CN219657737U

CN219657737U - Probe platform for wafer chip test

Info

Publication number: CN219657737U
Application number: CN202320176828.7U
Authority: CN
Inventors: 黄少娃; 黄旭彪; 刘政宏; 吴桂冠; 翁友民; 汪浩
Original assignee: Shenzhen Quanxing Technology Co ltd
Current assignee: Shenzhen Quanxing Technology Co ltd
Priority date: 2023-02-10
Filing date: 2023-02-10
Publication date: 2023-09-08
Anticipated expiration: 2033-02-10

Abstract

The utility model belongs to the field of wafer chips, in particular to a probe platform for testing the wafer chips, which aims at the problems that the existing probe drives the chips to move to influence the detected data when detecting the chips, and the wafer chips are thinner after being detected, and are inconvenient to take off from a detection table.

Description

Probe platform for wafer chip test

Technical Field

The utility model relates to the technical field of wafer chips, in particular to a probe platform for testing wafer chips.

Background

Wafers are wafers made of semiconductors, and have been commonly referred to as silicon wafers since silicon has been mainly used as a raw material. After a series of processing procedures, a circuit can be carved on the wafer, and then the wafer is cut into a plurality of chips with the same size as nails, namely, a cake or a pizza is made on one side, and the chips are mainly used for processing digital signals, logic operation and data storage, namely, the brain of an electronic product, and the wafer is detected by using a wafer probe platform in the wafer mechanism process.

When the existing wafer chip detection device is used, the existing wafer chip detection device has some defects:

1. the wafer chip is placed on the placing table during detection, the table surface is smooth and tidy, and the probe can drive the chip to move when touching and detecting the wafer chip, so that detection data is affected.

2. The wafer chip is the piece type, needs to place the wafer chip on the test bench when detecting, because its thickness is thinner, takes off relatively more trouble from the test bench after detecting, and the careless wafer chip that can cause the fish tail slightly.

Disclosure of Invention

The utility model provides a probe platform for wafer chip test, which solves the defects that in the prior art, when a probe detects a chip, the probe drives the chip to move to influence the detected data, and the wafer chip is thinner after the wafer chip is detected, and is inconvenient to take off from a detection platform.

The utility model provides the following technical scheme:

the probe platform for wafer chip test comprises a bottom plate, wherein an electric push rod is fixedly connected to the inside of the bottom plate, a supporting base is fixedly connected to an output shaft of the electric push rod, and an adsorption assembly for adsorbing is arranged in the supporting base;

four backup pads are fixedly connected with at the top of bottom plate, four be equipped with the lifting unit who goes up and down between backup pad and the support base.

In one possible design, the adsorption component comprises a vacuum pump fixedly connected in the support base, an air outlet of the vacuum pump fixedly penetrates through the support base through an air outlet pipe, an air inlet fixedly connected with connecting pipe of the vacuum pump, a placement plate is fixedly connected with the top of the support base, a vacuum groove is formed in the placement plate, the top end of the connecting pipe extends into the vacuum groove, and a plurality of air suction holes are formed in the top of the placement plate.

In a possible design, lifting unit is including locating the rotation groove of supporting the base both sides, be equipped with the rotor plate in the rotation groove, be located with one side two fixedly connected with rotates the cross axle between the backup pad, and rotates the cross axle and rotate and run through the rotor plate, the other end of rotor plate is equipped with the groove of stepping down, is located with one side two be equipped with the holder between the backup pad, the holder is close to one side of supporting the base and is equipped with the sliding tray, fixed connection fixed axle in the sliding tray, and the rotor plate extends to in the sliding tray, and the groove of stepping down is run through to the one end of fixed axle.

In one possible design, two support plates on the same side are respectively provided with a movable groove on one side, two movable shafts are respectively connected in the movable grooves in a sliding manner, and one sides, close to each other, of the two movable shafts are fixedly connected with the clamping frame.

In one possible design, two clamping frames are provided with clamping arc openings on one side, which is close to each other, and the surfaces of the clamping arc openings are provided with anti-skid patterns.

