CN214122375U - SMD thermistor divides material check out test set - Google Patents
SMD thermistor divides material check out test set Download PDFInfo
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- CN214122375U CN214122375U CN202022692802.7U CN202022692802U CN214122375U CN 214122375 U CN214122375 U CN 214122375U CN 202022692802 U CN202022692802 U CN 202022692802U CN 214122375 U CN214122375 U CN 214122375U
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Abstract
A sorting detection device for a chip thermistor comprises a mounting seat, a feeding assembly and a detection assembly, wherein the feeding assembly comprises a vibration disc and a material waiting table, the material waiting table is connected with a discharge end of the vibration disc, the detection assembly comprises a rotary driving piece, a material taking piece, a test piece, a defective material pipe and a discharging table, the rotary driving piece is arranged on the mounting seat, the defective material pipe is arranged on the mounting seat, the test piece is arranged on the mounting seat, the discharging table is arranged on the mounting seat, the rotary driving piece is used for driving the material taking piece to sequentially pass through the material waiting table, the test piece, the defective material pipe and the discharging table, the test piece comprises a supporting table and two test probes, the supporting table is arranged on the mounting seat, the two test probes are respectively arranged on the supporting table in a sliding manner, the material taking piece is driven to sequentially pass through the material waiting table, the test piece, the defective material pipe and the discharging table through the rotary driving piece, so that the chip thermistor can automatically test the resistance value, the detection efficiency can be improved, and meanwhile, the situation that the chip thermistor is missed to be detected can also be avoided.
Description
Technical Field
The utility model relates to a paster thermistor detects the field, especially relates to a paster thermistor divides material check out test set.
Background
The thermistor is a device with a resistance value capable of changing along with temperature change, and particularly, the thermistor can be divided into a positive temperature coefficient thermistor and a negative temperature coefficient thermistor, wherein the positive temperature coefficient thermistor is a thermistor with a resistance value capable of increasing along with temperature rise, the negative temperature coefficient thermistor is a thermistor capable of decreasing along with temperature rise, and the patch thermistor is a mounting thermistor, and compared with a traditional plug-in type thermistor, the mounting thermistor is more compact in structure.
In the actual production of the chip thermistor, one of the procedures is to test the resistance value of the chip thermistor, and the thermistors with the resistance values exceeding the specified range need to be selected. At present, the resistance value of the chip thermistor is mainly tested manually by workers, however, the chip thermistor is easy to leak and detect by manual operation of the workers, so that the testing quality of the chip thermistor is poor, the manual operation efficiency of the workers is low, and the submission of the chip thermistor is small, so that the work difficulty of the workers is further increased, and the detection efficiency is further reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, providing a paster thermistor divides material check out test set, can divide the material to detect the paster thermistor automatically to can improve detection efficiency, simultaneously, can also improve paster thermistor's detection quality.
The purpose of the utility model is realized through the following technical scheme:
a chip thermistor divides material check out test set, includes:
a mounting seat;
the feeding assembly comprises a vibrating disc and a material waiting table, the vibrating disc and the material waiting table are respectively arranged on the mounting seat, and the material waiting table is connected with the discharging end of the vibrating disc; and
the detecting assembly comprises a rotating driving piece, a material taking piece, a testing piece, a defective material pipe and a discharging platform, wherein the rotating driving piece is arranged on the mounting seat, the material taking piece is arranged on an output shaft of the rotating driving piece, the defective material pipe is arranged on the mounting seat, the testing piece is positioned between the defective material pipe and the material waiting platform, the discharging platform is arranged on the mounting seat, the discharging platform is arranged adjacent to the defective material pipe, and the rotating driving piece is used for driving the material taking piece to sequentially pass through the material waiting platform, the testing piece, the defective material pipe and the discharging platform;
the test piece includes brace table and two test probes, the brace table set up in on the mount pad, two the test probe respectively slide set up in on the brace table.
In one embodiment, the test piece further includes an insulating plate and two return springs, the insulating plate is disposed on the supporting table, the two test probes are respectively disposed on the insulating plate in a penetrating manner, one ends of the two return springs are respectively abutted against the insulating plate, and the other ends of the two return springs are abutted against the two test probes in a one-to-one correspondence manner.
