CN213634409U - Processor cooling device installed inside computer host - Google Patents
Processor cooling device installed inside computer host Download PDFInfo
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- CN213634409U CN213634409U CN202120027902.XU CN202120027902U CN213634409U CN 213634409 U CN213634409 U CN 213634409U CN 202120027902 U CN202120027902 U CN 202120027902U CN 213634409 U CN213634409 U CN 213634409U
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Abstract
The utility model discloses a processor cooling device arranged in a computer host, which comprises a base, a pair of mounting racks arranged at two sides of the base, the mounting rack is provided with a plurality of mounting holes, a plurality of mounting pillars are arranged in the mounting holes, a plurality of heat conduction pipes are U-shaped, the bottoms of the heat conduction pipes are embedded in the lower end surface of the base, a plurality of heat dissipation fins are stacked above the base, the vertical sections of the heat conduction pipes penetrate through the heat dissipation fins, the heat-radiating fins are fixedly connected with the heat-conducting pipes, a cooling module is arranged on one side of the heat-radiating fins, a cooling fan is arranged on the side of the cooling module far away from the heat-radiating fins, a cooling plate is fixedly arranged on the upper end surface of the topmost heat-radiating fins, a dustproof mesh enclosure is arranged above the base, and the heat radiating fins, the cooling module, the cooling fan and the cooling plate are all arranged in the dustproof mesh enclosure. The utility model discloses the radiating effect is good, can prevent dust.
Description
Technical Field
The utility model relates to a computer field, what specifically say is what an install in inside treater cooling device of main frame.
Background
As is well known, a computer processor is a functional unit that interprets and executes instructions, also referred to as a central processing unit or CPU, which is the central nervous system of the computer, in contrast to devices around the processor and memory, referred to as peripherals, such as keyboards, displays, disks, tape drives, etc. Each processor has a unique set of operating commands, which may be referred to as the processor's instruction set, such as store, call, etc. The central processing unit is the operation core and the control core of a computer.
The computer processor mainly has the functions of interpreting computer instructions and processing data in computer software, and the CPU consists of an arithmetic unit, a controller, a register and a bus for realizing the data, control and state of the connection among the arithmetic unit, the controller and the register.
SUMMERY OF THE UTILITY MODEL
Therefore, in order to solve the above insufficiency, the utility model provides a reasonable in design herein, the radiating effect is good, can dirt-proof install in the inside treater cooling device of main frame.
The utility model is realized by constructing a processor cooling device which is arranged inside a computer host and comprises a base;
the device also comprises a pair of mounting frames which are arranged at two sides of the base; a plurality of mounting holes are formed in the mounting frame;
the device also comprises a plurality of mounting pillars which are arranged in the mounting holes;
the device also comprises a plurality of heat conduction pipes which are U-shaped, and the bottoms of the heat conduction pipes are embedded in the lower end surface of the base;
the device also comprises a plurality of radiating fins stacked above the base; the plurality of heat conduction pipe vertical sections penetrate through the plurality of radiating fins; the radiating fins are fixedly connected with the heat conducting pipes;
the device also comprises a cooling module which is arranged on one side of the radiating fin;
the device also comprises a cooling fan which is arranged at the far radiating fin side of the cooling module;
the device also comprises a cooling plate which is fixedly arranged on the upper end surface of the topmost radiating fin;
the device also comprises a dustproof mesh enclosure which is arranged above the base and is fixedly connected with the mounting support; the radiating fins, the cooling module, the cooling fan and the cooling plate are all arranged in the dustproof mesh enclosure.
Furthermore, the material of the heat conduction pipe is copper.
Furthermore, the heat conduction pipe is hollow, and heat conduction liquid is filled in the heat conduction pipe.
Furthermore, the base is made of heat dissipation and heat transfer materials.
Furthermore, the cooling module comprises a frame, a first cavity and a second cavity are arranged on two sides of the frame, the cooling module further comprises a plurality of first heating panels and a plurality of second heating panels, the first heating panels are hollow and communicated with the first cavity and the second cavity, the second heating panels are arranged between the plurality of first heating panels, a first pipe orifice is formed in the top of the frame and communicated with the first cavity, a second pipe orifice is formed in the bottom of the frame and communicated with the second cavity.
