CN217387095U - Ejector pin mechanism of laser chip testing and sorting machine - Google Patents
Ejector pin mechanism of laser chip testing and sorting machine Download PDFInfo
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- CN217387095U CN217387095U CN202220987532.9U CN202220987532U CN217387095U CN 217387095 U CN217387095 U CN 217387095U CN 202220987532 U CN202220987532 U CN 202220987532U CN 217387095 U CN217387095 U CN 217387095U
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Abstract
The utility model relates to a thimble mechanism of a laser chip testing and sorting machine, which comprises a thimble seat arranged below a blue membrane disc, wherein the middle part of the top surface of the thimble seat is provided with a thimble perforation, and the outer side of the thimble perforation is provided with a plurality of negative pressure adsorption holes; a negative pressure cavity communicated with the negative pressure adsorption hole is arranged in the thimble seat, and a thimble driven by the lifting mechanism to upwards penetrate through the thimble hole is arranged in the negative pressure cavity; the thimble seat comprises a thimble base and a thimble sleeve sleeved outside the upper end of the thimble base, a vertical through hole is formed in the middle of the thimble base, and the vertical through hole is communicated with the inside of the thimble sleeve to form a negative pressure cavity; the thimble perforation and the negative pressure adsorption hole are both arranged on the top surface of the thimble sleeve. The utility model has the advantages of reasonable design, utilize the negative pressure to adsorb the hole and adsorb the laser chip who is located the thimble outside earlier and live, later utilize thimble rebound with blue membrane jack-up that makes progress, the laser chip through thimble jack-up can be better contact with the suction nozzle, improve the adsorption efficiency of suction nozzle.
Description
The technical field is as follows:
the utility model relates to a thimble mechanism of laser chip test sorter.
Background art:
currently, laser chips are tested in a strip, and a chip strip contains 80 chips, and a single test is performed on one chip. However, after testing a laser chip, the laser chip needs to be separated into individual chips, chip damage exists in the separation process, the damaged chips are tested after being packaged, 10% of defective products exist, and the defective products cause waste of packaged materials and process time. By adopting the single test, the waste of packaged materials and process time can be effectively avoided, and the production efficiency can be improved.
In the prior art, when a single chip is tested, a negative pressure suction nozzle is usually adopted to suck a laser chip and move the laser chip to a testing station. However, the size of a single laser chip is small, the distance between adjacent laser chips is small, and the suction nozzle is inconvenient to accurately adsorb the single laser chip, so that the material taking efficiency of the single laser chip is low, and the subsequent testing efficiency is influenced.
The utility model has the following contents:
the utility model discloses make the improvement to the problem that above-mentioned prior art exists, promptly the utility model aims to solve the technical problem that a thimble mechanism of laser chip test sorter is provided, reasonable in design, the negative pressure of being convenient for adsorbs and lives single laser chip.
In order to realize the purpose, the utility model discloses a technical scheme is: a thimble mechanism of a laser chip testing and sorting machine comprises a thimble seat arranged below a blue membrane disc, wherein a thimble perforation is arranged in the middle of the top surface of the thimble seat, and a plurality of negative pressure adsorption holes are arranged on the outer side of the thimble perforation; the inside of thimble seat is equipped with the negative pressure cavity that communicates with negative pressure adsorption hole, be provided with in the negative pressure cavity and upwards run through the fenestrate thimble of thimble by the elevating system drive.
Further, the thimble seat comprises a thimble base and a thimble sleeve sleeved outside the upper end of the thimble base, a vertical through hole is formed in the middle of the thimble base, and the vertical through hole is communicated with the inside of the thimble sleeve to form a negative pressure cavity; the thimble perforation and the negative pressure adsorption hole are both arranged on the top surface of the thimble sleeve.
Furthermore, a thimble clamp is arranged inside the upper end of the thimble sleeve, a vertical clamping hole used for containing a thimble is formed in the middle of the upper end of the thimble clamp, and the lower end of the thimble clamp is connected with the lifting mechanism.