In one embodiment, the test probe is a brass probe.
In one embodiment, the rotary driving member includes a lifting divider and an expansion frame, the lifting divider is disposed on the mounting base, the expansion frame is disposed on an output shaft of the lifting divider, and the material taking member is disposed on the expansion frame.
In one embodiment, the material taking part comprises a fixed block, a buffer spring, a buffer rod and a sucker, the fixed block is arranged on the expansion frame body, the buffer rod is slidably arranged in the fixed block, two ends of the buffer spring are respectively abutted against the buffer rod and the fixed block, and the sucker is arranged at one end of the buffer rod.
In one embodiment, the material taking part is provided with a plurality of material taking parts, and each material taking part is arranged on the expansion frame body respectively.
In one embodiment, the chip thermistor distribution detection device further comprises a classification assembly, the classification assembly comprises a sliding plate, a sliding driving piece, a distribution pipe and a plurality of distribution pipes, each distribution pipe is arranged on the mounting seat, the sliding driving piece is arranged on the mounting seat, the sliding plate is arranged on the mounting seat in a sliding mode, the sliding plate is connected with an output shaft of the sliding driving piece, one end of the distribution pipe is connected with the defective product pipe, the other end of the distribution pipe is connected with the sliding plate, and the sliding driving piece is used for driving the other end of the distribution pipe to slide between the distribution pipes.
In one embodiment, the sorting assembly further includes a plurality of storage barrels, each storage barrel is disposed on the mounting seat, and each storage barrel is connected to each material distributing pipe in a one-to-one correspondence manner.
In one embodiment, the sliding driving member includes a sliding motor and a belt, the sliding motor is disposed on the mounting seat, and two ends of the belt are respectively connected to an output shaft of the sliding motor and the sliding plate.
In one embodiment, the detection assembly further comprises an air claw and four clamping blocks, the air claw is arranged on the mounting base and located between the material waiting table and the supporting table, the four clamping blocks are respectively arranged on an output shaft of the air claw, and the air claw is used for driving the clamping blocks to be close to or far away from each other.
Compared with the prior art, the utility model discloses at least, following advantage has:
the utility model discloses a paster thermistor divides material check out test set, including mount pad, material loading subassembly and detection subassembly, the material loading subassembly includes vibration dish and waiting to expect the platform, vibration dish and waiting to expect the platform and set up respectively on the mount pad, and wait to expect the platform and be connected with the discharge end of vibration dish, the detection subassembly includes the rotation driving piece, get the material piece, the test piece, defective products material pipe and unloading platform, the rotation driving piece sets up on the mount pad, it sets up on the output shaft of rotation driving piece to get the material piece, defective products material pipe sets up on the mount pad, the test piece sets up on the mount pad, and the test piece is located defective products material pipe and wait to expect between the platform, the unloading platform sets up on the mount pad, and the unloading platform sets up adjacent defective products material pipe, the rotation driving piece is used for driving to get the material piece and pass through waiting to expect the platform in proper order, the test piece, defective products material pipe and unloading platform, the test piece includes brace table and two test probes, the supporting table is arranged on the mounting seat, the two test probes are arranged on the supporting table in a sliding mode respectively, the material taking part is driven by the rotating driving part which is arranged to sequentially pass through the material waiting table, the test piece, the defective product material pipe and the discharging table, so that the resistance value of the chip thermistor can be automatically tested, the detection efficiency can be improved, and meanwhile, the chip thermistor can be prevented from being missed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a chip thermistor sorting detection apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a partial structure of the SMD thermistor sorting detection apparatus shown in FIG. 1;
fig. 3 is a schematic view of a part of a test piece according to an embodiment of the present invention;
FIG. 4 is an enlarged view of part A of FIG. 2;
fig. 5 is a schematic structural diagram of a sorting assembly according to an embodiment of the present invention.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It is noted that as used herein, reference to an element being "connected" to another element also means that the element is "in communication" with the other element, and fluid can be in exchange communication between the two.
