JP2834935B2 - Active matrix display element and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an active matrix display device.

[0002]

2. Description of the Related Art Two types of matrix type liquid crystal display devices, a simple matrix and an active matrix, are well known. Both types of display elements have a structure in which two transparent electrode substrates provided with electrodes are disposed to face each other, and a liquid crystal material functioning as a display medium is sealed between the two substrates. In the case of an active matrix display element, in addition to the above structure, scanning lines and signal lines are arranged vertically and horizontally on a substrate, and a switching element is provided at a position where the scanning line and the signal line intersect. As the switching element, a thin film transistor or a diode such as MIM (Metal Insulator Metal) is used.

The size and resolution of the liquid crystal display element are increased year by year, and when the number of picture elements on one screen increases, the yield is reduced due to an increase in defects. These defects include point defects, line defects, display unevenness, and the like. All of them can be almost repaired if they are detected at the inspection stage in the manufacturing process of the display element, so the inspection accuracy becomes important.

[0004] There are two types of inspections conventionally used in the manufacturing process of an active matrix type liquid crystal display element. There are other inspection methods, but there is a problem in detection accuracy and the like.

The first method is a method in which a predetermined signal is input to an active matrix substrate provided with switching elements and the like, a pattern abnormality is detected from its characteristics, and a defective portion is specified. In this method, when a plurality of active matrix substrates are manufactured from one insulating substrate (hereinafter, referred to as an original substrate), the inspection can be performed with the original substrate as it is, and the inspection efficiency is high.

In a second method, a predetermined voltage is applied to a signal line, a scanning line, and a counter electrode after bonding a display medium and bonding the display medium to a counter substrate on which a counter electrode is provided to form a display element. This is a method of detecting an abnormality from the display state obtained as a result and identifying a defective portion. According to this method, almost all defects such as display defects can be detected, and the inspection accuracy is excellent.

Although the method of inspecting an active matrix type display element has been described above, the same applies to a simple matrix type display element.

[0008]

The above two inspection methods have the following problems, respectively.

In the first method, since only the active matrix substrate is inspected, it is necessary to actually detect all the defects that occur when the display element is bonded to the counter substrate and the display medium is sealed. Is not reached, and there is a problem in the inspection accuracy.

In the second method, since the inspection is performed after the display elements are completed, the processing is performed for each display element, and today's manufacturing method for manufacturing an active matrix substrate of a plurality of display elements from one original substrate. Inspection efficiency is low in the method. Also, in the process of manufacturing many types of display elements, when encapsulating and inspecting display media with a common device,
Each time the model of the display element changes, the setting of the apparatus must be changed, and it takes time to change the setting, and the operation rate of the apparatus decreases.

There is also a problem common to the above two methods. In both methods, a probe card or a flexible printed board is used as a means for applying a signal line, a scanning line, and a counter electrode. A probe card and a flexible printed board are elements for applying a voltage to a plurality of terminals at once. In the case of a probe card, needles are provided corresponding to each terminal, and in the case of a flexible printed board, a circuit is provided. Is configured. However, as the definition of the display element advances, the pitch between terminals becomes smaller, and the terminals of the display element may not be sufficiently contacted with these voltage applying elements. As a result, an appropriate inspection is not performed, the inspection accuracy is reduced, and a defective display element is sent to a subsequent process.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems of the prior art, and has an active matrix type display capable of performing inspection with high inspection accuracy and high inspection efficiency. An object is to provide a method for manufacturing an element.

[0013]

An active mat according to the present invention is provided.
Rix type display elements have a display medium sealed between two original substrates.
Cut out the inserted motherboard into multiple and display each display element
In the active matrix display element to be manufactured,
Signal that short-circuits the multiple signal lines formed on
Signal line, and a signal line formed on the one of the original substrates.
Short-circuiting multiple scanning lines orthogonal to the multiple signal lines
And a common line for the scanning line to be
The common wiring for the signal line and the common wiring for the scanning line are formed.
Between the voltage application terminal of the wire and the one original substrate.
The other has a counter electrode provided with a display medium
And an original substrate. In addition, the accelerator of the present invention
The method of manufacturing the active matrix display element has two basic
Cut motherboards with display media between them
Active matrix type that manufactures each display element
In a method of manufacturing a display element, a plurality of
A signal line, a plurality of scanning lines orthogonal to the signal line, and the signal line
The common wiring for signal lines that short-circuits each other and the scanning lines
A common line for a scanning line to be short-circuited is formed, and a common line for the signal line is formed.
Wiring and the voltage application terminal of the scanning line common wiring are
Forming one of the original substrates on one side;
Other than having a counter electrode with a display medium in between
Arranging the two original substrates in opposition to each other, and
Voltage to the common line, the common line for the scanning line, and the counter electrode
Inspector to detect defects in the display state of multiple display elements
And cut the plurality of motherboards after the inspection process.
And providing the same.

