CN210640181U

CN210640181U - Silicon wafer cleaning device

Info

Publication number: CN210640181U
Application number: CN201921503715.3U
Authority: CN
Inventors: 张学强; 戴军; 张建伟; 罗银兵; 张巍
Original assignee: RoboTechnik Intelligent Technology Co Ltd
Current assignee: RoboTechnik Intelligent Technology Co Ltd
Priority date: 2019-09-10
Filing date: 2019-09-10
Publication date: 2020-05-29
Anticipated expiration: 2029-09-10

Abstract

The utility model discloses a silicon wafer cleaning device, which comprises a comb tooth component for placing a silicon wafer, a jacking component for lifting the silicon wafer and cleaning components for cleaning the silicon wafer from two sides; the comb tooth assembly is connected with the jacking assembly, the cleaning assembly comprises air knives which are arranged on two sides of the comb tooth assembly in parallel; the parallel spaced of broach subassembly is provided with two sets ofly, and the broach subassembly includes the broach piece that a plurality of equidistance set up and the base of fixed broach piece, is formed with the groove of stepping down between the broach piece upper portion, and the jacking groove that extends along vertical direction is seted up at broach piece top. Can be at the in-process that shifts the silicon chip to the quartz boat from a station, clean the silicon chip automatically, improve work efficiency, the piece that drops when simultaneously can avoiding cleaning is stained with once more and attaches on the silicon chip.

Description

Silicon wafer cleaning device

Technical Field

The utility model relates to a silicon chip processing technology field, concretely relates to silicon chip cleaning device.

Background

The silicon chip is a carrier of the solar cell, the quality of the silicon chip directly determines the conversion efficiency of the solar cell, the solar cell needs a large-area PN junction to realize the conversion from light energy to electric energy, and the diffusion furnace is special equipment for manufacturing the PN junction of the solar cell. The tubular diffusion furnace mainly comprises an upper loading part and a lower loading part of a quartz boat, an exhaust gas chamber, a furnace body part, a gas holder part and the like. The diffusion is generally carried out by using a liquid source of phosphorus oxychloride as a diffusion source. The P-type silicon chip is placed in a quartz container of a tubular diffusion furnace, phosphorus oxychloride is brought into the quartz container by using nitrogen at the high temperature of 850-900 ℃, and phosphorus atoms are obtained by the reaction of the phosphorus oxychloride and the silicon chip. After a certain period of time, phosphorus atoms enter the surface layer of the silicon wafer from the periphery, and permeate and diffuse to the interior of the silicon wafer through gaps among the silicon atoms to form an interface of the N-type semiconductor and the P-type semiconductor, namely a PN junction. In the processing process of the silicon wafer, the silicon wafer is transferred to the quartz boat from the previous station, and before the silicon wafer is processed, fragments and the like on the surface of the silicon wafer need to be cleaned, manual operation is needed, the processing time is long, and the integral production yield is influenced.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a cleaning device of clearance silicon chip can shift the in-process of quartz boat with the silicon chip from a station, cleans the silicon chip automatically, improves work efficiency, and the piece that drops when can avoiding cleaning simultaneously is stained with once more and attaches on the silicon chip.

In order to solve the technical problem, the utility model provides a silicon wafer cleaning device, which comprises a comb tooth assembly for placing a silicon wafer, a jacking assembly for lifting the silicon wafer and a cleaning assembly for cleaning the silicon wafer from two sides; the comb tooth assembly is connected to the jacking assembly, the cleaning assembly comprises air knives, and the air knives are arranged on two sides of the comb tooth assembly in parallel; the parallel spaced of broach subassembly is provided with two sets ofly, the broach subassembly includes the broach piece that a plurality of equidistance set up and fixes the base of broach piece, be formed with the groove of stepping down between broach piece upper portion, the jacking groove of extending along vertical direction is seted up at broach piece top.

Further, the air knives are arranged in a staggered mode in the height direction.