Furthermore, a snakelike water tank is arranged inside the cooling plate, a water inlet pipe and a water outlet pipe are arranged on one side of the cooling plate, the water inlet pipe is communicated with the first end part of the water tank, and the water outlet pipe is communicated with the second end part of the water tank.
The utility model has the advantages of as follows: the utility model provides a processor cooling device arranged in a computer host through improvement, which has the following improvement and advantages;
its 1, the utility model discloses a base, a pair of mounting bracket sets up in the base both sides, set up the several mounting hole on the mounting bracket, several erection bracing post sets up in the several mounting hole, several heat pipes are the U form, the bottom inlays terminal surface under the base, several heat dissipation fin stacks in the base top, several heat pipe vertical section runs through several heat dissipation fin, heat dissipation fin and heat pipe fixed connection, a cooling module installs in heat dissipation fin one side, a cooling fan installs in the cooling module and keeps heat dissipation fin side far away, a cooling plate fixed mounting is in the fin up end of top heat dissipation, a dustproof screen panel sets up in the base top, keep fixed connection with erection bracing post, heat dissipation fin, cooling module, cooling fan and cooling plate all set up in dustproof screen panel. The utility model relates to a rationally, the heat pipe is favorable to thermal dispersion with treater heat evenly distributed to the radiating fin in, cools off the treater, the cooling plate on radiating fin upper portion, and the cooling plate contacts with the radiating fin, can cool off radiating fin, improves the cooling effect, and the cooling fan of side drives the air flow, and cooling module cools off the air that flows, and the heat is taken away to radiating fin to the refrigerated air-blowing, improves cooling efficiency.
Its 2, reasonable design dust screen panel, dust screen panel can block the dust, and then can prevent dust for the treater main part to avoid the dust to get into the inside of treater main part.
In the embodiment, the heat pipe is made of copper, which has good thermal conductivity, so that the heat generated by the processor can be rapidly and uniformly dispersed into the heat dissipation fins.
In the embodiment, the heat conduction pipe is hollow, and the heat conduction pipe is filled with the heat conduction liquid, so that the heat conduction efficiency is further improved.
In the embodiment, the base is made of a heat dissipation and heat transfer material, and the base is made of an aluminum alloy and silver composite material, so that the heat transfer work is accelerated, the heat conductivity is accelerated through heat transfer, and the heat transfer efficiency is improved.
It 6, in this embodiment, the cooling module includes a frame, and the frame both sides are provided with first cavity and second cavity, and the cooling module still includes the first heating panel of several and second heating panel, and the inside cavity of first heating panel communicates with first cavity and second cavity, and the second heating panel sets up between the first heating panel of several, and the frame top sets up a first mouth of pipe, first mouth of pipe and first cavity intercommunication, and the frame bottom sets up a second mouth of pipe, second mouth of pipe and second cavity intercommunication. The coolant liquid is discharged from the second pipe orifice in entering and being filled into the first cavity, the first heating panel inner cavity and the second cavity from the first pipe orifice, and cooling fan drives the air flow, and the air is through cooling module, and the heat in the air is taken away the heat of heating panel through the exchange of first heating panel and second heating panel again, realizes the cooling to flowing air, and flowing air after the cooling blows to radiating fin, improves the radiating efficiency.
Its 7, in this embodiment, the inside snakelike basin that sets up of cooling plate, cooling plate one side is provided with inlet tube and outlet pipe, inlet tube and basin first end intercommunication, outlet pipe and basin second end intercommunication.
Its 8, the coolant liquid enters into snakelike basin from the inlet tube in, from outlet pipe drainage, the circulation flow gives off radiating fin and exchanges the heat of cooling plate and take away, improves the radiating efficiency.
Drawings
Fig. 1 to 3 are schematic structural views of the present invention;
FIG. 4 is a cross-sectional view A-A of FIG. 2;
FIG. 5 is a cross-sectional view B-B of FIG. 4;
fig. 6 is a cross-sectional view C-C of fig. 5.
Wherein: 1. a dust-proof net cover; 2. a mounting frame; 3. mounting a support column; 4. a base; 5. a heat conducting pipe; 6. a heat dissipating fin; 7. a cooling plate; 8. a cooling module; 9. a cooling fan; 10. a water tank; 11. a water inlet pipe; 12. a water outlet pipe; 13. a first nozzle; 14. a first heat dissipation plate; 15. a second heat dissipation plate; 16 a first cavity; 17. a second cavity.
