CN217369299U

CN217369299U - Material sucking mechanism of laser chip testing and sorting machine

Info

Publication number: CN217369299U
Application number: CN202220988667.7U
Authority: CN
Inventors: 邓艳汉; 苏婷
Original assignee: Quanzhou Lambda Instrument Equipment Co ltd
Current assignee: Quanzhou Lambda Instrument Equipment Co ltd
Priority date: 2022-04-27
Filing date: 2022-04-27
Publication date: 2022-09-06
Anticipated expiration: 2032-04-27

Abstract

The utility model relates to a material suction mechanism of a laser chip testing and sorting machine, which comprises a material suction seat arranged above a blue membrane disc, wherein a plurality of laser chips are placed on the top surface of the blue membrane disc, a suction nozzle mounting seat driven by a driving mechanism to lift is arranged on the front side of the material suction seat, and a chip suction nozzle is arranged on the suction nozzle mounting seat; the device is characterized by also comprising an ejector pin mechanism which is arranged below the blue film plate and corresponds to the position of the chip suction nozzle, wherein the ejector pin mechanism comprises an ejector pin base, an ejector pin through hole is arranged in the middle of the top surface of the ejector pin base, and a plurality of negative pressure adsorption holes are arranged on the outer side of the ejector pin through hole; the inside of thimble seat is equipped with the negative pressure cavity with negative pressure adsorption hole intercommunication, be provided with in the negative pressure cavity and upwards run through the fenestrate thimble of thimble by the elevating system drive. The utility model has the advantages of reasonable design, the chip suction nozzle that utilizes the liftable cooperatees with the thimble, is convenient for get material, convenient to use to single laser chip.

Description

Material sucking mechanism of laser chip testing and sorting machine

The technical field is as follows:

the utility model relates to a laser chip tests inhaling of sorter and expects mechanism.

Background art:

currently, laser chips are tested in a strip, and a chip strip contains 80 chips, and a single test is performed on one chip. However, after testing a laser chip, the laser chip needs to be separated into individual chips, chip damage exists in the separation process, the damaged chips are tested after being packaged, 10% of defective products exist, and the defective products cause waste of packaged materials and process time. If single test can be adopted, the waste of packaged materials and process time can be effectively avoided, and the production efficiency can be improved. In view of this, in order to meet the requirement of single test of the laser chip, it is necessary to design a corresponding material suction mechanism so as to facilitate the material taking of the single chip.

The utility model has the following contents:

the utility model discloses make the improvement to the problem that above-mentioned prior art exists, promptly the utility model aims to solve the technical problem that a laser chip test sorter inhales material mechanism and working method are provided, reasonable in design is convenient for get the material to single laser chip.

In order to realize the purpose, the utility model discloses a technical scheme is: the utility model provides a laser chip test sorter inhale material mechanism, is including locating the material seat of inhaling above the blue membrane dish, the front side of inhaling the material seat is equipped with the suction nozzle mount pad that is driven by actuating mechanism to go up and down, be provided with the chip suction nozzle on the suction nozzle mount pad.

Furthermore, the driving mechanism comprises an eccentric rotating block, a sliding rod, a sliding seat and a vertical sliding rail, the vertical sliding rail is arranged on the front side surface of the material suction seat, one end of the sliding seat is in sliding fit with the vertical sliding rail, and the other end of the sliding seat is provided with a transverse sliding chute; the eccentric rotating block is driven to rotate by a driving motor, the rear end of the sliding rod is eccentrically connected with the eccentric rotating block, and the front end of the sliding rod extends into the transverse sliding groove and is in sliding fit with the transverse sliding groove; the suction nozzle mounting seat is fixed on the sliding seat.

Furthermore, the inside of suction nozzle mount pad is equipped with vertical mounting hole, the inside slip of vertical mounting hole is worn to be equipped with the negative pressure connecting pipe, the chip suction nozzle is installed at the lower extreme of negative pressure connecting pipe.

