CN216773236U - Water cooling plate with multilayer flow channels - Google Patents
Water cooling plate with multilayer flow channels Download PDFInfo
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- CN216773236U CN216773236U CN202220404849.5U CN202220404849U CN216773236U CN 216773236 U CN216773236 U CN 216773236U CN 202220404849 U CN202220404849 U CN 202220404849U CN 216773236 U CN216773236 U CN 216773236U
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Abstract
本实用新型公开一种具有多层流道的水冷板，属于水冷散热技术领域，包括壳体、进液管和出液管，壳体内间隔设有若干个折流隔板，若干个折流隔板分隔壳体内空腔为若干个流道层；折流隔板上开设有连通相邻流道层的折流孔洞，且相邻折流隔板上的折流孔洞分布于两侧；壳体的导热面上设有伸入各个流道层的导热柱；壳体上设有与进液管和出液管分别连通的进液口和出液口；进液口和出液口分别与首尾端的流道层连通。散热液通过进液口进入，散热液在多个流道层内与导热柱多次、充分换热，然后通过最下层的流道层与壳体的导热面充分换热，最后通过出液口排出。可有效增大与芯片的换热面积，提高芯片的散热效率，保证芯片稳定运行。
The utility model discloses a water cooling plate with multi-layer flow channels, belonging to the technical field of water cooling and heat dissipation, comprising a shell, a liquid inlet pipe and a liquid outlet pipe. The inner cavity of the plate partition shell is composed of several flow channel layers; the baffle baffle plate is provided with baffle holes connecting the adjacent flow channel layers, and the baffle holes on the adjacent baffle baffle plates are distributed on both sides; The heat transfer surface of the casing is provided with a heat transfer column extending into each flow channel layer; the shell is provided with a liquid inlet and a liquid outlet which are connected with the liquid inlet pipe and the liquid outlet pipe respectively; the liquid inlet and the liquid outlet are respectively connected with the head and tail. The flow channel layer at the end is connected. The heat dissipation liquid enters through the liquid inlet, and the heat dissipation liquid exchanges heat with the heat conduction column for many times in multiple flow channel layers, and then fully exchanges heat with the heat conduction surface of the shell through the lowermost flow channel layer, and finally passes through the liquid outlet. discharge. It can effectively increase the heat exchange area with the chip, improve the heat dissipation efficiency of the chip, and ensure the stable operation of the chip.
Description
Technical Field
The utility model belongs to the technical field of water-cooling heat dissipation, and particularly relates to a water-cooling plate with a multilayer flow channel.
Background
Modern electronic equipment further improves the requirements on reliability, performance indexes, power density and the like, and the thermal design of the electronic equipment is more and more important. The chip is a key device in most electronic equipment, and the reliability, safety and service life of the whole machine are directly affected by the working state of the chip. In addition to the heat dissipation scheme of the chip being able to effectively dissipate heat, reliability is also critical.
The water-cooling heat dissipation effectively solves the problems of high noise, poor cooling reliability and high dependence on the external environment existing in air-cooling heat dissipation.
The water-cooling heat dissipation refers to a heat dissipation mode that liquid is forced to circulate under the driving of a pump, and the heat of a chip is removed through a water cooling plate attached to the chip. Because the heat capacity of the heat dissipation liquid (water or other liquid) is larger, the water cooling heat dissipation has better heat load capacity than the air cooling heat dissipation, and the heat fluctuation of the chip is smaller.
Nowadays, the water-cooling plate is generally a single-layer runner, and water flows in a single-layer runner cavity, so that one surface of the runner cavity is attached to a chip (such as a CPU, a GPU and the like), and heat generated by the chip is taken away. However, the single-layer flow channel of the water cooling plate is generally linear, the flow channel is single, the heat exchange area is limited, and the heat exchange efficiency with the chip is not high, so that the heat dissipation efficiency of the chip is not high.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model provides the water cooling plate with the multilayer flow channel, and the heat exchange area between the water cooling plate and a chip is increased and the heat dissipation efficiency of the chip is improved through the multilayer baffling flow channel structure.
The utility model is realized by the following technical scheme:
a water cooling plate with multilayer flow channels comprises a shell, a liquid inlet pipe and a liquid outlet pipe, wherein a plurality of baffling partition plates are arranged in the shell at intervals, and a cavity in the shell is divided into a plurality of flow channel layers by the baffling partition plates; the baffling partition plates are provided with baffling holes communicated with adjacent flow channel layers, and the baffling holes on the adjacent baffling partition plates are distributed on two sides; the heat-conducting surface of the shell is provided with heat-conducting columns extending into each flow channel layer; the shell is provided with a liquid inlet and a liquid outlet which are respectively communicated with the liquid inlet pipe and the liquid outlet pipe; the liquid inlet and the liquid outlet are respectively communicated with the runner layers at the head end and the tail end.