Detailed Description
The present invention will be described in detail with reference to fig. 1 to 6, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a processor cooling device installed in the computer host through improvement, as shown in fig. 1-6, which can be implemented as follows; including a base 4, a pair of mounting bracket 2 sets up in base 4 both sides, set up the several mounting hole on mounting bracket 2, several erection bracing post 3 sets up in the several mounting hole, several heat pipe 5 is the U form, the bottom inlays terminal surface under base 4, several radiating fin 6 stacks in base 4 top, several radiating fin 6 is run through to the vertical section of several heat pipe 5, radiating fin 6 and heat pipe 5 fixed connection, a cooling module 8 is installed in radiating fin 6 one side, a cooling fan 9 is installed in the radiating fin 6 side far away of cooling module 8, a cooling plate 7 fixed mounting is in 6 up end of top radiating fin, a dust screen panel 1 sets up in base 4 top, keep fixed connection with erection bracing post 3, radiating fin 6, cooling module 8, cooling fan 9 and cooling plate 7 all set up in dust screen panel 1. The utility model relates to a rationally, the heat pipe is favorable to thermal dispersion with treater heat evenly distributed to the radiating fin in, cools off the treater, the cooling plate on radiating fin upper portion, and the cooling plate contacts with the radiating fin, can cool off radiating fin, improves the cooling effect, and the cooling fan of side drives the air flow, and cooling module cools off the air that flows, and the heat is taken away to radiating fin to the refrigerated air-blowing, improves cooling efficiency.
In addition, the reasonable design of the dustproof mesh enclosure can block dust, and then the dustproof mesh enclosure can prevent dust for the processor main body so as to prevent the dust from entering the inside of the processor main body.
The utility model discloses during the implementation, contact heat pipe 5 bottom and treater, installation pillar 3 keeps fixed connection with the mainboard, heat pipe 5 is with treater heat evenly distributed to radiating fin 6 in, be favorable to thermal dispersion, cool off the treater, cooling plate 7 on radiating fin 6 upper portion, cooling plate 7 and radiating fin 6 contact, can cool off radiating fin 6, improve the cooling effect, the cooling fan 9 of side drives the air flow, cooling module 8 cools off the air that flows, the heat is taken away to radiating fin 6 to the refrigerated air blow, the cooling efficiency is improved.
In this embodiment, the heat pipe 5 is made of copper, which has good thermal conductivity, so as to rapidly and uniformly disperse the heat generated by the processor into the heat dissipation fins.
In this embodiment, the heat conduction pipe 5 is hollow, and the heat conduction pipe 5 is filled with a heat conduction liquid, thereby further improving the heat conduction efficiency.
In this embodiment, the base 4 is made of a heat dissipation and heat transfer material, and the base 4 is made of an aluminum alloy and silver composite material, so that the heat transfer work is accelerated, the heat conductivity is accelerated through heat transfer, and the heat transfer efficiency is improved.
In this embodiment, the cooling module 8 includes a frame, a first cavity 16 and a second cavity 17 are disposed on two sides of the frame, the cooling module 8 further includes a plurality of first heat dissipation plates 14 and second heat dissipation plates 15, the first heat dissipation plates 14 are hollow and communicated with the first cavity 16 and the second cavity 17, the second heat dissipation plates 15 are disposed between the plurality of first heat dissipation plates 14, a first pipe opening 13 is disposed on the top of the frame, the first pipe opening 13 is communicated with the first cavity 16, a second pipe opening is disposed on the bottom of the frame, and the second pipe opening is communicated with the second cavity 17.
The coolant liquid enters from first mouth of pipe 13 and fills in first cavity 16, cavity and second cavity 17 in the first heating panel 14, discharge from the second mouth of pipe, cooling fan 9 drives the air flow, the air is through cooling module 8, the heat in the air is through the exchange of first heating panel 14 and second heating panel 15, the coolant liquid takes away the heat of heating panel again, realize the cooling to flowing air, the flowing air after the cooling blows to radiating fin 6, the efficiency of heat dissipation is improved.