Furthermore, a U-shaped limiting block with an opening facing the rear side is fixed at the top of the suction nozzle mounting seat, the negative pressure connecting pipe is in a ladder shape with a large upper end size and a small lower end size, the upper end of the negative pressure connecting pipe is accommodated in the U-shaped limiting block, and a pair of flat positions is arranged on the outer wall of the upper end of the negative pressure connecting pipe.

Furthermore, a connecting screw is screwed on the outer wall of the upper end of the negative pressure connecting pipe and extends out of an opening of the U-shaped limiting block; the rear side of vertical mounting hole is equipped with vertical through-hole A, vertical extension spring that is provided with in vertical through-hole A's inside, extension spring's lower extreme is connected with vertical through-hole A's lateral wall, and vertical through-hole A is stretched out and is connected with connecting screw in extension spring's upper end.

Further, a linear bearing A is arranged between the negative pressure connecting pipe and the vertical mounting hole.

The chip vacuum suction device is characterized by further comprising an ejector pin mechanism which is arranged below the blue film plate and corresponds to the position of a chip suction nozzle, wherein the ejector pin mechanism comprises an ejector pin base, an ejector pin through hole is formed in the middle of the top surface of the ejector pin base, and a plurality of negative pressure adsorption holes are formed in the outer side of the ejector pin through hole; the inside of thimble seat is equipped with the negative pressure cavity with negative pressure adsorption hole intercommunication, be provided with in the negative pressure cavity and upwards run through the fenestrate thimble of thimble by the elevating system drive.

Further, the thimble seat comprises a thimble base and a thimble sleeve sleeved outside the upper end of the thimble base, a vertical through hole B is formed in the middle of the thimble base, and the vertical through hole B is communicated with the inside of the thimble sleeve to form a negative pressure cavity; the thimble through hole and the negative pressure adsorption hole are both arranged on the top surface of the thimble sleeve; the thimble structure is characterized in that a thimble clamp is arranged in the upper end of the thimble sleeve, a vertical clamping hole used for containing a thimble is formed in the middle of the upper end of the thimble clamp, and the lower end of the thimble clamp is connected with the lifting mechanism.

Further, the lifting mechanism comprises a vertical connecting rod, an eccentric wheel, a connecting block and a lifting motor, the vertical connecting rod is in sliding fit with the vertical through hole B through a linear bearing B, and the upper end of the vertical connecting rod is connected with the lower end of the ejector pin clamp; the lifting motor is transversely arranged, a motor shaft of the lifting motor is connected with the middle part of one end of the eccentric wheel, the other end of the eccentric wheel is connected with the lower end of the connecting block, and the upper end of the connecting block is connected with the lower end of the vertical connecting rod through a connecting piece.

Compared with the prior art, the utility model discloses following effect has: the utility model has the advantages of reasonable design, the chip suction nozzle that utilizes the liftable cooperatees with the thimble, is convenient for get material, convenient to use to single laser chip.

Description of the drawings:

FIG. 1 is a schematic perspective view of an embodiment of the present invention;

FIG. 2 is a schematic view of the structure of the embodiment of the present invention cooperating with the thimble mechanism;

FIG. 3 is a schematic perspective view of a nozzle mount in an embodiment of the present invention;

FIG. 4 is a schematic front sectional view of a nozzle mount according to an embodiment of the present invention;

FIG. 5 is a schematic side view of a nozzle mount according to an embodiment of the present invention;

FIG. 6 is a schematic perspective view of a negative pressure connection pipe according to an embodiment of the present invention;

fig. 7 is a schematic perspective view of an ejector pin mechanism in an embodiment of the present invention;

FIG. 8 is a schematic view of the fitting structure of the thimble seat and the lifting mechanism in the embodiment of the present invention;

fig. 9 is a schematic perspective view of an embodiment of the present invention;

FIG. 10 is a schematic sectional view of the thimble seat in the embodiment of the present invention;

FIG. 11 is a schematic perspective view of an embodiment of a thimble holder according to the present invention;

fig. 12 is a schematic perspective view of a thimble sleeve according to an embodiment of the present invention.

