CN109710043A - A kind of computer heat radiating device - Google Patents
A kind of computer heat radiating device Download PDFInfo
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- CN109710043A CN109710043A CN201811488017.0A CN201811488017A CN109710043A CN 109710043 A CN109710043 A CN 109710043A CN 201811488017 A CN201811488017 A CN 201811488017A CN 109710043 A CN109710043 A CN 109710043A
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- inner chamber
- heat dissipation
- vertical fin
- heat
- inner cavity
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 76
- 230000017525 heat dissipation Effects 0.000 claims abstract description 58
- 238000001816 cooling Methods 0.000 claims abstract description 17
- 238000001514 detection method Methods 0.000 claims abstract description 8
- 230000005611 electricity Effects 0.000 claims abstract description 4
- 238000005192 partition Methods 0.000 claims description 8
- 239000011358 absorbing material Substances 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000036413 temperature sense Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of computer heat radiating devices, including cabinet and cooling mechanism, the cooling mechanism includes water tank, water pump, first heat dissipation box, second heat dissipation box, controller, temperature inductor and exhaust fan, computer motherboard is installed on the outside of first cassette bottom of first heat dissipation box, the controller, temperature inductor is separately mounted on computer motherboard, the controller respectively with temperature inductor, water pump and exhaust fan electrical connection, the controller is preset with first threshold and second threshold, when temperature inductor detection temperature data is greater than first threshold, the controller controls water pump operation;When temperature inductor detection temperature data is greater than second threshold, the controller controls exhaust fan electricity operation.Computer heat radiating device clever structure of the invention, by water cooling and air-cooled fine combination, rapid heat dissipation, heat dissipation performance is high.
Description
Technical field
The present invention relates to computer hardware equipment fields, and in particular to a kind of computer heat radiating device.
Background technique
With the rapid development of electronic industry, computer have become people office, life in essential equipment.Numerous
In busy work, computer is constantly in long time running state, therefore the computer moment is made to keep preferable and sustainable
Long-time use state works to the people most important.
In existing computer, CPU is mounted on mainboard.CPU can give out biggish heat at work,
A portion heat is taken away by fan, and another part heat, which can be transmitted on mainboard, to radiate.But in existing computer
In, it is not provided with the structure for mainboard heat dissipation, not only influences the mainboard service life in this way, but also to the job stability of computer
It will also result in certain influence.
Summary of the invention
It is an object of the present invention to provide a kind of new solutions of computer heat radiating device.
According to an aspect of the present invention, a kind of computer heat radiating device, including cabinet and cooling mechanism, the machine are provided
The adjacent side of case offers the first mounting hole and the second mounting hole, first mounting hole and the second mounting hole between the upper and lower every point
Cloth, the cabinet two sides offer air hole, the cooling mechanism include water tank, water pump, the first heat dissipation box, the second heat dissipation box,
Controller, temperature inductor and exhaust fan, the first heat dissipation box inside are separated into first inner chamber by first partition or so
And second inner chamber, the first inner chamber and second inner chamber are connected by " Qian " font interface channel, first heat dissipation box includes
The first cassette bottom to link together and the first box cover, the second heat dissipation box inside are separated into third by second partition or so
Chamber and the 4th inner cavity, second heat dissipation box include the second cassette bottom to link together and the second box cover, the first inner chamber with
Third inner cavity is connected to by the first water service pipe, and the second inner chamber is connected to the 4th inner cavity by the second water service pipe, and described first
Water service pipe and second water service pipe one end, which are respectively perpendicular, is connected to the first box cover lower part, and first water service pipe and the second water service pipe are another
One end, which is respectively perpendicular, is connected to the second cassette bottom top, and the third intracavity bottom is connected with water inlet pipe, and the water inlet pipe passes through water
Pump is connected with water tank, and the 4th intracavity bottom is connected with outlet pipe and is connected by outlet pipe with water tank, second heat dissipation
Box is arranged in the second mounting hole, and second box cover is fixed by engaging lug and cabinet, and the water tank is arranged in chassis bottom
And be connected with the second cassette bottom outside, first heat dissipation box is fixed with enclosure top, and the exhaust fan is arranged in the first mounting hole
Interior, the exhaust fan is fixed by engaging lug and cabinet, and the exhaust fan is located on the outside of the first box cover, on the outside of first cassette bottom
Computer motherboard is installed, the controller, temperature inductor are separately mounted on computer motherboard, the controller respectively with
Temperature inductor, water pump and exhaust fan electrical connection, the controller are preset with first threshold and second threshold, work as temperature sense
When device detects temperature data greater than first threshold, the controller controls water pump operation;When temperature inductor detects temperature data
When greater than second threshold, the controller controls exhaust fan electricity operation.
