CN213184218U - Silicon chip climbing mechanism - Google Patents
Silicon chip climbing mechanism Download PDFInfo
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- CN213184218U CN213184218U CN202021861931.8U CN202021861931U CN213184218U CN 213184218 U CN213184218 U CN 213184218U CN 202021861931 U CN202021861931 U CN 202021861931U CN 213184218 U CN213184218 U CN 213184218U
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Abstract
The utility model discloses a silicon wafer jacking mechanism, which comprises a bearing component, a top tooth mounting block and a plurality of top tooth components, wherein the top tooth mounting block is arranged at the upper side of the bearing component, the top tooth components are arranged in parallel, the top tooth components comprise top teeth and comb teeth which are arranged in parallel, a plurality of slots are fixedly arranged on the top tooth mounting block, at least one group of top teeth and one group of comb teeth are arranged in the slots, a gap for placing a silicon wafer is arranged between the top teeth and the comb teeth, notches for placing the silicon wafer are fixedly arranged at the tops of the top teeth and the comb teeth, the utility model adopts screws to lock the top tooth components, not only the positions of the top teeth and the comb teeth can be accurately positioned, but also the positions between the adjacent top teeth and the comb teeth are not affected, when one of the top teeth is damaged, the screws are unscrewed, and then a locking device is opened, and the top teeth or the comb teeth are, the efficiency and the quality of change have been improved.
Description
Technical Field
The utility model belongs to the photovoltaic field relates to a silicon chip climbing mechanism.
Background
Semiconductor or photovoltaic materials are widely applied to industries such as electronics, new energy and the like, the semiconductor and photovoltaic materials can be applied to products generally through processing treatment, a CVD technology, a diffusion technology or an oxidation technology is one of the processing modes, wherein the CVD technology is chemical vapor deposition, the CVD technology is widely applied to semiconductor or photovoltaic material processing at present, common processing equipment includes PECVD, LPCVD, APCVD and the like, and besides the CVD technology, the diffusion technology includes phosphorus diffusion, boron diffusion and the like. At present, there are many related apparatuses in the industry, and the apparatuses can be selected to process semiconductor or photovoltaic materials according to specific processing requirements, and the processing of semiconductor or photovoltaic materials is usually realized by feeding sheet materials into a furnace to react under certain temperature and pressure conditions, and in the process of processing semiconductor or photovoltaic materials, some devices are usually adopted to load silicon wafers, and such loaded or moved devices are usually called as boats, boats or flower baskets in the industry.
At present, a sucker mechanism is usually adopted to suck silicon wafers out of a flower basket for slicing, and the silicon wafers are impacted at the moment of air suction and inflation of the sucker mechanism, so that the silicon wafers are easily damaged, and the equipment effectively solves the problem.
Disclosure of Invention
The utility model discloses an overcome prior art not enough, provide a silicon chip climbing mechanism.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a silicon chip climbing mechanism which characterized in that: including bearing subassembly, top tooth installation piece and a plurality of top tooth subassembly, top tooth installation piece is installed in the bearing subassembly upside, top tooth subassembly parallel arrangement, top tooth subassembly includes parallel arrangement's top tooth and broach, a plurality of slots have set firmly on the top tooth installation piece, install a set of top tooth and a set of broach at least in the slot, be provided with the clearance that is used for placing the silicon chip between top tooth and the broach, top tooth and broach top set firmly the breach that is used for placing the silicon chip.
Further, the method comprises the following steps of; the supporting component is used as a supporting component for supporting the top tooth mounting block and the top tooth component and comprises a top tooth mounting plate, symmetrical positioning cavities are fixedly arranged on the top tooth mounting plate, supporting blocks are fixedly connected to the positioning cavities, the positioning cavities are used for positioning the supporting blocks and the top tooth mounting plate, and lightening holes are fixedly formed in the supporting blocks to lighten the weight of the supporting blocks.