Further, the lifting mechanism comprises a vertical connecting rod, an eccentric wheel, a connecting block and a lifting motor, the vertical connecting rod is in sliding fit with the vertical through hole through a linear bearing, and the upper end of the vertical connecting rod is connected with the lower end of the thimble clamp; the lifting motor is transversely arranged, a motor shaft of the lifting motor is connected with the middle part of one end of the eccentric wheel, the other end of the eccentric wheel is connected with the lower end of the connecting block, and the upper end of the connecting block is connected with the lower end of the vertical connecting rod through a connecting piece.
Furthermore, an annular air exhaust cavity is arranged on the side wall of the lower end of the vertical through hole, and an air exhaust hole is formed in the side wall of the air exhaust cavity; the side wall of the upper end of the vertical through hole is provided with a pair of air guide grooves which are communicated with the inside of the upper ends of the air pumping cavity and the thimble sleeve.
The device further comprises a rotating table which is arranged below the ejector pin seat and driven to rotate by a rotating motor, wherein an XY-axis electric adjusting sliding table is arranged on the rotating table, a film disc fixing frame is arranged on the XY-axis electric adjusting sliding table, and the blue film disc is arranged on the film disc fixing frame; the middle part of revolving stage installs XY axle manual regulation slip table, install the supporting seat on the XY axle manual regulation slip table, the thimble seat is installed at the top of supporting seat.
Furthermore, one end of the film disc fixing frame is provided with a pair of film disc fixing blocks, the film disc fixing blocks are used for being arranged at the upper end of the outer edge of the blue film disc in a pressing mode, and one side face, close to the blue film disc, of each film disc fixing block is an inclined face; the other end of the film disc fixing frame is provided with a film disc pressing block, the middle of the film disc pressing block is hinged to the film disc fixing frame through a vertical hinged shaft, one end of the film disc pressing block is connected with an extension spring, and the other end of the extension spring pulling the film disc pressing block swings towards the blue film disc and presses the outer edge of the blue film disc.
Compared with the prior art, the utility model discloses following effect has: the utility model has the advantages of reasonable design, utilize the negative pressure to adsorb the hole and adsorb the laser chip who is located the thimble outside earlier and live, later utilize thimble rebound with blue membrane jack-up that makes progress, the laser chip through thimble jack-up can be better contact with the suction nozzle, improve the adsorption efficiency of suction nozzle.
Description of the drawings:
fig. 1 is a schematic front view of the embodiment of the present invention;
fig. 2 is a schematic perspective view of an embodiment of the present invention;
FIG. 3 is a schematic view of the fitting structure of the thimble seat and the lifting mechanism in the embodiment of the present invention;
fig. 4 is a schematic perspective view of an embodiment of the present invention;
FIG. 5 is a schematic sectional view of the thimble seat in the embodiment of the present invention;
FIG. 6 is a schematic perspective view of an embodiment of a thimble clamp according to the present invention;
FIG. 7 is a schematic perspective view of a thimble sleeve according to an embodiment of the present invention;
fig. 8 is a schematic front view of a camera module according to an embodiment of the present invention;
fig. 9 is a schematic perspective view of the camera module according to the embodiment of the present invention.
In the figure:
101-blue film disk; 102-thimble seat; 103-thimble perforation; 104-negative pressure adsorption holes; 105-a lifting mechanism; 106-ejector pins; 107-thimble base; 108-a thimble sleeve; 109-vertical through holes; 110-a negative pressure chamber; 111-thimble clamp; 112-vertical clamping holes; 113-radial through hole; 114-vertical connection hole; 115-connecting screw holes; 116-a vertical link; 117-eccentric wheel; 118-a connection block; 119-a lifting motor; 120-a pumping cavity; 121-air extraction holes; 122-gas guiding groove; 123-rotating table; 124-linear bearings; 125-XY axis electric adjusting sliding table; the sliding table is manually adjusted by 126-XY axes; 127-a membrane disc holder; 128-membrane disc fixing block; 129-pressing the membrane disc; 130-a tension spring; 131-a sealing ring; 132-a gasket; 133-a camera component; 134-a frame; 135-lateral mobile station; 136-vertical mobile station; 137-supporting seat; 138-camera support.