[0014]

[0015]

[0016]

The active matrix type display device according to the present invention comprises:
A matrix in which a plurality of active matrix display elements are formed
In a direction perpendicular to the board
Common wiring for signal lines that short-circuits multiple signal lines
To the common line for the scanning line that short-circuits the scanning lines
Since the application terminal is formed on one side of one of the original substrates,
Leakage of scanning lines and signal lines in motherboard state
And a device for supplying test signals supplied from outside.
Connection structure between the power supply terminal and the voltage application terminal on one of the original substrates
can do. In the method of manufacturing an active matrix display element according to the present invention, after the two original substrates are attached to each other to enclose the display medium, and the two original substrates (hereinafter, referred to as motherboard) are attached to each other, the plurality of original substrates are bonded to each other. Before cutting into display elements, display inspection is performed on the motherboard as it is. Therefore, the inspection can be performed in an actual use state, and a plurality of display elements can be inspected simultaneously.

Further, when the common wiring for voltage application for display inspection is incorporated into the original substrate, the number of terminals to which voltage is applied in the inspection process is reduced, and the connection state and the like are managed. Can be easier.

[0018]

Embodiments of the present invention will be described below.

FIG. 1 shows a motherboard of the active matrix type display element of this embodiment. The motherboard shown has a pattern of an active matrix substrate 2 of two display elements formed on one original substrate 1.
An original substrate 3 which is a counter substrate slightly smaller than the original substrate 1 is disposed so as to face the substrate. An injection port 4 for enclosing a display medium is provided between the original substrates 1 and 3, and a display medium is enclosed between the original substrates 1 and 3.

A method for manufacturing the active matrix type display element of this embodiment will be described with reference to FIG.

First, a predetermined pattern is formed on an original substrate 1 serving as an active matrix substrate 2 and an original substrate 3 serving as a counter substrate. The pattern formed on the original substrate 1 and the original substrate 3 is divided into two figures so that it is easy to see. FIG. 2 shows a wiring diagram of the signal lines, the counter electrodes and their terminals, and FIG. FIG. Although switching elements are not shown in the figure, thin film transistors and MIM
Anything is not specified well.

As shown in FIG. 2, on the original substrate 1, the terminals of the odd-numbered signal lines 11a and the terminals of the even-numbered signal lines 11b are connected to signal lines provided on opposite sides of the active matrix substrate 2 therebetween. Are connected to the common wiring 12.
On the original substrate 3, the counter electrode wiring 31 is connected to the counter electrode common wiring 32. As shown in FIG. 3, on the original substrate 1, the terminals of the odd-numbered scanning lines 13a and the terminals of the even-numbered scanning lines 13b are connected to a common scanning line provided on the opposite side of the active matrix substrate 2 therebetween. Each is connected to the wiring 14. At the end of each of the common wirings 12, 14, 32, a voltage application terminal 5 is formed so that a voltage can be applied from outside the original substrates 1, 3.

Next, the original substrate 1 and the original substrate 3 on which the pattern is formed as described above are attached to each other,
If liquid crystal as a display medium is sealed from the injection port 4 during
The motherboard shown in FIG. 1 is obtained.

Here, the signal lines 11a, 11b,
By applying a predetermined voltage to each of the scanning lines 13a and 13b and the counter electrode and detecting an abnormality in the display state, it is possible to detect a defect in a picture element, a disconnection and a short circuit of the wiring.

The resistance of each of the common lines 12, 14 to which the odd-numbered signal line 11a, the even-numbered signal line 11b, the odd-numbered scanning line 13a, and the even-numbered scanning line 13b are connected is measured. Signal lines 11a and 11b and scanning lines 13a and 13 generated due to a defective resist or a defective etching during manufacture of an active matrix substrate.
A short circuit between each adjacent wiring of b can be found.

Defects determined to be defective by the above-described inspection by inspection and inspection by resistance measurement are repaired by irradiating light energy such as a laser.