In the figure:

100-a thimble mechanism; 101-blue film disk; 102-thimble seat; 103-thimble perforation; 104-negative pressure adsorption holes; 105-a lifting mechanism; 106-ejector pins; 107-thimble base; 108-an ejector pin sleeve; 109-vertical through holes; 110-a negative pressure chamber; 111-thimble clamp; 112-vertical clamping holes; 113-radial through hole; 114-vertical connection holes; 115-connecting screw holes; 116-a vertical link; 117-eccentric wheel; 118-a connection block; 119-a lifting motor; 120-a pumping cavity; 121-air extraction holes; 122-gas guiding groove; 123-rotating table; 124-linear bearing B; 125-XY axis electric adjusting sliding table; the sliding table is manually adjusted by 126-XY axes; 127-a membrane disc holder; 128-membrane disc fixing block; 129-pressing the membrane disc; 130-a tension spring; 131-a sealing ring; 132-a gasket; 133-a support seat;

201-material suction seat; 202-nozzle mount; 203-chip suction nozzle; 204-eccentric rotating block; 205-sliding bar; 206-sliding seat; 207-vertical slide rail; 208-a transverse chute; 209-vertical mounting holes; 210-a negative pressure connecting pipe; 211-pneumatic joint; 212-U-shaped limiting blocks; 213-flat position; 214-attachment screws; 215-vertical through hole a; 216-an extension spring; 217-linear bearing a; 218-drive motor.

The specific implementation mode is as follows:

the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description of the present invention, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

As shown in fig. 1 to 12, the material suction mechanism of the laser chip testing and sorting machine of the present invention comprises a material suction seat 201 disposed above a blue membrane disc 101, wherein a plurality of laser chips are disposed on the top surface of the blue membrane disc, a suction nozzle mounting seat 202 driven by a driving mechanism to lift is disposed on the front side of the material suction seat 201, and a chip suction nozzle 203 is disposed on the suction nozzle mounting seat 202; the device is characterized by further comprising an ejector pin mechanism 100 which is arranged below the blue film disc 101 and corresponds to the position of a chip suction nozzle, wherein the ejector pin mechanism 100 comprises an ejector pin base 102, an ejector pin through hole 103 is formed in the middle of the top surface of the ejector pin base 102, and a plurality of negative pressure adsorption holes 104 are formed in the outer side of the ejector pin through hole 103; a negative pressure chamber 110 communicated with the negative pressure adsorption hole 104 is arranged in the thimble seat 102, and a thimble 106 driven by a lifting mechanism 105 to penetrate through the thimble through hole 103 upwards is arranged in the negative pressure chamber 110. When the device works, the laser chips corresponding to the positions of the negative pressure adsorption holes on the blue film disc are adsorbed by the negative pressure adsorption holes at the top of the ejector pin base, then the ejector pins are driven by the lifting mechanism to move upwards and penetrate through the ejector pins to be punched, the blue films are upwards jacked by the ejector pins, then the suction nozzle mounting base is driven by the driving mechanism to move downwards, and the laser chips jacked by the ejector pins are adsorbed by the chip suction nozzles to realize material adsorption.

In this embodiment, as shown in fig. 1, the driving mechanism includes an eccentric rotating block 204, a sliding rod 205, a sliding seat 206, and a vertical sliding rail 207, the vertical sliding rail 207 is installed on the front side surface of the material suction seat 201, one end of the sliding seat 206 is in sliding fit with the vertical sliding rail 207, and the other end of the sliding seat 206 is provided with a horizontal sliding groove 208; the eccentric rotating block 204 is driven to rotate by a driving motor 218, the rear end of the sliding rod 205 is eccentrically connected with the eccentric rotating block 204, and the front end of the sliding rod 205 extends into the transverse sliding groove 208 and is in sliding fit with the transverse sliding groove; the nozzle mount 202 is fixed to a slide mount 206. During operation, the driving motor drives the sliding rod to rotate through driving the eccentric rotating block, the sliding rod is in sliding fit with the transverse sliding groove in the rotating process and drives the sliding seat to slide up and down along the vertical sliding rail, and the sliding seat drives the suction nozzle mounting seat to move synchronously, so that the chip suction nozzle is lifted.