Referring to fig. 1, a chip thermistor distribution detection apparatus 10 includes a mounting base 100, a feeding assembly 200 and a detection assembly 300, wherein the feeding assembly 200 and the detection assembly 300 are respectively mounted on the mounting base 100, the feeding assembly 200 is used for continuously transferring a chip thermistor to the detection assembly 300, and the detection assembly 300 is used for detecting a resistance value of the chip thermistor.
Referring to fig. 1, the feeding assembly 200 includes a vibration tray 210 and a material waiting table 220, the vibration tray 210 and the material waiting table 220 are respectively disposed on the mounting base 100, and the material waiting table 220 is connected to a discharging end of the vibration tray 210.
It should be noted that the discharge end of the vibration tray 210 is connected to the material waiting table 220, so that the vibration tray 210 can arrange the chip thermistors on the material waiting table 220 in sequence, and the detection assembly 300 can take out the chip thermistors from the material waiting table 220.
Referring to fig. 1 and fig. 2, the detecting assembly 300 includes a rotary driving member 310, a material taking member 320, a testing member 330, a defective material tube 340 and a discharging table 350, the rotary driving member 310 is disposed on the mounting base 100, the material taking member 320 is disposed on an output shaft of the rotary driving member 310, the defective material tube 340 is disposed on the mounting base 100, the testing member 330 is located between the defective material tube 340 and the material waiting table 220, the discharging table 350 is disposed on the mounting base 100, the discharging table 350 is disposed adjacent to the defective material tube 340, and the rotary driving member 310 is configured to drive the material taking member 320 to sequentially pass through the material waiting table 220, the testing member 330, the defective material tube 340 and the discharging table 350.
It should be noted that the rotating driving member 310 can drive the material taking member 320 to rotate, and it should be noted that the material waiting table 220, the testing member 330, the defective material tube 340 and the material discharging table 350 are disposed around the rotating driving member 310, so that when the rotating driving member 310 drives the material taking member 320 to rotate, the material taking member 320 can sequentially pass through the material waiting table 220, the testing member 330, the defective material tube 340 and the material discharging table 350; since the vibrating tray 210 has arranged the chip thermistors in the material waiting table 220 in sequence, when the material taking piece 320 passes through the material waiting table 220, the material taking piece 320 can take one chip thermistor out of the material waiting table 220 and then transfer the chip thermistor to the testing piece 330, so that the testing piece 330 can perform contact test on the chip thermistors to determine the resistance value of the chip thermistors, then transfer the chip thermistors through the defective product pipe 340, if the chip thermistors are defective, the material taking piece 320 can transfer the chip thermistors to the blanking table 350, then the material taking piece 320 moves to the material waiting table 220 to take the materials, and the steps are repeated in a circulating manner, the resistance value of the chip thermistors is automatically tested, manual operation of workers is omitted, so that the detection efficiency can be effectively improved, meanwhile, as the chip thermistors are fed one by one, the missing detection can be effectively avoided, and the detection quality can be effectively improved.
Referring to fig. 3, in one embodiment, the testing unit 330 includes a supporting platform 331 and two testing probes 332, the supporting platform 331 is disposed on the mounting base 100, and the two testing probes 332 are slidably disposed on the supporting platform 331 respectively.
It should be noted that, the two test probes 332 are respectively slidably disposed on the supporting platform 331, so that, after the material taking component 320 drives the chip thermistor to be transferred to the upper side of the supporting platform 331, the material taking component 320 drives the chip thermistor to descend, so that two poles of the chip thermistor are connected to the two test probes 332 in a one-to-one correspondence manner, so as to be able to perform resistance value test on the chip thermistor, it should be noted that, in the process of testing the chip thermistor, the chip thermistor does not need to be separated from the material taking component 320, and therefore, the actions of discharging and taking materials can be omitted, so as to improve the detection efficiency of the chip thermistor, and in one embodiment, the test probes 332 are brass probes.