In one possible design, an observation tube is provided above the base plate.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.

According to the wafer clamping device, the rotating plate rotates on the rotating transverse shaft, when the supporting base descends, the two clamping frames ascend and are close to each other to clamp the wafer chip, and meanwhile, when the two clamping frames are far away from each other and descend, the supporting base can ascend to push the wafer chip upwards to release the clamping, so that the detected chip can be conveniently taken down.

In the utility model, the surface of the placing plate is provided with a plurality of air suction holes, the air in the vacuum groove can be pumped out through the vacuum pump, the vacuum groove is in a negative pressure state, and the chip can be adsorbed through the air suction holes, so that the chip is adhered to the surface of the air suction holes, and the probe is prevented from moving during testing.

According to the utility model, the two clamping frames are close to each other, the supporting base descends, the chip on the surface of the supporting base can be clamped, when the two clamping frames are far away from each other and the supporting base ascends, the monitored chip can be pushed upwards, the clamping is eliminated, the chip is conveniently taken out, and during detection, the gas in the vacuum groove is discharged, the vacuum groove is in a negative pressure state, the chip on the top of the placing plate can be adsorbed and fixed, and the chip is prevented from shifting.

Drawings

FIG. 1 is a schematic three-dimensional diagram of a probe platform for testing a wafer chip according to an embodiment of the present utility model;

FIG. 2 is a schematic three-dimensional view of a probe platform holder for wafer chip testing according to an embodiment of the present utility model;

FIG. 3 is an exploded view of a motion axis of a probe platform for wafer chip testing according to an embodiment of the present utility model;

fig. 4 is a three-dimensional cross-sectional view of a probe platform placement plate for wafer chip testing according to an embodiment of the present utility model.

Reference numerals:

1. a bottom plate; 2. a support plate; 3. a support base; 4. a clamping frame; 5. an observation lens barrel; 6. a rotating plate; 7. a fixed shaft; 8. a relief groove; 9. a sliding groove; 10. rotating the transverse shaft; 11. a rotating groove; 12. placing a plate; 13. clamping the arc opening; 14. a moving groove; 15. a movable shaft; 16. a vacuum pump; 17. a connecting pipe; 18. a vacuum tank; 19. an air suction hole; 20. an electric push rod.

Detailed Description

Embodiments of the present utility model will be described below with reference to the accompanying drawings in the embodiments of the present utility model.

In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled" and "mounted" should be interpreted broadly, and for example, "coupled" may or may not be detachably coupled; may be directly connected or indirectly connected through an intermediate medium. In addition, "communication" may be direct communication or may be indirect communication through an intermediary. Wherein, "fixed" means that the relative positional relationship is not changed after being connected to each other. References to orientation terms, such as "inner", "outer", "top", "bottom", etc., in the embodiments of the present utility model are merely to refer to the orientation of the drawings and, therefore, the use of orientation terms is intended to better and more clearly illustrate and understand the embodiments of the present utility model, rather than to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the embodiments of the present utility model.

In embodiments of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In the embodiment of the present utility model, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the utility model. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

Example 1

Referring to fig. 1 and 2, a probe platform for wafer chip test, including bottom plate 1, the internal fixation of bottom plate 1 has electric putter 20, and electric putter's output shaft fixedly connected with supports base 3, is equipped with the adsorption component that adsorbs in the support base 3, and the top fixedly connected with of bottom plate 1 four backup pads 2 are equipped with the lifting unit that goes up and down between four backup pads 2 and the support base 3.

Above-mentioned technical scheme supports the subassembly of adsorbing in the base 3 and four backup pads 2 and supports the lifting unit between the base 3, can reach and adsorb the wafer chip, control four backup pads 2 and support the base 3 and carry out the technological effect of lifting adjustment.

