CN214375115U - Testing device and system - Google Patents
Testing device and system Download PDFInfo
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- CN214375115U CN214375115U CN202022396172.9U CN202022396172U CN214375115U CN 214375115 U CN214375115 U CN 214375115U CN 202022396172 U CN202022396172 U CN 202022396172U CN 214375115 U CN214375115 U CN 214375115U
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Abstract
The application discloses a testing device and a testing system. The testing device comprises a testing mother board, a plurality of contact elements and a positioning board, wherein the contact elements are arranged on the testing mother board and protrude from the surface of one side of the testing mother board, the contact elements are arranged corresponding to jointed boards in a device board to be tested, and the jointed boards can be electrically connected with the corresponding contact elements after the device board to be tested is placed on the testing mother board; the positioning plate is provided with a plurality of positioning windows used for placing the jointed boards, and the positioning windows are arranged corresponding to the contact elements, so that the jointed boards arranged in the positioning windows can be electrically connected with the corresponding contact elements after the positioning plate is placed on the test motherboard. The application provides a testing arrangement and system both can detect the whole board of device board that awaits measuring, also can detect the makeup after whole board split.
Description
Technical Field
The present application relates to the field of test instruments, and more particularly, to a test apparatus and system.
Background
The PCB (Printed Circuit Board) is generally processed by a whole Board, but when the actually required PCB has a smaller size, several PCB single boards need to be spliced on the same whole Board for processing, that is, a small-sized PCB is processed by splicing.
The existing PCB device test can not find out the failed jointed board in the whole board, but the test of a single PCB jointed board needs to increase the solder paste welding flow, the efficiency is low, and the welding lead on the device is a destructive test, and the product delivery requirement can not be met.
SUMMERY OF THE UTILITY MODEL
The application provides a testing arrangement and system, both can detect the whole board of device board that awaits measuring, also conveniently detect the makeup after the whole board split.
In order to solve the foregoing technical problem, an aspect of the embodiments of the present application provides a testing apparatus, including:
testing the motherboard;
the contact elements are arranged on the test mother board and protrude from the surface of one side of the test mother board, and the contact elements are arranged corresponding to the jointed boards in the device board to be tested, so that the jointed boards can be electrically connected with the corresponding contact elements after the device board to be tested is placed on the test mother board;
the positioning plate is provided with a plurality of positioning windows used for placing the jointed boards, and the positioning windows are arranged corresponding to the contact elements, so that the jointed boards arranged in the positioning windows can be electrically connected with the corresponding contact elements after the positioning plate is placed on the test motherboard.
The contact elements are divided into a plurality of groups, the number and the positions of the groups correspond to the number and the positions of the positioning windows and also correspond to the number and the positions of the jointed boards in the device board to be tested, and the number and the positions of the contact elements in the groups correspond to the number and the positions of pins of the jointed boards.
The test motherboard is provided with a test port for connecting a test instrument, and the plurality of contact elements are respectively connected with the test port.
Wherein, the testing device further comprises:
and the positioning pieces are arranged on the test mother board and used for positioning the device board to be tested, and after the device board to be tested is positioned, the jointed board corresponds to the contact element.
The positioning window is provided with a plurality of positioning holes, the positioning holes are arranged corresponding to the positioning pieces, and the positioning windows correspond to the contact elements after the positioning pieces penetrate through the positioning holes.
The positioning pieces are positioning columns arranged at four corners of the test mother board or stop blocks arranged at four sides of the test mother board.
The positioning window is the same as the jointed board in shape and size.
Wherein the contact element is a contact probe having elasticity.
On the other hand of this application embodiment still provides a test system, include the aforesaid testing arrangement and with the test instrument that testing arrangement connects, test instrument is used for right the makeup carries out capability test.