Referring to fig. 3, in an embodiment, the testing unit 330 further includes an insulating plate 333 and two return springs 334, the insulating plate 333 is disposed on the supporting table 331, the two testing probes 332 are respectively disposed on the insulating plate 333 in a penetrating manner, one ends of the two return springs 334 are respectively abutted against the insulating plate 333, and the other ends of the two return springs 334 are abutted against the two testing probes 332 in a one-to-one correspondence manner.
It should be noted that, the reset spring 334 is sleeved on the test probe 332, and two ends of the reset spring 334 are respectively abutted to the test probe 332 and the insulating plate 333, so that under the elastic acting force of the reset spring 334, the test probe 332 has a tendency of being far away from the insulating plate 333, so that when the material taking piece 320 drives the patch thermistor to be pressed down on the two test probes 332, the reset spring 334 is pushed and compressed, so that the test probe 332 can be in close contact with the patch thermistor, thereby avoiding misdetection due to poor contact, and improving the detection quality of the patch thermistor.
Referring to fig. 2, in one embodiment, the rotary driving member 310 includes a lifting type divider and an expanding frame 311, the lifting type divider is disposed on the mounting base 100, the expanding frame 311 is disposed on an output shaft of the lifting type divider, and the material taking member 320 is disposed on the expanding frame 311.
It should be noted that the lifting type divider can drive the extension frame body 311 to rotate and lift at the same time, and the lifting type divider is driven by a motor, and the material taking member 320 is mounted on the extension frame body 311, so that the lifting type divider can drive the material taking member 320 to rotate and lift at the same time; in one embodiment, the expansion frame 311 has a disk shape.
Referring to fig. 4, in an embodiment, the material taking member 320 includes a fixing block 321, a buffer spring 322, a buffer rod 323 and a suction cup 324, the fixing block 321 is disposed on the extension frame 311, the buffer rod 323 is slidably disposed in the fixing block 321, two ends of the buffer spring 322 are respectively abutted against the buffer rod 323 and the fixing block 321, and the suction cup 324 is disposed on one end of the buffer rod 323.
It should be noted that the fixing block 321 may be fixed on the extension frame 311 by screws, the buffering rod 323 is slidably disposed in the fixing block 321, specifically, a through hole is formed in the fixing block 321, the buffering rod 323 can slide in the through hole, further, the buffering spring 322 is sleeved on the buffering rod 323, and two ends of the buffering spring 322 are respectively abutted against the buffering rod 323 and the fixing block 321, and the buffering rod 323 is below the fixing block 321 along the gravity direction, so that the buffering rod 323 has a tendency to move away from the fixing block 321 downwards under the elastic force of the buffering spring 322, further, a suction cup 324 is mounted at the end of the buffering rod 323 away from the buffering spring 322, it should be noted that a through hole is also formed in the buffering rod 323, the through hole of the buffering rod 323 is communicated with the suction cup 324, and the end of the buffering rod 323 away from the suction cup 324 is connected with the vacuum generator, in this way, a negative pressure can be formed in the suction cup 324, so that the suction cup 324 can adsorb and fix the patch thermistor; when the suction cup 324 drives the chip thermistor to press down to the two test probes 332, the buffer spring 322 is also compressed, so that the pressure between the test probes 332 and the chip thermistor can be further enhanced, and therefore misdetection caused by poor contact is avoided.
In one embodiment, the material taking members 320 are provided in plurality, and each material taking member 320 is respectively disposed on the expansion frame body 311. It should be noted that the plurality of material taking members 320 are attached to the extension holder body 311, and the detection efficiency of the chip thermistor can be improved.
Referring to fig. 2 and 5, in an embodiment, the chip thermistor separation detection device 10 further includes a classification assembly 400, the classification assembly 400 includes a sliding plate 410, a sliding driving member 420, a separation tube 430 and a plurality of separation tubes 440, each separation tube 440 is respectively disposed on the mounting base 100, the sliding driving member 420 is disposed on the mounting base 100, the sliding plate 410 is slidably disposed on the mounting base 100, the sliding plate 410 is connected to an output shaft of the sliding driving member 420, one end of the separation tube 430 is connected to the defective material tube 340, the other end of the separation tube 430 is connected to the sliding plate 410, and the sliding driving member 420 is configured to drive the other end of the separation tube 430 to slide between the separation tubes 440.