In this embodiment, a serpentine water tank 10 is disposed inside the cooling plate 7, a water inlet pipe 11 and a water outlet pipe 12 are disposed on one side of the cooling plate 7, the water inlet pipe 11 is communicated with a first end of the water tank 10, and the water outlet pipe 12 is communicated with a second end of the water tank 10.
The cooling liquid enters the snakelike water tank 10 from the water inlet pipe 11, is drained from the water outlet pipe 12, circularly flows, and dissipates and exchanges heat of the cooling plate with the radiating fins 6 to be taken away, so that the radiating efficiency is improved.
The utility model has the following improvements and advantages;
1, the present invention provides a processor cooling device installed inside a computer host by improvement, as shown in fig. 1 to 6, which can be implemented as follows; including a base 4, a pair of mounting bracket 2 sets up in base 4 both sides, set up the several mounting hole on mounting bracket 2, several erection bracing post 3 sets up in the several mounting hole, several heat pipe 5 is the U form, the bottom inlays terminal surface under base 4, several radiating fin 6 stacks in base 4 top, several radiating fin 6 is run through to the vertical section of several heat pipe 5, radiating fin 6 and heat pipe 5 fixed connection, a cooling module 8 is installed in radiating fin 6 one side, a cooling fan 9 is installed in the radiating fin 6 side far away of cooling module 8, a cooling plate 7 fixed mounting is in 6 up end of top radiating fin, a dust screen panel 1 sets up in base 4 top, keep fixed connection with erection bracing post 3, radiating fin 6, cooling module 8, cooling fan 9 and cooling plate 7 all set up in dust screen panel 1. The utility model relates to a rationally, the heat pipe is favorable to thermal dispersion with treater heat evenly distributed to the radiating fin in, cools off the treater, the cooling plate on radiating fin upper portion, and the cooling plate contacts with the radiating fin, can cool off radiating fin, improves the cooling effect, and the cooling fan of side drives the air flow, and cooling module cools off the air that flows, and the heat is taken away to radiating fin to the refrigerated air-blowing, improves cooling efficiency.
Its 2, reasonable design dust screen panel, dust screen panel can block the dust, and then can prevent dust for the treater main part to avoid the dust to get into the inside of treater main part.
The utility model discloses during the implementation, contact heat pipe 5 bottom and treater, installation pillar 3 keeps fixed connection with the mainboard, heat pipe 5 is with treater heat evenly distributed to radiating fin 6 in, be favorable to thermal dispersion, cool off the treater, cooling plate 7 on radiating fin 6 upper portion, cooling plate 7 and radiating fin 6 contact, can cool off radiating fin 6, improve the cooling effect, the cooling fan 9 of side drives the air flow, cooling module 8 cools off the air that flows, the heat is taken away to radiating fin 6 to the refrigerated air blow, the cooling efficiency is improved.
In the embodiment, the heat pipe 5 is made of copper, which has good thermal conductivity, so as to rapidly and uniformly disperse the heat generated by the processor into the heat dissipation fins.
In this embodiment, the heat pipe 5 is hollow, and the heat pipe 5 is filled with a heat conductive liquid, thereby further improving the heat transfer efficiency.
In the embodiment, the base 4 is made of a heat dissipation and heat transfer material, and the base 4 is made of an aluminum alloy and silver composite material, so that the heat transfer work is accelerated, the heat conductivity is accelerated through heat transfer, and the heat transfer efficiency is improved.
It 6, in this embodiment, the cooling module 8 includes a frame, the frame both sides are provided with first cavity 16 and second cavity 17, the cooling module 8 still includes first heating panel 14 of several and second heating panel 15, the inside cavity of first heating panel 14, communicate with first cavity 16 and second cavity 17, second heating panel 15 sets up between first heating panel 14 of several, the frame top sets up a first mouth of pipe 13, first mouth of pipe 13 communicates with first cavity 16, the frame bottom sets up a second mouth of pipe, the second mouth of pipe communicates with second cavity 17. The coolant liquid enters from first mouth of pipe 13 and fills in first cavity 16, cavity and second cavity 17 in the first heating panel 14, discharge from the second mouth of pipe, cooling fan 9 drives the air flow, the air is through cooling module 8, the heat in the air is through the exchange of first heating panel 14 and second heating panel 15, the coolant liquid takes away the heat of heating panel again, realize the cooling to flowing air, the flowing air after the cooling blows to radiating fin 6, the efficiency of heat dissipation is improved.
