CN214350507U

CN214350507U - Detachable one-time welding die for power semiconductor

Info

Publication number: CN214350507U
Application number: CN202022941290.3U
Authority: CN
Inventors: 邱珍华; 刘亚坤; 陈瑶
Original assignee: Zhejiang Tianyi Semiconductor Technology Co ltd
Current assignee: Zhejiang Tianyi Semiconductor Technology Co ltd
Priority date: 2020-12-11
Filing date: 2020-12-11
Publication date: 2021-10-08
Anticipated expiration: 2030-12-11

Abstract

The utility model relates to a semiconductor die field, concretely relates to disposable welding of power semiconductor detachable uses mould. The utility model relates to a disposable mould for welding of power semiconductor detachable, comprising a base plate, be equipped with the DBC locating hole on the bottom plate, pillar hole and curb plate mounting hole, install the multilayer support with the detachable mode on the pillar hole, be equipped with the row needle locating plate with the detachable mode on the multilayer support, be equipped with the chip locating plate with the detachable mode on the bottom plate, install a plurality of curb plates with the detachable mode on the curb plate mounting hole. The utility model provides a disposable welded, detachable power semiconductor mould.

Description

Detachable one-time welding die for power semiconductor

Technical Field

The utility model relates to a semiconductor die field, concretely relates to disposable welding of power semiconductor detachable uses mould.

Background

The power semiconductor module is formed by combining and encapsulating high-power electronic power devices into a whole according to a certain function. Power metal oxide semiconductor field effect transistors (power mosfets, often abbreviated as power mos), insulated gate bipolar transistors (igbt), and power integrated circuits (power ics, often abbreviated as pic) are the main. The devices or integrated circuits can work under very high frequency, and the circuits can save more energy and materials when working under high frequency, thereby greatly reducing the volume and the weight of equipment. A wide variety of semiconductor devices have become an important part of people's daily life, and are widely used in daily consumer products (such as washing machines), industrial fields (such as pumps), transportation (electric vehicles), and the like.

The die for semiconductor welding is used for positioning and welding original parts such as a copper bottom plate, a chip, a terminal, a pin header and the like. The existing die for welding the semiconductor has the following problems: 1. the mold is complex in shape and structure, high in manufacturing difficulty, high in processing cost and long in cost period. 2. The positioning of copper plates or single devices such as DBC plates, chips, terminal leads and the like can only be realized, the copper plates and the DBC plates are generally welded and divided into two steps of DBC and chips, terminals and leads, and the one-time full positioning of the devices related to the module processing process cannot be realized. And 3, the clamp cannot be flexibly adjusted according to requirements, and once the module is changed, the whole clamp is scrapped.

Disclosure of Invention

For solving the problems of the prior art, the utility model discloses hope to provide a disposable welded, detachable power semiconductor mould, concrete scheme is as follows:

the utility model provides a power semiconductor detachable is mould for one-time welding, includes the bottom plate, be equipped with the DBC locating hole on the bottom plate, pillar hole and curb plate mounting hole, install the multilayer support with detachable mode on the pillar hole, be equipped with the row needle locating plate with detachable mode on the multilayer support, be equipped with the chip locating plate with detachable mode on the bottom plate, install a plurality of curb plates with detachable mode on the curb plate mounting hole.

The side plates are provided with terminal fixing holes, and the terminal fixing holes are connected through fine grooves. The structure can be completed by one-time wire walking through wire cutting, and the terminal fixing holes are used for fixing the terminals.

The multilayer support is in a multilayer ladder shape, and the pin header positioning plate is provided with a plurality of blocks. Namely, the multilayer support is used for connecting and supporting a plurality of rows of needle positioning plates.

The bottom plate is provided with a bolt hole. The bolt hole is convenient for the installation of the bolt.

The chip positioning plate comprises an extension part. The design of extension can conveniently get and take.

The extension part extends 2-3 mm beyond the outer edge of the bottom plate. Can be conveniently taken.

The pin header positioning plate is provided with a pin header positioning hole and a supporting connecting hole, and is connected with the multilayer support through the supporting connecting hole. The pin header positioning hole can conveniently position the pin header.

The utility model relates to a disposable mould for welding of power semiconductor detachable has following advantage:

1. the die is completely in the shape of a perforated plate, and is convenient to process (linear cutting), short in time and low in cost.

2. The multi-layer plate structure can realize the one-time positioning of all parts such as the bottom plate, the chip, the terminal, the pin header and the like, and the welding can be carried out once without secondary welding.

3. The mould can be dismantled, assembles in a flexible way as required, and only the replacement corresponds the board can when having the change.

