CN214009690U - Constant temperature storage cabinet - Google Patents

Abstract

The utility model provides a constant temperature locker, including the cabinet body, set up in the internal a plurality of storing rooms of cabinet, wherein, each storing room correspondence is equipped with semiconductor refrigerating plant and heating device, constant temperature locker still including corresponding each storing room setting and with the power control panel that power looks electrical connection, semiconductor refrigerating plant and heating device respectively with power control panel electric connection, be equipped with the single-pole double-throw switch of control semiconductor refrigerating plant and the work of heating device looks mutual switch-over on the power control panel. The utility model discloses avoided semiconductor refrigerating plant to heat to the storing room, its cold junction produces the problem of condensation, and indoor board conductor refrigerating plant and heating device pass through single-pole double-throw switch sharing power control panel in each room moreover, the control circuit work of not only being convenient for, and simple structure still can practice thrift manufacturing cost.

Description

Constant temperature storage cabinet

Technical Field

The utility model relates to a constant temperature locker especially relates to a simple structure's constant temperature locker.

Background

The existing constant-temperature storage cabinet usually adopts the semiconductor wafer to refrigerate or heat, the front end of the general semiconductor wafer is located in the storage room, the rear end of the semiconductor wafer is located in the heat dissipation space, when the storage room is heated, the rear end of the semiconductor wafer is refrigerated, therefore, air in the heat dissipation space can generate condensation due to low temperature, the condensation can flow downwards along with the heat dissipation fins, and the heat dissipation space is not provided with a flow guide structure usually, so that potential safety hazards are easily generated.

In view of the above, there is a need for an improved constant temperature cabinet to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a simple structure's constant temperature locker.

For the above-mentioned utility model purpose, the utility model provides a constant temperature locker, including the cabinet body, set up in the internal a plurality of storing rooms of cabinet, wherein, each storing room correspondence is equipped with semiconductor refrigerating plant and heating device, constant temperature locker still including corresponding each storing room setting and with the power control panel of power looks electric connection, semiconductor refrigerating plant and heating device respectively with power control panel electric connection, be equipped with the single-pole double-throw switch of control semiconductor refrigerating plant and the work of heating device inter-switching on the power control panel.

As a further improvement, the semiconductor refrigeration device includes the semiconductor wafer, is located the refrigeration unit of semiconductor wafer front side, is located the radiating unit of semiconductor wafer rear side, the refrigeration unit includes the refrigeration heat conduction piece, the refrigeration fin that contact with the semiconductor wafer front surface, connects the refrigeration heat pipe between refrigeration heat conduction piece and refrigeration fin, the radiating unit includes the heat dissipation heat conduction piece, the radiating fin that contact with the semiconductor wafer rear surface, connects the heat dissipation heat pipe between heat dissipation heat conduction piece and radiating fin.

As a further improvement, the semiconductor refrigeration device further comprises a heat insulation member wrapped around the semiconductor wafer, wherein the heat insulation member is connected with the refrigeration heat conduction block and the heat dissipation heat conduction block along the front-back direction.

As a further improvement of the present invention, the refrigeration heat conduction block further has a refrigeration heat conduction block fin projecting forward from the front surface thereof, and the heat dissipation heat conduction block further has a heat dissipation heat conduction block fin projecting rearward from the rear surface thereof.

As a further improvement, the constant temperature locker has the inner bag that forms the storing room, set up the baffle of inner bag rear side, with backplate that the baffle cooperation set up, be located the foaming layer between baffle and the inner bag, be formed with between baffle and the backplate and accept the heat dissipation space of heat dissipation unit, the semiconductor wafer sets up in the foaming layer, the refrigeration unit sets up indoor in the storing room.

As a further improvement, the constant temperature locker still has the deep bead that sets up in the cooling fan of cooling fin below, set up with the cooling fan cooperation, the deep bead encircles cooling fan's the latter half setting, the backplate is equipped with the heat dissipation air intake that sets up with the cooling fan cooperation, is located the heat dissipation air outlet of cooling fin top.

As a further improvement, the constant temperature storage cabinet further comprises a refrigeration fan arranged above the refrigeration unit, a wind guide part arranged around the upper half part of the refrigeration fan, and a wind channel cover plate arranged at the front side of the refrigeration unit, wherein the wind channel cover plate is provided with a refrigeration return air inlet arranged in cooperation with the refrigeration fan and a refrigeration air outlet arranged at the left side, the right side and the lower side.

