CN213586419U - Novel multilayer circuit board - Google Patents
Novel multilayer circuit board Download PDFInfo
- Publication number
- CN213586419U CN213586419U CN202022836692.7U CN202022836692U CN213586419U CN 213586419 U CN213586419 U CN 213586419U CN 202022836692 U CN202022836692 U CN 202022836692U CN 213586419 U CN213586419 U CN 213586419U
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- heat dissipation
- circuit board
- multilayer circuit
- fan
- motor
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Abstract
The utility model discloses a novel multilayer circuit board relates to a circuit board technical field. The utility model discloses a multilayer circuit board, multilayer circuit board surface are equipped with a plurality of fixed plates, the fixed plate upper surface is equipped with the through hole, the inside inner chamber that is equipped with of multilayer circuit board, the inside a plurality of inner plates and heat abstractor that are equipped with of inner chamber, heat abstractor includes cooling tube, a plurality of division boards, heat dissipation room and motor, the inside fan that is equipped with of cooling tube, the indoor portion of heat dissipation is equipped with the second fan, heat dissipation outdoor surface is equipped with a plurality of louvres, the inside fluting that is equipped with of louvre, inside expansion bend. The utility model achieves the effect of heat dissipation to the multilayer circuit board by arranging the heat dissipation chamber, the heat dissipation holes, the heat dissipation pipes, the isolation board, the inner layer board, the fan, the second fan and the motor; through setting up heat dissipation room, louvre, fluting, expansion bend, baffle, trigger and motor, reach dirt-proof effect.
Description
Technical Field
The utility model belongs to the technical field of a circuit board, especially, relate to a novel multilayer circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, multilayer circuit board main body, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin multilayer circuit board main body, ultra-thin circuit board, printed (copper etching technology) circuit board, etc., the circuit board miniaturizes and visualizes the circuit, plays an important role in the mass production of fixed circuits and in optimizing the layout of electrical appliances, the circuit board may be called a printed multi-layer circuit board body or printed circuit board, when the circuit board works, heat is generated, the multilayer circuit board is more serious to the problem, therefore, the heat dissipation problem of the multi-layer circuit board needs to be solved, and at the same time, the heat dissipation is carried out, and at the same time, the dust can not enter the multi-layer circuit board, cause the damage to electronic component, so, the utility model discloses release a novel multilayer circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel multilayer circuit board solves current multilayer circuit board heat dissipation problem and dirt-proof problem.
In order to solve the technical problem, the utility model discloses a realize through following technical scheme:
the utility model relates to a novel multilayer circuit board, which comprises a multilayer circuit board, wherein the outer surface of the multilayer circuit board is provided with a plurality of fixed plates;
the inner cavity is arranged in the multilayer circuit board, a plurality of arrays of inner-layer boards and heat dissipation devices are arranged in the inner cavity, each heat dissipation device comprises a heat dissipation pipe, a plurality of isolation boards, a heat dissipation chamber and a motor, a fan is arranged in each heat dissipation pipe, the fans drive the flow of heat dissipation liquid in each heat dissipation pipe, the isolation boards cover two opposite side surfaces of each inner-layer board, one part of each heat dissipation pipe is arranged between the two isolation boards, heat is transferred through the isolation boards, the heat dissipation efficiency is enhanced, a plurality of second fans are arranged in the heat dissipation chamber, a plurality of heat dissipation holes are formed in the outer surface of the heat dissipation chamber, one ends of the heat dissipation holes are communicated with the outer surface of the multilayer circuit board, one part of each heat dissipation pipe is arranged in the heat dissipation chamber, the heat brought by the heat, the dustproof fan comprises a slot, and is characterized in that a telescopic device, a baffle and a trigger are arranged inside the slot, one end of the telescopic device is connected with the inside of the slot, the other end of the telescopic device is connected with the baffle, the telescopic device is controlled to move by controlling the telescopic device to achieve the dustproof effect, the motor is connected with a fan, the trigger is respectively connected with the motor and the telescopic device, and the telescopic device contracts to achieve the effect of opening the heat dissipation holes when the motor works under the effect of the trigger.
Furthermore, the upper surface of the fixing plate is provided with a through hole, and the through hole is matched with a nut to fix the multilayer circuit board.
Further, the radiating pipe is positioned in the radiating chamber part and is a spiral pipeline.
Further, the outer surface of the multilayer circuit board is provided with a wear-resistant layer.
Further, the thickness of the isolation plate is 0.2 cm.
The utility model discloses following beneficial effect has:
the utility model discloses a set up heat dissipation room, louvre, cooling tube, division board, inner plating, fan, second fan and motor, reach the radiating effect to the multilayer circuit board.
The utility model discloses a set up heat dissipation room, louvre, fluting, expansion bend, baffle, trigger and motor, can open the louvre when dispelling the heat, close the louvre when out of work, reach dirt-proof effect.
Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a novel multi-layer circuit board;
FIG. 2 is a schematic front sectional view of the structure of FIG. 1;
FIG. 3 is a schematic cross-sectional view of a heat dissipation hole.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a multilayer wiring board; 101. a fixing plate; 102. a through hole; 2. an inner cavity; 201. an inner layer board; 202. A heat sink; 203. a radiating pipe; 204. a separator plate; 205. a heat dissipation chamber; 206. a motor; 207. A fan; 208. a second fan; 209. heat dissipation holes; 3. grooving; 301. a retractor; 302. a baffle plate; 303. and a trigger.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", and the like, indicate positional or positional relationships, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Referring to fig. 1-3, the present invention relates to a novel multilayer circuit board, which includes a multilayer circuit board 1, wherein a plurality of fixing plates 101 are disposed on an outer surface of the multilayer circuit board 1;
the inner cavity 2 is arranged in the multilayer circuit board 1, a plurality of arrays of inner-layer boards 201 and heat dissipation devices 202 are arranged in the inner cavity 2, each heat dissipation device 202 comprises a heat dissipation pipe 203, a plurality of isolation boards 204, a heat dissipation chamber 205 and a motor 206, a fan 207 is arranged in each heat dissipation pipe 203, the fan 207 drives the flow of heat dissipation liquid in each heat dissipation pipe 203, the isolation boards 204 cover two opposite side surfaces of each inner-layer board 201, a part of each heat dissipation pipe 203 is positioned between the two isolation boards 204, heat is transferred through the isolation boards 204, the heat dissipation efficiency is enhanced, a plurality of second fans 208 are arranged in each heat dissipation chamber 205, a plurality of heat dissipation holes 209 are arranged on the outer surface of each heat dissipation chamber 205, one end of each heat dissipation hole 209 is communicated with the outer surface of the multilayer circuit board 1, a part of each heat dissipation pipe 203 is positioned, inside being equipped with slot 3 of louvre 209, 3 inside retractors 301 that are equipped with of slot, baffle 302 and trigger 303, retractor 301 one end is connected with 3 insides of slot, the retractor 301 other end is connected with baffle 302, through control retractor 301, control baffle 302 removes, reach dirt-proof effect, motor 206 is connected with fan 207, trigger 303 is connected with motor 206 and retractor 301 respectively, act through trigger 303, carry out the during operation at motor 206, retractor 301 contracts, reach the effect of opening louvre 209.
The fixing plate 101 has a through hole 102 formed in an upper surface thereof, and the through hole 102 is engaged with a nut to fix the multilayer wiring board 1.
The portion of the radiating pipe 203 positioned in the radiating chamber 205 is a spiral pipe.
The outer surface of the multilayer circuit board 1 is provided with a wear-resistant layer.
The spacer 204 is 0.2cm thick.
The utility model discloses when concrete operation, carry out the during operation at multilayer circuit board 1, motor 206 begins to work, it rotates to drive fan 207, cooling tube 203 plays a role, division board 204 shifts the heat that inner plate 201 produced, shift to inside heat dissipation chamber 205 through cooling tube 203, lower the temperature through second fan 208, discharge from louvre 209, at motor 206 during operation, trigger 303 triggers, expansion bend 301 drives baffle 302 shrink, open louvre 209, when out of work, expansion bend 301 drives baffle 302 and stretches out and draws back, seal louvre 209, reach dirt-proof effect.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (5)
1. A novel multilayer circuit board comprises a multilayer circuit board (1), and is characterized in that: the outer surface of the multilayer circuit board (1) is provided with a plurality of fixing plates (101);
the heat dissipation device comprises a multilayer circuit board (1), wherein an inner cavity (2) is arranged in the multilayer circuit board (1), a plurality of arrays of inner-layer boards (201) and a heat dissipation device (202) are arranged in the inner cavity (2), the heat dissipation device (202) comprises a heat dissipation pipe (203), a plurality of isolation boards (204), a heat dissipation chamber (205) and a motor (206), a fan (207) is arranged in the heat dissipation pipe (203), the isolation boards (204) cover two opposite side faces of each inner-layer board (201), one part of the heat dissipation pipe (203) is located between the two isolation boards (204), a plurality of second fans (208) are arranged in the heat dissipation chamber (205), a plurality of heat dissipation holes (209) are formed in the outer surface of the heat dissipation chamber (205), one end of each heat dissipation hole (209) is communicated with the outer surface of the multilayer circuit board (1), one part of the heat dissipation pipe (, slotted (3) inside expansion bend (301), baffle (302) and trigger (303) of being equipped with, expansion bend (301) one end is connected with slotted (3) inside, expansion bend (301) other end is connected with baffle (302), motor (206) are connected with fan (207), trigger (303) are connected with motor (206) and expansion bend (301) respectively.
2. The novel multilayer circuit board of claim 1, wherein the fixing plate (101) is provided with a through hole (102) on the upper surface, and the through hole (102) is matched with a nut to fix the multilayer circuit board (1).
3. A novel multilayer circuit board according to claim 1, characterized in that the portion of the heat dissipation pipe (203) located in the heat dissipation chamber (205) is a spiral pipe.
4. The novel multilayer circuit board according to claim 1, characterized in that the outer surface of the multilayer circuit board (1) is provided with a wear resistant layer.
5. A novel multilayer wiring board according to claim 1, characterized in that the thickness of the spacer (204) is 0.2 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022836692.7U CN213586419U (en) | 2020-12-01 | 2020-12-01 | Novel multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022836692.7U CN213586419U (en) | 2020-12-01 | 2020-12-01 | Novel multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213586419U true CN213586419U (en) | 2021-06-29 |
Family
ID=76544409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022836692.7U Active CN213586419U (en) | 2020-12-01 | 2020-12-01 | Novel multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213586419U (en) |
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2020
- 2020-12-01 CN CN202022836692.7U patent/CN213586419U/en active Active
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