CN208992412U - A kind of double end wafer lapping machine - Google Patents
A kind of double end wafer lapping machine Download PDFInfo
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- CN208992412U CN208992412U CN201821730714.8U CN201821730714U CN208992412U CN 208992412 U CN208992412 U CN 208992412U CN 201821730714 U CN201821730714 U CN 201821730714U CN 208992412 U CN208992412 U CN 208992412U
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- pedestal
- sleeve
- spring
- lapping machine
- damping
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Abstract
The utility model discloses a kind of double end wafer lapping machines, including pedestal, there are two be ground mechanism for setting on the pedestal, two feed mechanisms and two aid mechanisms, the aid mechanism is set on the feed mechanism, the feed mechanism is for driving aid mechanism close to the grinding mechanism, the base bottom is provided with damping base, the pedestal is connect by damping mechanism with the damping base, it further include stabilization mechanism, the stabilization mechanism includes sleeve, spring and push plate, the sleeve is horizontally placed on damping base two sides, the push plate is set in the sleeve and can slide along the length sleeve direction, one end far from pedestal is connected on the inside of one end of the spring and the sleeve, the other end of the spring is connect with the push plate, it is provided with sliding slot along its length on the sleeve, connecting rod pass through sliding slot with The sleeve is hinged, and the other end of the connecting rod and the pedestal are hinged.The application can effectively reduce the vibration during equipment operation.
Description
Technical field
The utility model relates to rubber diaphragm fields, and in particular to a kind of double end wafer lapping machine.
Background technique
Wafer lapping machine is the equipment for rubber test piece being polished to certain thickness, other testing equipments being supplied to test, and double end is ground
Piece machine is the wafer lapping machine for having fine grinding simultaneously and roughly grinding two groups of workpiece polishing mechanisms.
Wherein, Chinese patent literature: CN203156490U discloses a kind of novel Plane surface grinding machine, including cabinet, sets on cabinet
There are device for grinding, sample feed arrangement and sample holding device.Device for grinding is connected with motor, and motor is set in cabinet, motor
Power is provided for device for grinding, drives device for grinding rotation.Sample feed arrangement is fixed on cabinet, and sample holding device is set
In on sample feed arrangement, sample feed arrangement drives sample holding device mobile.Above-mentioned wafer lapping machine is simple with mechanism, designs
Rationally, device for grinding and dust exhaust apparatus are an integral structure, small in size, save space, grinding accuracy is high, and easy to operate is excellent
Point.But wafer lapping machine can usually be vibrated when being polished, and influence grinding effect, therefore how reduce wafer lapping machine generation
This field urgent problem when vibration.
Summary of the invention
The technical problem to be solved by the present invention is to provide one kind can reduce a kind of double end grinding vibrated when processing
Machine.
In order to solve the above-mentioned technical problem, scheme provided by the utility model is: a kind of double end wafer lapping machine, including pedestal,
There are two grinding mechanism, two feed mechanisms and two aid mechanisms, the aid mechanisms to be set to institute for setting on the pedestal
It states on feed mechanism, for driving aid mechanism close to the grinding mechanism, the base bottom is provided with the feed mechanism
Damping base, the pedestal are connect by damping mechanism with the damping base, further include stabilization mechanism, the stabilization motivation
Structure includes sleeve, spring and push plate, and the sleeve is horizontally placed on damping base two sides, and the push plate is set in the sleeve
And can be slided along the length sleeve direction, one end far from pedestal is connected on the inside of one end of the spring and the sleeve, institute
The other end for stating spring is connect with the push plate, is provided with sliding slot on the sleeve along its length, and connecting rod passes through sliding slot and institute
State that sleeve is hinged, the other end of the connecting rod and the pedestal are hinged.
Further, the damping mechanism is spring damping mechanism.
Further, being provided with air suction opening above the pedestal, the pedestal side is provided with drawable dust and takes out
Drawer, the dust collection hole are connected to the dust collection drawer, and the dust takes out one side wall and is provided with multiple dust filtering mesh, in the pedestal
Portion is provided with blower and carries out exhausting for the dust collection drawer, and the pedestal is provided with air outlet close to the side of blower.
Further, the blower is centrifugal blower.
Further, being respectively arranged with two in grinding mechanism and two lateral edges of aid Mechanism Clearance on the pedestal
A positioning disk is provided with several pin holes in the disk circumferential direction of the positioning disk, and being hinged at positioning disk disk axle center can erect
It can be inserted into bolt to the dust board of rotation, in the pin hole to position the dust board.