Further, the method comprises the following steps of; the top tooth mounting block is fixedly arranged on the upper end face of the supporting block, a plurality of slots are fixedly arranged on the top tooth mounting block, and adjacent slots are mutually communicated.
Further, the method comprises the following steps of; the comb tooth is characterized in that the top tooth and the comb teeth are of a square structure, the top tooth and the comb teeth are made of ceramic materials, a spacer located in the slot is fixedly arranged between the top tooth and the comb teeth, the side face of the spacer is abutted to the top tooth and the comb teeth respectively to limit the movement of the top tooth and the comb teeth in the x direction, the gap is formed by the top tooth, the comb teeth and the spacer, and the width of the gap is matched with the width of the spacer.
Further, the method comprises the following steps of; still include locking device, locking device is including setting firmly in the locking hole of a tooth installation piece side and longitudinal symmetry, set firmly the lockhole subassembly with slot position one-to-one on the locking hole, the lockhole subassembly include bilateral symmetry and with the lock chamber of slot intercommunication, the lock chamber sets up to the screw hole, and the screw will push up tooth and broach and slot inner wall counterbalance respectively in stretching into the slot through the lock chamber, will push up tooth and broach locking, restriction push up the removal of tooth and broach in the y direction, is convenient for push up the change of tooth or broach simultaneously.
Further, the method comprises the following steps of; the breach is located top tooth and broach upside and sets up to the structure that runs through up and around the opening, the breach downside has set firmly the cushion, the cushion material adopts the PEEK material for the buffering silicon chip falls into in the breach with the cushion collision production impact force in the twinkling of an eye.
Further, the method comprises the following steps of; the side sets firmly the clamping piece on the breach, the side of clamping piece one side and the vertical side of breach become the obtuse angle, the leading-in and the derivation of the silicon chip of being convenient for, clamping piece another side is provided with the chamfer, and the clamping piece of being convenient for stretches into in the clearance of silicon chip.
Further, the method comprises the following steps of; the utility model discloses a comb, including a top tooth, a broach, first roof and slot, the top tooth is the square structure, the broach is the notch cuttype structure, the broach includes first roof and first step, first roof is the same with a tooth structure, first step sets firmly with first roof, just terminal surface parallel and level under terminal surface and the first roof under the first step, first step height highly matches with the slot, when top tooth and broach are installed in the slot, first step side offsets with a tooth side, top tooth, first step and first top plate thickness sum match with the slot, restrict the removal of top tooth and broach, top tooth, first roof and first step side form the clearance.
Further, the method comprises the following steps of; the utility model discloses a comb tooth, including first roof and first step, the broach is including first roof and first step, the top tooth includes second roof and second step, terminal surface parallel and level under terminal surface and the first roof under the first step, terminal surface parallel and level under terminal surface and the second roof under the second step, first step, second step height and slot height match, when top tooth and broach are installed in the slot, first step side offsets with second step side, the top tooth sets up with the broach symmetry, top tooth and broach thickness sum match with the slot, restrict the removal of top tooth and broach, second roof, first roof, second step and first step side form the clearance.
Further, the method comprises the following steps of; the vertical central planes of the gaps and the gaps are arranged vertically to the top tooth assemblies, and when the silicon wafer falls into the gaps and the gaps corresponding to the front and the back, the silicon wafer is arranged vertically to the top tooth assemblies.
To sum up, the utility model discloses an useful part lies in:
1) the utility model discloses a location chamber fixes a position the installation of supporting shoe and apical tooth mounting panel, has improved the installation effectiveness of supporting shoe, and adjacent slot intercommunication is convenient for process simultaneously, improves the machining efficiency of apical tooth mounting block.
2) The utility model discloses a spacer is fixed tooth and broach in the x direction to pushing up to fix tooth and broach in the y direction through locking device, guaranteed the stability of pushing up the tooth unit mount.
3) The utility model discloses a screw locks the top tooth subassembly, not only can the position of accurate location top tooth and broach, and is not influenced between adjacent top tooth and the broach position, when one of them top tooth damages, with the screw pine soon, and then open locking device, will push up tooth or broach and take out from the slot and change, improved the efficiency and the quality of changing.
