CN213210542U - Optical module - Google Patents

Abstract

The optical module provided by the application comprises a circuit board, a light emission submodule and a light receiving submodule, wherein a first laser component and a second laser component in the light emission submodule respectively emit laser towards a first light multiplexing component and a second light multiplexing component, and the first light multiplexing component and the second light multiplexing component respectively combine the received laser into a first laser beam and a second laser beam; the first laser beam and the second laser beam are combined into a laser beam through a third optical multiplexing component and then emitted into an external optical fiber; the first optical demultiplexing assembly in the optical receive submodule decomposes an optical signal from an external optical fiber into a first optical demultiplexing signal and a second optical demultiplexing signal, the second optical demultiplexing assembly and the second optical demultiplexing assembly decompose the first optical demultiplexing signal and the second optical demultiplexing signal respectively, and the decomposed optical signal is converted into an electrical signal through the photoelectric conversion assembly. Based on this, by adjusting the number of the laser modules and the photodetection modules, an 8-channel FR8 optical module can be obtained.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The main requirement of the 800G pluggable optical module is to be positioned in an application scene within 2 km. According to a single channel rate, the system comprises two systems of 8 × 100Gbps and 4 × 200Gbps, wherein the 4 × 200Gbps system has higher requirements on device broadband, so 8 × 100Gbps becomes the current main selection scheme.

The pluggable optical module satisfying 8 × 100Gbps standards mainly includes a PSM8 optical module having a transmission distance of 100 m, a DR8 optical module having a transmission distance of 500 m, and an FR8 optical module having a transmission distance of 2 km. For the optical module of the FR series, a 4-channel laser is adopted based on the O-band wavelength, and the optical paths are combined with the wavelength division multiplexing component.

In order to meet the transmission requirement of 8 × 100Gbps, the wavelength is mainly extended continuously on the O band at present, but the wavelength of the O band coarse wavelength division multiplexing is only 4, which is 1271nm, 1291nm, 1311nm and 1331nm, and the wavelength of the O band coarse wavelength division multiplexing is extended continuously on the O band, so that no resource is available, and the transmission requirement of 8 × 100Gbps cannot be met.

Disclosure of Invention

The application provides an optical module, which realizes that an FR series optical module meets the transmission requirement of 8 × 100 Gbps.

The application provides an optical module, including:

a circuit board;

the light emission secondary module is connected with the circuit board and used for emitting signal light;

the transmitter optical subassembly includes:

a first laser component for emitting laser towards the first optical multiplexing component;

a second laser module for emitting laser light toward the second optical multiplexing module;

the first optical multiplexing component is used for receiving laser light from the first laser component and combining the received laser light into a first laser beam,

the second optical multiplexing component is used for receiving the laser light from the second laser component and combining the received laser light into a second laser beam;

a third optical multiplexing component for receiving and combining the first laser beam and the second laser beam.

The application provides an optical module, including:

a circuit board;

the light receiving secondary module is connected with the circuit board;

the optical receive sub-module includes:

a first optical demultiplexing module for receiving signal light from an external optical fiber and demultiplexing the received signal light into a first optical division signal and a second optical division signal;

a second optical demultiplexing component for receiving and demultiplexing the first optical demultiplexed signal;

a third optical demultiplexing component for receiving and demultiplexing the second optical demultiplexed signal;

a first photoelectric conversion element for converting the optical signal from the second optical demultiplexing element into an electrical signal;

a second photoelectric conversion module for converting the optical signal from the third optical demultiplexing module into an electrical signal.