The testing device provided by the embodiment of the application has flexible testing mode, and can test both the whole board and the jointed board; the quantity of the test jig for the jointed boards can be determined according to the requirements of operators, and the test jig can be used for testing a single jointed board and can also be used for testing a plurality of jointed boards simultaneously; meanwhile, the method has the advantage of easily searching unqualified devices, and the single jointed board test is convenient for operators to quickly find unqualified failed jointed boards, so that the problem that the failed devices in the whole board cannot be positioned is solved; the testing device can perform nondestructive testing on a single jointed board device, welding or other destructive operations are not needed, and the destructive problem of a welding lead is solved; the test efficiency can be obviously improved, a plurality of jointed board devices can be placed simultaneously according to requirements, and the test efficiency is improved.
Drawings
FIG. 1 is a schematic structural diagram of a testing device for testing a panel of an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a test motherboard according to an embodiment of the present application;
FIG. 3 is a schematic view of a positioning plate according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a DUT board in an embodiment of the present application;
FIG. 5 is a schematic diagram of a frame line structure of a test system according to an embodiment of the present application;
fig. 6 is a flowchart illustrating a testing method according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a testing device for testing a jointed board according to an embodiment of the present application; FIG. 2 is a schematic structural diagram of a test motherboard according to an embodiment of the present application; fig. 3 is a schematic structural diagram of a positioning plate according to an embodiment of the present application. The test apparatus includes a test motherboard 100, a plurality of contact members 200, a positioning plate 300, and a plurality of positioning members 400. Fig. 4 is a schematic structural diagram of a device board to be tested in an embodiment of the present application, please refer to fig. 4, the testing apparatus is used for performing performance testing on the device board 500 to be tested and the boards 510, the device board 500 to be tested is a whole PCB board composed of a plurality of small-sized PCB boards, that is, a plurality of boards 510 are manufactured on the same device board 500 to be tested.
The shape and size of the test motherboard 100 are matched with the shape and size of the device board 500 to be tested, so that the volume of the test equipment is reduced, and the manufacturing cost is reduced. The plurality of contact elements 200 are arranged on the test mother board 100 and protrude from one side surface of the test mother board 100, and each contact element 200 is arranged corresponding to each jointed board 510 in the device board 500 to be tested, so that after the device board 500 to be tested is placed on the test mother board 100, each jointed board 510 can be electrically connected with the corresponding contact element 200 and can test the whole device board 500 to be tested. The number of contact elements 200 can be one or more, and is set according to the number of panels 510, and the placement positions of contact elements 200 also correspond to the pin positions on panels 510.
The positioning plate 300 is provided with a plurality of positioning windows 310 for placing the single jointed board 510, and the positioning windows 310 are arranged corresponding to the contact elements 200, so that the jointed board 510 placed in the positioning windows 310 can be contacted and electrically connected with the corresponding contact elements 200 after the positioning plate 300 is placed on the test motherboard 100. Positioning windows 310 may be one or more, corresponding in number to the number of contact elements 200 and tiles 510, and may be located in positions corresponding to the positions of individual tiles 510 in device under test board 500.
When the testing device is used for testing, the testing device needs to be matched with a testing instrument for use. The test instrument is electrically connected to each contact element 200; for rapid detection, the testing apparatus simultaneously obtains signals input by each contact element 200 for detection, that is, the testing apparatus simultaneously detects all the panels 510 electrically connected to the contact elements 200, reads all the input signals at one time, and outputs corresponding test results. When all the panels 510 electrically connected to the contact element 200 are qualified products, the test instrument will show that the test is passed; when one or more defective products are present in all of panels 510 electrically connected to contact element 200, the testing instrument will indicate that the test failed.