Drawings

FIG. 1 is a schematic view of a detachable disposable welding mold for power semiconductors according to the present invention;

FIG. 2 is an exploded view of a detachable disposable welding mold for a power semiconductor of the present invention;

FIG. 3 is a schematic view of a detachable middle bottom plate of a disposable welding mold for power semiconductors according to the present invention;

FIG. 4 is a first schematic view showing a side plate of a detachable one-time welding mold for a power semiconductor of the present invention;

FIG. 5 is a second schematic structural view of a detachable side plate of a disposable welding mold for power semiconductors according to the present invention;

FIG. 6 is a schematic view of a multi-layered support of a detachable one-time welding mold for power semiconductors according to the present invention;

FIG. 7 is a schematic view showing a structure of a pin header positioning plate of a detachable one-time welding die for a power semiconductor of the present invention;

FIG. 8 is a schematic view of a chip positioning plate of a detachable one-time welding mold for a power semiconductor of the present invention;

FIG. 9 is a schematic view showing a detachable disposable welding mold for power semiconductor of the present invention;

FIG. 10 is a schematic view of a sample of a detachable disposable welding mold for power semiconductors according to the present invention;

wherein the reference numbers: 1. a base plate; positioning holes of the DBC; 12. a strut hole; 13. a side plate mounting hole; 14. bolt holes; 2. a side plate; 21. a terminal fixing hole; 22. a fine groove; 3. a multilayer support; 4. a pin header positioning plate; 41. arranging needle positioning holes; 42. supporting the connecting hole; 5. chip positioning plates; 51. an extension portion.

Detailed Description

This is further illustrated below in connection with FIGS. 1-8:

the utility model provides a disposable mould for welding of power semiconductor detachable, comprising a base plate 1, be equipped with DBC locating hole 11 on bottom plate 1, pillar hole 12 and curb plate mounting hole 13, with detachable mode install multilayer support 3 on pillar hole 12, be equipped with row needle locating plate 4 with detachable mode on the multilayer support 3, be equipped with chip locating plate 5 with detachable mode on bottom plate 1 (be equipped with chip and components and parts locating hole on chip locating plate 5), install a plurality of curb plates 2 (be equipped with the arch like 2 bottoms of figure 4 or 5 curb plates, the arch is used for connecting bottom plate 1) with detachable mode on curb plate mounting hole 13.

The side plate 2 is provided with terminal fixing holes 21, and the terminal fixing holes 21 are connected by narrow grooves 22. The structure can be completed by one-time wire walking through wire cutting, and the terminal fixing holes 21 are used for fixing the terminals.

The multilayer support 3 is in a multilayer ladder shape, and the pin header positioning plate 4 is provided with a plurality of blocks (2 blocks in the figure 1 or 2). I.e. a multi-layer support 3 for connecting and supporting a number of rows of needle location plates 4.

The bottom plate 1 is provided with bolt holes 14. The bolt hole 14 facilitates the installation of the bolt.

The chip positioning plate 5 (the edge of the chip positioning plate 5 is cut to a certain depth so that the chip can be positioned to deeply contact the DBC board, and the specific depth depends on the maximum height of the chip and the solder) includes an extension 51. The extension 51 is designed to be easily accessible.

The extension 51 extends 2-3 mm beyond the outer edge of the base plate 1. Can be conveniently taken.

The pin header positioning plate 4 is provided with a pin header positioning hole 41 and a support connection hole 42, and the pin header positioning plate 4 is connected with the multilayer support 3 through the support connection hole 42. The pin header positioning hole 41 can facilitate positioning of the pin header.

The utility model relates to a disposable mould for welding of power semiconductor detachable has following advantage: 1. the whole die can realize the full positioning of the internal parts of the power module, and only one-time welding is needed without step-by-step welding. 2. All the components are in the shape of perforated plates, so that the processing is convenient and the cost is low. 3. Can assemble according to needs during the use, nimble high-efficient, removable interchangeable. 4. The supporting and the positioning of the multi-surface plate are effectively realized by the multi-layer support, so that the mold can be expanded.

The above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the same, and those skilled in the art can make various corresponding changes and modifications according to the present invention without departing from the spirit and the essence of the present invention, but these corresponding changes and modifications should fall within the protection scope of the appended claims of the present invention.

Claims

1. The utility model provides a power semiconductor detachable once only welds and uses mould which characterized in that: the bottom plate comprises a base plate, be equipped with the DBC locating hole on the bottom plate, pillar hole and curb plate mounting hole, install the multilayer support with detachable mode on the pillar hole, be equipped with the pin header locating plate with detachable mode on the multilayer support, be equipped with the chip locating plate with detachable mode on the bottom plate, install a plurality of curb plates with detachable mode on the curb plate mounting hole.

2. A detachable one-time soldering die for a power semiconductor according to claim 1, wherein: the side plates are provided with terminal fixing holes, and the terminal fixing holes are connected through fine grooves.

3. A detachable one-time soldering die for a power semiconductor according to claim 1, wherein: the bottom plate is provided with a bolt hole.

4. A detachable one-time soldering die for a power semiconductor according to claim 1, wherein: the chip positioning plate comprises an extension part.

5. A detachable one-time soldering die for a power semiconductor according to claim 4, wherein: the extension part extends 2-3 mm beyond the outer edge of the bottom plate.

6. A detachable one-time soldering die for a power semiconductor according to claim 1, wherein: the pin header positioning plate is provided with a pin header positioning hole and a supporting connecting hole, and is connected with the multilayer support through the supporting connecting hole.