In this embodiment, as shown in fig. 4 and 5, a vertical mounting hole 209 is formed inside the suction nozzle mounting seat 206, a negative pressure connection pipe 210 is slidably inserted into the vertical mounting hole 209, an upper end of the negative pressure connection pipe 210 is connected with a pneumatic connector 211, and the chip suction nozzle 203 is inserted into a lower end of the negative pressure connection pipe 210 and locked by a set screw.

In this embodiment, as shown in fig. 3 and 5, a U-shaped stopper 212 with an opening facing the rear side is fixed at the top of the suction nozzle mounting seat 202, the negative pressure connecting pipe 210 is in a step shape with a large upper end and a small lower end, the step surface contacts with the top surface of the suction nozzle mounting seat in a normal state, the upper end of the negative pressure connecting pipe 210 is accommodated inside the U-shaped stopper 212, the outer wall of the upper end of the negative pressure connecting pipe 210 is provided with a pair of flat positions 213, the flat positions are used for left and right limitation, rotation during laser chip adsorption is avoided, and it is ensured that the negative pressure connecting pipe can only move vertically.

In this embodiment, the outer wall of the upper end of the negative pressure connecting pipe 210 is screwed with a connecting screw 214, and the connecting screw 214 extends out of the opening of the U-shaped limiting block 212; the rear side of the vertical mounting hole 209 is provided with a vertical through hole A215, an extension spring 216 is vertically arranged in the vertical through hole A215, the lower end of the extension spring 216 is connected with the side wall of the vertical through hole A215, and the upper end of the extension spring 216 extends out of the vertical through hole A and is connected with a connecting screw 215. When the chip suction nozzle is matched with the ejector pin to adsorb the laser chip, the chip suction nozzle and the negative pressure connecting pipe move upwards, the chip suction nozzle is connected with the upper end of the negative pressure connecting pipe through the extension spring, and the negative pressure connecting pipe is driven to reset downwards by the elasticity of the extension spring.

In this embodiment, in order to guide the vertical movement of the negative pressure connection pipe and the chip suction nozzle, a linear bearing a217 is disposed between the negative pressure connection pipe 210 and the vertical mounting hole 209.

In this embodiment, as shown in fig. 8, 9 and 10, the thimble seat 102 includes a T-shaped thimble base 107 and a thimble sleeve 108 sleeved outside an upper end of the thimble base 107, a vertical through hole B109 is formed in a middle portion of the thimble base 107, and the vertical through hole B109 is communicated with an interior of the thimble sleeve 108 to form a negative pressure chamber 110; the thimble through hole 103 and the negative pressure suction hole 104 are both arranged on the top surface of the thimble sleeve 108.

In this embodiment, a thimble clamp 111 is arranged inside the upper end of the thimble sleeve 108, a vertical clamping hole 112 for accommodating the thimble 106 is arranged in the middle of the upper end of the thimble clamp 111, a radial through hole 113 is communicated with the lower end of the vertical clamping hole 112, and a thimble locking screw for locking the thimble is screwed in the radial through hole; the lower end of the thimble clamp 111 is provided with a vertical connecting hole 114, the side wall of the vertical connecting hole 114 is provided with a connecting screw hole 115, and a connecting rod locking screw is screwed in the connecting screw hole. As shown in fig. 3 and 4, the lifting mechanism 105 includes a vertical connecting rod 116, an eccentric wheel 117, a connecting block 118 and a lifting motor 119, the vertical connecting rod 116 is slidably fitted with the vertical through hole 109 through a linear bearing B124, and the upper end of the vertical connecting rod 116 extends into the vertical connecting hole 114 and is locked by a connecting rod locking screw; the lifting motor 119 is transversely arranged, a motor shaft of the lifting motor 119 is connected with the middle part of one end of the eccentric wheel 117, the other end of the eccentric wheel 117 is eccentrically connected with the lower end of the connecting block 118, and the upper end of the connecting block 118 is connected with the lower end of the vertical connecting rod 116 through a connecting piece. During operation, the lifting motor drives the eccentric wheel to rotate, the eccentric wheel drives the vertical connecting rod to slide up and down along the vertical through hole through the connecting block, and the vertical connecting rod drives the ejector pin to move up and down through the ejector pin fixture so as to realize lifting of the ejector pin.