Preferably, it is provided with the heat-dissipating pipe that a row arranges vertically on the outside of second box cover, heat-dissipating pipe upper end is located at
Below exhaust fan, the cross section of the heat-dissipating pipe is rectangle and constantly becomes larger from lower end to upper end, in the heat-dissipating pipe upper semisection
Coated with heat-absorbing material.
Preferably, the first inner chamber, second inner chamber, intracavitary in third inner cavity and the 4th be configured with drainage rib group, institute
State drainage rib group in first inner chamber, third tube conformation direction it is identical and with structural grain phase intracavitary in second inner chamber, the 4th
Instead, the drainage rib group includes horizontal fin, several first vertical fins and several second vertical fins, between the first vertical fin is uniform
Every arrangement and it is vertical with horizontal fin connect, the second vertical fin and the first vertical fin are located at horizontal fin the same side, described the
Two vertical fins are parallel with the first vertical fin and are successively alternately arranged, and described second vertical fin one end is stretched out outside the first vertical fin, separately
One end and horizontal fin mutually from, the first inner chamber, second inner chamber, third inner cavity and the water inlet of the 4th inner cavity with it is most intermediate
Second vertical fin is opposite.
Preferably, it is constructed on the first box cover in the first inner chamber with the drainage rib group of second inner chamber, in the third
Intracavitary drainage rib group constructs in the second cassette bottom in chamber and the 4th.
Preferably, one more than the quantity of the described second vertical fin fin quantity more vertical than first, the second vertical fin and
The length of one vertical fin is identical.
Preferably, the first inner chamber, second inner chamber, third inner cavity are identical with the height of the 4th inner cavity, the horizontal fin,
First vertical fin and the second vertical fin height are identical, and the horizontal fin, the first vertical fin and the second vertical fin height are in first
Chamber, second inner chamber, the height of third inner cavity and the 4th inner cavity 1/2 or more.
It was found by the inventors of the present invention that existing computer heat radiating device there are problems that not being able to satisfy mainboard heat dissipation.Cause
This, the technical assignment to be realized of the invention or never expect the technical problem to be solved is that those skilled in the art or
Person it is not expected that, therefore the present invention is a kind of new technical solution.
Computer heat radiating device clever structure of the invention, by water cooling and air-cooled fine combination, rapid heat dissipation, heat dissipation performance
It is high.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is the structural schematic diagram of computer heat radiating device provided in an embodiment of the present invention;
Fig. 2 is another schematic diagram of computer heat radiating device provided in an embodiment of the present invention;
Fig. 3 is the schematic diagram of the first heat dissipation box and the second heat dissipation box provided in an embodiment of the present invention.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
It should be noted that the positional terms such as left and right, upper and lower in the embodiment of the present invention, be only each other relative concept or
Reference that be with the normal operating condition of product be, and should not be regarded as restrictive.
The term used in embodiments of the present invention is only to be not intended to be limiting merely for for the purpose of describing particular embodiments
The present invention.In the embodiment of the present invention and the "an" of singular used in the attached claims, " described " and "the"
It is also intended to including most forms, unless the context clearly indicates other meaning.
It should be appreciated that term "and/or" used herein is only a kind of incidence relation for describing affiliated partner, indicate
There may be three kinds of relationships, for example, A and/or B, can indicate: individualism A, exist simultaneously A and B, individualism B these three
Situation.In addition, character "/" herein, typicallys represent the relationship that forward-backward correlation object is a kind of "or".
Depending on context, word as used in this " if " can be construed to " ... when " or " when ...