Furthermore, the broach piece is including the fixed part that is located the lower part and the extension portion of being fixed in with fixed part looks rigid coupling, the thickness of extension portion is less than the thickness of fixed part, and the dead lever passes the fixed part is in order to establish ties the broach piece, the base includes basement, side limiting plate and end limiting plate, the broach piece is placed in the basement, the dead lever both ends with fix at the basement both ends the end limiting plate is fixed, the broach piece both sides are spacing through the side limiting plate fixed with the basement side.

Further, the base is the picture peg, the equidistant a plurality of slots that are provided with of picture peg, the broach piece inserts in the slot, a picture peg side is equipped with and link up the locking screw hole of slot, and locking screw passes through locking screw hole butt broach piece.

Furthermore, the slot penetrates through the inserting plate, a bottom plate is arranged at one end of the slot, and the bottom plate is fixedly connected with the inserting plate through a fastening screw.

Furthermore, the cross section of the bottom plate is convex, and the bottom surface of the inserting plate is concave matched with the bottom plate.

Further, the bottom of jacking groove is equipped with the inclined plane of laying to the inboard slope of broach, the contained angle of laying inclined plane and horizontal plane is 30 ~ 60.

Further, the width of the jacking groove is smaller than that of the abdicating groove.

Furthermore, a guide inclined plane which enables the opening of the jacking portion to gradually expand outwards is arranged at the opening of the jacking portion of the jacking groove.

Furthermore, the included angle between the guide inclined plane and the vertical direction is 5-15 degrees.

The utility model discloses a beneficial effect that top tooth cleaning device compares with prior art is, can shift the in-process of quartz boat from a station with the silicon chip, clean the silicon chip automatically, improve work efficiency, the piece that drops when can avoiding cleaning simultaneously is stained with once more and attaches on the silicon chip.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a side view of the present invention;

FIG. 3 is a schematic structural view of an embodiment of the comb assembly of the present invention;

FIG. 4 is a schematic structural view of a second embodiment of the comb teeth assembly of the present invention;

fig. 5 is an enlarged side view of the structure of region a in fig. 4.

Detailed Description

The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

Referring to fig. 1, 2 and 3, which are schematic structural views of an embodiment of a silicon wafer cleaning apparatus of the present invention, the silicon wafer cleaning apparatus includes a comb assembly 10 for placing a silicon wafer 40, a jacking assembly 20 for lifting the silicon wafer 40, and a cleaning assembly 30 for cleaning the silicon wafer 40 from two sides; during operation, the comb tooth assembly 10 connect in the jacking assembly 20, the jacking assembly 20 drives the silicon chip 40 of placing on the comb tooth assembly 10 and goes up and down to shift, clean the subassembly 30 and include air knife 31, air knife 31 parallel arrangement in comb tooth assembly 10 both sides, at the lift transfer in-process, air knife 31 is fixed at silicon chip 40 both sides position, along with reciprocating of silicon chip 40, air knife 31 sweeps silicon chip 40 from both sides, realizes the holistic cleanness to silicon chip 40. Because the whole narrower of broach subassembly 10, for fixed silicon chip 40, the parallel spaced of broach subassembly 10 is provided with two sets ofly, broach subassembly 10 includes the broach piece 11 that a plurality of equidistance set up and fixes the base 12 of broach piece 11, be formed with the groove of stepping down 13 between broach piece 11 upper portion, the jacking groove 14 along vertical direction extension is seted up at broach piece 11 top, and silicon chip 40 inserts in jacking groove 14, when air knife 31 cleaned silicon chip 40 blowing, the piece that drops from silicon chip 40 upper portion was either blown down outside the scope of broach subassembly 10, or fell into the groove of stepping down 13, reduces the probability that the card was between two broach pieces 11 or fell into jacking groove 14. In this embodiment, the air knives 31 are staggered in the height direction, and a height difference exists between the two air knives 31, which is equivalent to twice cleaning of the silicon wafer 40, thereby ensuring the cleanness of the silicon wafer 40.

Referring to fig. 2, a schematic structural view of a comb assembly according to an embodiment of the present invention is shown, in this embodiment, the comb-teeth plate 11 comprises a fixing part 111 at the lower part and an extending part 112 fixed with the fixing part 111, the thickness of the extension part 112 is smaller than that of the fixing part 111, the fixing rod 113 penetrates the fixing part 111 to connect the comb teeth sheet 11 in series, the fixing rod 113 makes the fixing parts 111 of the comb teeth sheet 11 arranged next to each other, since the thickness of the extending portions 112 of the comb teeth sheet 11 is smaller than that of the fixing portion 111, a relief groove 13 extending in a vertical direction is formed between two adjacent extending portions 112, and in order to further fix the comb teeth sheet 11, the base 12 includes a base 121, a side limiting plate 122 and an end limiting plate 123, the comb teeth sheet 11 is placed on the base 121, both ends of the fixing bar 113 are fixed to the end limiting plates 123 fixed to both ends of the base 121, the two sides of the comb-teeth plate 11 are limited by the side limiting plates 122 fixed with the sides of the base 121. In this embodiment, the jacking assembly 20 is a linear motor, the comb tooth assembly 10 is connected with the linear motor through a support frame, the silicon wafer 40 is inserted into the jacking groove 14 of the comb tooth assembly 10, the linear motor drives the comb tooth assembly 10 to drive the silicon wafer 40 to ascend and be inserted into the silicon wafer 40 mounting groove on the quartz boat, during the ascending process, the top of the silicon wafer 40 is firstly blown by the air knife 31, fragments at the top drop downwards, most of the fragments drop from the gap between the two comb tooth assemblies 10 after blowing to the inside of the silicon wafer 40 due to blowing of the air knife 31, and a part of the fragments drop on the comb tooth assembly 10, if the abdicating groove 13 is not arranged, the dropped fragments fall on the comb teeth between the two jacking grooves 14, easily fall into the jacking groove 14 or adhere to the silicon wafer 40 again, and after the abdicating groove 13 is arranged, the comb tooth plates 11 at the two sides of the jacking groove 14 are thinner, and are not easy to accumulate fragments, so that the fragments drop in the abdicati, the abdicating groove 13 is not connected with the silicon chip 40, and the fragments falling into the abdicating groove 13 can not influence the silicon chip 40 any more. In a preferred embodiment, in order to prevent the fragments from falling into the jacking slot 14, the width of the jacking slot 14 is smaller than that of the abdicating slot 13. Meanwhile, in order to enable the fragments falling into the jacking groove 14 to automatically slide off, the bottom of the jacking groove 14 is provided with a placing inclined plane 114 inclined towards the inner side of the comb teeth, the included angle between the placing inclined plane 114 and the horizontal plane is 30-60 degrees, and the placing inclined plane 114 can enable the silicon wafer 40 to be inserted into the comb teeth piece 11 at a certain angle and stably clamped by the two groups of comb teeth assemblies 10 in the left-right direction.