Further, the dust board is transparent plastic sheet.
The utility model has the beneficial effects that the application passes through setting damping base, and it connect pedestal with damping base, from
And the vibration on vertical can be effectively reduced, by the way that sleeve is arranged, and spring is set in sleeve, so as to effectively subtract
Few vibration in the lateral direction.
Detailed description of the invention
Fig. 1 is the overall schematic of the utility model.
Figure label explanation: pedestal 1, grinding mechanism 2, feed mechanism 3, aid mechanism 4, damping base 51, damping mechanism
52, sleeve 61, spring 62, push plate 63, dust collection drawer 7, positioning disk 81, pin hole 82, dust board 83.
Specific embodiment
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, so that those skilled in the art
The utility model may be better understood and can be practiced, but illustrated embodiment is not as the restriction to the utility model.
As shown in Figure 1, a kind of double end wafer lapping machine, including pedestal 1, there are two be ground mechanism 2, two for setting on the pedestal 1
A feed mechanism 3 and two aid mechanisms 4, the aid mechanism 4 are set on the feed mechanism 3, and the feed mechanism 3 is used
Mechanism 4 is accommodated close to the grinding mechanism 2 in driving.
Specifically, as shown in Figure 1, two grinding mechanisms 2 are the different grinding wheel of thick, thin two groups of grinding accuracy, central rack
Motor is installed to connect with two groups of grinding wheels, motor is for driving grinding wheel to rotate；Accommodating mechanism 4 includes locating wheel, the wheel of locating wheel
Face is corresponding with the wheel face of grinding wheel, and sample cell is provided on the wheel face of locating wheel, eccentric wheel and block structure have been provided in sample cell
At retaining mechanism sample is clamped, the sample that it can be made to accommodate by rotational positioning wheel is towards grinding wheel；Wherein feed
Including being set on pedestal 1 and towards the slide unit that grinding wheel extends, locating wheel is slidably matched by bracket and slide unit, is passed through for mechanism 3
Driving mechanism drives locating wheel towards the mobile feed to complete sample of grinding wheel.
As shown in Figure 1, in this application, 1 bottom of pedestal is provided with damping base 51, the pedestal 1 passes through damping
Mechanism 52 is connect with the damping base 51, wherein damping mechanism 52 can be hydraulic damping mechanism or spring damping mechanism, lead to
Overdamp mechanism 52 can effectively reduce the vibration of the application in the vertical direction.
As shown in Figure 1, including additionally stabilization mechanism, specifically, the stabilization mechanism includes sleeve 61, spring 62
With push plate 63, wherein sleeve 61 includes two, two sleeves 61 its be horizontally fixed on respectively in the level of 51 two sides of damping base
On face, the push plate 63 is the circular slab that diameter is slightly less than 61 internal diameter of sleeve, can be in sleeve 61 along the sleeve 61
Length direction sliding, one end of spring 62 and 61 inside of the sleeve are connected far from one end of pedestal 1, the spring 62 it is another
End and the disc face of the push plate 63 are connected, and the push plate 63 and one end of a connecting rod are hinged, the other end of the connecting rod and institute
It is hinged to state pedestal 1, it is sliding along 61 length direction of sleeve for connecting rod to offer sliding slot on the stack shell of middle sleeve 61 along its length
It is dynamic.
When processing, the shake on left and right directions occurs for pedestal 1, at this point, connecting rod drives push plate 63 to squeeze spring 62,
Spring 62 plays damping action at this time, so as to effectively reduce the shake of the generation of pedestal 1.
On the basis of the above, as shown in Figure 1, being provided with air suction opening above the pedestal 1, it is preferred that air suction opening is located at mill
Piece mechanism 2 carries out the lower section of grinding position, and the pedestal 1 is internally provided with cavity, and the side side wall of the cavity and pedestal 1 connects
It is logical, dust collection drawer 7 is provided in cavity, dust collection drawer 7 can be pulled out to drawer outside, the dust collection hole and the dust collection drawer 7
Connection, the dust collection drawer one side wall are provided with multiple dust filtering mesh, and blower is equipped in 1 internal cavities of pedestal for institute
It states dust collection drawer 7 and carries out exhausting, the pedestal 1 is provided with air outlet close to the side of blower, which can be centrifugal blower.