As a further improvement, the constant temperature locker has the inner bag and the backplate that form the storing compartment, forms the foaming layer between inner bag and the backplate, heating device sets up in the foaming in situ and pastes and apply in the setting of inner bag rear side.

As a further improvement of the utility model, the heating device comprises a heat-conducting plate and a heating wire, wherein the heat-conducting plate is attached to the inner container, and the heating wire is connected with the heat-conducting plate.

As a further improvement of the utility model, be equipped with PWM control module on the power control board.

The utility model has the advantages that: the utility model discloses a room correspondence is equipped with semiconductor refrigerating plant and heating device between each storing of constant temperature locker, and the constant temperature locker still sets up and the power control panel who is connected with power looks electrical connection including corresponding room between each storing, is equipped with the single-pole double-throw switch of control semiconductor refrigerating plant and the mutual switching work of heating device on the power control panel. The semiconductor refrigeration device is prevented from heating the storage chambers, the cold ends of the semiconductor refrigeration device are condensed, the plate conductor refrigeration device and the heating device in each chamber share the power control panel through the single-pole double-throw switch, the work of a control circuit is facilitated, the structure is simple, and the manufacturing cost can be saved.

Drawings

Fig. 1 is a schematic perspective view of the storage cabinet of the present invention.

Fig. 2 is an exploded perspective view of the storage cabinet of the present invention from another perspective.

Fig. 3 is an enlarged view at a in fig. 2.

FIG. 4 is a perspective view of the storage cabinet from another perspective behind the hidden back panel.

Figure 5 is a front exploded view of the storage cabinet of the present invention.

Figure 6 is a rear exploded view of the storage cabinet of the present invention.

Detailed Description

The present invention will be described in detail below with reference to embodiments shown in the drawings. However, the present invention is not limited to the embodiment, and the structural, method, or functional changes made by those skilled in the art according to the embodiment are all included in the scope of the present invention.

Please refer to fig. 1 to 6 for embodiments of the constant temperature storage cabinet of the present invention, the constant temperature storage cabinet includes a cabinet body 1, a plurality of storage compartments 11 disposed in the cabinet body 1, wherein each storage compartment 11 is correspondingly provided with a semiconductor refrigeration device 2 and a heating device 3, the constant temperature storage cabinet further includes a power control board (not shown) disposed corresponding to each storage compartment 11 and electrically connected to a power source, the semiconductor refrigeration device 2 and the heating device 3 are respectively electrically connected to the power control board, and the power control board is provided with a single-pole double-throw switch for controlling the semiconductor refrigeration device 2 and the heating device 3 to switch each other.

In particular, in the embodiment, the constant temperature storage cabinet can be used for storing wine, cigars and other substances. The cabinet body 1 has a plurality of storage compartments 11 arranged at intervals in the vertical direction, but in other embodiments, the storage compartments 11 may also be arranged at intervals in the transverse direction.

In this embodiment, the constant temperature cabinet has an inner container 12 forming the storage compartment 11, a partition plate 13 disposed at the rear side of the inner container 12, a back plate 14 disposed in cooperation with the partition plate 13, a foaming layer 15 located between the partition plate 13 and the inner container 12, and a housing 16 at the outer side. Wherein, a containing and heat dissipating space 17 is formed between the back plate 14 and the partition plate 13.

As shown in fig. 5 and 6, in the present embodiment, the semiconductor cooling device 2 specifically includes a semiconductor wafer 21, a cooling unit 22 located on the front side of the semiconductor wafer 21, and a heat dissipation unit 23 located on the rear side of the semiconductor wafer 21. This requirement can be satisfied by merely providing the semiconductor wafer 21 if the cooling or refrigeration aspect is taken into consideration.

However, in order to further improve the cooling efficiency, the cooling unit 22 is disposed at the front side of the semiconductor wafer 21 so as to more rapidly and uniformly transfer the cooling energy generated from the semiconductor wafer 21 into the storage compartment 11. By providing the heat dissipating unit 23 at the rear side of the semiconductor wafer 21, heat at the rear side of the semiconductor wafer 21 can be rapidly dissipated, thereby further improving the cooling efficiency at the front side of the semiconductor wafer 21 and reducing the cooling temperature.