Referring to fig. 4 and 5, in order to facilitate the detachment of a single comb piece 11, in this embodiment, the base 12 is configured as an insertion plate 124, the insertion plate 124 is provided with a plurality of slots 125 at equal intervals, the comb piece 11 is inserted into the slots 125, so that the distance of the abdicating slot 13 exists between adjacent comb pieces 11, in order to fix the comb piece 11, a side surface of the insertion plate 124 is provided with a locking threaded hole 126 penetrating the slots 125, i.e. the locking screw 127 can extend into the slots 125, after the comb piece 11 is inserted into the slots 125, one end of the locking screw 127 is screwed into the slot 125 through the locking threaded hole 126, so that the locking screw 127 abuts against the comb piece to compress the comb piece 11 in the slots 125, thereby preventing the comb piece 11 from shaking in the slots 125 or from being loosened and falling due to unfirm fixation, and ensuring the stability of the comb piece 11, the locking screws 127 are provided in two. Because every piece of broach piece 11 inserts in the picture peg 124 alone, if the condition that a certain piece or several broach pieces 11 damaged appears, only need the locking screw 127 that unscrews and this broach piece 11 corresponds to can remove this broach piece 11 and do not have the influence to other broach pieces 11, improve the replacement efficiency, reduce the influence to production. Furthermore, in order to facilitate the processing of the slot 125, the slot 125 is arranged to penetrate through the inserting plate 124, a bottom plate 128 is arranged at one end of the slot 125, the bottom plate 128 is fixedly connected with the inserting plate 124 through a fastening screw, and the comb teeth sheet 11 is supported through the bottom plate 128, so that the same depth of the comb teeth sheet 11 inserted into the inserting plate 124 can be ensured. Preferably, the cross section of the bottom plate 128 is convex, and the bottom surface of the insert plate 124 is concave matched with the bottom plate 128, so that the bottom plate 128 and the insert plate 124 can be conveniently installed in a matched mode. In this embodiment, the top opening of the jacking groove 14 is provided with a guiding inclined plane 115 for gradually expanding the top opening, so that the top opening of the jacking groove 14 is wider than the bottom of the jacking groove, and the silicon wafer 40 is conveniently inserted into the jacking groove 14. The included angle between the guiding inclined plane 115 and the vertical direction is 5-15 degrees, and in this embodiment, the included angle between the guiding inclined plane 115 and the vertical direction is 10 degrees.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims

1. A silicon wafer cleaning device is characterized by comprising a comb tooth assembly for placing a silicon wafer, a jacking assembly for lifting the silicon wafer and a cleaning assembly for cleaning the silicon wafer from two sides; the comb tooth assembly is connected to the jacking assembly, the cleaning assembly comprises air knives, and the air knives are arranged on two sides of the comb tooth assembly in parallel; the parallel spaced of broach subassembly is provided with two sets ofly, the broach subassembly includes the broach piece that a plurality of equidistance set up and fixes the base of broach piece, be formed with the groove of stepping down between broach piece upper portion, the jacking groove of extending along vertical direction is seted up at broach piece top.

2. The silicon wafer cleaning apparatus as claimed in claim 1, wherein the air knives are staggered in a height direction.

3. The silicon wafer cleaning device as claimed in claim 1, wherein the comb-teeth plate includes a fixing portion at a lower portion and an extending portion fixed to the fixing portion, the extending portion having a thickness smaller than that of the fixing portion, a fixing rod passing through the fixing portion to connect the comb-teeth plate in series, the base includes a base, side limiting plates and end limiting plates, the comb-teeth plate is placed on the base, both ends of the fixing rod are fixed to the end limiting plates fixed to both ends of the base, and both sides of the comb-teeth plate are limited by the side limiting plates fixed to the sides of the base.

4. The silicon wafer cleaning device as claimed in claim 1, wherein the base is a plate, a plurality of slots are equidistantly formed in the plate, the comb-teeth plate is inserted into the slots, a locking screw hole penetrating through the slots is formed in one side surface of the plate, and the locking screw abuts against the comb-teeth plate through the locking screw hole.

5. The silicon wafer cleaning device according to claim 4, wherein the slot penetrates through the insertion plate, a bottom plate is disposed at one end of the slot, and the bottom plate is fixedly connected with the insertion plate through a fastening screw.

6. The silicon wafer cleaning apparatus as claimed in claim 5, wherein the bottom plate has a convex cross-section, and the bottom surface of the insertion plate has a concave shape which fits the bottom plate.

7. The silicon wafer cleaning device according to claim 1, wherein the bottom of the lift-up groove is provided with a placement slope inclined toward the inner side of the comb teeth, and the angle between the placement slope and the horizontal plane is 30 ° to 60 °.

8. The silicon wafer cleaning device as claimed in claim 1, wherein the width of the jacking groove is smaller than the width of the abdicating groove.

9. The silicon wafer cleaning apparatus as claimed in claim 1, wherein a guide slope for gradually expanding the opening of the lift portion is provided at the opening of the lift portion of the lift groove.

10. The silicon wafer cleaning apparatus as claimed in claim 9, wherein an angle between the guide slope and the vertical direction is 5 ° to 15 °.