In this embodiment, as shown in fig. 10, an annular air pumping cavity 120 is disposed on a side wall of a lower end of the vertical through hole B109, an air pumping hole 121 is disposed on a side wall of the air pumping cavity 120, and the air pumping hole is used for connecting a negative pressure generating apparatus through a pipeline; the upper end side wall of the vertical through hole 109 is provided with a pair of air guide grooves 122 extending vertically, the lower end of the air guide grooves 122 is communicated with the air suction cavity 120, and the upper end of the air guide grooves 122 is communicated with the inside of the upper end of the thimble sleeve 108. When the ejector pin sleeve works, the inner part of the upper end of the ejector pin sleeve, the pair of air guide grooves, the annular air exhaust cavity and the air exhaust hole are communicated, and the negative pressure generating equipment sucks air through the air exhaust hole to form a negative pressure structure.

In this embodiment, a rotating table 123 driven by a rotating motor to rotate is arranged below the thimble seat 102, an XY-axis electric adjusting sliding table 125 is arranged on the rotating table 123, an annular film disc fixing frame 127 is arranged on the XY-axis electric adjusting sliding table 125, the blue film disc 101 is arranged on the film disc fixing frame 127, and the XY-axis electric adjusting sliding table can be used for automatically adjusting the position of the blue film disc along the X-axis (i.e. transverse) and the Y-axis (i.e. longitudinal) directions.

In this embodiment, in order to adjust the position of the ejector pin in the initial state, the XY axis manual adjustment sliding table 126 is installed in the middle of the rotating table 123, the support seat 137 is installed on the XY axis manual adjustment sliding table 126, and the ejector pin base 102 is installed on the top of the support seat 133. The XY-axis manual adjusting sliding table can be used for manually adjusting the position of the thimble along the X-axis (namely, the transverse direction) and the Y-axis direction (namely, the longitudinal direction).

It should be noted that, the XY-axis electric adjustment sliding table and the XY-axis manual adjustment sliding table are the prior art, the XY-axis electric adjustment sliding table includes a pair of X-axis slide rails mounted on the rotating table, the pair of X-axis slide rails are connected with an X-axis moving frame in a sliding manner, and the X-axis moving frame is driven by a transverse synchronous belt to slide along the X-axis slide rails; the X-axis moving frame is provided with a Y-axis sliding rail, the Y-axis moving frame is connected onto the Y-axis sliding rail in a sliding mode and driven by a longitudinal synchronous belt to slide along the Y-axis sliding rail, and the film disc fixing frame is arranged on the Y-axis moving frame; the XY-axis manual adjustment sliding table adopts a manual adjustment mode, and the specific structures and the working principle of the XY-axis manual adjustment sliding table are not repeated and described.

