CN213213947U - Circuit board with heat radiation structure - Google Patents
Circuit board with heat radiation structure Download PDFInfo
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- CN213213947U CN213213947U CN202022489604.0U CN202022489604U CN213213947U CN 213213947 U CN213213947 U CN 213213947U CN 202022489604 U CN202022489604 U CN 202022489604U CN 213213947 U CN213213947 U CN 213213947U
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- circuit board
- heat dissipation
- shell
- dissipation fan
- heat
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Abstract
The utility model discloses a circuit board with heat radiation structure belongs to circuit board technical field, including the shell, the embedding of shell inner wall is provided with the bradyseism layer, and shell inner wall opening is provided with the draw-in groove, and the draw-in groove inner wall closely laminates there is the skid resistant course, and the embedding of shell top is provided with the dust screen, and the inside below fixedly connected with heat dissipation fan driving motor of shell, the supporting heat dissipation fan that is provided with in heat dissipation fan driving motor top, shell below fixedly connected with fixed plate. The utility model discloses, after accomplishing the circuit board installation, the circuit board circular telegram is worked, and the circuit board can generate heat at the during operation, if not in time give off the heat, equipment can continuously heat up, the device can be because of overheated inefficacy, electronic equipment's reliability will descend, at this moment, open the switch for heat dissipation fan driving motor drives the heat dissipation fan and rotates, continuously cools down the circuit board, it is perfect inadequately to have solved current circuit board heat dissipation measure that has heat radiation structure, lead to the problem that the device became invalid easily.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, specifically be a circuit board with heat radiation structure.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The Circuit Board can be called as a Printed Circuit Board or a Printed Circuit Board, and the english name (Printed Circuit Board) PCB, (Flexible Printed Circuit Board) FPC Circuit Board (FPC Circuit Board is also called as a Flexible Circuit Board) which is a Flexible Printed Circuit Board made of polyimide or polyester film as a base material and has high reliability and excellent flexibility. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
The search shows that there is a circuit board with a heat dissipation structure, which is CN201821960517.5, and the new circuit board with a heat dissipation structure has the function of increasing the heat dissipation efficiency of the circuit board. The structure is simple, and the effect of the heat dissipation performance of the circuit board can be improved; wherein, the deficiency points are as follows:
the existing shock absorption structure of the circuit board with the heat dissipation structure is not effective enough, the heat dissipation measures are not perfect enough, the failure of devices is easily caused, the reliability of electronic equipment is reduced, and the dustproof measures are not good enough.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: the circuit board with the heat dissipation structure is provided for solving the problems that the existing shock absorption structure of the circuit board with the heat dissipation structure is not effective enough, heat dissipation measures are not perfect enough, devices are easy to lose efficacy, the reliability of electronic equipment is reduced, and dustproof measures are not good enough.
The utility model adopts the technical scheme as follows: the utility model provides a circuit board with heat radiation structure, includes the shell, shell inner wall embedding is provided with the bradyseism layer, shell inner wall opening is provided with the draw-in groove, the draw-in groove inner wall closely laminates there is the skid resistant course, the embedding of shell top is provided with the dust screen, the inside below fixedly connected with heat dissipation fan actuating motor of shell, the supporting heat dissipation fan that is provided with in heat dissipation fan actuating motor top, shell below fixedly connected with fixed plate, fixed plate one side opening is provided with reserves the anchor eye, reserve the inside screw thread fixedly connected with screw rod that passes through of anchor eye, the inside embedding of draw-in groove is provided with the circuit board.
The thickness of the cushioning layer is 1cm, and the interior of the cushioning layer is made of an EVA (ethylene vinyl acetate) plate.
The heat dissipation fan driving motor extends to the upper part inside the shell through the rotating shaft and is fixedly connected with the heat dissipation fan, and the heat dissipation fan is located below the circuit board.
The dustproof net is characterized in that a plurality of holes are formed in the surface opening of the dustproof net, the number of the holes is 10 meshes, and the dustproof net is located above the circuit board.
The clamping groove and the periphery of the circuit board are in a fit shape, and the anti-slip layer is made of a silica gel anti-slip layer.
The heat dissipation fan driving motor is electrically connected with an external power supply through a control switch.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses in, when using the circuit board, need install the circuit board earlier, and take place the vibration easily in the installation, and the circuit board is the spare part that the precision is higher, and the vibration makes the circuit board receive the damage easily, and at this moment, the board of bradyseism in situ portion can reduce the influence of external force to the circuit board, has solved the current bradyseism structure of circuit board that has heat radiation structure effectual problem inadequately.