4) The utility model discloses a clamping piece structure has improved the leading-in efficiency with the derivation of silicon chip, has the chamfer to be convenient for the clamping piece to stretch into the clearance of silicon chip on the clamping piece simultaneously to improve the burst efficiency of silicon chip.
Drawings
Fig. 1 is a schematic view of the device of the present invention.
Fig. 2 is the installation schematic diagram of the middle top tooth installation block and the top tooth assembly of the utility model.
Fig. 3 is a schematic view of the middle top tooth mounting block of the present invention.
Fig. 4 is a schematic view of the middle top tooth assembly of the present invention.
Fig. 5 is a schematic view of the middle top tooth of the present invention.
Fig. 6 is an enlarged schematic view of a in fig. 5.
FIG. 7 is a schematic view of a top tooth assembly according to a second embodiment.
FIG. 8 is a schematic diagram of comb teeth in the second embodiment.
FIG. 9 is a schematic view of a third embodiment of a top tooth assembly.
The labels in the figure are: the comb comprises top teeth 100, slots 101, top tooth mounting blocks 102, supporting blocks 103, positioning cavities 104, top tooth mounting plates 105, lightening holes 106, gaps 110, cushion blocks 111, clamping pieces 112, notches 113, spacers 115, locking cavities 150, locking holes 151, comb teeth 200, a first step 201, a first top plate 202, a second top plate 203 and a second step 204.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic concept of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
All directional indicators (such as upper, lower, left, right, front, rear, horizontal, vertical … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture, if the specific posture changes, the directional indicator changes accordingly.
The first embodiment is as follows:
as shown in fig. 1-9, a silicon wafer jacking mechanism comprises a bearing component, a top tooth mounting block 102 and a plurality of top tooth components, the top tooth mounting block 102 is mounted on the upper side of the bearing component, the top tooth components are arranged in parallel, the top tooth components comprise top teeth 100 and comb teeth 200 which are arranged in parallel, a plurality of slots 101 are fixedly arranged on the top tooth mounting block 102, at least one group of top teeth 100 and one group of comb teeth 200 are mounted in the slots 101, gaps 110 for placing silicon wafers are arranged between the top teeth 100 and the comb teeth 200, and notches 113 for placing the silicon wafers are fixedly arranged at the tops of the top teeth 100 and the comb teeth 200.
As shown in fig. 1, the supporting component, which is used as a supporting component for supporting the top tooth mounting block 102 and the top tooth component, includes a top tooth mounting plate 105, symmetrical positioning cavities 104 are fixedly arranged on the top tooth mounting plate 105, a supporting block 103 is fixedly connected to the positioning cavities 104, the positioning cavities 104 are used for positioning the supporting block 103 and the top tooth mounting plate 105, so as to facilitate the mounting of the supporting block 103 and improve the mounting efficiency, and lightening holes 106 are fixedly arranged on the supporting block 103 to lighten the weight of the supporting block 103.
As shown in fig. 2-3, the top tooth mounting block 102 is fixedly disposed on the upper end surface of the supporting block 103, and the top tooth mounting block 102 is fixedly disposed with a plurality of slots 101 with upward openings, in this embodiment, the adjacent slots 101 are communicated with each other, which is convenient for processing and improves the processing efficiency of the top tooth mounting block 102.
In this embodiment, the top teeth 100 and the comb teeth 200 have the same structure and are both set to be square structures, the top teeth 100 and the comb teeth 200 are made of ceramic materials, silicon wafers are not prone to being scratched, and the machining precision is high, the top teeth 100 and the comb teeth 200 are installed in the slot 101, a spacer 115 located in the slot 101 is fixedly arranged between the top teeth 100 and the comb teeth 200, the left side and the right side of the spacer 115 abut against the top teeth 100 and the comb teeth 200 respectively, the top teeth 100 and the comb teeth 200 are prevented from being loosened in the x direction (the direction of the arrow x shown in the drawing), the silicon wafer slicing is affected, the slicing efficiency of the silicon wafers is further improved, the gap 110 is formed by the top teeth 100, the comb teeth 200 and the spacer 115, and the width of.
