CN214542193U - Three-dimensional chip that piles up of area heat dissipation function - Google Patents
Three-dimensional chip that piles up of area heat dissipation function Download PDFInfo
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- CN214542193U CN214542193U CN202120265712.1U CN202120265712U CN214542193U CN 214542193 U CN214542193 U CN 214542193U CN 202120265712 U CN202120265712 U CN 202120265712U CN 214542193 U CN214542193 U CN 214542193U
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Abstract
The utility model discloses a three-dimensional chip that piles up of area heat dissipation function, which comprises a circuit board, the upper end welding of circuit board has the tin ball, and the upper end welding of tin ball has and piles up the chip, the both sides of piling up the chip are provided with the mount, and the inboard of mount is provided with first fan, the outside of first fan is provided with oblique baffle, and the inboard surface of oblique baffle is provided with the guiding gutter, the upper end of oblique baffle is connected with the through-hole board, and the lower extreme of through-hole board is fixed with the ventilation pipe to the lower extreme of ventilation pipe is provided with oblique notch, the inboard of ventilation pipe is provided with indulges puts copper fin, and indulges the lower extreme of putting copper fin and be provided with the copper to the lower extreme of copper is provided with heat conduction silicone grease, the upper end of through-hole board is provided with horizontal copper fin. This take three-dimensional chip that piles up of heat dissipation function draws and concentrates the heat abstractor who transmits the upper end to and dispels the heat effectively with piling up the heat between the chip layer through setting up heat guider.
Description
Technical Field
The utility model relates to a three-dimensional chip technical field that piles up specifically is a three-dimensional chip that piles up of area heat dissipation function.
Background
The three-dimensional chip is a brand-new chip structure formed by manufacturing different circuit units on a plurality of planar wafers and stacking and interconnecting the wafers in the vertical direction through a through silicon via interlayer vertical interconnection technology, and has the characteristics of high integration level, low power consumption, high bandwidth, small area, short interconnection line, support for heterogeneous integration and the like.
However, when the existing three-dimensional stacked chip is used, heat generated by the chip is easy to accumulate, so that the use effect is affected, and the gas around the three-dimensional stacked chip has low fluidity, so that the heat dissipation effect is affected.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a three-dimensional chip that piles up of band elimination heat function to the current three-dimensional chip that piles up that proposes in solving above-mentioned background art is when using, and the heat that self produced is piled up easily, influences the result of use, and three-dimensionally piles up that gas mobility is slow around the chip, influences the problem of radiating effect.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a three-dimensional chip that piles up of area heat dissipation function, includes the circuit board, the upper end welding of circuit board has the tin ball, and the upper end welding of tin ball has and piles up the chip, the both sides of piling up the chip are provided with the mount, and the inboard of mount is provided with first fan, the outside of first fan is provided with oblique baffle, and the inboard surface of oblique baffle is provided with the guiding gutter, the upper end of oblique baffle is connected with the through-hole board, and the lower extreme of through-hole board is fixed with the ventilation pipe to the lower extreme of ventilation pipe is provided with the scarf, the inboard of ventilation pipe is provided with indulges puts the copper fin, and indulges the lower extreme of putting the copper fin and be provided with the copper to the lower extreme of copper is provided with heat conduction silicone grease, the upper end of through-hole board is provided with horizontal copper fin, and the upper end of horizontal copper fin is fixed with the fixed plate to the second fan is installed to the upper end of fixed plate.
Preferably, the stacked chips are welded and fixed with the circuit board through solder balls, the solder balls are arranged in a rectangular structure in an equidistant arrangement, and the stacked chips are connected with the copper plate through heat-conducting silicone grease in a gluing mode.
Preferably, the first fan is vertically installed with the circuit board through a fixing frame, the height of the first fan is consistent with that of the stacked chips, and the first fan is configured to draw air from the inner side and discharge air to the outer side.
Preferably, the inclined guide plate is a rectangular plate made of copper, the inner side face of the inclined guide plate and the circuit board are inclined and fixed at 120 degrees, and the guide grooves are formed in the inner side of the inclined guide plate along the inclined direction of the inclined guide plate at equal intervals.
Preferably, the ventilation pipe is provided with two sides of the longitudinally arranged copper fins, the ventilation pipe is gradually extended from outside to inside, and the tangent plane of the inclined notch at the lower end of the ventilation pipe faces to the diversion trenches at the two sides.