Finally, individual active matrix type display elements are cut out from the motherboard which has been inspected and repaired, and the common wirings 12, 14, 32 and the voltage application terminals 5 are separated.

As can be seen from the above-described manufacturing method, in the manufacturing method of this embodiment, the inspection by display and the inspection by resistance measurement are performed on the two active matrix display elements while keeping the size of the original substrates 1 and 3. , Repair the detected defects. Therefore, two active matrix display elements can be processed at one time, and the inspection efficiency is high. or,
Since inspection is performed after actually assembling as an active matrix display element, almost all defects leading to display defects can be detected, and inspection accuracy is excellent.

In this embodiment, each common wiring 12, 1
4, 32 and the voltage application terminal 5, the number of terminals to be applied can be reduced when applying a voltage from the outside in the inspection process. Defect detection failure due to poor connection with the voltage application element from the device can be prevented.

In the above embodiment, a method for manufacturing two active matrix type display elements from one motherboard has been described. However, the present invention is not limited to this, and can be applied to the manufacture of more multiple panels.

[0031]

According to the present invention, the above configuration is provided.
To form a plurality of active matrix display elements.
Placed on the motherboard in a direction perpendicular to the board
Common wiring for signal lines that short-circuits multiple signal lines
For common lines for scanning lines that short-circuit multiple scanning lines
The voltage application terminal is formed on one side of one of the original substrates.
In the state of motherboard, scanning line and signal line leak defect
Can be found, and for supplying inspection signals supplied from outside
Connection structure between the device and the voltage application terminal on one of the original substrates
Can shorten the inspection process and improve the inspection equipment.
Can be downsized.

Further, by providing the common wiring, it is possible to easily and reliably apply a voltage to a terminal to be applied at the time of inspection.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a motherboard of an active matrix display element according to an embodiment of the present invention.

FIG. 2 is a wiring diagram of signal lines, counter electrodes, and their terminals in the display element of FIG.

FIG. 3 is a wiring diagram of scanning lines and their terminals in the display element of FIG. 1;

[Explanation of symbols]

 1, 3 element substrate 2 Active matrix substrate 4 Injection port of display medium 5 Voltage application terminal 11a, 11b Signal line 12 Signal line common line 13a, 13b Scan line 14 Scan line common line 31 Counter electrode line 32 Counter electrode Common wiring

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Nobuyuki Kawase 22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka Inside Sharp Corporation (72) Inventor Kazuo Okamura 22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka Sharp Corporation (72) Inventor Tatsuya Sasaki 22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka Inside Sharp Corporation (56) References JP-A-2-222925 (JP, A) JP-A-58-209719 (JP, A) JP-A-1-130132 (JP, A) JP-A-55-4034 (JP, A) JP-A-5-19281 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) G02F 1/136 500 G02F 1/1343 G02F 1/13 101

Claims (2)

(57) [Claims] A display medium is sealed between two original substrates.
Cut the motherboard into multiple pieces to manufacture each display element
In an active matrix display element, a plurality of signal lines formed on one of the original substrates are short-circuited to each other.
A signal line common wiring signal line, and orthogonal to the plurality of signal lines formed on the one original substrate;
A common line for a scanning line that short-circuits a plurality of scanning lines, and a common line for the signal line formed on one side of the one original substrate.
A voltage application terminal of a wiring and a common wiring for the scanning line , and a display medium interposed between the one of the original substrates;
And the other original substrate having the opposite electrode provided.
Active matrix display device. 2. A display medium is sealed between two original substrates.
Cut the motherboard into multiple pieces to manufacture each display element
Method for manufacturing active matrix display elements
Te, orthogonal to one base substrate, a plurality of signal lines, and the signal lines double
Scan lines, a common arrangement for signal lines that short-circuits the signal lines.
Lines and common lines for scanning lines that short-circuit the scanning lines.
Forming a common line for the signal line and a common line for the scanning line.
Are formed on one side of the one original substrate.
Opposing one of the original substrates with a display medium interposed therebetween.
A step of arranging the other source substrate having electrodes facing each other, the step of arranging the common wiring for signal lines, the common wiring for scanning lines,
Defects in the display state of multiple display elements by applying voltage to the electrodes
An inspection step of detecting the motherboard , and a step of cutting out the plurality of motherboards after the inspection step.
Of active matrix type display element including process
Law.