CN214542198U - Chip with packaging structure - Google Patents
Chip with packaging structure Download PDFInfo
- Publication number
- CN214542198U CN214542198U CN202120837018.2U CN202120837018U CN214542198U CN 214542198 U CN214542198 U CN 214542198U CN 202120837018 U CN202120837018 U CN 202120837018U CN 214542198 U CN214542198 U CN 214542198U
- Authority
- CN
- China
- Prior art keywords
- chip
- chip body
- encapsulation
- aluminum alloy
- heat dissipation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 25
- 239000000872 buffer Substances 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims description 34
- 230000005855 radiation Effects 0.000 claims description 16
- 238000010030 laminating Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 abstract description 22
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a chip with a packaging structure, which comprises a packaging chip body, wherein an aluminum alloy heat dissipation structure is assembled on the packaging chip body, the aluminum alloy heat dissipation structure comprises an internal heat conduction structure arranged inside the packaging chip body, the outer wall of the packaging chip body is fixedly assembled with an external heat dissipation structure, the end parts at the two sides of the internal heat conduction structure are laminated with the external heat dissipation structure, and the upper surface of the packaging chip body is uniformly and fixedly assembled with a collision protection upper cover; the scheme adopts the aluminum alloy heat dissipation structure to dissipate heat of the packaged chip body, and utilizes the internal heat conduction structure to lead out the internal heat of the packaged chip body and transmit the heat to the external heat dissipation structure for heat dissipation, so that the heat dissipation efficiency is improved; the scheme adopts the collision protection upper cover to shelter from above the device, deflects the device impact and disperses and buffer protection, protects inside chip main part and avoids the collision influence.
Description
Technical Field
The utility model relates to an packaging structure technical field specifically is a chip with packaging structure.
Background
Packaging is the process of assembling an integrated circuit into a final chip product, in short, the produced integrated circuit die is placed on a substrate with a bearing function, pins are led out, and then the integrated circuit die is fixed and packaged into a whole.
However, the conventional packaged chips mostly adopt a multi-chip integration mode, the distance between the chips is small, mutual influence of heat is easily caused, heat accumulation cannot be timely dissipated, and the service life of the chips is influenced; meanwhile, the chip is easily affected by collision in the transportation or installation process of the chip, so that the problems of insufficient soldering, point dropping and the like in the chip are caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip with packaging structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a chip with packaging structure, includes the encapsulation chip body, be equipped with aluminum alloy heat radiation structure on the encapsulation chip body, aluminum alloy heat radiation structure is including locating the inside heat conduction structure of encapsulation chip body, encapsulation chip body outer wall is fixed to be equipped with outside heat radiation structure, inside heat conduction structure both sides tip and the laminating of outside heat radiation structure, even fixed the being equipped with collision protection upper cover of encapsulation chip body upper surface.
Preferably, the internal heat conducting structure comprises a strip-shaped groove which is uniformly and transversely arranged in the packaging chip body, and a heat conducting rod penetrates through the strip-shaped groove.
Preferably, outside heat radiation structure is including seting up in the joint groove of lateral wall about the encapsulation chip body, the joint inslot is fixed and is equipped with aluminum alloy heat dissipation plate, the even integrated into one piece of aluminum alloy heat dissipation plate lateral wall has aluminum alloy radiating fin.
Preferably, the collision protection upper cover includes the recess of encapsulation chip body upper surface, through the detachable fixed apron that is equipped with of bolt in the recess, the upper surface of apron evenly fixed mounting has elastic buffer.
Preferably, the elastic buffer part comprises a telescopic rod fixedly assembled on the upper surface of the cover plate, a hemispherical circular cap is fixedly assembled at the upper end of the telescopic rod, and a spring is fixedly connected between the upper surface of the telescopic rod base and the bottom surface of the hemispherical circular cap.
Preferably, the encapsulation chip body includes the encapsulation base, the rectangular channel has been seted up to the upper surface of encapsulation base, the rectangular channel inner chamber is filled and is fixed with insulating base, the inside top embedding of insulating base is equipped with the chip main part, the encapsulation base bottom surface corresponds the chip main part embedding and is equipped with the pin joint chair, the pin joint chair with correspond fixedly connected with pin between the chip main part.
Compared with the prior art, this scheme has designed a chip with packaging structure, has following beneficial effect:
(1) the scheme adopts aluminum alloy heat radiation structure to dispel the heat to the encapsulation chip body, utilizes inside heat conduction structure to derive the inside heat of encapsulation chip body, transmits to outside heat radiation structure department and dispels the heat, improves the radiating efficiency.
(2) The scheme adopts the collision protection upper cover to shelter from above the device, deflects the device impact and disperses and buffer protection, protects inside chip main part and avoids the collision influence.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the middle elastic buffer of the present invention.
In the figure: the packaging structure comprises a packaging chip body 1, a packaging base 11, a rectangular groove 12, an insulating base 13, a chip main body 14, a pin joint seat 15, pins 16, an aluminum alloy heat dissipation structure 2, an internal heat conduction structure 21, a strip-shaped groove 211, a heat conduction rod 212, an external heat dissipation structure 22, a clamping groove 221, an aluminum alloy heat dissipation plate 222, an aluminum alloy heat dissipation fin 223, an upper collision protection cover 3, a groove 31, a cover plate 32, an elastic buffer 33, a telescopic rod 331, a hemispherical circular cap 332 and a spring 333.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 and fig. 2, the present invention provides a technical solution: the utility model provides a chip with packaging structure, includes encapsulation chip body 1, is equipped with aluminum alloy heat radiation structure 2 on the encapsulation chip body 1, and aluminum alloy heat radiation structure 2 is including locating 1 inside heat conduction structure 21 of encapsulation chip body, and 1 outer wall of encapsulation chip body is fixed to be equipped with outside heat radiation structure 22, and the laminating of 21 both sides tip of inside heat conduction structure and outside heat radiation structure 22, and 1 upper surface of encapsulation chip body is even fixed to be equipped with collision protection upper cover 3.