The specific implementation mode is as follows:
the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description of the present invention, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
As shown in fig. 1 to 7, the ejector pin mechanism of the laser chip testing and sorting machine of the present invention comprises a blue membrane 101 disc disposed below a chip suction nozzle and containing a plurality of laser chips, and an ejector pin base 102 disposed below the blue membrane 101, wherein the top surface of the ejector pin base 102 is used for contacting with the bottom surface of the blue membrane 101, an ejector pin perforation 103 is disposed in the middle of the top surface of the ejector pin base 102, and a plurality of negative pressure adsorption holes 104 distributed on the top surface of the ejector pin base are disposed outside the ejector pin perforation 103; a negative pressure chamber 110 communicated with the negative pressure adsorption hole 104 is arranged in the thimble seat 102, and a thimble 106 driven by a lifting mechanism 105 to upwards penetrate through the thimble perforation 103 is arranged in the negative pressure chamber 110. During operation, a negative pressure cavity is formed in the ejector pin base after air exhaust, a plurality of negative pressure adsorption holes in the top of the ejector pin base adsorb laser chips on the blue film disc corresponding to the positions of the negative pressure adsorption holes through negative pressure, then the ejector pin is driven by the lifting mechanism to move upwards and penetrate through the ejector pin for perforation, the ejector pin jacks up the blue film, and the laser chips jacked up by the ejector pin can be better contacted with a chip suction nozzle.
In this embodiment, the thimble seat 102 includes a T-shaped thimble base 107 and a thimble sleeve 108 sleeved on the outer side of the upper end of the thimble base 107, a vertical through hole 109 is formed in the middle of the thimble base 107, and the vertical through hole 109 is communicated with the inside of the thimble sleeve 108 to form a negative pressure chamber 110; the thimble through hole 103 and the negative pressure suction hole 104 are both arranged on the top surface of the thimble sleeve 108.
In this embodiment, a thimble clamp 111 is arranged inside the upper end of the thimble sleeve 108, a vertical clamping hole 112 for accommodating the thimble 106 is arranged in the middle of the upper end of the thimble clamp 111, a radial through hole 113 is communicated with the lower end of the vertical clamping hole 112, and a thimble locking screw for locking the thimble is screwed in the radial through hole; the lower end of the thimble clamp 111 is provided with a vertical connecting hole 114, the side wall of the vertical connecting hole 114 is provided with a connecting screw hole 115, and a connecting rod locking screw is screwed in the connecting screw hole. As shown in fig. 3 and 4, the lifting mechanism 105 includes a vertical connecting rod 116, an eccentric wheel 117, a connecting block 118 and a lifting motor 119, the vertical connecting rod 116 is slidably fitted with the vertical through hole 109 through a linear bearing 124, and the upper end of the vertical connecting rod 116 extends into the vertical connecting hole 114 and is locked by a connecting rod locking screw; the lifting motor 119 is transversely arranged, a motor shaft of the lifting motor 119 is connected with the middle part of one end of the eccentric wheel 117, the other end of the eccentric wheel 117 is eccentrically connected with the lower end of the connecting block 118, and the upper end of the connecting block 118 is connected with the lower end of the vertical connecting rod 116 through a connecting piece. During operation, the lifting motor drives the eccentric wheel to rotate, the eccentric wheel drives the vertical connecting rod to slide up and down along the vertical through hole through the connecting block, and the vertical connecting rod drives the ejector pin to move up and down through the ejector pin fixture so as to realize lifting of the ejector pin.