Has the advantages that:

the optical module comprises a circuit board, and a light emission submodule and a light receiving submodule which are connected with the circuit board, wherein the light emission submodule comprises a first laser component and a second laser component, the first laser component and the second laser component respectively emit laser towards the first light multiplexing component and the second light multiplexing component, and the first light multiplexing component and the second light multiplexing component respectively combine the received laser into a first laser beam and a second laser beam; the first laser beam and the second laser beam are transmitted to a third optical multiplexing component, and the first laser beam and the second laser beam are combined into a laser beam through the third optical multiplexing component and transmitted to an external optical fiber, so that the electric signal is converted into an optical signal; the optical receiving submodule comprises a first optical demultiplexing assembly, the first optical demultiplexing assembly decomposes an optical signal from an external optical fiber into a first optical signal and a second optical signal, the second optical demultiplexing assembly and the second optical demultiplexing assembly decompose the first optical signal and the second optical signal respectively, and the optical signal obtained after decomposition is converted into an electrical signal through a photoelectric conversion assembly.

Based on the above, by adjusting the number of the laser components in the tosa and the number of the photodetection components in the rosa, an 8-channel FR8 optical module can be obtained, thereby satisfying the transmission requirement of 8 × 100 Gbps.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;

fig. 5 is an exploded schematic view of an tosa according to an embodiment of the present disclosure;

fig. 6 is a schematic partial structure diagram of a rosa according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram illustrating an optical module according to an embodiment of the present disclosure;

fig. 8 is a schematic optical path diagram of an optical module according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical communication is the interconversion of optical and electrical signals. Optical communication uses optical signals carrying information to transmit in information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fiber/optical waveguide; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network unit 100 having the optical module 200.

The optical port of the optical module 200 is connected to the optical fiber 101, and establishes a bidirectional optical signal connection with the optical fiber. The electrical port of the optical module 200 is connected to the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit. The optical module realizes the interconversion between an optical signal and an electrical signal, thereby realizing the connection between the optical fiber 101 and the optical network unit 100.

Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber 101. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and in the photoelectric conversion process, the carrier of the information is converted between the light and the electricity, but the information itself is not changed.

The optical network unit 100 has an optical module interface 102 for accessing the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200. The optical network unit is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through an optical network unit. Specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit serves as an upper computer of the optical module to monitor the operation of the optical module.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device sequentially through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an Optical Line Terminal (OLT) and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector connected to the circuit board 105 is provided in the cage 106, and is used for connecting an electrical port of an optical module such as a gold finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into the optical network unit 100, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is located on the circuit board 105 of the optical network unit 100, and the electrical connectors on the circuit board 105 are wrapped in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic diagram of an optical module according to an embodiment of the present invention, and fig. 4 is a schematic diagram of an optical module according to an embodiment of the present invention. As shown in fig. 3 and 4, the optical module 200 according to the embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, a tosa 400, and a tosa 500.

The upper shell 201 and the lower shell 202 form a package cavity with two ports, specifically two ports (204, 205) in the same direction, or two ports in different directions; one of the ports is an electrical port 204 which is used for being inserted into an upper computer such as an optical network unit; the other port is an optical port 205 for connecting an external optical fiber 101; the optoelectronic devices such as the circuit board 300, the transmitter sub-module 400, and the receiver sub-module 500 are disposed in the package cavity formed by the upper and lower shells.

The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper housing, casing combination down is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating part, heat dissipation and electromagnetic shield structure are not convenient for install, are unfavorable for production automation.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; pulling the tip of the unlocking member 203 can relatively move the unlocking member 203 on the outer wall surface; when the optical module is inserted into the cage of the upper computer, the cage 106 is engaged by the engaging member of the unlocking member 203, so that the optical module is fixed in the upper computer; by pulling the unlocking member 203, the engaging member moves along with the unlocking member, and the connection relationship between the engaging member and the host computer is changed, so that the engagement relationship between the optical module 200 and the cage 106 is released, and the optical module can be extracted from the host computer.

The circuit board 300 is located in a packaging cavity formed by the upper shell and the shell, the circuit board 300 is electrically connected with the light-emitting sub-module 400 and the light-receiving sub-module 500 respectively, and the circuit board is provided with chips, capacitors, resistors and other electric devices. The method comprises the following steps of selecting corresponding chips according to the requirements of products, wherein common chips comprise a microprocessor MCU, a data processing chip DSP or a clock data recovery chip CDR, a laser driving chip, a transimpedance amplifier TIA chip, a limiting amplifier LA chip, a power management chip and the like. The transimpedance amplifier is closely associated with the optical detection chip, and the transimpedance amplifier and the optical detection chip can be packaged together by a part of products, such as in the same TO (TO optical) tube shell or the same shell; the optical detection chip and the transimpedance amplifier can be separately packaged, and the transimpedance amplifier is arranged on the circuit board.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when the circuit board 300 is provided with a single chip with three functions in one.

