole,
Above-mentioned first adsorption hole is configured in accordance with regulations at interval with predefined size,
Above-mentioned second adsorption hole forms the aperture group that a plurality of apertures are adjacent to gather, and above-mentioned hole-shaped becomes less than above-mentioned first adsorption hole, and above-mentioned aperture group is along at least one side of the longitudinal edge and the horizontal edge of the peripheral region of aforesaid substrate, arranged spaced is on predefined position in accordance with regulations
Above-mentioned communication passage has: first communication passage that is communicated with above-mentioned first adsorption hole and second communication passage that is communicated with above-mentioned second adsorption hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005090361 | 2005-03-28 | ||
| JP2005090361A JP2006276084A (en) | 2005-03-28 | 2005-03-28 | Exposure table and exposure device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1841202A true CN1841202A (en) | 2006-10-04 |
| CN100487585C CN100487585C (en) | 2009-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610066090XA Expired - Fee Related CN100487585C (en) | 2005-03-28 | 2006-03-28 | Exposure worktable and exposure device |
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| Country | Link |
|---|---|
| JP (1) | JP2006276084A (en) |
| CN (1) | CN100487585C (en) |
| TW (1) | TWI414895B (en) |
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| CN101916049A (en) * | 2010-08-02 | 2010-12-15 | 友达光电股份有限公司 | Workbench |
| CN101315523B (en) * | 2007-05-29 | 2012-01-11 | 株式会社Orc制作所 | Ploting device |
| CN101470357B (en) * | 2007-12-27 | 2013-03-13 | 株式会社Orc制作所 | Exposure apparatus |
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- 2006-03-28 CN CNB200610066090XA patent/CN100487585C/en not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI414895B (en) | 2013-11-11 |
| TW200641555A (en) | 2006-12-01 |
| JP2006276084A (en) | 2006-10-12 |
| CN100487585C (en) | 2009-05-13 |
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