Preferably, a plurality of through holes are formed in the through hole plate, the transverse copper fins are transversely and vertically fixed with the through hole plate, and the transverse copper fins are arranged in gaps at the upper ends of the through holes in the through hole plate.
Preferably, the fixed plate sets up to the right angle board of opposition, and the fixed plate passes through the screw to be fixed with the front and back terminal surface of horizontal copper fin to the second fan passes through the screw to be fixed with the upper end of fixed plate, and the second fan is equipped with the interval with the upper end of horizontal copper fin.
Compared with the prior art, the beneficial effects of the utility model are that: the three-dimensional stacked chip with the heat dissipation function is reasonable in structural arrangement, and heat accumulated between chip layers is effectively led out and is intensively transferred to the heat dissipation device at the upper end for heat dissipation by arranging the heat guiding device;
1. the heat dissipation structure is provided with a tin ball, heat conduction silicone grease, a fixing frame and a first fan, wherein the tin ball is used for fixedly welding the chip and the circuit board, so that the air at the lower end of the chip can be conveniently circulated;
2. the inclined guide plate is used for preventing heat led out by the first fan from blowing to other electric elements, and the guide groove on the surface of the inclined guide plate is used for guiding the heat upwards, so that part of the heat is poured into the ventilation pipe through the inclined cut at the lower end of the ventilation pipe, and the other part of the wind heat is gathered between the ventilation pipes;
3. be equipped with and indulge copper fin, through-hole board, horizontal copper fin and first fan, through the heat of through-hole board with gathering to horizontal copper fin transmission, be convenient for with chip upper end heat to the through-hole board transmission through indulging to put copper fin, and indulge and put copper fin and will give off partly heat at the transmission in-process itself, the heat of rethread first fan with gathering horizontal copper fin upwards draws forth and gives off, and then plays the heat dissipation function to the chip.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a partial side view of the present invention;
FIG. 3 is a schematic view of the structure of the inclined guide plate of the present invention;
fig. 4 is a schematic side view of the ventilation pipe of the present invention.
In the figure: 1. a circuit board; 2. a fixed mount; 3. a first fan; 4. an inclined guide plate; 41. a diversion trench; 5. a vent pipe; 51. a bevel notch; 6. a through hole plate; 7. transversely arranging copper fins; 8. a second fan; 9. a fixing plate; 10. longitudinally arranging copper fins; 11. a copper plate; 12. heat-conducting silicone grease; 13. stacking the chips; 14. solder balls.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a three-dimensional stacked chip with a heat dissipation function comprises a circuit board 1, a fixing frame 2, a first fan 3, an inclined guide plate 4, a guide groove 41, a ventilation pipe 5, an inclined notch 51, a through hole plate 6, a transverse copper fin 7, a second fan 8, a fixing plate 9, a longitudinal copper fin 10, a copper plate 11, heat conduction silicone grease 12, a stacked chip 13 and a solder ball 14, wherein the solder ball 14 is welded at the upper end of the circuit board 1, the stacked chip 13 is welded at the upper end of the solder ball 14, the fixing frame 2 is arranged on two sides of the stacked chip 13, the first fan 3 is arranged on the inner side of the fixing frame 2, the inclined guide plate 4 is arranged on the outer side of the first fan 3, the guide groove 41 is arranged on the inner side surface of the inclined guide plate 4, the through hole plate 6 is connected to the upper end of the inclined guide plate 4, the ventilation pipe 5 is fixed at the lower end of the through hole plate 6, the inclined notch 51 is arranged at the lower end of the ventilation pipe 5, the longitudinal copper fin 10 is arranged on the inner side of the ventilation pipe 5, and the lower end of the longitudinal copper fin 10 is provided with a copper plate 11, the lower end of the copper plate 11 is provided with heat-conducting silicone grease 12, the upper end of the through hole plate 6 is provided with a transverse copper fin 7, the upper end of the transverse copper fin 7 is fixed with a fixing plate 9, and the upper end of the fixing plate 9 is provided with a second fan 8.