During testing, the whole board test can be adopted, the device board 500 to be tested is correspondingly placed on the test mother board 100, each jointed board 510 is in contact with and electrically connected with the corresponding contact element 200, and at the moment, the test instrument is started, so that the whole board of the device board 500 to be tested can be rapidly detected. The test is passed, which indicates that the jointed boards 510 on the whole device board 500 to be tested are all qualified products; and the test is failed, so that one or more unqualified jointed boards exist in the whole board, and the unqualified jointed boards need to be found out. At this time, a board alignment test is performed, the device board 500 to be tested is milled into a single board alignment 510 or a plurality of board alignment 510, and the positioning board 300 is placed on the test motherboard 100 such that each positioning window 310 is disposed corresponding to each contact element 200. The testing instrument is used for simultaneously detecting all the jointed boards 510 electrically connected with the contact element 200, a single jointed board 510 can be sequentially placed in the positioning window 310, the testing instrument detects all the jointed boards 510, and after a certain jointed board 510 is placed in the positioning window 310, the testing instrument displays that the jointed board 510 does not pass through, so that the jointed board 510 can be judged to be an unqualified jointed board; a plurality of panels 510 divided into strips or blocks may be placed in the positioning window 310 of the positioning plate 300 to be detected in batch in a partitioned manner, so that a problem panel can be detected more rapidly. In other embodiments, the split jointed boards 510 can be placed in the positioning windows 310 of the positioning plate 300 according to the original positions of the whole boards, so that it is more convenient to observe which position of the whole boards is a problem, and further to perform key inspection on the equipment for manufacturing the position of the jointed boards, thereby effectively improving the yield of subsequent products.
Simultaneously, also can test batch makeup 510 through locating plate 300, can place a plurality of makeup 510 simultaneously and test according to the demand, realize fixing a position nonconforming product fast, promote efficiency of software testing.
In other embodiments, the number of contact elements 200 and positioning windows 310 can be greater than the number of tiles 510 in device board 500 under test, such as multiple times the number of tiles 510, so that a testing device can simultaneously measure multiple device boards 500 under test to meet the requirement of simultaneously measuring a large batch of tile devices.
The testing device has flexible testing mode, and can test both the whole board and the jointed board; the quantity of the test jig for the jointed boards can be determined according to the requirements of operators, and the test jig can be used for testing a single jointed board and can also be used for testing a plurality of jointed boards simultaneously; the test device is easy to find unqualified devices, and the single jointed board test is convenient for operators to quickly find unqualified failed jointed boards, so that the problem that failed devices in the whole board cannot be positioned is solved; the testing device can perform nondestructive testing on a single jointed board device, welding or other destructive operations are not needed, and the destructive problem of a welding lead is solved; the testing device can obviously improve the testing efficiency, and can place a plurality of jointed board devices for testing simultaneously according to the requirements, thereby improving the testing efficiency.
Specifically, the shape and size of the test motherboard 100 and the positioning plate 300 in this embodiment are both matched with the shape and size of the device board 500 to be tested, so as to reduce the volume of the test equipment and reduce the manufacturing cost; in other embodiments, the test motherboard 100 and the alignment plate 300 may have any other shape, but the test motherboard 100 and the alignment plate 300 have an area that can completely fit the entire surface of the dut board 500. The test motherboard 100 and the positioning board 300 are insulating boards made of insulating materials, such as rubber boards, plastic boards, glass boards, or ceramic boards, so as to avoid interference and influence on electronic components.
The test mother board 100 is provided with a through hole or a groove, and one end of the contact element 200 is fixedly arranged in the through hole or the groove, and the other end protrudes from the front surface of the test mother board 100. The contact element 200 in this embodiment is a contact probe with elasticity, and each pin of the single jointed board 510 is electrically connected with the contact probe; because the contact probes are elastic, the board 510 placed in the positioning window 310 is pressed against the contact probes by gravity, so that the pins of the board 510 are in good contact with the contact probes.
The contact elements 200 are divided into a plurality of groups, the number and positions of the groups correspond to the number and positions of the positioning windows 310, and also correspond to the number and positions of the panels 510 in the device board 500 to be tested, and the number and positions of the contact elements 200 in the groups correspond to the number and positions of the pins of the panels 510. In this embodiment, each dut board 500 is provided with 36 patches 510, each patch 510 has 6 pins, so the contact elements 200 are divided into 36 groups, the positioning board 300 is provided with 36 positioning windows 310, and each group of contact elements 200 is 6 contact probes corresponding to the pins of the patch 510.
Since the contact elements 200 need to be connected to an external test instrument, the test motherboard 100 in this embodiment is provided with a test port 110 for connecting the test instrument, and all the contact elements 200 are electrically connected to the test port 110, so that the test instrument can test all the components electrically connected to the contact elements 200 at the same time.