In this embodiment, one end of the film disc fixing frame 127 is provided with a pair of film disc fixing blocks 128, the film disc fixing blocks 128 are used for being arranged at the upper end of the outer edge of the blue film disc in a pressing manner, and one side surface of the film disc fixing blocks 128 close to the blue film disc 101 is an inclined surface; the other end of the membrane disc fixing frame 127 is provided with a horizontally placed membrane disc pressing block 129, the middle of the membrane disc pressing block 129 is hinged to the membrane disc fixing frame 127 through a vertical hinged shaft, a horizontally arranged extension spring 130 is connected between one end of the membrane disc pressing block 129 and the membrane disc fixing frame 127, and the extension spring 130 pulls the other end of the membrane disc pressing block 129 to swing towards the blue membrane disc 101 and press the outer edge of the blue membrane disc 101. A pair of film disc fixing blocks are matched with the film disc pressing blocks to fix the blue film disc from three directions, so that the blue film disc is firmly fixed; meanwhile, as the side face, close to the blue film disc, of the film disc fixing block is an inclined face, when the blue film is upwards jacked up by the thimble, the blue film disc can be well pressed by the film disc fixing block, and the blue film disc is prevented from being separated.

In this embodiment, in order to improve the sealing effect of the negative pressure chamber, a sealing ring 131 is disposed between the outer sidewall of the upper end of the thimble base 104 and the inner wall of the lower end of the thimble sleeve 108; the top of the support seat 133 is provided with a circular concave portion, the vertical through hole of the circular concave portion corresponds in position, and a sealing gasket 132 is arranged in the circular concave portion.

In this embodiment, during operation: (1) manually shifting the film disc pressing block 129 to swing around the vertical hinged shaft, stretching the stretching spring 130 by the film disc pressing block 129, then placing the blue film disc 101 provided with a plurality of laser chips on the film disc fixing frame 127, enabling one end of the blue film disc 101 to abut against a pair of film disc fixing blocks 128, then loosening the film disc pressing block 129, and pulling the film disc pressing block 129 by the stretching spring 130 to swing towards the blue film disc 101 and press the outer edge of the blue film disc 101; (2) a plurality of negative pressure adsorption holes at the top of the thimble sleeve adsorb laser chips on the blue film disc by using negative pressure, then a lifting motor drives an eccentric wheel to rotate, the eccentric wheel drives a vertical connecting rod to slide upwards through a connecting block, the vertical connecting rod drives a thimble to upwards penetrate through a thimble perforation through a thimble clamp, and the thimble upwards jacks the laser chips at the corresponding position on the blue film disc; (3) the eccentric commentaries on classics piece of driving motor drive rotates, and eccentric commentaries on classics piece passes through the slide bar and drives the sliding seat and slide down along vertical slide rail, and the sliding seat drives suction nozzle mount pad and chip suction nozzle and moves down, and the chip suction nozzle adsorbs the laser chip by thimble jack-up, realizes getting the material.

The utility model discloses if disclose or related to mutual fixed connection's spare part or structure, then, except that other the note, fixed connection can understand: a detachable fixed connection (for example using bolts or screws) is also understood as: non-detachable fixed connections (e.g. riveting, welding), but of course, fixed connections to each other may also be replaced by one-piece structures (e.g. manufactured integrally using a casting process) (unless it is obviously impossible to use an integral forming process).

In addition, the terms used in any aspect of the present disclosure as described above to indicate positional relationships or shapes include similar, analogous, or approximate states or shapes unless otherwise stated.

The utility model provides an arbitrary part both can be assembled by a plurality of solitary component parts and form, also can be the solitary part that the integrated into one piece technology was made.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, it should be understood by those skilled in the art that: the invention can be modified or equivalent substituted for some technical features; without departing from the spirit of the present invention, it should be understood that the scope of the claims is intended to cover all such modifications and variations.

Claims

1. The utility model provides a laser chip test sorter inhale material mechanism which characterized in that: the device comprises a suction seat arranged above a blue membrane disc, wherein a suction nozzle mounting seat driven to lift by a driving mechanism is arranged on the front side of the suction seat, and a chip suction nozzle is arranged on the suction nozzle mounting seat.

2. The material sucking mechanism of the laser chip testing and sorting machine according to claim 1, characterized in that: the driving mechanism comprises an eccentric rotating block, a sliding rod, a sliding seat and a vertical sliding rail, the vertical sliding rail is arranged on the front side surface of the material suction seat, one end of the sliding seat is in sliding fit with the vertical sliding rail, and the other end of the sliding seat is provided with a transverse sliding chute; the eccentric rotating block is driven to rotate by a driving motor, the rear end of the sliding rod is eccentrically connected with the eccentric rotating block, and the front end of the sliding rod extends into the transverse sliding groove and is in sliding fit with the transverse sliding groove; the suction nozzle mounting seat is fixed on the sliding seat.