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The surface of the end part of the circuit board 300 is provided with a golden finger, the golden finger consists of one pin which is mutually independent, the circuit board is inserted into an electric connector in the cage, and the golden finger is in conductive connection with a clamping elastic sheet in the electric connector; the golden fingers can be arranged on the surface of one side of the circuit board, and the golden fingers are generally arranged on the upper surface and the lower surface of the circuit board in consideration of the large requirement on the number of pins; the golden finger is used for establishing electrical connection with the upper computer, and the specific electrical connection can be power supply, grounding, I2C signals, communication data signals and the like.

The optical module further includes a transmitter optical subassembly and a receiver optical subassembly, which may be collectively referred to as an optical subassembly. As shown in fig. 4, the optical module according to the embodiment of the present invention includes a tosa 400 and a rosa 500, where the tosa 400 is used for sending optical signals, and the rosa 500 is used for receiving optical signals.

The tosa 400 is located at the edge of the circuit board 300, and the tosa 400 and the rosa 500 are staggered on the surface of the circuit board 300, which is beneficial to achieving better electromagnetic shielding effect.

The tosa 400 is disposed on a surface of the circuit board 300. in another conventional package, the tosa is physically separated from the circuit board and electrically connected to the pcb through a flexible board. In the present embodiment, the tosa 400 is connected to a first fiber receptacle 402 by a first fiber 401.

The tosa 400 is located in a package cavity formed by the upper and lower shells, as shown in fig. 4, the circuit board 300 is provided with a notch 301 for placing the tosa; the notch 301 may be disposed in the middle of the circuit board, or may be disposed at the edge of the circuit board; the tosa is arranged in the notch 301 of the circuit board in an embedded mode, so that the circuit board can conveniently extend into the tosa, and the tosa and the circuit board can be conveniently fixed together.

The rosa 500 is disposed on the surface of the circuit board 300, and in another common packaging method, the rosa is physically separated from the circuit board and electrically connected through a flexible board. In the embodiment of the present application, the rosa 500 is connected to a second fiber receptacle 502 through a second fiber 501. The signal light outside the optical module is transmitted to the second optical fiber receptacle 502 through the external optical fiber, transmitted to the second optical fiber 501, and then transmitted to the optical receive sub-module 500 through the second optical fiber 501, and the receive sub-module 500 converts the received signal light into a current signal. Further, the rosa 500 includes an optical device and a photoelectric conversion device. Among them, optical devices such as optical fiber splices, arrayed waveguide gratings, lenses, etc. The second optical fiber 501 transmits the signal light to the optical device, then converts the optical device into a signal light beam transmission path, and finally transmits the signal light beam to the photoelectric conversion device.

In the embodiment of the present application, the tosa 400 includes a first laser component, a second laser component, a first optical multiplexing component, a second optical multiplexing component, and a third optical multiplexing component, and the first laser component, the second laser component, the first optical multiplexing component, the second optical multiplexing component, and the third optical multiplexing component are disposed in a cavity formed by a housing of the tosa 400 and the circuit board 300.

The first laser assembly comprises at least 2 first lasers, the first lasers are attached to the circuit board and used for emitting optical waves in an O wave band, and the wavelengths of the optical waves emitted by different first lasers are different; and the second laser assembly comprises at least 2 second lasers, the second lasers are attached to the circuit board and used for emitting light waves in a C waveband, and the wavelengths of the light waves emitted by different second lasers are different.