The utility model is further improved in that a baffle plate vertically connected with the baffling partition plate is arranged in the shell; a gap for communicating the liquid outlet and the tail end flow passage layer is reserved between the lower edge of the baffle and the heat conducting surface of the shell.
The utility model is further improved in that the liquid inlet and the liquid outlet are respectively arranged at two ends of the surface of the shell opposite to the heat conducting surface of the shell.
In a further development of the utility model, the heat-conducting columns are connected to the heat-conducting surface of the housing and to the opposite surface thereof by means of a support and are connected in a sealing manner to the baffle plate support.
The utility model is further improved in that the heat-conducting column is a heat-conducting copper rod, and the baffling partition plate is a heat-conducting copper sheet.
In a further development of the utility model, the baffle openings in each baffle plate are arranged at regular intervals in a direction perpendicular to the flow direction of the coolant.
The utility model further improves that the heat conducting columns are arranged in an annular array relative to the center of the heat conducting surface of the shell, and the heat conducting columns are also arranged at the center of the heat conducting surface of the shell.
According to the technical scheme, the utility model has the beneficial effects that:
overall structure is simple, and it is convenient to use, and the practicality is good, can effectively increase with the heat transfer area of chip, improves the radiating efficiency of chip, guarantees chip steady operation. The heat-conducting surface at the lower part of the shell is fixedly attached to the surface of the chip, and the heat-conducting column conducts heat of the chip; inside the radiating liquid passes through the inlet from the feed liquor pipe and gets into the casing, separate a plurality of flow channel layer that forms and connect the baffling hole on adjacent flow channel layer through the baffling baffle, thereby form the whole runner that is the S-shaped, the radiating liquid is in a plurality of flow channel in situ with the heat conduction post many times, abundant heat transfer, then the runner layer through the lower floor is abundant heat transfer with the heat-conducting surface of casing, discharge by the drain pipe through the liquid outlet at last, and through pump drive circulation, realize the water-cooling circulation.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic diagram of the internal structure of the embodiment of the present invention.
FIG. 3 is a schematic view of a cooling fluid flow path according to an embodiment of the present invention.
In the drawings: 1. casing, 2, feed liquor pipe, 3, drain pipe, 4, baffling baffle, 5, baffling hole, 6, heat conduction post, 7, baffle, 8, inlet, 9, liquid outlet.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the present embodiment, and it is apparent that the embodiments described below are only a part of embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of protection of this patent.
As shown in fig. 1-3, the utility model discloses a water-cooling plate with multilayer flow channels, which comprises a shell 1, a liquid inlet pipe 2 and a liquid outlet pipe 3, wherein the shell 1 is of a cuboid shell structure, the bottom surface of the shell is a heat conducting surface attached to a chip, and a cuboid cavity is formed inside the shell; a plurality of baffling partition plates 4 are arranged in the cavity at intervals, the baffling partition plates 4 are arranged in parallel with the heat conducting surface (are horizontally arranged), and the plurality of baffling partition plates 4 divide the cavity in the shell 1 into a plurality of flow channel layers; the baffling baffle plates 4 are provided with baffling holes 5 communicated with adjacent flow channel layers, and the baffling holes 5 on the adjacent baffling baffle plates 4 are distributed on two sides (not on the same side); the heat-conducting surface of the shell 1 is connected with heat-conducting columns 6 extending into each flow channel layer, namely, each heat-conducting column 6 penetrates through all the baffling partition plates 4 from bottom to top; a liquid inlet 8 and a liquid outlet 9 which are respectively communicated with the liquid inlet pipe 2 and the liquid outlet pipe 3 are arranged on the shell 1; the liquid inlet 8 and the liquid outlet 9 are respectively communicated with the uppermost layer and the lowermost layer of the runner layer.
The heat conducting surface at the lower part of the shell 1 is fixedly attached to the surface of the chip, and the heat conducting column 6 conducts heat of the chip; radiating liquid enters the shell 1 from the liquid inlet pipe 2 through the liquid inlet 8, is divided into a plurality of flow channel layers through the baffling partition plates 4 and is connected with the baffling holes 5 of the adjacent flow channel layers, so that an integral S-shaped flow channel is formed, the radiating liquid exchanges heat with the heat conduction columns 6 for multiple times and sufficiently in the plurality of flow channel layers, then exchanges heat with the heat conduction surface of the shell 1 sufficiently through the flow channel layer at the lowest layer, and is discharged from the liquid outlet pipe 3 through the liquid outlet 9 and is driven to circulate by a pump; overall structure is simple, and it is convenient to use, and the practicality is good, can effectively increase with the heat transfer area of chip, improves the radiating efficiency of chip, guarantees chip steady operation.