As shown in fig. 1, the stacked chip 13 is fixed to the circuit board 1 by soldering via solder balls 14, and the solder balls 14 are arranged in a rectangular structure with equal intervals, and the stacked chip 13 is connected to the copper plate 11 by gluing via heat-conducting silicone grease 12, the first fan 3 is vertically mounted to the circuit board 1 via the fixing frame 2, and the height of the first fan 3 is the same as that of the stacked chip 13, and the first fan 3 is arranged to wind and exhaust air from the inside, the chip is fixed to the circuit board 1 by soldering via the solder balls 14, so as to facilitate air circulation at the lower end of the chip, facilitate heat transfer at the upper end of the chip via the heat-conducting silicone grease 12, the first fan 3 is mounted at both sides of the chip via the fixing frame 2, and the first fan 3 is arranged to wind and exhaust air from the inside, which is favorable for sucking out the gathered heat between the stacked chips 13.
As shown in fig. 1, 3 and 4, the inclined guide plate 4 is a rectangular plate made of copper, the inner side surface of the inclined guide plate 4 is fixed to the circuit board 1 in an inclined manner of 120 degrees, and the guide grooves 41 are equidistantly arranged on the inner side of the inclined guide plate 4 along the inclined direction of the inclined guide plate 4, the ventilation pipe 5 is arranged on two sides of the longitudinally arranged copper fin 10, the ventilation pipe 5 is arranged to be gradually extended from outside to inside, the tangent plane of the inclined notch 51 at the lower end of the ventilation pipe 5 faces the guide grooves 41 on the two sides, the heat guided out by the first fan 3 is prevented from blowing to other electric elements by the inclined guide plate 4, and the heat is guided upwards by the guide grooves 41 on the surface of the inclined guide plate 4, so that part of the heat is poured into the ventilation pipe 5 through the inclined notch 51 at the lower end of the ventilation pipe 5, and the other part of the heat is collected between the ventilation pipes 5.
As shown in fig. 1 and fig. 2, a plurality of through holes are arranged inside the through hole plate 6, and the transverse copper fins 7 are transversely and vertically fixed with the through hole plate 6, the transverse copper fins 7 are arranged in the gaps at the upper ends of the through holes in the through hole plate 6, the fixing plates 9 are arranged as opposite right-angle plates, the fixing plates 9 are fixed with the front end surface and the rear end surface of the transverse copper fins 7 through screws, and the second fan 8 is fixed with the upper end of the fixing plate 9 through a screw, and a space is arranged between the second fan 8 and the upper end of the transverse copper fin 7, the gathered heat is transferred 7 to the horizontal copper fins through the through hole plate 6, the heat at the upper end of the chip is conveniently transferred to the through hole plate 6 through the longitudinal copper fins 10, the longitudinally-arranged copper fins 10 emit part of heat in the transmission process, and the heat accumulated on the transversely-arranged copper fins 7 is led out upwards by the first fan 3 to be emitted, so that the heat dissipation function of the chip is achieved.
The working principle is as follows: when the three-dimensional stacked chip with the heat dissipation function is used, firstly, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the chip and the circuit board 1 are welded and fixed through the solder balls 14, so that the air circulation at the lower end of the chip is facilitated, the heat at the upper end of the chip is conveniently transferred through the heat-conducting silicone grease 12, the first fan 3 is installed at two sides of the chip through the fixing frame 2, the first fan 3 is arranged to suck air from the inner side and exhaust the air outwards, the heat gathered between the stacked chips 13 is favorably sucked out, the heat led out by the first fan 3 is prevented from blowing to other electric elements through the inclined guide plate 4, the heat is conveniently guided upwards through the guide groove 41 on the surface of the inclined guide plate 4, so that part of the heat is poured into the ventilation pipe 5 through the inclined notch 51 at the lower end of the ventilation pipe 5, and the other part of the air heat is gathered among the ventilation pipes 5, and the gathered heat is transferred to the transverse copper fin 7 through the through hole plate 6, it is convenient for to be convenient for with chip upper end heat to through-hole board 6 transmission to indulge copper fin 10, and indulge copper fin 10 and will give off partly heat at the transfer process itself, and the heat of rethread first fan 3 with gathering at horizontal copper fin 7 upwards draws forth and gives off, and then plays the heat dissipation function to the chip, and this is the whole process that the chip used is piled up to the three-dimensional of taking the heat dissipation function.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a three-dimensional chip that piles up of area heat dissipation function, includes circuit board (1), its characterized in that: the upper end of the circuit board (1) is welded with a solder ball (14), the upper end of the solder ball (14) is welded with a stacked chip (13), two sides of the stacked chip (13) are provided with a fixing frame (2), the inner side of the fixing frame (2) is provided with a first fan (3), the outer side of the first fan (3) is provided with an inclined guide plate (4), the inner side surface of the inclined guide plate (4) is provided with a guide groove (41), the upper end of the inclined guide plate (4) is connected with a through hole plate (6), the lower end of the through hole plate (6) is fixed with a vent pipe (5), the lower end of the vent pipe (5) is provided with a bevel cut (51), the inner side of the vent pipe (5) is provided with a longitudinally arranged copper fin (10), the lower end of the longitudinally arranged copper fin (10) is provided with a copper plate (11), the lower end of the copper plate (11) is provided with heat-conducting silicone grease (12), the upper end of the through hole plate (6) is provided with a transversely arranged copper fin (7), and a fixing plate (9) is fixed at the upper end of the transverse copper fin (7), and a second fan (8) is installed at the upper end of the fixing plate (9).
2. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: the stacked chips (13) are fixedly welded with the circuit board (1) through solder balls (14), the solder balls (14) are arranged in a rectangular structure in an equidistant mode, and the stacked chips (13) are connected with the copper plate (11) through heat conduction silicone grease (12) in a gluing mode.
3. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: the first fan (3) is vertically installed with the circuit board (1) through the fixing frame (2), the height of the first fan (3) is consistent with that of the stacked chips (13), and the first fan (3) is arranged to suck air from the inner side and exhaust air to the outer side.
4. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: oblique baffle (4) set up to the rectangular plate of copper material, and oblique baffle (4) medial surface becomes 120 degrees slopes with circuit board (1) and fixes to guiding gutter (41) are seted up in the inboard of oblique baffle (4) along oblique baffle (4) incline direction equidistance.
5. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: the ventilation pipe (5) is provided with two sides of the longitudinally arranged copper fins (10), the ventilation pipe (5) is gradually extended from outside to inside, and the section of the inclined notch (51) at the lower end of the ventilation pipe (5) faces to the diversion grooves (41) at the two sides.
6. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: the through hole plate is characterized in that a plurality of through holes are formed in the through hole plate (6), the transverse copper fins (7) are transversely and vertically fixed with the through hole plate (6), and the transverse copper fins (7) are arranged in gaps at the upper ends of the through holes in the through hole plate (6).
7. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: the fixed plate (9) is arranged to be a right-angle plate which is arranged oppositely, the fixed plate (9) is fixed with the front end face and the rear end face of the transverse copper fin (7) through screws, the second fan (8) is fixed with the upper end of the fixed plate (9) through screws, and a space is arranged between the second fan (8) and the upper end of the transverse copper fin (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120265712.1U CN214542193U (en) | 2021-01-31 | 2021-01-31 | Three-dimensional chip that piles up of area heat dissipation function |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120265712.1U CN214542193U (en) | 2021-01-31 | 2021-01-31 | Three-dimensional chip that piles up of area heat dissipation function |
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| Publication Number | Publication Date |
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| CN214542193U true CN214542193U (en) | 2021-10-29 |
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| CN202120265712.1U Active CN214542193U (en) | 2021-01-31 | 2021-01-31 | Three-dimensional chip that piles up of area heat dissipation function |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114203655A (en) * | 2021-11-19 | 2022-03-18 | 苏州浪潮智能科技有限公司 | Chip packaging structure |
| CN117038602A (en) * | 2023-08-07 | 2023-11-10 | 深圳市金誉半导体股份有限公司 | Semiconductor device stacking and packaging structure |
| CN117038602B (en) * | 2023-08-07 | 2024-05-28 | 深圳市金誉半导体股份有限公司 | Semiconductor device stacking and packaging structure |
-
2021
- 2021-01-31 CN CN202120265712.1U patent/CN214542193U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114203655A (en) * | 2021-11-19 | 2022-03-18 | 苏州浪潮智能科技有限公司 | Chip packaging structure |
| CN114203655B (en) * | 2021-11-19 | 2023-11-03 | 苏州浪潮智能科技有限公司 | Chip packaging structure |
| CN117038602A (en) * | 2023-08-07 | 2023-11-10 | 深圳市金誉半导体股份有限公司 | Semiconductor device stacking and packaging structure |
| CN117038602B (en) * | 2023-08-07 | 2024-05-28 | 深圳市金誉半导体股份有限公司 | Semiconductor device stacking and packaging structure |
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