The first optical multiplexing component is connected with the first laser component and combines the optical waves with different wavelengths of at least 2 paths of O wave bands emitted by the first laser component into a first laser beam; the second optical multiplexing component is connected with the second laser component and is used for combining at least 2 paths of light waves with different wavelengths in the C wave band emitted by the second laser component into a second laser beam; and one end of the third optical multiplexing component is connected with the first optical multiplexing component and the second optical multiplexing component, the other end of the third optical multiplexing component is connected with the transmitting end of the transmitter optical subassembly module, and the third optical multiplexing component is used for receiving and combining the first laser beam and the second laser beam into a third laser beam which is transmitted through the transmitting end, wherein the third laser beam comprises at least 2 paths of O waveband optical waves and at least 2 paths of C waveband optical waves.

In the embodiment of the present application, a first laser component includes 4 first lasers, and a second laser component includes 4 second lasers, for example, to describe the structure and principle of the tosa, where the 4 first lasers sequentially emit optical waves in the O-band with wavelengths of 1271nm, 1291nm, 1311nm, and 1331nm, and the 4 second lasers sequentially emit optical waves in the C-band with wavelengths of 1511nm, 1531nm, 1551nm, and 1571 nm. Correspondingly, when the optical multiplexing component is selected to be in the form of a filter, if the O-band light wave of 1271nm, 1291nm, 1311nm and 1331nm and the C-band light wave of 1511nm, 1531nm, 1551nm and 1571nm are coupled together through one filter, the thickness of the coated film of the filter is increased in order to achieve the transmission and reflection of 8 paths of light waves, the processing difficulty of the filter is increased to a great extent at the moment, the precision requirement on the filter is increased along with the increase of the thickness of the coated film, the transmission or reflection effect of the filter is influenced to a certain extent, and the optical coupling efficiency of the optical module is reduced. In this way, in the embodiment of the present application, the O-band light waves of 1271nm, 1291nm, 1311nm and 1331nm are multiplexed by the first optical multiplexing module, and the C-band light waves of 1511nm, 1531nm, 1551nm and 1571nm are multiplexed by the second optical multiplexing module.

Fig. 5 is an exploded view of an tosa according to an embodiment of the present invention. As shown in fig. 5, the first laser assembly or the second laser assembly in the embodiment of the present application is shown as the laser assembly 406 in the figure, and specifically, fig. 5 shows that the first laser assembly or the second laser assembly includes 4 laser chips 406a, 4 collimating lenses 406b, 4 metallized ceramics 406c, and 1 semiconductor cooler 406 d. A common light emitting chip of the optical module is a laser chip, the laser chip 406a is arranged on the surface of the metallized ceramic 406c, and a circuit pattern is formed on the surface of the metallized ceramic 406c and can supply power to the laser chip; meanwhile, the metallized ceramic 406C has better heat conduction performance and can be used as a heat sink of the laser chip 406a for heat dissipation. The laser becomes the first choice light source of optical module and even optical fiber transmission by better single wavelength characteristic and better wavelength tuning characteristic; even if a special optical communication system adopts the light source, the characteristics and chip structure of the light source are greatly different from those of laser, so that the optical module adopting laser and the optical module adopting other light sources have great technical difference, and a person skilled in the art generally does not consider that the two types of optical modules can give technical inspiration to each other.

With reference to fig. 5, the tosa according to the embodiment of the present invention further includes a cover plate 403 and a tosa cavity (hereinafter referred to as cavity) 404, the cavity 404 is covered by the cover plate 403 from above, a sidewall of the cavity 404 has an opening 405 for inserting the circuit board 300, and the circuit board 300 is fixed to the lower housing of the optical module. A first laser component and a second laser component are arranged in the cavity 404, the circuit board 300 extending into the cavity is electrically connected with the first laser component and the second laser component, and the laser components are provided with components such as a laser chip and a collimating lens to form collimated light emission.