2. The utility model discloses in, after accomplishing the circuit board installation, the circuit board circular telegram is worked, and the circuit board can generate heat at the during operation, if not in time give off the heat, equipment can continuously heat up, the device can be because of overheated inefficacy, electronic equipment's reliability will descend, at this moment, open the switch, make heat dissipation fan driving motor drive heat dissipation fan and rotate, continuously cool down the circuit board, it is perfect inadequately to have solved current circuit board heat dissipation measure that has heat radiation structure, lead to the device to lose efficacy easily, electronic equipment's reliability will descend the problem.
3. The utility model discloses in, when the circuit board is using, can produce certain electric field, these electric fields can attract the dust to make it spill on the circuit board, if the dust is too much, can be to the printed line in the circuit board, electronic components's metal pin etc. produce the corruption, cause circuit board control inefficacy or inoperative easily, and a plurality of holes on dust screen surface, can stop the dust outside the shell, can prevent that the dust from falling on the circuit board, solved current circuit board dustproof measure not good enough problem that has heat radiation structure.
Drawings
FIG. 1 is a schematic diagram of a side view structure of the present invention;
FIG. 2 is a schematic diagram of a top view structure of the present invention;
fig. 3 is a schematic diagram of the overall structure of the present invention.
The labels in the figure are: 1. a housing; 101. a cushioning layer; 102. a card slot; 103. an anti-slip layer; 104. a dust screen; 2. a heat radiation fan drive motor; 201. a heat dissipation fan; 3. a fixing plate; 301. reserving an anchor hole; 302. a screw; 4. a circuit board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses in:
referring to fig. 1-3, a circuit board with a heat dissipation structure, including shell 1, the embedding of shell 1 inner wall is provided with bradyseism layer 101, shell 1 inner wall opening is provided with draw-in groove 102, draw-in groove 102 inner wall closely laminates anti-skid layer 103, the embedding is provided with dust screen 104 above shell 1, the inside below fixedly connected with heat dissipation fan driving motor 2 of shell 1, the supporting heat dissipation fan 201 that is provided with in heat dissipation fan driving motor 2 top, shell 1 below fixedly connected with fixed plate 3, 3 one side openings of fixed plate are provided with and reserve anchor eye 301, reserve anchor eye 301 inside through screw thread fixedly connected with screw 302, the inside embedding of draw-in groove 102 is provided with circuit board 4.
Referring to fig. 1, furtherly, bradyseism layer 101 thickness is 1cm, the inside material of bradyseism layer 101 is the EVA board, when using circuit board 4, need install circuit board 4 earlier, and take place the vibration easily in the installation, and circuit board 4 is the higher spare part of precision, the vibration makes circuit board 4 receive the damage easily, at this moment, the inside EVA board of bradyseism layer 101 can reduce external force to circuit board 4's influence, the current bradyseism structure of circuit board that has heat radiation structure is effectual problem inadequately.
Referring to fig. 1, it is further, heat dissipation fan driving motor 2 extends to the inside top of shell 1 and heat dissipation fan 201 fixed connection through the pivot, heat dissipation fan 201 is located circuit board 4 below, after the installation is accomplished to circuit board 4, circuit board 4 circular telegram is worked, and circuit board 4 can generate heat at the during operation, if not in time give off the heat, equipment can last the intensification, the device can be because of overheated inefficacy, electronic equipment's reliability will descend, at this moment, open the switch, make heat dissipation fan driving motor 2 drive heat dissipation fan 201 and rotate, continuously cool down to circuit board 4, it is not perfect to have solved current circuit board heat dissipation measure that has heat radiation structure, lead to the device to lose efficacy easily, electronic equipment's reliability will descend the problem.
Referring to fig. 1 and 3, further, the opening on the surface of the dust screen 104 is provided with a plurality of holes, the number of the holes is 10, the dust screen 104 is located above the circuit board 4, when the circuit board 4 is in use, a certain electric field is generated, the electric field can attract dust to make the dust fall on the circuit board, if the dust is too much, the dust can corrode printed lines in the circuit board, metal pins of electronic components and the like, and the control failure or the failure of the circuit board is easily caused, and the holes on the surface of the dust screen 104 can block the dust outside the housing 1, so that the dust can be prevented from falling on the circuit board 4, and the problem that the existing dust-proof measures of the circuit board with the heat dissipation structure are not good enough is solved.
Referring to fig. 1, further, the card slot 102 is fitted around the circuit board 4, and the anti-slip layer 103 is made of a silica gel anti-slip layer.
