CN214043702U

CN214043702U - LED light source structure for dental luminous mobile phone

Info

Publication number: CN214043702U
Application number: CN202023135043.0U
Authority: CN
Inventors: 赵家路
Original assignee: Shenzhen Yulu Science And Technology Development Co ltd
Current assignee: Shenzhen Yulu Science And Technology Development Co ltd
Priority date: 2020-12-23
Filing date: 2020-12-23
Publication date: 2021-08-24
Anticipated expiration: 2030-12-23

Abstract

The utility model discloses a LED light source structure for a dental light-emitting mobile phone, which comprises a substrate and an LED chip, wherein the lower surface of the LED chip is provided with a first positive bonding pad and a first negative bonding pad, and the upper surface of the substrate is provided with a second positive bonding pad matched with the first positive bonding pad and a second negative bonding pad matched with the first negative bonding pad; the first positive electrode bonding pad is welded with the second positive electrode bonding pad through tin cream, and the first negative electrode bonding pad is welded with the second negative electrode bonding pad through tin cream. Compare with the LED light source of the luminous cell-phone of current dentistry, the utility model discloses a well LED chip and base plate, base plate and base all are the direct welding, have avoided the bonding wire structure for luminous cell-phone is when high temperature high pressure environment disinfection, and the LED light source is difficult for becoming invalid, the life of the LED light source of extension.

Description

LED light source structure for dental luminous mobile phone

Technical Field

The utility model relates to an oral medical equipment makes the field, especially relates to a LED light source structure for luminous cell-phone of dentistry.

Background

The LED light source is a novel light source, is green and environment-friendly, is widely applied to various fields, brings great convenience to real life and work, and has a very important position.

The dental luminous mobile phone is used as oral medical equipment, and due to the particularity of the industry, the mobile phone equipment needs to be sterilized and disinfected repeatedly under high temperature and high pressure in the using process, so that the requirements on the service life and the reliability of an LED light source on the mobile phone are very high. At present, LED light sources of the existing dental light-emitting mobile phones are bound and packaged in a fixed support plane welding wire mode, so that the volume of the light sources is increased, and the application difficulty is increased; on the other hand, due to the wire bonding structure of the LED light source, when the dental light-emitting handpiece is in a high-temperature and high-pressure environment, the wire bonding structure is easy to break or short circuit, so that the light source fails, and the service life of the LED light source is seriously influenced.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems existing in the prior art, the utility model provides a LED light source structure for the luminous cell-phone of dentistry to specifically provide following technical scheme:

an LED light source structure for a dental light-emitting mobile phone comprises a substrate and an LED chip, wherein a first positive electrode bonding pad and a first negative electrode bonding pad are arranged on the lower surface of the LED chip, and a second positive electrode bonding pad matched with the first positive electrode bonding pad and a second negative electrode bonding pad matched with the first negative electrode bonding pad are arranged on the upper surface of the substrate; the first positive electrode bonding pad is welded with the second positive electrode bonding pad through tin cream, and the first negative electrode bonding pad is welded with the second negative electrode bonding pad through tin cream.

Further, the LED chip packaging structure further comprises a packaging protective cover, wherein the packaging protective cover wraps the LED chip and is fixedly connected with the upper surface of the substrate.

The base is fixed on the light-emitting mobile phone, and the upper surface of the base is electrically connected with the substrate; the base comprises a first conductive piece and a second conductive piece, the first conductive piece is sleeved on the second conductive piece, an insulating piece is arranged between the first conductive piece and the second conductive piece, and the insulating piece is respectively connected with the first conductive piece and the second conductive piece.

Further, the first conductive member is in a circular cylindrical shape, and the second conductive member is in a cylindrical shape.

Furthermore, a first bonding pad and a second bonding pad are fixedly arranged on the lower surface of the substrate, and the first bonding pad and the second bonding pad are respectively welded with the first conductive piece and the second conductive piece.

Furthermore, the shape of the first bonding pad is matched with the end face of the first conductive piece, and the shape of the second bonding pad is matched with the end face of the second conductive piece.

Further, the material of encapsulation protection casing is transparent silica gel.

Furthermore, the outer wall of the packaging protective cover is spherical, and the included angle of the light transmission area is 60-180 degrees.

Further, the material of the substrate is aluminum oxide.

Further, the LED chip is a flip CSP chip.

Compared with the LED light source of the existing dental light-emitting mobile phone, the utility model adopts the structure that the LED chip is directly welded with the substrate and the substrate is directly welded with the base, thereby avoiding the welding wire structure, ensuring that the LED light source is not easy to lose efficacy when the light-emitting mobile phone is disinfected in a high-temperature and high-pressure environment, and prolonging the service life of the LED light source; and simultaneously, the utility model discloses the encapsulation protection casing adopts high temperature resistant silica gel material, fault rate that can effectual reduction LED chip.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a top view of the present invention;

fig. 3 is a bottom view of the base plate of the present invention;

fig. 4 is a schematic view of the base structure of the present invention.

Detailed Description

To further illustrate the technical means and technical effects of the present invention, the following describes a preferred embodiment of the present invention with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-4, an LED light source structure for a dental light-emitting handset includes a base 1, a substrate 2, an LED chip 3 and a packaging protective cover 4, in this example, the LED chip 3 is a flip CSP chip, a first positive pad and a first negative pad are disposed on a lower surface of the LED chip 3, a second positive pad adapted to the first positive pad in shape and a second negative pad adapted to the first negative pad in shape are disposed on an upper surface of the substrate; the first positive electrode bonding pad is welded with the second positive electrode bonding pad through solder paste, and the first negative electrode bonding pad is welded with the second negative electrode bonding pad through solder paste. The LED chip 3 and the substrate 2 form a conduction loop, and the solder paste has high temperature resistance and can meet the requirement that the dental light-emitting mobile phone is disinfected at high temperature and high pressure frequently. The packaging protective cover 4 is made of transparent silica gel material, and the packaging protective cover 4 is wrapped outside the LED chip 3 and used for protecting the LED chip 3; in order to improve the light emitting effect of the LED light source, the outer wall of the packaging protective cover 4 is set to be in a spherical shape, and the included angle of the light transmission area is controlled to be 60-180 degrees. The base 1 is fixed on a light source installation position of a dental luminous mobile phone, the base 1 comprises a shell 11, a first conductive piece 12 and a second conductive piece 13, the shell 11 is sleeved on the outer wall of the first conductive piece 12, the first conductive piece 12 is sleeved on the second conductive piece 13, the first conductive piece 12 is in a circular ring column shape, the second conductive piece 13 is in a cylindrical shape, an insulating piece 14 is arranged between the first conductive piece 12 and the second conductive piece 13, and the insulating piece 14 is respectively connected with the first conductive piece 12 and the second conductive piece 13. The substrate 2 is made of alumina with excellent heat conductivity, a first bonding pad 21 and a second bonding pad 22 are fixedly arranged on the lower surface of the substrate 2, the first bonding pad 21 is in a circular shape matched with the end face of the first conductive piece 12, the second bonding pad 22 is in a circular shape matched with the end face of the second conductive piece 13, and the circle centers of the first bonding pad 21 and the second bonding pad 22 are overlapped; the first pad 21 is welded to the upper end surface of the first conductive member 12, and the second pad 22 is welded to the upper end surface of the second conductive member 13, so that the base 1 and the substrate 2 form a conductive loop.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Claims

1. An LED light source structure for a dental light-emitting mobile phone is characterized by comprising a substrate and an LED chip, wherein a first positive electrode bonding pad and a first negative electrode bonding pad are arranged on the lower surface of the LED chip, and a second positive electrode bonding pad matched with the first positive electrode bonding pad and a second negative electrode bonding pad matched with the first negative electrode bonding pad are arranged on the upper surface of the substrate;

the first positive electrode bonding pad is welded with the second positive electrode bonding pad through tin cream, and the first negative electrode bonding pad is welded with the second negative electrode bonding pad through tin cream.

2. The LED light source structure for a dental light-emitting handpiece of claim 1, further comprising a package shield, the package shield being wrapped around the LED chip and fixedly attached to the upper surface of the substrate.

3. The LED light source structure for a dental light-emitting handpiece of claim 2, further comprising a base, wherein the base is fixed to the light-emitting handpiece, and an upper surface of the base is electrically connected to the substrate;

the base comprises a first conductive piece and a second conductive piece, the first conductive piece is sleeved on the second conductive piece, an insulating piece is arranged between the first conductive piece and the second conductive piece, and the insulating piece is respectively connected with the first conductive piece and the second conductive piece.

4. The LED light source structure for a dental light handpiece of claim 3, wherein the first conductive member is in the shape of a circular ring cylinder and the second conductive member is in the shape of a cylinder.

5. An LED light source structure for a dental light-emitting handpiece according to claim 4, wherein a first bonding pad and a second bonding pad are fixedly provided on a lower surface of the substrate, and the first bonding pad and the second bonding pad are soldered to the first conductive member and the second conductive member, respectively.

6. The LED light source structure for a dental light handpiece of claim 5, wherein the first pad has a shape that fits an end surface of the first conductive member, and the second pad has a shape that fits an end surface of the second conductive member.

7. An LED light source structure for a dental light handpiece as in any one of claims 2-6, wherein the material of the packaging shield is transparent silicone.

8. The LED light source structure for a dental light handpiece of claim 7, wherein the outer wall of the package shield is spherical and the angle of the light transmitting area is 60-180 degrees.

9. The LED light source structure for a dental light handpiece of claim 8, wherein the material of the substrate is aluminum oxide.

10. The LED light source structure for a dental light handpiece of claim 9, wherein the LED chip is a flip-chip CSP chip.