The aluminum alloy heat dissipation structure 2 dissipates heat of the packaged chip body 1, and internal heat of the packaged chip body 1 is conducted out by the internal heat conduction structure 21 and is transferred to the external heat dissipation structure 22 for heat dissipation, so that heat dissipation efficiency is improved; the collision protection upper cover 3 is shielded above the device, deflects and disperses the impact force of the device and performs buffer protection, and protects the inner chip main body 14 from collision.
The internal heat conducting structure 21 comprises a strip-shaped groove 211 which is uniformly and transversely arranged in the packaging chip body 1, and a heat conducting rod 212 penetrates through the strip-shaped groove 211; the heat conducting rod 212 is made of aluminum alloy and used for transferring heat inside the packaged chip body 1, and the heat conducting rod 212 and the pins 16 are staggered.
The external heat dissipation structure 22 comprises clamping grooves 221 formed in the left side wall and the right side wall of the package chip body 1, aluminum alloy heat dissipation plates 222 are fixedly assembled in the clamping grooves 221, and aluminum alloy heat dissipation fins 223 are uniformly and integrally formed on the outer side walls of the aluminum alloy heat dissipation plates 222; the aluminum alloy heat radiating fins 223 are used to improve heat radiating efficiency.
The collision protection upper cover 3 comprises a groove 31 for packaging the upper surface of the chip body 1, a cover plate 32 is detachably and fixedly assembled in the groove 31 through a bolt, and elastic buffer parts 33 are uniformly and fixedly assembled on the upper surface of the cover plate 32; the elastic buffer piece 33 is used for buffering and deflecting the impact force, and the cover plate 32 is fixed in the groove 31 through bolts and is stably installed.
The elastic buffer 33 comprises an expansion link 331 fixedly assembled on the upper surface of the cover plate 32, a hemispherical cap 332 is fixedly assembled on the upper end of the expansion link 331, and a spring 333 is fixedly connected between the upper surface of the base of the expansion link 331 and the bottom surface of the hemispherical cap 332; during impact, an impactor impacts on the hemispherical circular cap 332, slides and deflects along the outer wall of the hemispherical circular cap 332, disperses the impact force, and buffers the impact force through the spring 333 to protect the inner chip body 14 from impact.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A chip with a package structure is characterized in that: including encapsulation chip body (1), be equipped with aluminum alloy heat radiation structure (2) on encapsulation chip body (1), aluminum alloy heat radiation structure (2) are including locating inside heat conduction structure (21) of encapsulation chip body (1) inside, encapsulation chip body (1) outer wall fixed be equipped with outside heat radiation structure (22), inside heat conduction structure (21) both sides tip and the laminating of outside heat radiation structure (22), even fixed the being equipped with collision protection upper cover (3) of surface on encapsulation chip body (1).
2. The chip with the packaging structure according to claim 1, wherein: inside heat conduction structure (21) are including even horizontal strip groove (211) of seting up in encapsulation chip body (1) inside, it has heat conduction pole (212) to run through in strip groove (211).
3. The chip with the packaging structure according to claim 1, wherein: outside heat radiation structure (22) are including offering joint groove (221) of lateral wall about encapsulation chip body (1), joint groove (221) internal fixation is equipped with aluminum alloy heating panel (222), the even integrated into one piece of aluminum alloy heating panel (222) lateral wall has aluminum alloy radiating fin (223).
4. The chip with the packaging structure according to claim 1, wherein: collision protection upper cover (3) are including recess (31) of encapsulation chip body (1) upper surface, through the detachable fixed mounting of bolt apron (32) in recess (31), the even fixed mounting of upper surface of apron (32) has elastic buffer (33).
5. The chip with the packaging structure according to claim 4, wherein: elastic buffer member (33) are including fixed assembly in telescopic link (331) of apron (32) upper surface, telescopic link (331) upper end fixed assembly has hemisphere cap (332), fixedly connected with spring (333) between telescopic link (331) base upper surface and hemisphere cap (332) bottom surface.
6. The chip with the packaging structure according to claim 1, wherein: encapsulation chip body (1) is including encapsulation base (11), rectangular channel (12) have been seted up to the upper surface of encapsulation base (11), rectangular channel (12) inner chamber is filled and is fixed with insulating base (13), the inside top embedding of insulating base (13) is equipped with chip main part (14), encapsulation base (11) bottom surface corresponds chip main part (14) embedding and is equipped with pin connection seat (15), pin connection seat (15) and corresponding fixedly connected with pin (16) between chip main part (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120837018.2U CN214542198U (en) | 2021-04-22 | 2021-04-22 | Chip with packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120837018.2U CN214542198U (en) | 2021-04-22 | 2021-04-22 | Chip with packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214542198U true CN214542198U (en) | 2021-10-29 |
Family
ID=78276492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120837018.2U Expired - Fee Related CN214542198U (en) | 2021-04-22 | 2021-04-22 | Chip with packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214542198U (en) |
-
2021
- 2021-04-22 CN CN202120837018.2U patent/CN214542198U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211029 |