When " or " in response to determination " or " in response to detection ".Similarly, depend on context, phrase " if it is determined that " or " if detection
(condition or event of statement) " can be construed to " when determining " or " in response to determination " or " when the detection (condition of statement
Or event) when " or " in response to detection (condition or event of statement) ".
With reference to Fig. 1-Fig. 3, the embodiment of the invention provides a kind of computer heat radiating devices.
The computer heat radiating device includes cabinet 100 and cooling mechanism, and 100 side of cabinet offers the first mounting hole
110 and second mounting hole 120, first mounting hole 110 and the second about 120 mounting hole be spaced apart, 100 phase of cabinet
Adjacent side offers air hole 130.Cabinet 100 may include shell and the side cover that is detachably connected with shell, and
One mounting hole 110 and the second mounting hole 120 can be provided on side cover.
Wherein, cooling mechanism include water tank 210, water pump 220, the first heat dissipation box 230, the second heat dissipation box 240, controller,
Temperature inductor and exhaust fan 250.
First inner chamber and second inner chamber are separated by first partition 231 or so inside first heat dissipation box 230, described first
Inner cavity is connected to second inner chamber by " Qian " font interface channel 232, and first heat dissipation box 230 includes linking together
The first cassette bottom 233 and the first box cover 234.First inner chamber is not only connected to defeated by " Qian " font interface channel 232 with second inner chamber
Cooling water is sent, and the heat dissipation path being formed in outside the first heat dissipation box 230 can be increased, improves heat dissipation effect.Second heat dissipation
Third inner cavity and the 4th inner cavity are separated by second partition 241 or so inside box 240, second heat dissipation box 240 includes connecting
The second cassette bottom 242 being connected together and the second box cover 243.First partition 231 and the structure of second partition 241 can be one will
Box chamber is divided into two chambers and can be carried out the diaphragm structure of water proof, can also be by having reeded first plate and being plugged in groove
The second board group at the first plate and the second plate can be respectively formed in the first cassette bottom 233 and the first box cover 234, the first plate and
Two plates can be respectively formed in the first cassette bottom 233 and the first box cover 234.First inner chamber and third inner cavity pass through the first water service pipe
260 connections, the second inner chamber are connected to the 4th inner cavity by the second water service pipe 270, the first water service pipe 260 and the second water service pipe
270 are symmetrical arranged relative to the first heat dissipation box 230, the second heat dissipation box 240, first water service pipe 260 and the second water service pipe 270
One end, which is respectively perpendicular, is connected to 234 lower part of the first box cover, first water service pipe 260 and 270 other end of the second water service pipe difference
It is vertically connected on 242 top of the second cassette bottom.Third intracavity bottom is connected with water inlet pipe 244, and the water inlet pipe 244 passes through water pump
220 are connected with water tank 210, and the 4th intracavity bottom is connected with outlet pipe 245 and is connected by outlet pipe 245 with water tank 210,
Water inlet pipe 244 and outlet pipe 245 are symmetrically connected at left and right sides of 242 bottom of the second cassette bottom.Second heat dissipation box 240 is arranged second
In mounting hole 120,240 size of the second heat dissipation box is adapted to the second mounting hole 120, second box cover 243 by engaging lug with
Cabinet 100 is fixed, and the water tank 210 is arranged in 100 bottom of cabinet and is connected on the outside of the second cassette bottom 242, first heat dissipation
Fixed at the top of box 230 and cabinet 100, the exhaust fan 250 is arranged in the first mounting hole 110,250 size of exhaust fan and first
Mounting hole 110 is adapted to, and exhaust fan 250 is equipped with shell, and the exhaust fan 250 is fixed by engaging lug and cabinet 100, the air draft
Fan 250 is located at 234 outside of the first box cover, is equipped with computer motherboard 300 on the outside of the first cassette bottom 233.It is set on the outside of second box cover 243
It is equipped with the heat-dissipating pipe 246 that a row arranges vertically, 246 upper end of the heat-dissipating pipe is located at 250 lower section of exhaust fan, the heat-dissipating pipe 246
Cross section be rectangle and constantly to become larger from lower end to upper end, heat-absorbing material, heat absorption are coated in 246 upper semisection of heat-dissipating pipe
Material uses paintable common heat-absorbing material.The present invention uses the first heat dissipation box 230, the second heat dissipation box 240 and exhaust fan