In this embodiment, as shown in fig. 5, an annular air pumping cavity 120 is disposed on a side wall of a lower end of the vertical through hole 109, an air pumping hole 121 is disposed on a side wall of the air pumping cavity 120, and the air pumping hole is used for connecting a negative pressure generating apparatus through a pipeline; the upper end side wall of the vertical through hole 109 is provided with a pair of air guide grooves 122 extending vertically, the lower end of the air guide grooves 122 is communicated with the air suction cavity 120, and the upper end of the air guide grooves 122 is communicated with the inside of the upper end of the thimble sleeve 108. When the ejector pin sleeve works, the inner part of the upper end of the ejector pin sleeve, the pair of air guide grooves, the annular air exhaust cavity and the air exhaust hole are communicated, and the negative pressure generating equipment sucks air through the air exhaust hole to form a negative pressure structure.
In this embodiment, the device further comprises a rotating table 123 which is arranged below the ejector seat 102 and is driven to rotate by a rotating motor, an XY-axis electric adjusting sliding table 125 is arranged on the rotating table 123, an annular film disc fixing frame 127 is arranged on the XY-axis electric adjusting sliding table 125, the blue film disc 101 is arranged on the film disc fixing frame 127, and the XY-axis electric adjusting sliding table can be used for automatically adjusting the position of the blue film disc along the X-axis (i.e. transverse) and the Y-axis (i.e. longitudinal) directions.
In this embodiment, in order to adjust the position of the ejector pin in the initial state, the XY axis manual adjustment sliding table 126 is installed in the middle of the rotating table 123, the support seat 137 is installed on the XY axis manual adjustment sliding table 126, and the ejector pin seat 102 is installed on the top of the support seat 137. The XY-axis manual adjusting sliding table can be used for manually adjusting the position of the thimble along the X-axis (namely, the transverse direction) and the Y-axis direction (namely, the longitudinal direction).
It should be noted that, the XY-axis electric adjusting sliding table and the XY-axis manual adjusting sliding table are the prior art, the XY-axis electric adjusting sliding table includes a pair of X-axis sliding rails installed on the rotating table, an X-axis moving frame is connected to the pair of X-axis sliding rails in a sliding manner, and the X-axis moving frame is driven by a transverse synchronous belt to slide along the X-axis sliding rails; the X-axis moving frame is provided with a Y-axis sliding rail, the Y-axis moving frame is connected onto the Y-axis sliding rail in a sliding mode and driven by a longitudinal synchronous belt to slide along the Y-axis sliding rail, and the film disc fixing frame is arranged on the Y-axis moving frame; the XY-axis manual adjustment sliding table adopts a manual adjustment mode, and the specific structures and the working principle of the XY-axis manual adjustment sliding table are not repeated and described.
In this embodiment, one end of the film disc fixing frame 127 is provided with a pair of film disc fixing blocks 128, the film disc fixing blocks 128 are used for being arranged at the upper end of the outer edge of the blue film disc in a pressing manner, and one side surface of the film disc fixing blocks 128 close to the blue film disc 101 is an inclined surface; the other end of the membrane disc fixing frame 127 is provided with a membrane disc pressing block 129 which is horizontally placed, the middle of the membrane disc pressing block 129 is hinged to the membrane disc fixing frame 127 through a vertical hinge shaft, a tension spring 130 which is horizontally arranged is connected between one end of the membrane disc pressing block 129 and the membrane disc fixing frame 127, and the other end of the tension spring 130 pulls the membrane disc pressing block 129 to swing towards the blue membrane disc 101 and press the outer edge of the blue membrane disc 101 tightly. A pair of film disc fixing blocks are matched with the film disc pressing blocks to fix the blue film disc from three directions, so that the blue film disc is firmly fixed; meanwhile, as the side face, close to the blue film disc, of the film disc fixing block is an inclined face, when the blue film is upwards jacked up by the thimble, the blue film disc can be well pressed by the film disc fixing block, and the blue film disc is prevented from being separated.
In this embodiment, in order to improve the sealing effect of the negative pressure chamber, a sealing ring 131 is disposed between the outer sidewall of the upper end of the thimble base 104 and the inner wall of the lower end of the thimble sleeve 108; the top of the supporting seat 137 is provided with a circular concave portion, the vertical through hole of the circular concave portion corresponds in position, and the circular concave portion is internally provided with a sealing gasket 132.