In order to improve the stability of the installation of the top teeth 100, the comb teeth 200 and the top tooth installation block 102, a locking device is further provided, the locking device comprises locking holes 151 which are fixedly arranged on the side surface of the top tooth installation block 102 and are symmetrical up and down, locking hole assemblies which are in one-to-one correspondence with the positions of the slots 101 are fixedly arranged on the locking holes 151, the locking hole assemblies comprise lock cavities 150 which are symmetrical left and right and are communicated with the slots 101, in the embodiment, the lock cavities 150 are arranged to be threaded holes, and screws (not shown) extend into the slots 101 through the lock cavities 150 to respectively abut the top teeth 100 and the comb teeth 200 against the inner walls of the slots 101, so that the top teeth 100 and the comb teeth 200 are locked, the top teeth 100 and the comb teeth 200 are prevented from being loosened in the y direction (shown by the arrow direction y) to influence the slicing of a silicon wafer, the slicing efficiency of the silicon wafer is improved, the top teeth are locked and fixed through the structure, and the positions of the adjacent top teeth 100 and the comb teeth 200 are not influenced, when one of the top teeth is damaged, the screw is unscrewed, the locking device is further opened, the top teeth 100 or the comb teeth 200 are pulled out from the slots 101 for replacement, and the replacement efficiency and quality are improved.
As shown in fig. 4-6, the top teeth 100 and the upper sides of the comb teeth 200 are fixedly provided with notches 113 with upward openings and penetrating front and back, cushion blocks 111 are fixedly arranged on the lower sides of the notches 113, the cushion blocks 111 can be made of PEEK materials and used for buffering instant impact force generated by collision of silicon wafers falling into the notches 113 and the cushion blocks 111, so that the silicon wafers are prevented from being damaged under the action of the impact force, the reliability of the equipment is improved, two groups of clamping pieces 112 are fixedly arranged on the upper sides of the notches 113, and an angle formed by one side surface of one side of the clamping pieces 112 and the vertical side surface of the notches 113 is an obtuse angle, so that the silicon wafers can be conveniently guided in and guided out, the efficiency of the equipment is improved, and the other side surface of the clamping piece 112 is provided with a.
According to the visual angle shown in fig. 1, the vertical central planes of the two sets of gaps 113 and the gaps 110, which correspond to each other in the front and back, on the two sets of top tooth mounting blocks 102 are perpendicular to the top tooth assemblies, that is, when the silicon wafer falls into the gaps 113 and the gaps 110, which correspond to each other in the front and back, the silicon wafer is placed perpendicular to the top tooth assemblies.
In the implementation process, the clamping piece 112 is inserted into a gap between two silicon wafers in the basket, at this time, the silicon wafers fall into the gap 113, and the silicon wafers adjacent to the left and right of the silicon wafers in the gap 113 fall into the gap 110 between the gap 110 and the comb teeth 200, so that the purpose of slicing the silicon wafers in the basket is achieved.
Example two:
as shown in fig. 7-8, the present embodiment is different from the first embodiment in that the top teeth 100 and the comb teeth 200 have the same structure, both are square, and the gap 110 is formed by the spacers 115, the top teeth 100 and the comb teeth 200, while the top teeth 100 and the comb teeth 200 have different structures, the top teeth 100 have a square structure, the comb teeth 200 have a step-type structure, and the gap 110 is formed by the top teeth 100 and the comb teeth 200.