With continued reference to fig. 5, the optical transmitter sub-module provided in this embodiment of the present application further includes a first optical multiplexing component, a second optical multiplexing component, and a third optical multiplexing component, where the first optical multiplexing component, the second optical multiplexing component, or the third optical multiplexing component is an optical multiplexing component 407 in the figure, and the optical multiplexing component 407 receives multiple beams of light from the laser component 406, and combines the multiple beams of light into one beam of light, where the one beam of light includes light with different wavelengths. Specifically, the first optical multiplexing component receives 4O-band optical waves emitted by the first laser component and combines the optical waves into a first laser beam, the second optical multiplexing component receives 4C-band optical waves emitted by the second laser component and combines the optical waves into a second laser beam, and the third optical multiplexing component combines the first laser beam and the second laser beam into a third laser beam and emits the third laser beam through an emitting end, wherein the third laser beam comprises 4O-band optical waves and 4C-band optical waves.

Fig. 8 is a schematic optical path diagram of an optical module according to an embodiment of the present application, in fig. 8, a first optical multiplexing component, a second optical multiplexing component, and a third optical multiplexing component are selected as optical filters, such that the first optical multiplexing component, the second optical multiplexing component, and the third optical multiplexing component respectively select a first optical filter, a second optical filter, and a third optical filter, wherein the optical filters may specifically select optical filters with a certain angle, as shown in fig. 8, the first optical filter set synthesizes 4 optical wavelengths of the O band into a first laser beam, the second optical filter set synthesizes optical wavelengths of the C band into a second laser beam, the first laser beam and the second laser beam enter the third optical filter with an incident angle of 45 °, the third optical filter may be configured to transmit and reflect the C band, or transmit and reflect the O band, and combine the first laser beam and the second laser beam into a third laser beam through the third optical filter, and transmitted through the transmitting end.

The optical lens is used for converging light, the light emitted from the light emitting chip is in a divergent state, and convergence processing is required for facilitating subsequent light path design and light coupling into the optical fiber. The common convergence is to converge divergent light into parallel light, and converge divergent light and parallel light into convergent light. Fig. 5 shows a collimating lens 406b and a focusing lens 408, the collimating lens 406b is disposed on the light-emitting path of the laser chip to converge the third laser beam into parallel light; the focusing lens 408 is disposed near the optical multiplexing component 407, and focuses the parallel light into the optical fiber.

In this application embodiment, can paste first laser subassembly and second laser subassembly in parallel on the circuit board, first laser subassembly with the light wave emission direction of second laser subassembly is parallel, and all light waves that first laser subassembly and second laser subassembly were launched are parallel to be penetrated into first light multiplex subassembly or second light multiplex subassembly, and after obtaining first laser beam and second laser beam, first laser beam and second laser beam are parallel to be penetrated into third light multiplex subassembly, also can paste first laser subassembly and second laser subassembly on the circuit board with certain contained angle, no matter how many the angle between first laser subassembly and the second laser subassembly, the emission direction of first laser beam and second laser beam all faces the multiplexer receiving terminal of third light multiplex subassembly.

In the embodiment of the present application, the light-receiving sub-module 500 includes a first optical demultiplexing module, a second optical demultiplexing module, a third optical demultiplexing module, a first photoelectric conversion module and a second photoelectric conversion module, and the first optical demultiplexing module, the second optical demultiplexing module, the third optical demultiplexing module, the first photoelectric conversion module and the second photoelectric conversion module are all disposed in a cavity formed by a housing of the light-receiving sub-module and a circuit board. Will come from the outside signal photolysis of optical module to first optical signal group and second optical signal group through first optical demultiplexing subassembly, decompose first optical signal group into 2 way O wave band lightwaves, decompose second optical signal group into 2 way C wave band lightwaves at least respectively through second optical demultiplexing subassembly, third optical demultiplexing subassembly, the wavelength of 2 way O wave band lightwaves at least is different, and the wavelength of 2 way C wave band lightwaves at least is different. The first photoelectric conversion assembly comprises at least 2 first photodetectors, one end of the first photoelectric conversion assembly is connected with the second optical demultiplexing assembly, and the other end of the first photoelectric conversion assembly is connected with the first transimpedance amplifier; and the second photoelectric conversion component comprises at least 2 second photoelectric detectors, one end of each second photoelectric detector is connected with the third optical demultiplexing component, and the other end of each second photoelectric conversion component is connected with the second transimpedance amplifier. Similarly, if when the optical signal from external optical fiber is decomposed by the same optical demultiplexing module, the optical demultiplexing module is taken as an example, the processing difficulty of the filter can be increased at the moment, the processing precision is difficult to guarantee, and the optical coupling efficiency is further influenced.