250 are used as heat sink body, the first heat dissipation box 230 and the second about 240 heat dissipation box diagonally setting, on the one hand according to casing structure reality
Maximum heat dissipation area is showed, and has been conducive to heat and sheds, on the other hand, has in succession been mounted on exhaust fan 250 and water tank 210 in addition
Two diagonal, realizes the maximum of chassis space and utilizes.Moreover, the special arrangement of said modules also has specific effect, it is first
First, the heat derives that the first heat dissipation box 230 can utmostly generate computer motherboard 300, heat is first focused on first
Heat dissipation box 230, the exhaust fan 250 set on 230 right side of the first heat dissipation box carry out air-cooled and heat are blown out cabinet 100, lead to simultaneously
It crosses the first heat dissipation box 230, the second heat dissipation box 240, water tank 210 and carries out recirculated water cooling.Secondly, the second box cover 243 is directly arranged at
In second mounting hole 120, can directly radiate with contacting external air, and in 246 upper semisection of heat-dissipating pipe air themperature because being coated with
Heat-absorbing material and increase, and recirculated water cooling of the present invention structure thus top than lower part heat, therefore in 246 upper semisection of heat-dissipating pipe
Air is higher than the temperature of air in lower semisection, so that formation temperature is poor, in addition, since heat-dissipating pipe 246 is continuous from lower end to upper end
The structure to become larger forms ascending motion, and then promotes heat-dissipating pipe 246 convenient for expanded by heating, the air that volume increases, quality lightens
Upward motion of air, so that the heat of the second heat dissipation box 240 be taken away.In addition, the exhaust fan that cooperation is located on heat-dissipating pipe 246
250, exhaust fan 250 can drive the upward motion of air of heat-dissipating pipe 246, can accelerate while air-cooled to the first heat dissipation box 230
Second box cover 243, realizes good heat dissipation effect.
In addition, first inner chamber, second inner chamber, it is intracavitary in third inner cavity and the 4th be configured with drainage rib group, it is described to draw
Flow rib group in first inner chamber, third tube conformation direction it is identical and in second inner chamber, the 4th intracavitary structural grain it is opposite.Its
In, drainage rib group includes horizontal fin 281, several first vertical fins 282 and several second vertical fins 283, the first vertical fin
282 uniform intervals arrangement and it is vertical with horizontal fin 281 connect, the second vertical fin 283 and the first vertical fin 282 are positioned at horizontal
281 the same side of fin, the second vertical fin 283 is parallel with the first vertical fin 282 and is successively alternately arranged, described second indulge it is convex
283 one end of rib is stretched out outside the first vertical fin 282, and the other end is with horizontal 281 phase of fin from the first inner chamber, second inner chamber, third
The water inlet of inner cavity and the 4th inner cavity is opposite with the second most intermediate vertical fin 283.The quantity of second vertical fin 283 is than first
Vertical 282 quantity of fin is one more, and the second vertical fin 283 is identical with the length of the first vertical fin 282.Drain the setting of rib group
Flowing time of the recirculated water in the first heat dissipation box 230, the second heat dissipation box 240 is increased, is dissipated with the first heat dissipation box 230, second
Hot 240 two sides shell of box contact is more abundant, extends heat exchanger time and efficiency.The interior drainage rib with second inner chamber of first inner chamber
Group construction is on the first box cover 234, and intracavitary drainage rib group constructs in the second cassette bottom 242 in the third inner cavity and the 4th.
First inner chamber, second inner chamber, third inner cavity are identical with the height of the 4th inner cavity, the horizontal fin 281, the first vertical 282 and of fin
Second vertical 283 height of fin is identical, and the horizontal fin 281, the first vertical fin 282 and the second vertical 283 height of fin are in first
Chamber, second inner chamber, the height of third inner cavity and the 4th inner cavity 1/2 or more.Computer motherboard is installed on the outside of first cassette bottom 233
Pair 300, therefore, drainage rib group constructs on the first box cover 234, the heat of the first cassette bottom 233 can be more sufficiently taken away with coolant liquid, i.e.,
Computer motherboard 300 carries out heat exchange, and drains rib group construction in the second cassette bottom 242, so that can be on the outside of the second box cover 243
It is more sufficiently thermally conductive to cooling water progress, so that heat be shed;And the height for draining rib group to meet drainage, increases cold water
, it can be achieved that cooling water is to the first sufficiently heat absorption of box cover 234 while the water flowing time, cooling water is abundant by the second box cover 243
Heat dissipation.
