CN216213376U

CN216213376U - Transistor fence type heat dissipation structure

Info

Publication number: CN216213376U
Application number: CN202122779859.5U
Authority: CN
Inventors: 邹伟
Original assignee: Shanghai Pangfu Electronic Technology Co ltd
Current assignee: Shanghai Pangfu Electronic Technology Co ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2022-04-05
Anticipated expiration: 2031-11-15

Abstract

The utility model discloses a transistor barrier type heat dissipation structure, which comprises an installation plate, a top of the installation plate is evenly provided with a placement groove and a heat insulation plate, the bottom of the installation plate is evenly provided with a card groove, and a plurality of groups of the card The inner top of the slot is provided with a plurality of groups of through holes that communicate with the inside of the placement slot, the interior of the placement slot of the plurality of groups are all provided with transistors, the two sides of the interior of the card slot of the plurality of groups are provided with limit chutes, and many Both ends of the inner top of the limit chute are provided with fixed blocks; the utility model can effectively realize the heat conduction through the mutual cooperation of the water pump, the U-shaped cooling bin, the output pipe, the cooling pipe, the heat conduction plate and the cooling plate. The circulating cooling of the plate works, and the cooling liquid inside the cooling pipe can also be cooled through the cooling plate, so as to prevent the cooling liquid from generating high temperature and reduce the cooling effect, thereby improving the heat dissipation efficiency of the transistor, thereby further reducing its aging phenomenon. usability.

Description

Transistor fence type heat dissipation structure

Technical Field

The utility model relates to the technical field of transistors, in particular to a transistor fence type heat dissipation structure.

Background

The transistor is a solid semiconductor device, has multiple functions such as detection, rectification, amplification, switching, voltage stabilization, signal modulation and the like, can control output current based on input voltage as a variable current switch, is different from a common mechanical switch, controls the opening and closing of the transistor by using an electric signal, and has very high switching speed, and the switching speed in a laboratory can reach more than 100 GHz;

the prior transistor has the following inconveniences in the use process: 1. when the existing transistors are assembled, most of the transistors are arranged in a mutually close manner, and the close arrangement type installation can mix heat generated by the transistors in working with heat of other transistors around, so that the self heat of the transistors is improved, the aging of the transistors is accelerated, the service life of the transistors is shortened, and operators need to replace the transistors more frequently; 2. the internal structure of the existing transistor is single, the heat dissipation effect is poor, and the phenomenon of accumulation of the internal heat of the transistor is caused, so that the aging speed of the transistor is further accelerated, and the use practicability of the transistor is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a transistor fence type heat dissipation structure to solve the following inconveniences in the use process of the existing transistor proposed in the background art: 1. when the existing transistors are assembled, most of the transistors are arranged in a mutually close mode, and due to the close arrangement mode, heat generated by the transistors during working can be mixed with heat of other surrounding transistors, so that the self heat of the transistors is improved, and the aging of the transistors is accelerated; 2. the existing transistor has a single internal structure and a poor heat dissipation effect, so that the phenomenon of accumulation of heat inside the transistor is caused, and the aging speed of the transistor is accelerated again.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a transistor fence formula heat radiation structure, includes the mounting panel, the top of mounting panel evenly is equipped with standing groove and heat insulating board, the bottom of mounting panel evenly is equipped with draw-in groove, multiunit the interior top of draw-in groove all is equipped with the through-hole that multiunit and standing groove are linked together, the multiunit the inside of standing groove all is equipped with transistor, multiunit the inside both sides of draw-in groove all are equipped with spacing spout, multiunit the both ends at top all are equipped with fixed block, multiunit in the spacing spout the inside of draw-in groove all is equipped with heat-conducting plate, multiunit the top of heat-conducting plate both sides all is equipped with the spacing slider with spacing spout matched with, multiunit the both ends at spacing slider top all are equipped with the fixed slot with fixed block looks adaptation, the bottom of mounting panel is equipped with cooling module.

Preferably, cooling module is including installation storehouse, water pump, output tube, cooling plate and U type cooling bin, U type cooling bin is located the back one end in the installation board outside, the bottom in U type cooling bin evenly is equipped with the cooling tube, and the one end of cooling tube extends to the bottom of the inside one side in U type cooling bin, the four corners department of U type cooling bin bottom is equipped with the cooling plate jointly, the installation storehouse is located the bottom that U type cooling bin kept away from cooling tube one side, the interior bottom in installation storehouse is equipped with the water pump, and the input of water pump extends to the interior bottom in U type cooling bin, the output of water pump is equipped with the output tube that is linked together with the cooling tube other end.

Preferably, one side of the top of the U-shaped cooling bin is provided with a water inlet communicated with the inside of the U-shaped cooling bin, and a sealing plug matched with the water inlet is arranged inside the water inlet.

Preferably, the fixing block, the fixing groove and the placing groove are all made of arc-shaped structures.

Preferably, the cooling pipe is made of a continuous zigzag structure.

Preferably, the four corners of the bottom of the U-shaped cooling bin are provided with mounting blocks, and the mounting blocks are connected with the cooling plate.

Compared with the prior art, the utility model has the beneficial effects that: the transistor fence type heat dissipation structure;

1. through the mutual matching of the transistors, the placing grooves and the heat insulation plates, each group of transistors can be isolated, so that heat generated during working can not affect other transistors around, the aging speed of the transistors is reduced, the service life of the transistors is prolonged, and the replacement frequency of operators is reduced;

2. through mutually supporting of water pump, U type cooling bin, output tube, cooling tube, heat-conducting plate and cooling plate, can effectual realization to the circulation cooling work of heat-conducting plate, and still can cool off the inside coolant liquid of cooling tube through the cooling plate to prevent that the coolant liquid from producing high temperature and reducing the cooling effect, thereby improved the radiating efficiency of transistor, thereby further reduce its ageing phenomenon, with the practicality that improves its use.

Drawings

FIG. 1 is a front cross-sectional view of the present invention;

FIG. 2 is a first perspective view of the mounting plate of the present invention;

FIG. 3 is a schematic perspective view of a mounting plate according to the present invention;

FIG. 4 is a bottom view of the U-shaped cooling cartridge of the present invention;

FIG. 5 is an enlarged view of the structure at A of FIG. 1 according to the present invention;

fig. 6 is an enlarged view of the structure at B of fig. 1 according to the present invention.

In the figure: 1. mounting a plate; 2. installing a bin; 3. a water pump; 4. an output pipe; 5. a cooling tube; 6. a cooling plate; 7. a heat conducting plate; 8. a U-shaped cooling bin; 9. a transistor; 10. a heat insulation plate; 11. a fixed block; 12. fixing grooves; 13. a limiting chute; 14. a limiting slide block; 15. a placement groove; 16. a through hole; 17. a clamping groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides an embodiment: the utility model provides a transistor fence formula heat radiation structure, including mounting panel 1, mounting panel 1's top evenly is equipped with standing groove 15 and heat insulating board 10, mounting panel 1's bottom evenly is equipped with draw-in groove 17, the interior top of multiunit draw-in groove 17 all is equipped with multiunit and the inside through-hole 16 that is linked together of standing groove 15, the inside of multiunit standing groove 15 all is equipped with transistor 9, the inside both sides of multiunit draw-in groove 17 all are equipped with spacing spout 13, the both ends at top all are equipped with fixed block 11 in the multiunit spacing spout 13, the inside of multiunit draw-in groove 17 all is equipped with heat-conducting plate 7, the top of multiunit heat-conducting plate 7 both sides all is equipped with spacing slider 14 with spacing spout 13 matched with, the both ends at multiunit spacing slider 14 top all are equipped with the fixed slot 12 with 11 looks adaptations of fixed block, mounting panel 1's bottom is equipped with cooling module, be convenient for improve the cooling effect and reduce the ageing speed of transistor 9 legal system people in order to prolong its life.

Further, cooling unit is including installation storehouse 2, water pump 3, output tube 4, cooling tube 5, cooling plate 6 and U type cooling storehouse 8, U type cooling storehouse 8 is located the back one end in the 1 outside of installation board, U type cooling storehouse 8's bottom evenly is equipped with cooling tube 5, and cooling tube 5's one end extends to the bottom of the inside one side of U type cooling storehouse 8, the four corners department of U type cooling storehouse 8 bottom is equipped with cooling plate 6 jointly, installation storehouse 2 is located the bottom that U type cooling storehouse 8 kept away from cooling tube 5 one side, the interior bottom in installation storehouse 2 is equipped with water pump 3, and water pump 3's input extends to U type cooling storehouse 8's interior bottom, water pump 3's output end is equipped with the output tube 4 that is linked together with the 5 other ends of cooling tube, be convenient for improve the cooling effect and reduce the ageing speed of transistor 9 people in order to prolong its life.

Furthermore, one side of the top of the U-shaped cooling bin 8 is provided with a water inlet communicated with the inside of the U-shaped cooling bin, and a sealing plug matched with the water inlet is arranged inside the water inlet, so that cooling liquid can be conveniently infused.

Further, the fixing block 11, the fixing groove 12 and the placing groove 15 are all made of arc-shaped structures, so that the clamping and fixing functions are conveniently realized, and the transistor 9 is also conveniently placed.

Furthermore, the cooling pipe 5 is made of a continuous zigzag structure, so that the heat dissipation efficiency is improved, and the circulating cooling function is realized.