In another embodiment, the laser positioning device further comprises a camera assembly 133 arranged above the blue film disc 101, wherein the camera assembly 133 is used for shooting the distribution of the laser chips on the blue film disc 101, and comparing the distribution with a pre-stored position picture, so that the XY axis electric adjustment sliding table 125 can be operated conveniently to determine the position of the first laser chip to be adsorbed on the blue film disc 101. As shown in fig. 8 and 9, a frame 134 is disposed on the rear side of the camera assembly 101, a horizontal moving stage 135 is disposed on the frame 134, a camera bracket 138 is mounted on a moving portion of the horizontal moving stage 135, a vertical moving stage 136 is mounted at the front end of the camera bracket 138, and the camera assembly 133 is mounted on a moving portion of the vertical moving stage 136. The lateral and vertical translation stages cooperate to adjust the position of the camera assembly in both the lateral and vertical directions. It should be noted that both the lateral moving stage and the vertical moving stage are manually adjusted.
In this embodiment, during operation: (1) manually shifting the film disc pressing block 129 to swing around the vertical hinged shaft, stretching the stretching spring 130 by the film disc pressing block 129, then placing the blue film disc 101 provided with a plurality of laser chips on the film disc fixing frame 127, enabling one end of the blue film disc 101 to abut against a pair of film disc fixing blocks 128, then loosening the film disc pressing block 129, and pulling the film disc pressing block 129 by the stretching spring 130 to swing towards the blue film disc 101 and press the outer edge of the blue film disc 101; (2) the laser chips on the blue film plate 101 are adsorbed by the negative pressure adsorption holes 104 in the top of the thimble sleeve 108 through negative pressure, then the lifting motor 119 drives the eccentric wheel 117 to rotate, the eccentric wheel 117 drives the vertical connecting rod 116 to slide upwards through the connecting block 118, the vertical connecting rod 116 drives the thimble 106 to upwards penetrate through the thimble perforation 103 through the thimble clamp 111, and the thimble 106 upwards jacks the laser chips at the corresponding positions on the blue film plate 101, so that a subsequent suction nozzle can conveniently absorb the laser chips.
The utility model discloses if disclose or related to mutual fixed connection's spare part or structure, then, except that other the note, fixed connection can understand: a detachable fixed connection (for example using bolts or screws) is also understood as: non-detachable fixed connections (e.g. riveting, welding), but of course, fixed connections to each other may also be replaced by one-piece structures (e.g. manufactured integrally using a casting process) (unless it is obviously impossible to use an integral forming process).
In addition, the terms used in any aspect of the present disclosure as described above to indicate positional relationships or shapes include similar, analogous, or approximate states or shapes unless otherwise stated.
The utility model provides an arbitrary part both can be assembled by a plurality of solitary component parts and form, also can be the solitary part that the integrated into one piece technology was made.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, it should be understood by those skilled in the art that: the invention can be modified or equivalent substituted for some technical features; without departing from the spirit of the present invention, it should be understood that the scope of the claims is intended to cover all such modifications and variations.
Claims (7)
1. The utility model provides a thimble mechanism of laser chip test sorter which characterized in that: the device comprises a thimble seat arranged below a blue membrane disc, wherein a thimble perforation is arranged in the middle of the top surface of the thimble seat, and a plurality of negative pressure adsorption holes are arranged on the outer side of the thimble perforation; the inside of thimble seat is equipped with the negative pressure cavity with negative pressure adsorption hole intercommunication, be provided with in the negative pressure cavity and upwards run through the fenestrate thimble of thimble by the elevating system drive.
2. The ejector pin mechanism of the laser chip testing and sorting machine according to claim 1, wherein: the ejector pin base comprises an ejector pin base and an ejector pin sleeve sleeved on the outer side of the upper end of the ejector pin base, a vertical through hole is formed in the middle of the ejector pin base, and the vertical through hole is communicated with the interior of the ejector pin sleeve to form a negative pressure cavity; the thimble perforation and the negative pressure adsorption hole are both arranged on the top surface of the thimble sleeve.