Specifically, the refrigeration unit 22 includes a refrigeration heat conduction block 221 contacting with the front surface of the semiconductor wafer 21, a refrigeration fin 222, and a refrigeration heat conduction pipe 223 connected between the refrigeration heat conduction block 221 and the refrigeration fin 222, and the heat dissipation unit 23 includes a heat dissipation heat conduction block 231 contacting with the rear surface of the semiconductor wafer 21, a heat dissipation fin 232, and a heat dissipation heat conduction pipe 233 connected between the heat dissipation heat conduction block 231 and the heat dissipation fin 232.

The refrigeration heat conduction block 221 and the heat dissipation heat conduction block 231 are used for respectively and rapidly conducting out the cold and heat generated from the front and back of the semiconductor wafer 21, so as to improve the refrigeration and heat dissipation efficiency, and therefore, the refrigeration heat conduction block 221 and the heat dissipation heat conduction block 231 are generally made of materials with better heat conduction performance.

In order to further improve the cooling and heat dissipation efficiency, in the present embodiment, the cooling heat conduction block 221 and the heat dissipation heat conduction block 231 are respectively attached to the front and rear surfaces of the semiconductor wafer 21 in a full covering manner, so as to conduct more cooling or heating generated on the surface of the semiconductor wafer 21. Of course, in other embodiments, the rear surface area of the cooling heat conduction block 221 and the front surface area of the heat dissipation heat conduction block 231 may be smaller than the front surface area and the rear surface area of the semiconductor wafer 21.

In order to improve the refrigerating and heat dissipating efficiency, the refrigerating heat conducting block 221 and the heat dissipating heat conducting block 231 may also be configured to have a larger volume, which of course needs to take into consideration the required refrigerating efficiency, the cost, the volume of the constant temperature storage cabinet, and other factors.

In this embodiment, the cooling heat conduction block 221 further has cooling heat conduction block fins 2211 protruding forward from the front surface thereof, and the heat dissipation heat conduction block 231 further has heat dissipation heat conduction block fins 2311 protruding rearward from the rear surface thereof. Thus, the surface areas of the refrigeration heat conduction block 221 and the heat dissipation heat conduction block 231 can be fully utilized, and more cold or heat can be conducted out.

As shown in fig. 3 and 4, in the present embodiment, the semiconductor chip 21 is disposed in the foaming layer 15, the refrigeration unit 22 is mainly disposed in the storage compartment 11, the heat dissipation unit 23 is mainly disposed in the heat dissipation space 17, and only part of the refrigeration heat conduction block 221 and only part of the heat dissipation heat conduction block 231 of the refrigeration unit 22 and the heat dissipation unit 23 are disposed in the foaming layer 15.

In this embodiment, the semiconductor cooling device 2 further includes a heat insulating member (not shown) wrapped around the semiconductor chip 21, and the heat insulating member is disposed along the front-back direction and connected to the cooling heat conducting block 221 and the heat dissipating heat conducting block 231, that is, the heat insulating member completely fills the gap between the semiconductor chip 21, the cooling heat conducting block 221, and the heat dissipating heat conducting block 231, so as to prevent the cooling energy and the heat energy generated by the semiconductor chip 21 from being dissipated out of the gap.

In order to fix the semiconductor wafer 21, the heat insulating member, the refrigerating heat conducting block 221 and the heat dissipating heat conducting block 231 conveniently, the constant temperature cabinet further has a fixing member 4 disposed in the foaming layer 15 for installing the above structure, and the fixing member 4 is connected to the front and rear sides of the partition plate 13 and the inner container 12 so as to fix the above structure conveniently.

In the present embodiment, the constant temperature cabinet has two semiconductor wafers 21 arranged in the transverse direction, and therefore, the refrigerating unit 22 and the heat radiating unit 23 also have two refrigerating heat conduction blocks 221 and heat radiating heat conduction blocks 231 in the transverse direction. The refrigeration unit 22 has three sets of the refrigeration fins 222 respectively penetrating the two refrigeration heat conduction blocks 221 at intervals, so that the refrigeration capacity can be kept uniform in the transverse direction in the storage compartment 11. Of course, in other embodiments, the number of the semiconductor wafers 21 can be adjusted according to actual conditions.

As shown in fig. 5 and 6, the constant temperature cabinet further includes a refrigeration fan 5 disposed in the storage compartment 11 and above the refrigeration unit 22, an air guiding portion 6 disposed around the upper half portion of the refrigeration fan 5, and an air duct cover plate 7 disposed at the front side of the refrigeration unit 22, where the air duct cover plate 7 has a refrigeration air return opening 71 disposed in cooperation with the refrigeration fan 5, and refrigeration air outlets 72 disposed at the left side, the right side, and the lower side.