The first transimpedance amplifier and the second transimpedance amplifier respectively receive current signals generated by the first photoelectric conversion assembly and the second photoelectric conversion assembly and convert the received current signals into voltage signals; the position relation of first optical demultiplexing subassembly, second optical demultiplexing subassembly and third optical demultiplexing subassembly need satisfy first light splitting signal group with the light-emitting direction of second light splitting signal group is faced respectively the demultiplexer receiving terminal of second optical demultiplexing subassembly with the demultiplexer receiving terminal of third optical demultiplexing subassembly.

In the embodiment of the present application, the at least 2O-band optical waves are converted into current signals by a first photoelectric conversion component, and the at least 2C-band optical waves are converted into current signals by a second photoelectric conversion component.

Fig. 6 is a schematic structural diagram of a part of a light-receiving sub-module according to an embodiment of the present disclosure, and as shown in fig. 6, the first photoelectric conversion module further includes a first pad 504, the first pad is disposed on the circuit board, and a circuit is disposed on a front surface of the first pad; the first photodetector is flip-chip bonded to the front side of the first pad 504, i.e., the front side of the first photodetector is bonded to the front side of the first pad 504.

The front surface of the first photodetector 503 is provided with a photosensitive surface and an electrode, the front surface is connected to the front surface of the first pad 504, the electrode is connected to one end of the circuit, and the back surface is away from the first pad 504 and is formed with a lens for converging signal light to the photosensitive surface, so as to convert the received optical signal into a current signal. Similarly, the second photoelectric conversion assembly further comprises a second gasket, the second gasket is arranged on the circuit board, and the front surface of the second gasket is provided with a circuit; the first photoelectric detector is flip-chip bonded on the front surface of the second gasket, namely the front surface of the first photoelectric detector is bonded on the front surface of the second gasket.

The front of second photoelectric detector is provided with photosensitive surface and electrode, openly connects the front of second gasket just the electrode is connected the one end of circuit, the back is kept away from the second gasket just be formed with be used for to photosensitive surface assembles the lens of signal light for convert received light signal into current signal. The first gasket and the second gasket are metalized ceramic gaskets, and circuit patterns are formed on the surfaces of the metalized ceramic gaskets and can supply power to the first photoelectric detector or the second photoelectric detector and transmit signals; meanwhile, the metallized ceramic has better heat conduction performance and can be used as a heat sink of the first photoelectric detector or the second photoelectric detector for heat dissipation.

Fig. 7 is a schematic diagram of an optical module according to an embodiment of the present application, and as shown in fig. 7, an optical module according to the present application includes a circuit board and a tosa disposed on the circuit board. The transmitter optical subassembly comprises a first laser component, a second laser component, a first optical multiplexing component, a second optical multiplexing component and a third optical multiplexing component. Firstly, the first laser assembly comprises at least 2 first lasers, the first lasers can emit optical waves in an O wave band, and the wavelengths of the optical waves emitted by the first lasers are different; the second laser assembly comprises at least 2 second lasers, the second lasers can emit light waves in a C wave band, and the wavelengths of the light waves emitted by the second lasers are different; the O-band light waves and the C-band light waves are respectively coupled to the first optical multiplexing component and the second optical multiplexing component through the lens, then the O-band light waves with different wavelengths are combined into first laser beams by the first optical multiplexing component, the C-band light waves with different wavelengths are combined into second laser beams by the second optical multiplexing component, the first laser beams and the second laser beams are received and combined by the third optical multiplexing component into third laser beams, the third laser beams are emitted through the emitting end, and the third laser beams comprise the O-band light waves with different wavelengths and the C-band light waves with different wavelengths.