3. The ejector pin mechanism of the laser chip testing and sorting machine according to claim 2, wherein: the thimble structure is characterized in that a thimble clamp is arranged in the upper end of the thimble sleeve, a vertical clamping hole used for containing a thimble is formed in the middle of the upper end of the thimble clamp, and the lower end of the thimble clamp is connected with the lifting mechanism.
4. The ejector pin mechanism of the laser chip testing and sorting machine according to claim 3, wherein: the lifting mechanism comprises a vertical connecting rod, an eccentric wheel, a connecting block and a lifting motor, the vertical connecting rod is in sliding fit with the vertical through hole through a linear bearing, and the upper end of the vertical connecting rod is connected with the lower end of the thimble clamp; the lifting motor is transversely arranged, a motor shaft of the lifting motor is connected with the middle part of one end of the eccentric wheel, the other end of the eccentric wheel is connected with the lower end of the connecting block, and the upper end of the connecting block is connected with the lower end of the vertical connecting rod through a connecting piece.
5. The ejector pin mechanism of the laser chip testing and sorting machine according to claim 4, wherein: an annular air exhaust cavity is formed in the side wall of the lower end of the vertical through hole, and an air exhaust hole is formed in the side wall of the air exhaust cavity; the side wall of the upper end of the vertical through hole is provided with a pair of air guide grooves which are communicated with the inside of the upper ends of the air pumping cavity and the thimble sleeve.
6. The ejector pin mechanism of the laser chip testing and sorting machine according to claim 1, wherein: the device also comprises a rotating table which is arranged below the ejector pin seat and driven to rotate by a rotating motor, wherein an XY-axis electric adjusting sliding table is arranged on the rotating table, a membrane disc fixing frame is arranged on the XY-axis electric adjusting sliding table, and the blue membrane disc is arranged on the membrane disc fixing frame; the middle part of revolving stage installs XY axle manual regulation slip table, install the supporting seat on the XY axle manual regulation slip table, the thimble seat is installed at the top of supporting seat.
7. The ejector pin mechanism of the laser chip testing and sorting machine according to claim 6, wherein: one end of the membrane disc fixing frame is provided with a pair of membrane disc fixing blocks, the membrane disc fixing blocks are used for being arranged at the upper end of the outer edge of the blue membrane disc in a pressing mode, and one side face, close to the blue membrane disc, of each membrane disc fixing block is an inclined plane; the other end of the film disc fixing frame is provided with a film disc pressing block, the middle of the film disc pressing block is hinged to the film disc fixing frame through a vertical hinged shaft, one end of the film disc pressing block is connected with an extension spring, and the other end of the extension spring pulling the film disc pressing block swings towards the blue film disc and presses the outer edge of the blue film disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220987532.9U CN217387095U (en) | 2022-04-27 | 2022-04-27 | Ejector pin mechanism of laser chip testing and sorting machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220987532.9U CN217387095U (en) | 2022-04-27 | 2022-04-27 | Ejector pin mechanism of laser chip testing and sorting machine |
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| CN217387095U true CN217387095U (en) | 2022-09-06 |
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| CN202220987532.9U Active CN217387095U (en) | 2022-04-27 | 2022-04-27 | Ejector pin mechanism of laser chip testing and sorting machine |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114933167A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Ejector pin mechanism of laser chip testing and sorting machine and working method thereof |
| CN116699369A (en) * | 2023-07-27 | 2023-09-05 | 珠海市申科谱工业科技有限公司 | High-low temperature laser chip test equipment |
-
2022
- 2022-04-27 CN CN202220987532.9U patent/CN217387095U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114933167A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Ejector pin mechanism of laser chip testing and sorting machine and working method thereof |
| CN116699369A (en) * | 2023-07-27 | 2023-09-05 | 珠海市申科谱工业科技有限公司 | High-low temperature laser chip test equipment |
| CN116699369B (en) * | 2023-07-27 | 2023-11-07 | 珠海市申科谱工业科技有限公司 | High-low temperature laser chip test equipment |
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