Further, the four corners of the bottom of the U-shaped cooling bin 8 are provided with mounting blocks, and the mounting blocks are connected with the cooling plate 6, so that the cooling plate 6 is convenient to mount and fix.

The working principle is as follows: the electric parts of the device are all supplied with power by the storage battery, when in use, an operator can firstly place the transistors 9 in the placing groove 15, then each group of transistors 9 can be isolated by the design of the heat insulation plate 10, so that the heat generated in the operation can not affect other transistors 9 around, thereby reducing the aging speed of the transistors 9, prolonging the service life of the transistors, reducing the frequency of replacement of the operators, simultaneously, the heat generated in the operation of the transistors 9 can be guided into the heat conduction plate 7 through the through holes 16 to facilitate the subsequent cooling operation, when the heat conduction plate 7 is used for a long time and needs to be replaced, the operator can directly pull the heat conduction plate 7 to drive the limit slide block 14 to slide in the limit slide groove 13, and further, the fixing groove 12 can be separated from the outside of the fixing block 11 to release the fixation of the heat conduction plate 7, so that the operator can take out and replace the device;

at the during operation, can be with the inside coolant liquid suction of U type cooling bin 8 to the inside of output tube 4 through the work of water pump 3, transmit the inside to cooling tube 5 through output tube 4, structural design through cooling tube 5 can absorb cooling work to the inside heat of heat-conducting plate 7, the design through cooling plate 6 can accelerate the thermal cooling of the inside coolant liquid of cooling tube 5 simultaneously, with the radiating efficiency who promotes transistor 9, the inside coolant liquid of cooling tube 5 is carrying out the work of cooling to heat-conducting plate 7 and is accomplishing the back simultaneously, still can transmit the inside to U type cooling bin 8, in order to realize circulation cooling work.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that the terms "connected" and "connected" are to be interpreted broadly, e.g., as either a fixed connection or a removable connection, unless expressly stated or limited otherwise; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Claims

1. A transistor barrier type heat dissipation structure, comprising a mounting plate (1), characterized in that: the top of the mounting plate (1) is evenly provided with a placement groove (15) and a heat insulation plate (10), the mounting plate The bottom of (1) is evenly provided with card slots (17), and the inner tops of multiple groups of said card slots (17) are provided with multiple groups of through holes (16) that communicate with the interior of the placement slot (15). Transistors (9) are provided inside the placement grooves (15), limit chutes (13) are provided on both sides of the interior of the plurality of sets of the clamping grooves (17), and the plurality of sets of limit chutes (13) Both ends of the inner top are provided with fixing blocks (11), the interiors of the plurality of sets of the card slots (17) are provided with heat-conducting plates (7), and the tops on both sides of the plurality of sets of the heat-conducting plates (7) are provided with The limit sliders (14) matched with the limit chute (13), the two ends of the tops of the plurality of sets of limit sliders (14) are provided with fixing grooves (11) adapted to the fixing blocks (11). 12), the bottom of the mounting plate (1) is provided with a cooling component.

2. A transistor barrier type heat dissipation structure according to claim 1, characterized in that: the cooling assembly comprises an installation bin (2), a water pump (3), an output pipe (4), a cooling pipe (5), a cooling A plate (6) and a U-shaped cooling bin (8), the U-shaped cooling bin (8) is located at one end of the back of the outer side of the mounting plate (1), and the bottom of the U-shaped cooling bin (8) is evenly provided with cooling pipes ( 5), and one end of the cooling pipe (5) extends to the bottom of the inner side of the U-shaped cooling bin (8), and the four corners of the bottom of the U-shaped cooling bin (8) are provided with cooling plates (6), the The installation bin (2) is located at the bottom of the side of the U-shaped cooling bin (8) away from the cooling pipe (5). Extending to the inner bottom of the U-shaped cooling bin (8), the output end of the water pump (3) is provided with an output pipe (4) communicating with the other end of the cooling pipe (5).

3. A transistor barrier type heat dissipation structure according to claim 2, characterized in that: one side of the top of the U-shaped cooling bin (8) is provided with a water inlet communicated with the inside thereof, and the inside of the water inlet is provided with a water inlet. There is a matching sealing plug.

4 . The barrier-type heat dissipation structure for transistors according to claim 1 , wherein the fixing block ( 11 ), the fixing groove ( 12 ) and the placing groove ( 15 ) are all made of arc structures. 5 .

5 . The transistor barrier type heat dissipation structure according to claim 2 , wherein the cooling pipe ( 5 ) is made of a continuous zigzag structure. 6 .

6. A transistor barrier type heat dissipation structure according to claim 2, characterized in that: four corners of the bottom of the U-shaped cooling bin (8) are provided with mounting blocks, and the mounting blocks and the cooling plate (6) are mutually connect.