The comb teeth 200 comprise a first top plate 202 and a first step 201, the first top plate 202 is the same as the top teeth 100 in structure, the first step 201 is fixedly arranged on the side face of the first top plate 202, the lower end face of the first step 201 is flush with the lower end face of the first top plate 202, the height of the first step 201 is matched with the height of the slot 101, when the top teeth 100 and the comb teeth 200 are arranged in the slot 101, the side face of the first step 201 is abutted against the side face of the top teeth 100, the thickness sum of the top teeth 100, the first step 201 and the first top plate 202 is matched with the slot 101, the top teeth 100 and the comb teeth 200 are prevented from loosening, silicon wafer slicing is influenced, slicing efficiency of the silicon wafer is further improved, and gaps 110 are formed among the top teeth 100, the first top plate 202 and the side face of the first step 201.
Example three:
as shown in FIG. 9, the present embodiment is different from the first embodiment in that the top teeth 100 and the comb teeth 200 are arranged in a square structure, and the gaps 110 are formed by the spacers 115, the top teeth 100 and the comb teeth 200, while the top teeth 100 and the comb teeth 200 are arranged in a ladder structure, and the gaps 110 are formed by the top teeth 100 and the comb teeth 200.
The comb teeth 200 comprise a first top plate 202 and a first step 201, the top teeth 100 comprise a second top plate 203 and a second step 204, the lower end face of the first top plate 202 is flush with the lower end face of the first step 201, the lower end face of the second step 204 is flush with the lower end face of the second top plate 203, the heights of the first step 201 and the second step 204 are matched with the height of the slot 101, when the top teeth 100 and the comb teeth 200 are installed in the slot 101, the side face of the first step 201 is abutted against the side face of the second step 204, namely, the top teeth 100 are symmetrically arranged with the comb teeth 200, the thickness sum of the top teeth 100 and the comb teeth 200 is matched with the slot 101, the top teeth 100 and the comb teeth 200 are prevented from being loosened, silicon wafer slicing is influenced, the slicing efficiency of the silicon wafer is further improved, and gaps 110 are formed on the side faces of the second top plate 203, the first top plate 202, the second step.
It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Claims (10)
1. The utility model provides a silicon chip climbing mechanism which characterized in that: including bearing subassembly, top tooth installation piece and a plurality of top tooth subassembly, top tooth installation piece is installed in the bearing subassembly upside, top tooth subassembly parallel arrangement, top tooth subassembly includes parallel arrangement's top tooth and broach, a plurality of slots have set firmly on the top tooth installation piece, install a set of top tooth and a set of broach at least in the slot, be provided with the clearance that is used for placing the silicon chip between top tooth and the broach, top tooth and broach top set firmly the breach that is used for placing the silicon chip.
2. The silicon wafer jacking mechanism of claim 1, wherein: the supporting component is used as a supporting component for supporting the top tooth mounting block and the top tooth component and comprises a top tooth mounting plate, symmetrical positioning cavities are fixedly arranged on the top tooth mounting plate, supporting blocks are fixedly connected to the positioning cavities, the positioning cavities are used for positioning the supporting blocks and the top tooth mounting plate, and lightening holes are fixedly formed in the supporting blocks to lighten the weight of the supporting blocks.
3. The silicon wafer jacking mechanism of claim 1, wherein: the top tooth mounting block is fixedly arranged on the upper end face of the supporting block, a plurality of slots are fixedly arranged on the top tooth mounting block, and adjacent slots are mutually communicated.
4. The silicon wafer jacking mechanism of claim 1, wherein: the comb tooth is characterized in that the top tooth and the comb teeth are of a square structure, the top tooth and the comb teeth are made of ceramic materials, a spacer located in the slot is fixedly arranged between the top tooth and the comb teeth, the side face of the spacer is abutted to the top tooth and the comb teeth respectively to limit the movement of the top tooth and the comb teeth in the x direction, the gap is formed by the top tooth, the comb teeth and the spacer, and the width of the gap is matched with the width of the spacer.