In this embodiment, the refrigeration fan 5 is a centrifugal fan, and the air guiding portion 6 is disposed around the upper side of the refrigeration fan 5 in a semicircular shape, so that when the refrigeration fan 5 operates, the refrigeration fan 5 first sucks air in the storage compartment 11 from the refrigeration air return opening 71, and sends cooling energy into the storage compartment 11 from the refrigeration air outlet 72 around the refrigeration fan. Specifically, when the refrigeration fan 5 rotates, the air guiding part 6 is blocked, so that the upward blowing air flows downwards along the air guiding part 6 and rebounds upwards at the bottom layer of the storage compartment 11, and a W-shaped cold flow direction is formed, so that the cold in the storage compartment 11 is more uniform.

The constant temperature locker still has the cooling fan 8 that sets up in cooling fin 232 below, the deep bead 9 that sets up with cooling fan 8 cooperation, the deep bead 9 encircles the setting of cooling fan 8 the latter half, backplate 14 is equipped with the heat dissipation air intake 141 that sets up with cooling fan 8 cooperation, is located the heat dissipation air outlet 142 of cooling fin 232 top.

In this embodiment, the heat dissipation fan 8 is also a centrifugal fan, the wind shielding plate 9 also surrounds the lower side of the centrifugal fan in a semicircular shape, when the centrifugal fan works, the centrifugal fan firstly sucks the outside air from the heat dissipation air inlet 141, and discharges the heat on the heat dissipation fins 232 from the heat dissipation air outlet 142, and due to the effect of the wind shielding plate 9, the wind blowing to the wind shielding plate 9 can be upwards blown, so that the heat dissipation effect is enhanced.

Meanwhile, the heat dissipation air inlet 141 is located above the heat dissipation air outlet 142, and the heat dissipation air outlet 142 is located above the heat dissipation air inlet 141, and the heat dissipation air inlet 232 and the heat dissipation air outlet 142 are far away from each other, so that the heat dissipation from the heat dissipation air outlet 142 is not easily affected to the air in the heat dissipation air inlet 141.

In the present embodiment, the heating device 3 includes a heat conducting plate 31 attached to the inner container 12 and a heating wire 32 connecting the heat conducting plate 31. Of course, in other embodiments, the heating device 3 may also be a heating block, a heating tube, or other forms of heating devices 3.

And the heating device 3 is arranged in the foaming layer 15 and is adhered to the rear side of the inner container 12, on one hand, the volume ratio of the storage chamber 11 in the foaming layer 15 can be increased, and on the other hand, the heating device is arranged on the rear side of the inner container 12, which is beneficial to the heat conduction from the rear side of the inner container 12 to the left side and the right side of the inner container 12, thereby ensuring that the heat conduction is more uniform and the temperature fluctuation is smaller. The heating device 3 is mainly used for temperature compensation, and the power is relatively low, so that the inner container 12 is not damaged in the heating process.

Be equipped with PWM control module on the power control board, can be more accurate and convenient regulation through PWM control module semiconductor refrigerating plant 2 and heating device 3's power passes through resistance regulation power for the tradition, and the structure is comparatively simple.

Specifically, the PWM method is to control the magnitude of the analog signal parameter by the pulse width modulation (i.e. duty ratio modulation) of the digital signal; if the duty ratio of the heating voltage value is adjusted by PWM to 20%, the actual output voltage U is 20% (Umax-Umin) + Umin, the example voltage output range is 13-32V, and when the duty ratio is 20%, the output voltage U is 20% (32-13) +13 is 16.8V.

In this embodiment, the semiconductor refrigerating device 2 and the heating device 3 in each storage compartment 11 are power-regulated by the power control board through the single-pole double-throw switch, and the power control board is simple in structure and low in cost. Of course, in other embodiments, when other devices are disposed in each storage chamber 11, the single-pole double-throw switch may be configured as a single-pole multi-throw switch to meet the requirement.