It should be noted that, the connection pipe 430 is a flexible pipe, one end of the connection pipe 430 is connected to the defective product pipe 340, and the other end of the connection pipe 430 can slide between the material distribution pipes 440, in an embodiment, the sliding driving member 420 can be an air cylinder, since the defective chip thermistor can be moved into the defective product pipe 340 by the material taking member 320, the defective chip thermistor can enter the connection pipe 430, and can slide between the material distribution pipes 440 by setting the connection pipe 430, so that the defective chip thermistor can be classified according to the type of the defective product, for example, the defective chip thermistor can be classified into one type when the resistance value is too high, the one type when the resistance value is too low, and the one type when the detection fails, and the defective chip thermistor that needs to be retested can be classified into one type, so that the different types of chip thermistors can be directly distinguished by classification, and the subsequent classification work can be omitted, making detection more convenient.
Referring to fig. 5, in an embodiment, the sorting assembly 400 further includes a plurality of storage barrels 450, each storage barrel 450 is disposed on the mounting base 100, and each storage barrel 450 is connected to each material distributing pipe 440 in a one-to-one correspondence. Note that the storage cartridge 450 is used to store a defective chip thermistor.
Referring to fig. 5, in an embodiment, the sliding driving member 420 includes a sliding motor 421 and a belt 422, the sliding motor 421 is disposed on the mounting base 100, and two ends of the belt 422 are respectively connected to an output shaft of the sliding motor 421 and the sliding plate 410.
It should be noted that, a belt pulley is further installed on the installation base 100, the belt 422 is sleeved on the belt pulley and the output shaft of the sliding motor 421, and the sliding plate 410 is fixedly connected with the belt 422, so that when the belt 422 rotates, the sliding plate 410 can be driven to slide.
Referring to fig. 2, in an embodiment, the detecting assembly 300 further includes an air claw 360 and four clamping blocks 370, the air claw 360 is disposed on the mounting base 100, the air claw 360 is located between the material waiting table 220 and the supporting table 331, the four clamping blocks 370 are respectively disposed on the output shafts of the air claw 360, and the air claw 360 is used for driving the clamping blocks 370 to approach or depart from each other.
It should be noted that the four clamping blocks 370 are driven by the air gripper to approach each other, so that when the chip thermistor is placed on the four clamping blocks 370, the four clamping blocks 370 can adjust the position of the chip thermistor, and thus, when the chip thermistor is transferred to the test piece 330 by the subsequent suction cup 324, two electrodes of the chip thermistor can accurately contact with the two test probes 332, and further, the resistance value can be reliably detected.
Compared with the prior art, the utility model discloses at least, following advantage has:
the utility model discloses a paster thermistor divides material check out test set, including mount pad, material loading subassembly and detection subassembly, the material loading subassembly includes vibration dish and waiting to expect the platform, vibration dish and waiting to expect the platform and set up respectively on the mount pad, and wait to expect the platform and be connected with the discharge end of vibration dish, the detection subassembly includes the rotation driving piece, get the material piece, the test piece, defective products material pipe and unloading platform, the rotation driving piece sets up on the mount pad, it sets up on the output shaft of rotation driving piece to get the material piece, defective products material pipe sets up on the mount pad, the test piece sets up on the mount pad, and the test piece is located defective products material pipe and wait to expect between the platform, the unloading platform sets up on the mount pad, and the unloading platform sets up adjacent defective products material pipe, the rotation driving piece is used for driving to get the material piece and pass through waiting to expect the platform in proper order, the test piece, defective products material pipe and unloading platform, the test piece includes brace table and two test probes, the supporting table is arranged on the mounting seat, the two test probes are arranged on the supporting table in a sliding mode respectively, the material taking part is driven by the rotating driving part which is arranged to sequentially pass through the material waiting table, the test piece, the defective product material pipe and the discharging table, so that the resistance value of the chip thermistor can be automatically tested, the detection efficiency can be improved, and meanwhile, the chip thermistor can be prevented from being missed.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a paster thermistor divides material check out test set which characterized in that includes:
a mounting seat;
the feeding assembly comprises a vibrating disc and a material waiting table, the vibrating disc and the material waiting table are respectively arranged on the mounting seat, and the material waiting table is connected with the discharging end of the vibrating disc; and
the detecting assembly comprises a rotating driving piece, a material taking piece, a testing piece, a defective material pipe and a discharging platform, wherein the rotating driving piece is arranged on the mounting seat, the material taking piece is arranged on an output shaft of the rotating driving piece, the defective material pipe is arranged on the mounting seat, the testing piece is positioned between the defective material pipe and the material waiting platform, the discharging platform is arranged on the mounting seat, the discharging platform is arranged adjacent to the defective material pipe, and the rotating driving piece is used for driving the material taking piece to sequentially pass through the material waiting platform, the testing piece, the defective material pipe and the discharging platform;
the test piece includes brace table and two test probes, the brace table set up in on the mount pad, two the test probe respectively slide set up in on the brace table.