Wherein, the water cycle heat radiation path of cooling mechanism of the present invention are as follows: water pump 220 by the cooling water in water tank 21 by into
Water pipe 244 is transported to third inner cavity, then enters first inner chamber by the first water service pipe 260, then logical from the connection of " Qian " font
Road 232 enters second inner chamber, then enters the 4th inner cavity by the second water service pipe 270, returns to water tank finally by outlet pipe 245
21.Cooling water enters first inner chamber, second inner chamber, intracavitary in third inner cavity and the 4th every time, and drainage rib group all carries out it
Drainage, then exhaust fan 250 and heat-dissipating pipe 246 is cooperated to realize the combination with wind-cooling heat dissipating.
In addition, controller, temperature inductor are separately mounted on computer motherboard 300, the controller respectively with temperature
Inductor, water pump 220 and exhaust fan 250 are electrically connected, and the controller is preset with first threshold and second threshold, when temperature sense
When device detection temperature data being answered to be greater than first threshold, the controller control water pump 220 is run;When temperature inductor detects temperature
When data are greater than second threshold, the controller controls 250 electricity operation of exhaust fan.Controller is according to the temperature of computer motherboard 300
The height of degree replaces radiating mode, energy conservation, when temperature is lower, separately through water-cooling, energy conservation and noise is small, and water cooling not
Be able to satisfy cooling requirements temperature it is higher when, increase exhaust fan 250 radiate.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (6)
1. a kind of computer heat radiating device, it is characterised in that: including cabinet and cooling mechanism, the cabinet side offers first
Mounting hole and the second mounting hole, first mounting hole and the second mounting hole are spaced apart up and down, and the adjacent side of the cabinet is opened
Equipped with air hole, the cooling mechanism includes water tank, water pump, the first heat dissipation box, the second heat dissipation box, controller, temperature inductor
And exhaust fan, first inner chamber and second inner chamber are separated by first partition or so inside first heat dissipation box, described the
One inner cavity is connected with second inner chamber by " Qian " font interface channel, and first heat dissipation box includes the first box to link together
Bottom and the first box cover, the second heat dissipation box inside is separated into third inner cavity and the 4th inner cavity by second partition or so, described
Second heat dissipation box includes the second cassette bottom to link together and the second box cover, and the first inner chamber and third inner cavity are logical by first
Water pipe connection, the second inner chamber are connected to the 4th inner cavity by the second water service pipe, first water service pipe and the second water service pipe
One end, which is respectively perpendicular, is connected to the first box cover lower part, and first water service pipe and the second water service pipe other end are respectively perpendicular and are connected to
Second cassette bottom top, the third intracavity bottom are connected with water inlet pipe, and the water inlet pipe is connected by water pump with water tank, and described the
Four intracavity bottoms are connected with outlet pipe and are connected by outlet pipe with water tank, and second heat dissipation box is arranged in the second mounting hole
Interior, second box cover is fixed by engaging lug and cabinet, water tank setting chassis bottom and with the second cassette bottom on the outside of phase
Even, first heat dissipation box is fixed with enclosure top, and the exhaust fan is fixed on the outside of the first box cover and is located at the first mounting hole
It is interior, computer motherboard is installed on the outside of first cassette bottom, the controller, temperature inductor are separately mounted to computer motherboard
On, the controller is electrically connected with temperature inductor, water pump and exhaust fan respectively, the controller be preset with first threshold and
Second threshold, when temperature inductor detection temperature data is greater than first threshold, the controller controls water pump operation;Work as temperature
When inductor detects temperature data greater than second threshold, the controller controls exhaust fan electricity operation.