In order to facilitate the operation, the device board 500 to be tested can be quickly positioned, the testing apparatus provided in this embodiment further includes a plurality of positioning members 400, and the plurality of positioning members 400 are set on the testing motherboard 100 and used for positioning the device board 500 to be tested; after device board 500 under test is positioned, panel 510 will also correspond to the location of contact element 200. The positioning plate 300 is also provided with a plurality of positioning holes 320, the positioning holes 320 are disposed corresponding to the positioning members 400, and after the positioning members 400 penetrate through the positioning holes 320, the positioning windows 310 correspond to the positions of the contact elements 200.
The positioning member 400 can position the dut board 500 by using a fence or a column and positioning hole. The device board 500 to be tested in this embodiment is a square or rectangular structure, and when the positioning is performed by using the enclosure method, the plurality of positioning members 400 are stoppers arranged on four sides of the test motherboard 100, and the four sides of the device board 500 to be tested can be just clamped by the stoppers, so that the device board 500 to be tested is positioned in the stoppers.
Since the four corners of the dut board 500 have the through holes 520 for positioning, the dut board 500 is positioned by the matching of the columns and the positioning holes in the present embodiment. The positioning members 400 in this embodiment are four positioning columns, the four positioning columns are respectively disposed at four corners of the test mother board 100, and the four positioning columns correspond to the four through holes 520 on the dut board 500. When the four through holes 520 of the device board 500 to be tested are laid down corresponding to the four positioning posts on the test motherboard 100, so that the positioning posts pass through the through holes 520 of the device board 500 to be tested, the jointed boards 510 in the device board 500 to be tested correspond to the positions of the sets of contact elements 200, and the pins of the corresponding jointed boards 510 are correspondingly contacted and electrically connected with the contact probes.
The positioning plate 300 is also provided with four positioning holes 320, when the positioning plate 300 needs to be used, the four positioning holes 320 of the positioning plate 300 are placed corresponding to the four positioning columns, so that the positioning columns pass through the positioning holes 320, and the positioning windows 310 on the positioning plate 300 correspond to the positions of the sets of contact elements 200.
Furthermore, the shape and size of the positioning window 310 is the same as the shape and size of the jointed board 510, so that the jointed board 510 placed in the positioning window 310 can be quickly positioned, and the pins on the positioned jointed board 510 are correspondingly contacted and electrically connected with the contact probes of each group of contact elements 200, thereby realizing the technical effect of quickly positioning the whole board and jointed board for testing.
Fig. 5 is a schematic diagram of a frame line structure of the test system in an embodiment of the present application, please refer to fig. 5, the test system includes the test apparatus 1000 and the test instrument 2000 connected to the test apparatus 1000. The test apparatus 1000 includes a test motherboard 100, a plurality of contact elements 200, a positioning plate 300, and a plurality of positioning members 400. The dut board 500 is a whole PCB composed of a plurality of small-sized PCB boards, i.e., a plurality of boards 510 are processed and manufactured on the same dut board 500.
The test system has flexible test mode, can carry out voltage resistance test on the whole board, and can also carry out voltage resistance test on the jointed board; the quantity of the test jig for the jointed boards can be determined according to the requirements of operators, and the test jig can be used for testing a single jointed board and can also be used for testing a plurality of jointed boards simultaneously; the test device is easy to search for voltage-resistant failure devices, and the single jointed board test is convenient for operators to quickly search for voltage-resistant failure jointed boards, so that the problem that the voltage-resistant failure devices in the whole board cannot be positioned is solved; the testing device can perform nondestructive testing on a single jointed board device, welding or other destructive operations are not needed, and the destructive problem of a welding lead is solved; the testing device can remarkably improve the withstand voltage testing efficiency of the PCB, can place a plurality of jointed board devices to be tested simultaneously according to requirements, and improves the testing efficiency.
The present embodiment further provides a testing method using the testing system described above, fig. 6 is a schematic flow chart of the testing method in an embodiment of the present application, please refer to fig. 6, and the testing method includes the following steps:
s1, placing the device board 500 to be tested on the test motherboard 100, electrically connecting the jointed board 510 with the corresponding contact element 200, and starting the test instrument 2000 to perform the test.