Referring to fig. 4, the adsorption assembly includes a vacuum pump 16 fixedly connected in the support base 3, an air outlet of the vacuum pump 16 fixedly penetrates through the support base 3 through an air outlet pipe, an air inlet of the vacuum pump 16 is fixedly connected with a connecting pipe 17, a top of the support base 3 is fixedly connected with a placing plate 12, a vacuum groove 18 is arranged in the placing plate 12, a top end of the connecting pipe 17 extends into the vacuum groove 18, and a plurality of air suction holes 19 are formed in the top of the placing plate 12.

According to the technical scheme, the vacuum pump 16 is started to discharge the gas in the vacuum groove 18, and the vacuum groove 18 is in a negative pressure state, so that the technical effect that the wafer chips are adsorbed on the surface of the placing plate 12 through the plurality of air suction holes 19 and are placed more stably can be achieved.

Referring to fig. 2, the lifting assembly includes a rotation groove 11 disposed on two sides of the support base 3, a rotation plate 6 is disposed in the rotation groove 11, a rotation transverse shaft 10 is fixedly connected between the two support plates 2 on the same side, the rotation transverse shaft 10 rotates to penetrate through the rotation plate 6, a yielding groove 8 is disposed at the other end of the rotation plate 6, a clamping frame 4 is disposed between the two support plates 2 on the same side, a sliding groove 9 is disposed on one side, close to the support base 3, of the clamping frame 4, a fixing shaft 7 is fixedly connected in the sliding groove 9, the rotation plate 6 extends into the sliding groove 9, and one end of the fixing shaft 7 penetrates through the yielding groove 8.

According to the technical scheme, the output shaft of the electric push rod 20 drives the supporting base 3 to descend, the supporting base 3 drives the rotating plates 6 at two ends to rotate downwards around the rotating transverse shaft 10, one ends, away from each other, of the two rotating plates 6 move in the corresponding sliding grooves 9, the clamping frames 4 are lifted, the moving shaft 15 on one side slides along the moving grooves 14, and the technical effect of driving the supporting base 3 and the two clamping frames 4 to move oppositely can be achieved.

Example 2

According to the technical scheme, the vacuum pump 16 is started to discharge the gas in the vacuum groove 18, and the vacuum groove 18 is in a negative pressure state, so that the wafer chips are adsorbed on the surface of the placing plate 12 through the plurality of air suction holes 19, and the wafer chips are placed more stably.

According to the technical scheme, the output shaft of the electric push rod 20 drives the supporting base 3 to descend, the supporting base 3 drives the rotating plates 6 at two ends to rotate downwards around the rotating transverse shaft 10, one ends, away from each other, of the two rotating plates 6 move in the corresponding sliding grooves 9, the clamping frames 4 are lifted, the moving shaft 15 on one side slides along the moving grooves 14, and the technical effect of driving the supporting base 3 and the two clamping frames 4 to move in the opposite direction can be achieved.

Referring to fig. 3, the two support plates 2 on the same side are provided with moving grooves 14 on the sides close to each other, moving shafts 15 are slidably connected in the two moving grooves 14, and the clamping frame 4 is fixedly connected to the side close to each other of the two moving shafts 15.

The technical proposal can achieve the technical effect of limiting the moving direction of the clamping frame 4 by moving the moving shaft 15 in the moving groove 14.

Referring to fig. 2, two clamping frames 4 are provided with clamping arc openings 13 on one side close to each other, and the surfaces of the clamping arc openings 13 are provided with anti-skid patterns.

The anti-skid patterns are arranged in the clamping arc opening 13 in the technical scheme, so that the wafer chips can be clamped conveniently, friction between the wafer chips and the edges of the wafer chips is increased, and the wafer chips are prevented from falling.

Referring to fig. 1, an observation barrel 5 is provided above a base plate 1.

The technical scheme can achieve the technical effect of being convenient for observing the test condition of the chip by observing the lens barrel 5.

However, as well known to those skilled in the art, the working principles and wiring methods of the vacuum pump 16 and the suction hole 19 are common, which are all conventional means or common general knowledge, and will not be described herein in detail, and those skilled in the art can perform any optional matching according to their needs or convenience.