3. The material sucking mechanism of the laser chip testing and sorting machine according to claim 1, characterized in that: the chip suction nozzle is characterized in that a vertical mounting hole is formed in the suction nozzle mounting seat, a negative pressure connecting pipe penetrates through the vertical mounting hole in a sliding mode, and the chip suction nozzle is mounted at the lower end of the negative pressure connecting pipe.

4. The material sucking mechanism of the laser chip testing and sorting machine according to claim 3, characterized in that: the suction nozzle mounting seat is characterized in that a U-shaped limiting block with an opening facing the rear side is fixed at the top of the suction nozzle mounting seat, the negative pressure connecting pipe is in a ladder shape with a large upper end size and a small lower end size, the upper end of the negative pressure connecting pipe is accommodated in the U-shaped limiting block, and the outer wall of the upper end of the negative pressure connecting pipe is provided with a pair of flat positions.

5. The material sucking mechanism of the laser chip testing and sorting machine as claimed in claim 4, wherein: the outer wall of the upper end of the negative pressure connecting pipe is in threaded connection with a connecting screw which extends out of an opening of the U-shaped limiting block; the rear side of vertical mounting hole is equipped with vertical through-hole A, vertical extension spring that is provided with in vertical through-hole A's inside, extension spring's lower extreme is connected with vertical through-hole A's lateral wall, and vertical through-hole A is stretched out and is connected with connecting screw in extension spring's upper end.

6. The material sucking mechanism of the laser chip testing and sorting machine according to claim 5, characterized in that: and a linear bearing A is arranged between the negative pressure connecting pipe and the vertical mounting hole.

7. The material sucking mechanism of the laser chip testing and sorting machine according to claim 1, characterized in that: the device is characterized by also comprising an ejector pin mechanism which is arranged below the blue film plate and corresponds to the position of the chip suction nozzle, wherein the ejector pin mechanism comprises an ejector pin base, an ejector pin through hole is arranged in the middle of the top surface of the ejector pin base, and a plurality of negative pressure adsorption holes are arranged on the outer side of the ejector pin through hole; the inside of thimble seat is equipped with the negative pressure cavity that communicates with negative pressure adsorption hole, be provided with in the negative pressure cavity and upwards run through the fenestrate thimble of thimble by the elevating system drive.

8. The material sucking mechanism of the laser chip testing and sorting machine according to claim 7, characterized in that: the thimble seat comprises a thimble base and a thimble sleeve sleeved outside the upper end of the thimble base, a vertical through hole B is formed in the middle of the thimble base, and the vertical through hole B is communicated with the inside of the thimble sleeve to form a negative pressure cavity; the thimble through hole and the negative pressure adsorption hole are both arranged on the top surface of the thimble sleeve; the thimble structure is characterized in that a thimble clamp is arranged in the upper end of the thimble sleeve, a vertical clamping hole used for containing a thimble is formed in the middle of the upper end of the thimble clamp, and the lower end of the thimble clamp is connected with the lifting mechanism.

9. The material sucking mechanism of the laser chip testing and sorting machine according to claim 8, wherein: the lifting mechanism comprises a vertical connecting rod, an eccentric wheel, a connecting block and a lifting motor, the vertical connecting rod is in sliding fit with the vertical through hole B through a linear bearing B, and the upper end of the vertical connecting rod is connected with the lower end of the thimble clamp; the lifting motor is transversely arranged, a motor shaft of the lifting motor is connected with the middle part of one end of the eccentric wheel, the other end of the eccentric wheel is connected with the lower end of the connecting block, and the upper end of the connecting block is connected with the lower end of the vertical connecting rod through a connecting piece.