Wherein, the shell 1 is internally provided with a baffle 7 vertically connected with the rear edge of the baffle 4, and a gap for communicating the liquid outlet 9 with the lowest layer flow channel layer is reserved between the lower edge of the baffle 7 and the heat conducting surface of the shell 1; the upper edge and the left edge and the right edge of the baffle 7 are respectively welded and sealed with the upper wall and the left side and the right side of the shell 1, and the front side of the baffle 7 is welded and sealed with the rear edge of the baffling partition plate 4, so that the right end of the flow passage layer except the lowest layer is blocked. The heat dissipation liquid flow channel is simple in structure, reasonable in arrangement and easy to achieve.
Wherein, the liquid inlet 8 and the liquid outlet 9 are respectively arranged at two ends of the upper wall of the shell 1. The structure sets up rationally, easily realizes the installation location to whole water-cooling board, and inlet 8 and liquid outlet 9 produce the mainboard and interfere when avoiding the installation.
As shown in fig. 3, the heat-conducting column 6 is supported and connected to the lower heat-conducting surface (lower wall) and the upper wall of the housing 1, and is supported and hermetically connected to the baffle 4. The heat conducting column 6 is perpendicular to the upper wall and the lower wall of the shell 1 and the baffle plate 4 and is welded, sealed and fixed, the heat conducting column 6 can have the function of a longitudinal beam, the structural strength and the installation stability of the shell 1 and the baffle plate 4 are improved, and the use reliability is guaranteed.
Wherein, in order to guarantee good heat conductivity, heat conduction post 6 adopts the heat conduction copper bar, and baffling baffle 4 adopts the heat conduction copper sheet.
As shown in fig. 2, the baffle holes 5 of each baffle plate 4 are uniformly spaced in a direction perpendicular to the flow direction of the coolant (left-right direction). When the radiating liquid flows into the next flow channel layer from the previous flow channel layer, the baffling holes 5 arranged at intervals are used for uniformly dividing and guiding the radiating liquid, so that the flowing uniformity and the heat absorption balance of the radiating liquid are ensured.
The heat conducting columns 6 are arranged in an annular array relative to the center of the heat conducting surface of the shell 1, and the heat conducting columns 6 with larger sizes are also arranged at the center of the heat conducting surface of the shell 1. When the chip operates, the temperature distribution is in a form of high in the middle and low in the periphery, and the heat conduction columns 6 arranged in the annular array and the heat conduction columns 6 arranged in the middle correspond to the heat generation distribution, so that the heat at the center of the chip can be better absorbed and taken away, and the heat dissipation adaptability of the chip is realized.
This water-cooling plate with multilayer runner, overall structure is simple, and it is convenient to use, and the practicality is good, can effectively increase with the heat transfer area of chip, improves the radiating efficiency of chip, guarantees chip steady operation. The heat conducting surface at the lower part of the shell 1 is fixedly attached to the surface of the chip, and the heat conducting column 6 conducts heat of the chip; the radiating liquid passes through inlet 8 from feed liquor pipe 2 and gets into inside casing 1, separate a plurality of runner layer that forms and connect the baffling hole 5 on adjacent runner layer through baffling baffle 4, thereby form the whole runner that is the S-shaped, the radiating liquid is in a plurality of runner layers in situ with heat conduction post 6 a lot of, abundant heat transfer, then the runner layer through the lower floor is abundant heat transfer with casing 1' S heat conduction surface, discharge by drain pipe 3 through liquid outlet 9 at last, and through pump drive circulation, realize the water-cooling circulation.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The terms "upper", "lower", "outside", "inside" and the like in the description and claims of the present invention and the above drawings are used for distinguishing relative positions if any, and are not necessarily given qualitatively. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the utility model described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220404849.5U CN216773236U (en) | 2022-02-25 | 2022-02-25 | Water cooling plate with multilayer flow channels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220404849.5U CN216773236U (en) | 2022-02-25 | 2022-02-25 | Water cooling plate with multilayer flow channels |
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| Publication Number | Publication Date |
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| CN216773236U true CN216773236U (en) | 2022-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220404849.5U Active CN216773236U (en) | 2022-02-25 | 2022-02-25 | Water cooling plate with multilayer flow channels |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115302167A (en) * | 2022-08-29 | 2022-11-08 | 深圳市晟达真空钎焊技术有限公司 | Welding structure of multilayer annular micro-channel in stainless steel pipe |
-
2022
- 2022-02-25 CN CN202220404849.5U patent/CN216773236U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115302167A (en) * | 2022-08-29 | 2022-11-08 | 深圳市晟达真空钎焊技术有限公司 | Welding structure of multilayer annular micro-channel in stainless steel pipe |
| CN115302167B (en) * | 2022-08-29 | 2024-03-12 | 深圳市晟达真空钎焊技术有限公司 | Welding structure of multilayer annular micro-channel in stainless steel pipe |
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Address after: 215100 Building 9, No.1 guanpu Road, Guoxiang street, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Yuannao Intelligent Technology Co.,Ltd. Country or region after: China Address before: 215100 Building 9, No.1 guanpu Road, Guoxiang street, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU LANGCHAO INTELLIGENT TECHNOLOGY Co.,Ltd. Country or region before: China |