With continuing reference to fig. 7, as shown in fig. 7, the present application provides an optical module, which includes a circuit board and a rosa disposed on the circuit board. The optical sub-module comprises a first optical demultiplexing module, a second optical demultiplexing module, a third optical demultiplexing module, a first photoelectric conversion module and a second photoelectric conversion module. Firstly, the first optical demultiplexing component is used for photolysis of received signals into a first optical demultiplexing signal group and a second optical demultiplexing signal group, the first optical demultiplexing signal group and the second optical demultiplexing signal group are respectively transmitted into a second optical demultiplexing component and a third optical demultiplexing component, the first optical demultiplexing signal group is decomposed into optical waves with different wavelengths of at least 2 paths of O wave bands through the second optical demultiplexing component, the second optical demultiplexing component is decomposed into optical waves with different wavelengths of at least 2 paths of C wave bands through the third optical demultiplexing component, then the optical waves with different wavelengths of at least 2 paths of O wave bands are converted into current signals through the first photoelectric conversion component, and the optical waves with different wavelengths of at least 2 paths of C wave bands are converted into current signals through the second photoelectric conversion component.

The optical module comprises a circuit board, and a light emission submodule and a light receiving submodule which are connected with the circuit board, wherein the light emission submodule comprises a first laser component and a second laser component, the first laser component and the second laser component respectively emit laser towards the first light multiplexing component and the second light multiplexing component, and the first light multiplexing component and the second light multiplexing component respectively combine the received laser into a first laser beam and a second laser beam; the first laser beam and the second laser beam are transmitted to a third optical multiplexing component, and the first laser beam and the second laser beam are combined into a laser beam through the third optical multiplexing component and transmitted to an external optical fiber, so that the electric signal is converted into an optical signal; the optical receiving submodule comprises a first optical demultiplexing assembly, the first optical demultiplexing assembly decomposes an optical signal from an external optical fiber into a first optical signal and a second optical signal, the second optical demultiplexing assembly and the second optical demultiplexing assembly decompose the first optical signal and the second optical signal respectively, and the optical signal obtained after decomposition is converted into an electrical signal through a photoelectric conversion assembly.

Based on the above, by adjusting the number of the laser components in the tosa and the number of the photodetection components in the rosa, an 8-channel FR8 optical module can be obtained, thereby satisfying the transmission requirement of 8 × 100 Gbps.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (10)

1. A light module, comprising:

a circuit board;

the light emission secondary module is connected with the circuit board and used for emitting signal light;

the transmitter optical subassembly includes:

a first laser component for emitting laser towards the first optical multiplexing component;

a second laser module for emitting laser light toward the second optical multiplexing module;

the first optical multiplexing component is used for receiving laser light from the first laser component and combining the received laser light into a first laser beam,

the second optical multiplexing component is used for receiving the laser light from the second laser component and combining the received laser light into a second laser beam;

a third optical multiplexing component for receiving and combining the first laser beam and the second laser beam.

2. The light module of claim 1, comprising:

the first laser assembly, the second laser assembly, the first optical multiplexing assembly, the second optical multiplexing assembly and the third optical multiplexing assembly are arranged in the shell of the transmitter optical subassembly module, wherein:

the first laser assembly comprises a first laser and a second laser and is used for emitting optical waves in an O wave band;

the second laser assembly comprises a third laser and a fourth laser and is used for emitting light waves in a C wave band;

the first laser emits first laser, the second laser emits second laser, the third laser emits third laser, the fourth laser emits fourth laser, and the wavelengths of the first laser, the second laser, the third laser and the fourth laser are different;

the first optical multiplexing component is used for receiving the first laser and the second laser and combining the first laser and the second laser into a first laser beam;

the second optical multiplexing component is used for receiving the third laser and the fourth laser and combining the third laser and the fourth laser into a second laser beam;

and one end of the third optical multiplexing component is connected with the first optical multiplexing component and the second optical multiplexing component, and the other end of the third optical multiplexing component is connected with the transmitting end of the transmitter optical subassembly and is used for receiving the first laser beam and the second laser beam, combining the first laser beam and the second laser beam into a third laser beam and transmitting the third laser beam through the transmitting end.