5. The silicon wafer jacking mechanism of claim 1, wherein: still include locking device, locking device is including setting firmly in the locking hole of a tooth installation piece side and longitudinal symmetry, set firmly the lockhole subassembly with slot position one-to-one on the locking hole, the lockhole subassembly include bilateral symmetry and with the lock chamber of slot intercommunication, the lock chamber sets up to the screw hole, and the screw will push up tooth and broach and slot inner wall counterbalance respectively in stretching into the slot through the lock chamber, will push up tooth and broach locking, restriction push up the removal of tooth and broach in the y direction, is convenient for push up the change of tooth or broach simultaneously.
6. The silicon wafer jacking mechanism of claim 1, wherein: the breach is located top tooth and broach upside and sets up to the structure that runs through up and around the opening, the breach downside has set firmly the cushion, the cushion material adopts the PEEK material for the buffering silicon chip falls into in the breach with the cushion collision production impact force in the twinkling of an eye.
7. The silicon wafer jacking mechanism of claim 1, wherein: the side sets firmly the clamping piece on the breach, the side of clamping piece one side and the vertical side of breach become the obtuse angle, the leading-in and the derivation of the silicon chip of being convenient for, clamping piece another side is provided with the chamfer, and the clamping piece of being convenient for stretches into in the clearance of silicon chip.
8. The silicon wafer jacking mechanism of claim 1, wherein: the utility model discloses a comb, including a top tooth, a broach, first roof and slot, the top tooth is the square structure, the broach is the notch cuttype structure, the broach includes first roof and first step, first roof is the same with a tooth structure, first step sets firmly with first roof, just terminal surface parallel and level under terminal surface and the first roof under the first step, first step height highly matches with the slot, when top tooth and broach are installed in the slot, first step side offsets with a tooth side, top tooth, first step and first top plate thickness sum match with the slot, restrict the removal of top tooth and broach, top tooth, first roof and first step side form the clearance.
9. The silicon wafer jacking mechanism of claim 1, wherein: the utility model discloses a comb tooth, including first roof and first step, the broach is including first roof and first step, the top tooth includes second roof and second step, terminal surface parallel and level under terminal surface and the first roof under the first step, terminal surface parallel and level under terminal surface and the second roof under the second step, first step, second step height and slot height match, when top tooth and broach are installed in the slot, first step side offsets with second step side, the top tooth sets up with the broach symmetry, top tooth and broach thickness sum match with the slot, restrict the removal of top tooth and broach, second roof, first roof, second step and first step side form the clearance.
10. The silicon wafer jacking mechanism of claim 1, wherein: the vertical central planes of the gaps and the gaps are arranged vertically to the top tooth assemblies, and when the silicon wafer falls into the gaps and the gaps corresponding to the front and the back, the silicon wafer is arranged vertically to the top tooth assemblies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021861931.8U CN213184218U (en) | 2020-08-31 | 2020-08-31 | Silicon chip climbing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021861931.8U CN213184218U (en) | 2020-08-31 | 2020-08-31 | Silicon chip climbing mechanism |
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| Publication Number | Publication Date |
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| CN213184218U true CN213184218U (en) | 2021-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021861931.8U Active CN213184218U (en) | 2020-08-31 | 2020-08-31 | Silicon chip climbing mechanism |
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| CN (1) | CN213184218U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113291814A (en) * | 2021-05-28 | 2021-08-24 | 艾华(无锡)半导体科技有限公司 | Suction disc group for sucking multiple wafers |
-
2020
- 2020-08-31 CN CN202021861931.8U patent/CN213184218U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113291814A (en) * | 2021-05-28 | 2021-08-24 | 艾华(无锡)半导体科技有限公司 | Suction disc group for sucking multiple wafers |
| CN113291814B (en) * | 2021-05-28 | 2022-09-16 | 艾华(无锡)半导体科技有限公司 | Suction disc group for sucking multiple wafers |
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Effective date of registration: 20220819 Address after: 3, Dongqinghe Road, Xibei, Xishan District, Wuxi City, Jiangsu Province, 214192 Patentee after: Laplace (Wuxi) semiconductor technology Co.,Ltd. Address before: No. 209, Zhangjing East Section, Xigang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Xiaoqiang Semiconductor Technology Co.,Ltd. |
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