2. The chip thermistor distribution detection device of claim 1, wherein the test piece further comprises an insulating plate and two return springs, the insulating plate is disposed on the support table, the two test probes are respectively disposed on the insulating plate in a penetrating manner, one ends of the two return springs are respectively abutted against the insulating plate, and the other ends of the two return springs are abutted against the two test probes in a one-to-one correspondence manner.
3. The chip thermistor of claim 2, wherein the test probe is a brass probe.
4. The patch thermistor distribution detection device of claim 1, wherein the rotary driving member comprises a lifting divider and an expansion frame, the lifting divider is disposed on the mounting base, the expansion frame is disposed on an output shaft of the lifting divider, and the material taking member is disposed on the expansion frame.
5. The chip thermistor distribution detection device of claim 4, wherein the material taking part comprises a fixed block, a buffer spring, a buffer rod and a suction cup, the fixed block is arranged on the expansion frame body, the buffer rod is slidably arranged in the fixed block, two ends of the buffer spring are respectively abutted against the buffer rod and the fixed block, and the suction cup is arranged at one end of the buffer rod.
6. The patch thermistor distribution detection device of claim 4, wherein the plurality of material taking parts are provided, and each material taking part is respectively provided on the expansion frame body.
7. The chip thermistor distribution detection device of claim 1, further comprising a classification component, wherein the classification component comprises a sliding plate, a sliding driving member, a distribution pipe and a plurality of distribution pipes, each distribution pipe is respectively arranged on the mounting base, the sliding driving member is arranged on the mounting base, the sliding plate is slidably arranged on the mounting base and is connected with an output shaft of the sliding driving member, one end of the distribution pipe is connected with the defective material pipe, the other end of the distribution pipe is connected with the sliding plate, and the sliding driving member is used for driving the other end of the distribution pipe to slide between the distribution pipes.
8. The chip thermistor distribution detection device of claim 7, wherein the sorting assembly further comprises a plurality of storage barrels, each storage barrel is respectively arranged on the mounting base, and each storage barrel is connected with each distribution pipe in a one-to-one correspondence manner.
9. The chip thermistor distribution detection device of claim 7, wherein the sliding driving member comprises a sliding motor and a belt, the sliding motor is arranged on the mounting seat, and two ends of the belt are respectively connected with an output shaft of the sliding motor and the sliding plate.
10. The chip thermistor distribution detection device of claim 1, wherein the detection assembly further comprises an air claw and four clamping blocks, the air claw is arranged on the mounting base and located between the material waiting table and the supporting table, the four clamping blocks are respectively arranged on an output shaft of the air claw, and the air claw is used for driving each clamping block to approach or separate from each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022692802.7U CN214122375U (en) | 2020-11-18 | 2020-11-18 | SMD thermistor divides material check out test set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022692802.7U CN214122375U (en) | 2020-11-18 | 2020-11-18 | SMD thermistor divides material check out test set |
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| Publication Number | Publication Date |
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| CN214122375U true CN214122375U (en) | 2021-09-03 |
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| CN202022692802.7U Active CN214122375U (en) | 2020-11-18 | 2020-11-18 | SMD thermistor divides material check out test set |
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