The working principle and the using flow of the technical scheme are as follows: the wafer chip is placed on the placing plate 12, the vacuum pump 16 is started to discharge the gas in the vacuum groove 18, the vacuum groove 18 is in a negative pressure state, the wafer chip is adsorbed on the surface of the placing plate 12 through the plurality of suction holes 19, the suction holes 19 are started, the output shaft of the suction holes 19 contracts, the electric push rod 20 is electrified, the output shaft of the electric push rod 20 drives the supporting base 3 to descend, the supporting base 3 drives the rotating plates 6 at two ends to rotate downwards around the rotating transverse shaft 10, one ends, far away from each other, of the two rotating plates 6 move in the corresponding sliding grooves 9, the clamping frames 4 are lifted, the moving shaft 15 at one side slides along the moving grooves 14, the two clamping frames 4 are close to each other to clamp the wafer chip through the clamping arc openings 13, the observation lens barrel 5 is detected, the detection is completed, the supporting base 3 is driven to move upwards through the suction holes 19, the rotating plates 6 at two sides drive the clamping frames 4 to descend, the clamping of the wafer chip is relieved, the gas is conveyed in the vacuum groove 18 in the lifting driving process, and the wafer chip is separated from the wafer chip to be adsorbed.

The present utility model is not limited to the above embodiments, and any person skilled in the art can easily think about the changes or substitutions within the technical scope of the present utility model, and the changes or substitutions are intended to be covered by the scope of the present utility model; embodiments of the utility model and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims

1. The probe platform for wafer chip test is characterized by comprising a bottom plate (1), wherein an electric push rod (20) is fixedly connected in the bottom plate (1), an output shaft of the electric push rod (20) is fixedly connected with a support base (3), and an adsorption assembly for adsorbing is arranged in the support base (3);

four backup pads (2) are fixedly connected with at the top of bottom plate (1), four be equipped with the lifting unit who goes up and down between backup pad (2) and support base (3).

2. The probe platform for wafer chip testing according to claim 1, wherein the adsorption assembly comprises a vacuum pump (16) fixedly connected in the support base (3), an air outlet of the vacuum pump (16) fixedly penetrates through the support base (3) through an air outlet pipe, an air inlet of the vacuum pump (16) is fixedly connected with a connecting pipe (17), the top of the support base (3) is fixedly connected with a placing plate (12), a vacuum groove (18) is formed in the placing plate (12), the top end of the connecting pipe (17) extends into the vacuum groove (18), and a plurality of air suction holes (19) are formed in the top of the placing plate (12).

3. The probe platform for wafer chip testing according to claim 1, wherein the lifting assembly comprises rotating grooves (11) arranged on two sides of the supporting base (3), a rotating plate (6) is arranged in each rotating groove (11), a rotating transverse shaft (10) is fixedly connected between the two supporting plates (2) on the same side, the rotating transverse shaft (10) rotates to penetrate through the rotating plate (6), a yielding groove (8) is arranged at the other end of the rotating plate (6), a clamping frame (4) is arranged between the two supporting plates (2) on the same side, a sliding groove (9) is arranged on one side, close to the supporting base (3), of the clamping frame (4), a fixed shaft (7) is fixedly connected in each sliding groove (9), the rotating plate (6) extends into the sliding groove (9), and one end of the fixed shaft (7) penetrates through the yielding groove (8).

4. The probe platform for wafer chip testing according to claim 1, wherein the two support plates (2) located on the same side are respectively provided with a moving groove (14) on the side close to each other, moving shafts (15) are respectively connected in the two moving grooves (14) in a sliding manner, and the side close to each other of the two moving shafts (15) is fixedly connected with the clamping frame (4).

5. A probe platform for wafer chip testing according to claim 3, wherein two clamping frames (4) are provided with clamping arc openings (13) on one side close to each other, and the surfaces of the clamping arc openings (13) are provided with anti-skidding patterns.

6. The probe platform for wafer chip testing according to claim 1, wherein an observation lens barrel (5) is arranged above the bottom plate (1).