3. The optical module of claim 1, wherein the first laser assembly and the second laser assembly are mounted on the circuit board in parallel, and the light wave emission directions of the first laser assembly and the second laser assembly are parallel.

4. The optical module of claim 1, wherein the emitting directions of the first laser beam and the second laser beam are both directed toward a combiner receiving end of the third optical multiplexing component.

5. The light module of claim 2,

a collimating lens and a focusing lens are respectively arranged on a transmission light path between the third laser beam and the emitting end;

the collimating lens is used for converging the third laser beam into a parallel beam;

the focusing lens is used for converging the parallel light beams into light spots which are coupled into an external optical fiber.

6. The optical module of claim 1, wherein the first optical multiplexing component, the second optical multiplexing component and the third optical multiplexing component are respectively a first optical filter, a second optical filter and a third optical filter.

7. A light module, comprising:

a circuit board;

the light receiving secondary module is connected with the circuit board;

the optical receive sub-module includes:

a first optical demultiplexing module for receiving signal light from an external optical fiber and demultiplexing the received signal light into a first optical division signal and a second optical division signal;

a second optical demultiplexing component for receiving and demultiplexing the first optical demultiplexed signal;

a third optical demultiplexing component for receiving and demultiplexing the second optical demultiplexed signal;

a first photoelectric conversion element for converting the optical signal from the second optical demultiplexing element into an electrical signal;

a second photoelectric conversion module for converting the optical signal from the third optical demultiplexing module into an electrical signal.

8. The light module of claim 7, comprising:

first optical demultiplexing subassembly, second optical demultiplexing subassembly, third optical demultiplexing subassembly, first photoelectric conversion subassembly and second photoelectric conversion subassembly all set up in the casing of light receiving submodule, wherein:

the first optical demultiplexing module is configured to receive signal light from an external optical fiber and demultiplex the received signal light into a first optical signal and a second optical signal; the second optical demultiplexing component is used for decomposing the first optical demultiplexing signal into a first optical wave and a second optical wave, and the wavelengths of the second optical wave and the second optical wave are different;

the third optical demultiplexing module is configured to demultiplex the second optical demultiplexing signal into a third optical wave and a fourth optical wave, where the wavelengths of the third optical wave and the fourth optical wave are different; the first photoelectric conversion assembly comprises a first photoelectric detector and a second photoelectric detector, the first photoelectric detector is used for converting the first light wave into a first electric signal, and the second photoelectric detector is used for converting the second light wave into a second electric signal;

the second photoelectric conversion assembly comprises a third photoelectric detector and a fourth photoelectric detector, the third photoelectric detector is used for converting the third light wave into a third electric signal, and the fourth photoelectric detector is used for converting the fourth light wave into a fourth electric signal.

9. The optical module of claim 8, wherein the first photoelectric conversion assembly further comprises:

the first gasket is arranged on the circuit board, and a circuit is arranged on the front surface of the first gasket;

the front surface of the first photoelectric detector is in contact with the front surface of the first gasket;

the front of first photoelectric detector is provided with photosensitive surface and electrode, openly connects the front of first gasket just the electrode is connected the one end of circuit, the back is kept away from first gasket just be formed with be used for to photosensitive surface assembles the lens of signal light for convert received light signal into current signal.

10. The optical module of claim 8, wherein the second photoelectric conversion assembly further comprises:

the second gasket is arranged on the circuit board, and a circuit is arranged on the front surface of the second gasket;

the front surface of the second photoelectric detector is in contact with the front surface of the second gasket;

the front of second photoelectric detector is provided with photosensitive surface and electrode, openly connects the front of second gasket just the electrode is connected the one end of circuit, the back is kept away from the second gasket just be formed with be used for to photosensitive surface assembles the lens of signal light for convert received light signal into current signal.

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