Referring to fig. 1 to 3, further, the driving motor 2 of the cooling fan is electrically connected to an external power source through a control switch.
The working principle is as follows: firstly, referring to fig. 1, when a circuit board 4 is used, the circuit board 4 needs to be installed first, vibration is easy to occur in the installation process, the circuit board 4 is a component with high precision, and the circuit board 4 is easy to be damaged due to vibration, at the moment, the EVA plate inside the cushioning layer 101 can reduce the influence of external force on the circuit board 4, and the problem that the cushioning structure of the existing circuit board with a heat dissipation structure is not effective enough is solved; then, referring to fig. 1, after the circuit board 4 is installed, the circuit board 4 is powered on to work, the circuit board 4 heats up when working, if heat is not dissipated timely, the device is heated continuously, the device fails due to overheating, the reliability of the electronic device is reduced, at the moment, the switch is turned on, so that the heat dissipation fan driving motor 2 drives the heat dissipation fan 201 to rotate, the circuit board 4 is cooled continuously, and the problems that the existing circuit board with a heat dissipation structure is not perfect in heat dissipation measures, the device is prone to failure, and the reliability of the electronic device is reduced are solved; finally, referring to fig. 1 and 3, when the circuit board 4 is in use, a certain electric field is generated, and the electric field attracts dust to make the dust fall on the circuit board, if the dust is too much, the dust can corrode the printed lines in the circuit board, the metal pins of electronic components and the like, so that the control of the circuit board is easy to lose efficacy or not work, and the holes on the surface of the dustproof mesh 104 can block the dust outside the shell 1, so that the dust can be prevented from falling on the circuit board 4, and the problem that the existing circuit board with a heat dissipation structure cannot be well dustproof is solved.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A circuit board with a heat dissipation structure, comprising a housing (1), characterized in that: the utility model discloses a novel anti-skidding heat dissipation device, including shell (1), shell (1) inner wall embedding is provided with bradyseism layer (101), shell (1) inner wall opening is provided with draw-in groove (102), draw-in groove (102) inner wall is closely laminated has skid resistant course (103), shell (1) top embedding is provided with dust screen (104), shell (1) inside below fixedly connected with heat dissipation fan actuating motor (2), the supporting heat dissipation fan (201) that is provided with in heat dissipation fan actuating motor (2) top, shell (1) below fixedly connected with fixed plate (3), fixed plate (3) one side opening is provided with reserves anchor eye (301), reserve anchor eye (301) inside through screw thread fixedly connected with screw rod (302), draw-in groove (102) inside embedding is provided with circuit board (4).
2. The circuit board with a heat dissipation structure as recited in claim 1, wherein: the thickness of the cushioning layer (101) is 1cm, and the interior of the cushioning layer (101) is made of an EVA plate.
3. The circuit board with a heat dissipation structure as recited in claim 1, wherein: the heat dissipation fan driving motor (2) extends to the upper part inside the shell (1) through a rotating shaft and is fixedly connected with the heat dissipation fan (201), and the heat dissipation fan (201) is located below the circuit board (4).
4. The circuit board with a heat dissipation structure as recited in claim 1, wherein: the surface opening of the dust screen (104) is provided with a plurality of holes, the number of the holes is 10 meshes, and the dust screen (104) is positioned above the circuit board (4).
5. The circuit board with a heat dissipation structure as recited in claim 1, wherein: the clamping groove (102) and the periphery of the circuit board (4) are in fit, and the anti-skid layer (103) is made of a silica gel anti-skid layer.
6. The circuit board with a heat dissipation structure as recited in claim 1, wherein: the heat dissipation fan driving motor (2) is electrically connected with an external power supply through a control switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022489604.0U CN213213947U (en) | 2020-11-02 | 2020-11-02 | Circuit board with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022489604.0U CN213213947U (en) | 2020-11-02 | 2020-11-02 | Circuit board with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213213947U true CN213213947U (en) | 2021-05-14 |
Family
ID=75827259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022489604.0U Active CN213213947U (en) | 2020-11-02 | 2020-11-02 | Circuit board with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213213947U (en) |
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2020
- 2020-11-02 CN CN202022489604.0U patent/CN213213947U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220111 Address after: 518000 workshop 101, building 2, No. 7, Jianlong street, Baoan community, Yuanshan street, Longgang District, Shenzhen, Guangdong Province Patentee after: SHENZHEN X-MULONG ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 518115 Room 401, building 2, No.7 Jianlong street, Baoan community, Yuanshan street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen xinyoucheng Electronic Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |