CN213424956U - Semiconductor lead frame piece type feeding and discharging system - Google Patents
Semiconductor lead frame piece type feeding and discharging system Download PDFInfo
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- CN213424956U CN213424956U CN202022465638.6U CN202022465638U CN213424956U CN 213424956 U CN213424956 U CN 213424956U CN 202022465638 U CN202022465638 U CN 202022465638U CN 213424956 U CN213424956 U CN 213424956U
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- multistation
- manipulator
- lead frame
- slider
- semiconductor lead
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000007599 discharging Methods 0.000 title claims description 24
- 239000000463 material Substances 0.000 claims abstract description 85
- 238000000926 separation method Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000003754 machining Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 6
- 238000007790 scraping Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Abstract
The utility model relates to a unloading system on semiconductor lead frame piece formula, including material loading machine and blanking machine, the material loading machine includes multistation dress extracting device, gets the material support, first manipulator, and first multistation conveying module, multistation are got the material module and are separated the carton, separate the carton setting in multistation extracting device side, first manipulator setting on getting the material support, and the multistation is got the material module and is connected with first manipulator, and first multistation conveying module is located multistation extracting device below, the blanking machine includes discharge apparatus, the discharge support, the second manipulator, shedding mechanism, and second multistation conveying module, second manipulator setting are on the discharge support, and shedding mechanism is connected with the second manipulator, and second multistation conveying module is located the shedding mechanism below. The utility model discloses can be with the paper and the material separation that separate of material, the processing of being convenient for promotes machining efficiency.
Description
Technical Field
The utility model relates to a semiconductor lead frame processing technology field, in particular to unloading system in semiconductor lead frame piece formula.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry. Lead frame adds man-hour, need realize the last unloading of material through snatching the mechanism, because lead frame adds man-hour, is equipped with between the adjacent lead frame that piles up and separates at a distance from the paper, consequently, needs research and development one kind can be adding man-hour last unloading system that separates the separation of paper box material.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve prior art's problem, provide a can be with the unloading system in semiconductor lead frame piece formula that the separation paper separation between the material was placed.
The specific technical scheme is as follows: the utility model provides a unloading system on semiconductor lead frame piece formula, includes material loading and unloading machine, and the material loading includes multistation dress extracting device, gets the material support, and first manipulator, first multistation conveying module, multistation are got the material module and are separated the carton, separate the carton setting in multistation extracting device side, first manipulator setting on getting the material support, the multistation is got the material module and is connected with first manipulator, and first multistation conveying module is located multistation extracting device below, the unloading machine includes multistation discharge apparatus, the support of unloading, the second manipulator, shedding mechanism, second multistation conveying module, and the second manipulator setting is on the support of unloading, and shedding mechanism is connected with the second manipulator, and the second multistation conveying module is located the shedding mechanism below.
As preferred scheme, the multistation is got the material module and is included the material loading and snatch the subassembly, the material loading snatchs the subassembly and includes getting the material subassembly, adjust the guide wire rail, width adjustment mechanism and width adjust knob, width adjust knob is connected with width adjustment mechanism, width adjustment mechanism includes first slider, the second slider, screw rod and drive mechanism, first slider and second slider set up relatively and set up respectively on adjusting the guide wire rail, the screw rod both ends and first slider and second slider threaded connection, drive mechanism is connected with screw rod and width adjust knob respectively, it is connected with first slider and second slider respectively to get the material subassembly.
As the preferred scheme, get the material subassembly including getting material vacuum suction nozzle, installation pole and position control knob, get material vacuum suction nozzle and pass through position control knob and set up on the installation pole, the installation pole is connected with first slider or second slider respectively.
Preferably, the transmission mechanism comprises a first gear and a second gear, the first gear is meshed with the second gear, the first gear is connected with the width adjusting knob, and the second gear is connected with the screw rod.
As preferred scheme, adjust the guide wire rail setting on the bottom plate, the bottom plate top is equipped with the backup pad, and the backup pad with get material lift cylinder and be connected, get material lift cylinder and set up on the connecting plate.
As the preferred scheme, discharge mechanism includes that the unloading snatchs the subassembly, and the unloading snatchs the subassembly and includes tongs subassembly, connecting portion, guide rail, eight characters shape adjustment mechanism and open and close the cylinder, tongs subassembly and connecting portion are connected, and connecting portion set up on the guide rail, and eight characters shape adjustment mechanism is connected with connecting portion, opens and closes the cylinder and be connected with eight characters shape adjustment mechanism.
Preferably, the splayed adjusting mechanism comprises a sliding part and a width adjusting knob, the sliding part is provided with a splayed groove, the connecting part is connected with the splayed groove through a connecting column, and the width adjusting knob is arranged on the side face of the sliding part.
According to the preferable scheme, the gripper assembly comprises grippers, a gripper adjusting knob, a fixing rod and a paper separation suction nozzle, the two rows of grippers are oppositely arranged and connected with the fixing rod, the fixing rod is connected with the connecting portion, and the paper separation suction nozzle is arranged between the grippers.
As preferred scheme, discharge mechanism includes unloading lift cylinder, and unloading lift cylinder sets up on the erection joint board and is connected with tongs subassembly.
The technical effects of the utility model: the sheet type feeding and discharging system of the semiconductor lead frame separates the paper of the material from the material, and is convenient to process; the problem of semiconductor lead frame product specification many, not equidimension, unloading compatibility is difficult on the different width products can be solved, machining efficiency is promoted, the problem of material scraping flower and fold material is avoided going up to go up to unloading.
Drawings
Fig. 1 is a schematic view of a feeding machine according to an embodiment of the present invention.
Fig. 2 is another schematic view of the feeding machine according to the embodiment of the present invention.
Fig. 3 is a schematic view of a blanking machine according to an embodiment of the present invention.
Fig. 4 is another schematic view of the blanking machine according to the embodiment of the present invention.
Fig. 5 is the utility model discloses a material loading snatchs subassembly's schematic diagram.
Fig. 6 is an enlarged view of a portion a in fig. 5 according to the present invention.
Fig. 7 is a schematic view of the multi-station material taking module according to the embodiment of the present invention.
Fig. 8 is a schematic view of a multi-station material taking device according to an embodiment of the present invention.
Fig. 9 is a schematic view of a gripper assembly according to an embodiment of the present invention.
Fig. 10 is a schematic view of the splayed adjusting mechanism according to the embodiment of the present invention.
Detailed Description
The essential features and advantages of the invention will be further explained below with reference to examples, but the invention is not limited to the embodiments listed.
As shown in fig. 1 to 10, the semiconductor lead frame sheet loading and unloading system of the present embodiment includes a feeding machine 100 and a discharging machine 200, the feeding machine 100 includes a multi-station loading and unloading device 10, a loading support 20, a first manipulator 30, a first multi-station conveying module 40, a multi-station loading and unloading module 50 and a paper separating box 60, the paper separating box 60 is disposed on the side of the multi-station loading and unloading device 10, the first manipulator 30 is disposed on the loading support 20, the multi-station loading and unloading module 50 is connected to the first manipulator 30, and the first multi-station conveying module 40 is located below the multi-station loading and unloading device 10. The discharging machine 200 comprises a multi-station discharging device 70, a discharging support 80, a second manipulator 90, a discharging mechanism 300 and a second multi-station conveying module 400, wherein the second manipulator 90 is arranged on the discharging support 80, the discharging mechanism 300 is connected with the second manipulator 90, and the second multi-station conveying module 400 is located below the discharging mechanism 300. Among the above-mentioned technical scheme, during the material loading, the material is placed on multistation dress extracting device 10, owing to have a plurality of stations, can the synchronous material loading of a plurality of materials, gets the material module 50 and takes out the material through the drive multistation of first manipulator 30 to place the paper that separates between the material in separating the paper box 60. The material is conveyed through the first multi-station conveying module 40, and is discharged through the discharging machine 200 after being processed. During discharging, the discharging mechanism 300 places the material on the second multi-station conveying module 400 on the multi-station discharging device 70 to realize discharging. In this embodiment, the multi-station loading and unloading device 10 is disposed corresponding to the manual operating platform 500, and is controlled through the human-machine interface 600,
in this embodiment, the multistation is got material module 10 and is included the material loading and snatch the subassembly, and the material loading snatchs the subassembly and includes getting material subassembly 1, adjusts the guide wire rail 2, and width adjustment mechanism 3 and width adjustment knob 4, width adjustment knob 4 is connected with width adjustment mechanism 3. The width adjusting mechanism 3 comprises a first slide block 31, a second slide block 32, a screw 33 and a transmission mechanism 34, wherein the first slide block 31 and the second slide block 32 are oppositely arranged and respectively arranged on the adjusting guide line rail 2. Two ends of the screw 33 are in threaded connection with the first sliding block 31 and the second sliding block 32, the transmission mechanism 34 is respectively connected with the screw 33 and the width adjusting knob 4, and the material taking assembly 1 is respectively connected with the first sliding block 31 and the second sliding block 32. Among the above-mentioned technical scheme, can drive screw 33 through drive mechanism 34 through width adjust knob 4 and rotate for first slider 31 and second slider 32 are close to relatively or keep away from, realize getting relative being close to or keeping away from between the material subassembly 1, thereby adjust two sets of distances of getting between the material subassembly 1, with the material loading that is applicable to not equidimension, different width products.
In this embodiment, the material taking assembly 1 comprises a material taking vacuum suction nozzle 11, an installation rod 12 and a position adjusting knob 13, the material taking vacuum suction nozzle 11 is arranged on the installation rod 12 through the position adjusting knob 13, and the installation rod 12 is respectively connected with a first sliding block 31 or a second sliding block 32. Through above-mentioned technical scheme, two sets of material subassembly 1 of getting set up relatively, and width adjustment mechanism 3 can adjust two sets of intervals of getting between the material vacuum suction nozzle 11 to be applicable to not unidimensional product and get the material. By screwing or releasing the position adjusting knob 13, the take-out vacuum nozzle 11 can be locked or released so that it can be adjusted in position along the mounting bar 12. Through the vacuum suction nozzle 11, the material and the separation paper can be sucked.
In this embodiment, the transmission mechanism 34 includes a first gear 341 and a second gear 342, the first gear 341 is engaged with the second gear 342, the first gear 341 is connected with the width adjustment knob 4, and the second gear 342 is connected with the screw 33, so that when the width adjustment knob 4 rotates, the first gear 341 is driven to rotate, and the power is transmitted to the screw 33 through the second gear 342, so as to rotate the screw 33.
In this embodiment, adjust the setting of wire guide rail 2 on bottom plate 51, bottom plate 51 top is equipped with backup pad 52, backup pad 52 with get material lift cylinder 53 and be connected, get material lift cylinder 53 and set up on connecting plate 54.
In this embodiment, discharge mechanism 300 includes that the unloading snatchs the subassembly, and the unloading snatchs the subassembly including tongs subassembly 6, connecting portion 7, guide rail 8, eight characters type adjustment mechanism 9 and open and close cylinder 301, tongs subassembly 6 is connected with connecting portion 7, and connecting portion 7 sets up on guide rail 8, and eight characters type adjustment mechanism 9 is connected with connecting portion 7, opens and closes cylinder 301 and be connected with eight characters type adjustment mechanism 9. Among the above-mentioned technical scheme, can drive splayed adjustment mechanism 9 through opening and shutting cylinder 301 to drive connecting portion 7 and follow the motion of guide rail 8, realize grabbing or the release of tongs subassembly 6.
In this embodiment, the splay adjustment mechanism 9 includes a sliding portion 91 and a width adjustment knob 92, the sliding portion 91 is provided with a splay groove 911, the connecting portion 7 and the splay groove 911 are connected by a connection post 912, and the width adjustment knob 92 is provided on a side surface of the sliding portion 91. In the above technical solution, the sliding portion 91 is connected to the upper sliding groove 92, and is connected to the sliding portion 91 through the opening and closing cylinder 301, so as to drive the sliding portion 91 to slide. Because the two groove bodies form the splayed groove 911, the connecting column 912 can be close to or far away from each other, and the grabbing component 6 is driven by the connecting part 7 to grab or release. Through setting up width adjust knob 92, can realize the position control rather than threaded connection's dog 93 through rotating width adjust knob 92, dog 93 can adjust the position of opening and shutting cylinder 301 to adjust the distance between two sets of tongs 6.
In this embodiment, the gripper assembly 6 includes grippers 61, gripper adjusting knobs 62, fixing rods 63 and paper separation nozzles 64, the two rows of grippers 61 are oppositely disposed and connected to the fixing rods 63, the fixing rods 63 are connected to the connecting portions 7, and the paper separation nozzles 64 are disposed between the grippers 61. Through above-mentioned technical scheme, can snatch the material through tongs 61, absorb packaging material through separating paper suction nozzle 64. In this embodiment, the paper separation suction nozzle 64 is connected to the suction nozzle rod 67 via the suction nozzle adjustment knob 66, and the position of the paper separation suction nozzle 64 can be adjusted by rotating the suction nozzle adjustment knob 66, and the paper separation suction nozzle is located between the two rows of grippers.
In this embodiment, the discharging mechanism further includes a discharging lifting cylinder 401, and the discharging lifting cylinder 401 is disposed on the mounting connection plate 65 and connected to the gripper assembly 6.
According to the sheet type feeding and discharging system for the semiconductor lead frame, the paper separating and the material separating of the material are separated, and the processing is convenient; the problem of semiconductor lead frame product specification many, not equidimension, unloading compatibility is difficult on the different width products can be solved, machining efficiency is promoted, the problem of material scraping flower and fold material is avoided going up to go up to unloading.
It should be noted that the above-mentioned preferred embodiments are only for illustrating the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention accordingly, and the protection scope of the present invention cannot be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (9)
1. The utility model provides a unloading system on semiconductor lead frame piece formula, a serial communication port, including material loading machine and blanking machine, the material loading machine includes multistation dress extracting device, gets the material support, and first manipulator, first multistation conveying module, multistation are got the material module and are separated the carton, separate the carton setting in multistation extracting device side, first manipulator setting on getting the material support, and the multistation is got the material module and is connected with first manipulator, and first multistation conveying module is located multistation extracting device below, the blanking machine includes discharge apparatus, the support of unloading, the second manipulator, shedding mechanism, and second multistation conveying module, the setting of second manipulator is on the support of unloading, and shedding mechanism is connected with the second manipulator, and second multistation conveying module is located the shedding mechanism below.
2. The semiconductor lead frame sheet type feeding and discharging system according to claim 1, wherein the multi-station material taking module comprises a material feeding and grabbing assembly, the material feeding and grabbing assembly comprises a material taking assembly, an adjusting guide line rail, a width adjusting mechanism and a width adjusting knob, the width adjusting knob is connected with the width adjusting mechanism, the width adjusting mechanism comprises a first slider, a second slider, a screw rod and a transmission mechanism, the first slider and the second slider are oppositely arranged and respectively arranged on the adjusting guide line rail, two ends of the screw rod are in threaded connection with the first slider and the second slider, the transmission mechanism is respectively connected with the screw rod and the width adjusting knob, and the material taking assembly is respectively connected with the first slider and the second slider.
3. The semiconductor lead frame sheet type loading and unloading system according to claim 2, wherein the material taking assembly comprises a material taking vacuum suction nozzle, a mounting rod and a position adjusting knob, the material taking vacuum suction nozzle is arranged on the mounting rod through the position adjusting knob, and the mounting rod is connected with the first sliding block or the second sliding block respectively.
4. The chip type feeding and discharging system of claim 3, wherein the transmission mechanism comprises a first gear and a second gear, the first gear is meshed with the second gear, the first gear is connected with the width adjusting knob, and the second gear is connected with the screw.
5. The chip type material loading and unloading system for the semiconductor lead frames as claimed in claim 4, wherein the adjusting guide rail is arranged on a bottom plate, a support plate is arranged above the bottom plate, the support plate is connected with a material taking lifting cylinder, and the material taking lifting cylinder is arranged on a connecting plate.
6. The semiconductor lead frame sheet type feeding and discharging system as claimed in claim 1, wherein the discharging mechanism comprises a feeding grabbing component, the feeding grabbing component comprises a gripper component, a connecting portion, a guide rail, a splayed adjusting mechanism and an opening and closing cylinder, the gripper component is connected with the connecting portion, the connecting portion is arranged on the guide rail, the splayed adjusting mechanism is connected with the connecting portion, and the opening and closing cylinder is connected with the splayed adjusting mechanism.
7. The chip type material loading and unloading system of the semiconductor lead frame as claimed in claim 6, wherein the splayed adjusting mechanism comprises a sliding part and a width adjusting knob, the sliding part is provided with a splayed groove, the connecting part is connected with the splayed groove through a connecting column, and the width adjusting knob is arranged on the side surface of the sliding part.
8. The semiconductor lead frame sheet type loading and unloading system according to claim 7, wherein the gripper assembly comprises grippers, gripper adjusting knobs, fixing rods and paper separation suction nozzles, the two rows of grippers are oppositely arranged and connected with the fixing rods, the fixing rods are connected with the connecting portions, and the paper separation suction nozzles are arranged between the grippers.
9. The semiconductor lead frame sheet type loading and unloading system according to claim 8, wherein the unloading mechanism comprises a blanking lifting cylinder, and the blanking lifting cylinder is arranged on the mounting connection plate and connected with the gripper assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022465638.6U CN213424956U (en) | 2020-10-30 | 2020-10-30 | Semiconductor lead frame piece type feeding and discharging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022465638.6U CN213424956U (en) | 2020-10-30 | 2020-10-30 | Semiconductor lead frame piece type feeding and discharging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213424956U true CN213424956U (en) | 2021-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022465638.6U Active CN213424956U (en) | 2020-10-30 | 2020-10-30 | Semiconductor lead frame piece type feeding and discharging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213424956U (en) |
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2020
- 2020-10-30 CN CN202022465638.6U patent/CN213424956U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231212 Address after: A-4, Yingxinda Science and Technology Innovation Park Phase II, No. 8 Xinda Road, Huimin Street, Jiashan County, Jiaxing City, Zhejiang Province, 314100 Patentee after: Jiashan Fudan Research Institute Address before: Room 1605, building 1, Guanghua Times Square, no.132greenland Avenue, Huaqiao Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Kunshan Shoujia Intelligent Technology Co.,Ltd. |