To sum up, the utility model discloses a room 11 correspondence between each storing of constant temperature locker is equipped with semiconductor refrigerating plant 2 and heating device 3, and the constant temperature locker is still including corresponding the power control panel that room 11 sets up and be connected with power looks electric connection between each storing, is equipped with the single-pole double-throw switch of controlling semiconductor refrigerating plant 2 and the mutual switching work of heating device 3 on the power control panel. The semiconductor refrigerating device 2 is prevented from heating the storage chamber 11, the cold end of the semiconductor refrigerating device is prevented from generating condensation, the semiconductor refrigerating device 2 and the heating device 3 in each chamber share the power supply control board through the single-pole double-throw switch, the work of a control circuit is facilitated, the structure is simple, and the manufacturing cost can be saved.

The above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present invention.

Claims (10)

1. The utility model provides a constant temperature locker, includes the cabinet body, sets up a plurality of storing compartments in the cabinet body, its characterized in that: each storage compartment corresponds and is equipped with semiconductor refrigerating plant and heating device, the constant temperature locker still includes the power control panel that corresponds each storage compartment setting and with power looks electric connection, semiconductor refrigerating plant and heating device respectively with power control panel electric connection, be equipped with the single-pole double-throw switch of control semiconductor refrigerating plant and the mutual switching work of heating device on the power control panel.

2. The constant temperature cabinet of claim 1, wherein: the semiconductor refrigerating device comprises a semiconductor wafer, a refrigerating unit located on the front side of the semiconductor wafer and a heat radiating unit located on the rear side of the semiconductor wafer, wherein the refrigerating unit comprises a refrigerating heat conduction block, a refrigerating fin and a refrigerating heat conduction pipe, the refrigerating heat conduction block is in contact with the front surface of the semiconductor wafer, the refrigerating fin is connected between the refrigerating heat conduction block and the refrigerating fin, and the heat radiating unit comprises a heat radiating heat conduction block, a heat radiating fin and a heat radiating heat conduction pipe, the heat radiating heat conduction block is in contact with the rear surface of the semiconductor wafer, and the heat radiating heat conduction pipe is connected between the heat radiating heat conduction block and the heat radiating fin.

3. The constant temperature cabinet of claim 2, wherein: the semiconductor refrigerating device further comprises a heat insulation piece wrapped around the semiconductor wafer, and the heat insulation piece is connected with the refrigerating heat conduction block and the radiating heat conduction block in the front-back direction.

4. The constant temperature cabinet of claim 2, wherein: the refrigeration heat conduction block is also provided with a refrigeration heat conduction block fin protruding forwards from the front surface of the refrigeration heat conduction block, and the heat dissipation heat conduction block is also provided with a heat dissipation heat conduction block fin protruding backwards from the rear surface of the heat dissipation heat conduction block.

5. The constant temperature cabinet of claim 2, wherein: the constant-temperature storage cabinet is provided with an inner container forming a storage chamber, a partition plate arranged on the rear side of the inner container, a back plate matched with the partition plate, and a foaming layer positioned between the partition plate and the inner container, wherein a heat dissipation space for accommodating the heat dissipation unit is formed between the partition plate and the back plate, the semiconductor wafer is arranged in the foaming layer, and the refrigeration unit is arranged in the storage chamber.

6. The constant temperature cabinet of claim 5, wherein: the constant temperature locker still has the cooling fan who sets up in cooling fin below, the deep bead that sets up with the cooling fan cooperation, the deep bead encircles cooling fan's the latter half setting, the backplate is equipped with the heat dissipation air intake that sets up with the cooling fan cooperation, is located the heat dissipation air outlet of cooling fin top.

7. The constant temperature cabinet of claim 2, wherein: the constant-temperature storage cabinet further comprises a refrigeration fan arranged above the refrigeration unit, an air guide part arranged around the upper half part of the refrigeration fan, and an air duct cover plate arranged on the front side of the refrigeration unit, wherein the air duct cover plate is provided with a refrigeration return air inlet arranged in a matched manner with the refrigeration fan and refrigeration air outlets arranged on the left side, the right side and the lower side.

8. The constant temperature cabinet of claim 1, wherein: the constant-temperature storage cabinet is provided with an inner container and a back plate, the inner container forms a storage chamber, a foaming layer is formed between the inner container and the back plate, and the heating device is arranged in the foaming layer and is attached to the rear side of the inner container.

9. The constant temperature cabinet of claim 8, wherein: the heating device comprises a heat-conducting plate and a heating wire, wherein the heat-conducting plate is attached to the inner container, and the heating wire is connected with the heat-conducting plate.

10. The constant temperature cabinet of claim 1, wherein: and the power control board is provided with a PWM control module.

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