In the embodiment of the present invention, a serpentine water tank 10 is disposed inside the cooling plate 7, a water inlet pipe 11 and a water outlet pipe 12 are disposed on one side of the cooling plate 7, the water inlet pipe 11 is communicated with a first end of the water tank 10, and the water outlet pipe 12 is communicated with a second end of the water tank 10.
In its 8, the coolant liquid enters into snakelike basin 10 from inlet tube 11, from outlet pipe 12 drainage, and the circulation flows, gives off fin 6 and exchanges the heat of cooling plate and take away, improves the radiating efficiency.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. The utility model provides an install inside treater cooling heat sink in host computer which characterized in that: the device comprises a base (4);
the device also comprises a pair of mounting frames (2) which are arranged at two sides of the base (4); a plurality of mounting holes are formed in the mounting rack (2);
the device also comprises a plurality of mounting pillars (3) which are arranged in the mounting holes;
the device also comprises a plurality of heat conduction pipes (5) which are U-shaped, and the bottoms of the heat conduction pipes are embedded in the lower end surface of the base (4);
the device also comprises a plurality of radiating fins (6) stacked above the base (4); the plurality of heat conduction pipes (5) penetrate through the plurality of heat dissipation fins (6); the heat radiating fins (6) are fixedly connected with the heat conducting pipe (5);
the device also comprises a cooling module (8) which is arranged on one side of the radiating fin (6);
the device also comprises a cooling fan (9) which is arranged at the side of the cooling module (8) far away from the radiating fin (6);
the device also comprises a cooling plate (7) which is fixedly arranged on the upper end surface of the topmost radiating fin (6);
the device also comprises a dustproof mesh enclosure (1) which is arranged above the base (4) and is fixedly connected with the mounting pillar (3); the heat radiating fins (6), the cooling module (8), the cooling fan (9) and the cooling plate (7) are all arranged in the dustproof mesh enclosure (1).
2. The processor cooling device installed inside a computer host according to claim 1, wherein: the heat conduction pipe (5) is made of copper.
3. The processor cooling device installed inside the computer host according to claim 1 or 2, wherein: the heat conduction pipe (5) is hollow, and heat conduction liquid is filled in the heat conduction pipe (5).
4. The processor cooling device installed inside a computer host according to claim 1, wherein: the base (4) is made of heat dissipation and heat transfer materials.
5. The processor cooling device installed inside a computer host according to claim 1, wherein: cooling module (8) includes a frame, the frame both sides are provided with first cavity (16) and second cavity (17), cooling module (8) still include the first heating panel (14) of several and second heating panel (15), the inside cavity of first heating panel (14), with first cavity (16) and second cavity (17) intercommunication, second heating panel (15) set up in the several between first heating panel (14), the frame top sets up a first mouth of pipe (13), first mouth of pipe (13) and first cavity (16) intercommunication, the frame bottom sets up a second mouth of pipe, the second mouth of pipe and second cavity (17) intercommunication.
6. The processor cooling device installed inside a computer host according to claim 1, wherein: the cooling device is characterized in that a snake-shaped water tank (10) is arranged inside the cooling plate (7), a water inlet pipe (11) and a water outlet pipe (12) are arranged on one side of the cooling plate (7), the water inlet pipe (11) is communicated with a first end part of the water tank (10), and the water outlet pipe (12) is communicated with a second end part of the water tank (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120027902.XU CN213634409U (en) | 2021-01-07 | 2021-01-07 | Processor cooling device installed inside computer host |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120027902.XU CN213634409U (en) | 2021-01-07 | 2021-01-07 | Processor cooling device installed inside computer host |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213634409U true CN213634409U (en) | 2021-07-06 |
Family
ID=76641300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120027902.XU Active CN213634409U (en) | 2021-01-07 | 2021-01-07 | Processor cooling device installed inside computer host |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213634409U (en) |
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2021
- 2021-01-07 CN CN202120027902.XU patent/CN213634409U/en active Active
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