Further, the through hole 520 of the device board 500 to be tested is placed in correspondence to the positioning element 400 on the test motherboard 100, so that the pins of the jointed board 510 on the device board 500 to be tested are in contact with and electrically connected to the contact element 200, and then the test instrument 2000 is started to perform the whole board test.
S2, if the test fails, cutting the device board 500 to be tested to separate a single jointed board 510; the positioning plate 300 is placed on the test mother board 100 such that the positioning windows 310 are disposed corresponding to the contact elements 200.
If the test fails, taking out the device board 500 to be tested, and milling the device board 500 to be tested into a single jointed board 510; the positioning holes 320 of the positioning plate 300 are placed corresponding to the positioning members 400 on the test motherboard 100, so that the positioning windows 310 of the positioning plate 300 correspond to the positions of the sets of contact elements 200.
S3, placing the single jointed board 510 in each positioning window 310 in sequence and electrically connecting the pins of the jointed board 510 with the corresponding contact elements 200; when a panel 510 fails the test after being placed, the panel 510 is determined to be a failed device.
Since test instrument 2000 continues to test during this process, when a panel 510 fails, it can be determined that panel 510 is a failed device.
In other embodiments, dut board 500 may be divided into multiple tiles 510 in strip or block form, and then placed in positioning window 310 of positioning board 300 for batch testing in a partitioned manner, thereby allowing for faster detection of problem tiles. The split single or multiple jointed boards 510 can be placed in the positioning window 310 of the positioning plate 300 according to the original positions on the whole board, so that the problem of the jointed board at which position in the whole board is found can be observed more conveniently, the equipment for manufacturing the jointed board at the position is subjected to key investigation, and the yield of subsequent products is effectively improved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (9)
1. A test apparatus, comprising:
testing the motherboard;
the contact elements are arranged on the test mother board and protrude from the surface of one side of the test mother board, and the contact elements are arranged corresponding to the jointed boards in the device board to be tested, so that the jointed boards can be electrically connected with the corresponding contact elements after the device board to be tested is placed on the test mother board;
the positioning plate is provided with a plurality of positioning windows used for placing the jointed boards, and the positioning windows are arranged corresponding to the contact elements, so that the jointed boards arranged in the positioning windows can be electrically connected with the corresponding contact elements after the positioning plate is placed on the test motherboard.
2. The testing device of claim 1, wherein the contact elements are grouped into groups, the number and location of the groups corresponding to the number and location of the positioning windows and the number and location of the panels in the dut board, the number and location of the contact elements in the groups corresponding to the number and location of the pins of the panels.
3. A test device as claimed in claim 1, characterized in that the test motherboard is provided with a test port for connection of a test instrument, to which test port a number of the contact elements are connected, respectively.
4. The testing device of claim 1, further comprising:
and the positioning pieces are arranged on the test mother board and used for positioning the device board to be tested, and after the device board to be tested is positioned, the jointed board corresponds to the contact element.
5. The testing device as claimed in claim 4, wherein the positioning plate has a plurality of positioning holes corresponding to the positioning members, and the positioning windows correspond to the contact elements after the positioning members penetrate through the positioning holes.
6. The testing device as claimed in claim 4, wherein the positioning members are positioning posts disposed at four corners of the testing mother board or stoppers disposed at four sides of the testing mother board.
7. The testing device as claimed in claim 1, wherein the positioning window is the same size and shape as the panels.
8. The testing device of claim 1, wherein the contact element is a contact probe having elasticity.
9. A test system comprising a test device as claimed in any one of claims 1 to 8 and a test instrument connected to the test device for performing a performance test on the panels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022396172.9U CN214375115U (en) | 2020-10-23 | 2020-10-23 | Testing device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022396172.9U CN214375115U (en) | 2020-10-23 | 2020-10-23 | Testing device and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214375115U true CN214375115U (en) | 2021-10-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022396172.9U Active CN214375115U (en) | 2020-10-23 | 2020-10-23 | Testing device and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214375115U (en) |
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2020
- 2020-10-23 CN CN202022396172.9U patent/CN214375115U/en active Active
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