2. computer heat radiating device according to claim 1, which is characterized in that be provided with a row on the outside of second box cover
The heat-dissipating pipe arranged vertically, the heat-dissipating pipe upper end are located at below exhaust fan, and the cross section of the heat-dissipating pipe is for rectangle and under
It holds to upper end and constantly becomes larger, heat-absorbing material is coated in the heat-dissipating pipe upper semisection.
3. computer heat radiating device according to claim 1, which is characterized in that the first inner chamber, second inner chamber, third
Intracavitary in inner cavity and the 4th to be configured with drainage rib group, the drainage rib group is identical in first inner chamber, third tube conformation direction
And with the intracavitary structural grain in second inner chamber, the 4th on the contrary, the drainage rib group include horizontal fin, several first vertical fins and
Several second vertical fins, the first vertical fin uniform intervals arrangement and it is vertical with horizontal fin connect, the second vertical fin
It is located at horizontal fin the same side with the first vertical fin, the second vertical fin is parallel with the first vertical fin and is successively alternately arranged, institute
It states second vertical fin one end to stretch out outside the first vertical fin, the other end and horizontal fin phase are from, the first inner chamber, second inner chamber, the
The water inlet of three inner cavities and the 4th inner cavity is opposite with the second most intermediate vertical fin.
4. computer heat radiating device according to claim 3, which is characterized in that in the first inner chamber and second inner chamber
Rib group construction is drained on the first box cover, intracavitary drainage rib group constructs in the second cassette bottom in the third inner cavity and the 4th.
5. computer heat radiating device according to claim 4, which is characterized in that the quantity of the second vertical fin is than first
Vertical fin quantity is one more, and the length of the second vertical fin and the first vertical fin is identical.
6. computer heat radiating device according to claim 5, which is characterized in that the first inner chamber, second inner chamber, third
Inner cavity is identical with the height of the 4th inner cavity, and the horizontal fin, the first vertical fin and the second vertical fin height are identical, and the cross is convex
Rib, the first vertical fin and the second vertical fin height be first inner chamber, second inner chamber, the height of third inner cavity and the 4th inner cavity 1/
2 or more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811488017.0A CN109710043B (en) | 2018-12-06 | 2018-12-06 | Computer heat abstractor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811488017.0A CN109710043B (en) | 2018-12-06 | 2018-12-06 | Computer heat abstractor |
Publications (2)
Publication Number | Publication Date |
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CN109710043A true CN109710043A (en) | 2019-05-03 |
CN109710043B CN109710043B (en) | 2022-04-26 |
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ID=66254671
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CN201811488017.0A Expired - Fee Related CN109710043B (en) | 2018-12-06 | 2018-12-06 | Computer heat abstractor |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110989803A (en) * | 2019-11-25 | 2020-04-10 | 华为技术有限公司 | Heat dissipation method and electronic equipment |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080283224A1 (en) * | 2007-05-18 | 2008-11-20 | Hsiao-Kang Ma | Water-cooling heat-dissipating system |
WO2011155730A2 (en) * | 2010-06-11 | 2011-12-15 | Lee Kwang-Ro | Hybrid cooling apparatus for computer components |
CN205158272U (en) * | 2015-12-07 | 2016-04-13 | 郑州职业技术学院 | Computer radiating device |
CN206039410U (en) * | 2016-06-17 | 2017-03-22 | 内江师范学院 | Imitate water -cooled computer by force |
-
2018
- 2018-12-06 CN CN201811488017.0A patent/CN109710043B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080283224A1 (en) * | 2007-05-18 | 2008-11-20 | Hsiao-Kang Ma | Water-cooling heat-dissipating system |
WO2011155730A2 (en) * | 2010-06-11 | 2011-12-15 | Lee Kwang-Ro | Hybrid cooling apparatus for computer components |
CN205158272U (en) * | 2015-12-07 | 2016-04-13 | 郑州职业技术学院 | Computer radiating device |
CN206039410U (en) * | 2016-06-17 | 2017-03-22 | 内江师范学院 | Imitate water -cooled computer by force |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110989803A (en) * | 2019-11-25 | 2020-04-10 | 华为技术有限公司 | Heat dissipation method and electronic equipment |
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