By blower, the dust in dust collection hole can be pumped into dust collection drawer 7, when dust collection drawer 7 is filled with dust
When, then it can pull out drawer and be cleared up, dust filtering hole is for preventing dust into running out of outside dust collection drawer 7.
In addition, being fixedly installed with semicircle in two lateral edges in grinding mechanism 2 and aid 4 gap of mechanism on the pedestal 1
The positioning disk 81 of shape, offers multiple pin holes 82 in the disk circumferential direction of the positioning disk 81, hinged at 81 axle center of positioning disk
There is dust board 83, can be inserted into bolt in the pin hole 82 and the dust board 83 is positioned.
When feeding, dust-break is now placed into level, making it not influences to operate aid mechanism 4, after the completion of feeding,
It is arranged obliquely horizontal by angle in vertical rotating dust board 83, thus when value dust drops into during grinding
1 outside of pedestal, is unable to collected by dust collection hole.
Preferably, in order to not block sight in processing, the dust board 83 is transparent plastic sheet.
Embodiment described above is only preferred embodiments for fully illustrating the utility model, the utility model
Protection scope it is without being limited thereto.Those skilled in the art made equivalent substitute or change on the basis of the utility model
It changes, both is within the protection scope of the present invention.The protection scope of the utility model is subject to claims.
Claims (6)
1. a kind of double end wafer lapping machine, including pedestal, there are two grinding mechanism, two feed mechanisms and two for setting on the pedestal
Mechanism is accommodated, the aid mechanism is set on the feed mechanism, and the feed mechanism is for driving aid mechanism close to institute
State grinding mechanism, which is characterized in that the base bottom is provided with damping base, and the pedestal is subtracted by damping mechanism with described
Pedestal connection is shaken, further includes stabilization mechanism, the stabilization mechanism includes sleeve, spring and push plate, and the sleeve level is set
Damping base two sides are placed in, the push plate is set in the sleeve and can slide along the length sleeve direction, the spring
One end and the sleeve on the inside of one end far from pedestal be connected, the other end of the spring is connect with the push plate, the set
Sliding slot is provided on cylinder along its length, connecting rod passes through sliding slot and the sleeve is hinged, the other end of the connecting rod and the base
Seat is hinged.
2. a kind of double end wafer lapping machine as described in claim 1, which is characterized in that the damping mechanism is spring damping mechanism.
3. a kind of double end wafer lapping machine as described in claim 1, which is characterized in that be provided with air suction opening above the pedestal, institute
It states pedestal side and is provided with drawable dust collection drawer, the air suction opening is connected to the dust collection drawer, the dust collection drawer one
Side wall is provided with multiple dust filtering mesh, and the base interior is provided with blower and carries out exhausting, the base for the dust collection drawer
The side for seating against nearly blower is provided with air outlet.
4. a kind of double end wafer lapping machine as claimed in claim 3, which is characterized in that the blower is centrifugal blower.
5. a kind of double end wafer lapping machine as described in claim 1, which is characterized in that close to grinding mechanism and aid on the pedestal
It is respectively set in two lateral edges of Mechanism Clearance there are two positioning disk, is provided with several pin holes in the disk circumferential direction of the positioning disk,
Be hinged at positioning disk disk axle center can vertical rotating dust board, can be inserted into bolt in the pin hole to the dust board
It is positioned.
6. a kind of double end wafer lapping machine as claimed in claim 5, which is characterized in that the dust board is transparent plastic sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821730714.8U CN208992412U (en) | 2018-10-24 | 2018-10-24 | A kind of double end wafer lapping machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821730714.8U CN208992412U (en) | 2018-10-24 | 2018-10-24 | A kind of double end wafer lapping machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208992412U true CN208992412U (en) | 2019-06-18 |
Family
ID=66805634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821730714.8U Active CN208992412U (en) | 2018-10-24 | 2018-10-24 | A kind of double end wafer lapping machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208992412U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025451A (en) * | 2020-09-11 | 2020-12-04 | 江苏省交通工程集团百润工程检测有限公司 | Double-end abrasive disc machine |
-
2018
- 2018-10-24 CN CN201821730714.8U patent/CN208992412U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025451A (en) * | 2020-09-11 | 2020-12-04 | 江苏省交通工程集团百润工程检测有限公司 | Double-end abrasive disc machine |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 No. 21 Wangwu Road, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Jiangsu Yushun Engineering Inspection Technology Service Co., Ltd. Address before: 215000 No. 21 Wangwu Road, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Suzhou three Xin Civil Air Defense Engineering Inspection Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |