CN104465464A - Small-size cadmium sulfide single crystal wafer ultrasonic washing frame - Google Patents
Small-size cadmium sulfide single crystal wafer ultrasonic washing frame Download PDFInfo
- Publication number
- CN104465464A CN104465464A CN201410775386.3A CN201410775386A CN104465464A CN 104465464 A CN104465464 A CN 104465464A CN 201410775386 A CN201410775386 A CN 201410775386A CN 104465464 A CN104465464 A CN 104465464A
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- China
- Prior art keywords
- wafer
- wafer holder
- single crystal
- clamping
- bar
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
Abstract
The invention relates to a small-size cadmium sulfide single crystal wafer ultrasonic washing frame. The small-size cadmium sulfide single crystal wafer ultrasonic washing frame comprises an extraction rod, fixed frames and two rows of wafer clamping structures installed on the fixed frames. Each row of clamping structure is composed of three transverse rods with the same diameter, wherein two transverse rods are clamping rods, another transverse rod is a supporting rod, and the two ends of each clamping rod and the two ends of the supporting rod are horizontally embedded in circular holes in the lower portions of the fixed frames. The outer sides of the fixed frames are bonded and sealed through sealing plates. The two ends of the extraction rod are horizontally embedded in circular holes in the upper portions of the sealing plates. A plurality of wafer clamping grooves are symmetrically formed in the two rows of clamping rods inwards respectively. A plurality of corresponding wafer supporting clamping grooves are formed in the upper end faces of the supporting rods. The wafer supporting clamping grooves and the wafer clamping grooves in the two sides in each row of wafer clamping structure are located on the same arc face, and then the row of clamping structure for fixing wafers is formed. Cadmium sulfide single crystal wafers obtained after the CMP are washed through the washing frame, the wafer vibration generated in the ultrasonic washing process can be relieved, stress generated when the wafers make contact with the clamping grooves is concentrated, and the probability that the wafers crack in the washing process can be effectively lowered.
Description
Technical field
The present invention relates to for single-chip processing unit (plant), particularly relate to a kind of small size CdS single crystal sheet ultrasonic cleaning bracket.
Background technology
Cadmium sulfide (CdS) crystal is the direct transition type II 1 IV compound semiconductor of bandwidth 2.4eV.The excellent photoelectric property of monocrystalline cadmium sulfide makes it at detector, solar cell, and the aspects such as imaging and the clear smooth device of semiconductor are widely used.The quality of substrate surface will directly affect the performance of growth of device thereon, and the Surface Machining of current CdS single crystal sheet passes through grinding, chemico-mechanical polishing (CMP) usually, and cleans several step.In CMP process, usually wafer is pasted onto on ceramic disk and carries out polishing, cadmium sulfide wafer surface is made to reach nanoscale smooth, but after CMP terminates, wafer is pasted onto the paraffin on ceramic disk, residual polishing fluid and be still attached to polished silicon wafer surface with the product that wafer chemical reaction produces, need to be removed by cleaning, wafer is generally placed in the rack for cleaning of quartzy material by original cleaning, and draw-in groove is without smoothing processing, polished silicon wafer is easily clashed into mutually with quartzy rack for cleaning draw-in groove in cleaning process, chipping, therefore the cleaning after wafer polishing is improved, after removing CMP, wafer is pasted and is made used wax, and other product and be attached to other impurity of wafer surface, smooth wafer is made to keep clean, and guarantee that single-chip is complete without cracked in cleaning process, very crucial in the processing of CdS single crystal sheet.
Summary of the invention
In view of above-mentioned existing technique Problems existing, the present invention designs a kind of small size CdS single crystal sheet ultrasonic cleaning bracket.CdS single crystal sheet adopts rack for cleaning of the present invention in ultrasonic cleaning, and polished silicon wafer can be prevented chipping in cleaning process.
In order to achieve the above object, the technical scheme that the present invention takes is: a kind of small size CdS single crystal sheet ultrasonic cleaning bracket, it is characterized in that: comprise extraction bar, two fixed mounts and the identical wafer holder structure of two rows be arranged on two fixed mounts, often arrange wafer holder structure to be made up of three isometrical cylindrical crossbar, what wherein two level heights were identical is wafer holder bar, other one is wafer support bar and is positioned at immediately below in the middle part of two wafer holder bars, the wafer holder bar of two rows and the two ends of wafer support bar respectively level embed in the reserved circular hole in fixed mount bottom, two, left and right, the outside of fixed mount adopts two end face seal plate adhesive seal, extracting bar is positioned on two positions, row's wafer holder structure middle, and both ends horizontal embeds in the reserved circular hole in end face seal plate top, two, left and right, the wafer holder bar of two rows has the wafer holder draw-in groove of several ellipse arcs respectively to inner side symmetry, the upper surface of wafer support bar has several wafers corresponding and supports draw-in groove, wafer supports that the wafer holder draw-in groove of draw-in groove and both sides is on same arc surface, the i.e. clamp structure of shape fixed wafer in a row.
The present invention has following beneficial effect: adopt rack for cleaning of the present invention to clean the CdS single crystal sheet after CMP, wafer vibration when can alleviate ultrasonic cleaning, the stress produced when contacting with clamping draw-in groove is concentrated, and effectively reduces the probability that wafer is cracked in cleaning process.
Accompanying drawing explanation
Front view when Fig. 1 is rack for cleaning horizontal positioned;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the vertical view of Fig. 1;
Fig. 4 is the partial enlarged drawing of wafer holder structure in Fig. 1.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Referring to figs. 1 through Fig. 4, a kind of small size CdS single crystal sheet ultrasonic cleaning bracket comprises extraction bar 6, two fixed mounts 5 and the identical wafer holder structure of two rows be arranged on two fixed mounts 5, often arrange wafer holder structure to be made up of three isometrical cylindrical crossbar, what wherein two level heights were identical is wafer holder bar 1, other one is wafer support bar 4 and is positioned at immediately below in the middle part of two wafer holder bars 1, the wafer holder bar 1 of two rows and the two ends of wafer support bar 4 respectively level embed in the reserved circular hole in fixed mount 5 bottom, two, left and right, the outside of fixed mount 5 adopts two end face seal plate 7 adhesive seal, extracting bar 6 is positioned on two positions, row's wafer holder structure middle, and both ends horizontal embeds in the reserved circular hole in end face seal plate 7 top, two, left and right, the wafer holder bar 1 of two rows has the wafer holder draw-in groove 3 of several ellipse arcs respectively to inner side symmetry, the upper surface of wafer support bar 4 has several wafers corresponding and supports draw-in groove 2, wafer supports that the wafer holder draw-in groove 3 of draw-in groove 2 and both sides is on same arc surface, the i.e. clamp structure of shape fixed wafer in a row.
Embodiment: rack for cleaning of the present invention is used for the cleaning of 10mm × 10mm × 0.260mm CdS single crystal sheet, rack for cleaning is provided with the clamp structure of two row's fixed wafers, often arranged eight groups of draw-in grooves, can place 8 CdS single crystal sheets, two rows place 16 CdS single crystal sheets altogether and clean.Rack for cleaning entirety all adopts polytetrafluoroethylmaterial material to make, and this materials chemistry character is stablized, and does not react with soda acid and other chemical reagent.Wafer embeds fixing by the mode of fluting by the position of supporting wafers, draw-in groove is open semiellipse arcuate structure, the stress reduced when wafer vibration contacts with draw-in groove when subsequent ultrasonic cleans is concentrated, thus is effectively avoided soft crisp CdS polished silicon wafer edge to burst apart.Wafer supports the design of draw-in groove 2 and wafer holder draw-in groove 3, being inserted by wafer to make the wafer by clamping stablize, and do not drop downwards, wherein the degree of depth of draw-in groove is 1mm, wafer supports that the major axis radius of draw-in groove 2 is 10.2mm, and minor axis radius can change according to the thickness of polished silicon wafer.The design of extracting bar 6 can facilitate hand-held rack for cleaning to move.
This rack for cleaning is adopted to carry out the embodiment of cleaning as follows:
By needing the CdS monocrystalline polished silicon wafer of the 10mm × 10 mm × 0.260mm of ultrasonic cleaning to be placed on clean rack for cleaning after CMP, rack for cleaning being placed in the container that absolute ethyl alcohol is housed, and container is placed in supersonic cleaning machine.Open ultrasonic machine after regulating ultrasonic temperature and ultrasonic time, after ultrasonic cleaning terminates, rack for cleaning is taken out, encapsulation after making wafer dry on rack for cleaning.
Claims (2)
1. a small size CdS single crystal sheet ultrasonic cleaning bracket, it is characterized in that: comprise and extract bar (6), two fixed mounts (5) and the identical wafer holder structure of two rows be arranged on two fixed mounts (5), often arrange wafer holder structure to be made up of three isometrical cylindrical crossbar, what wherein two level heights were identical is wafer holder bar (1), other one is wafer support bar (4) and is positioned at immediately below two wafer holder bars (1) middle parts, the wafer holder bar (1) of two rows and the two ends of wafer support bar (4) respectively level embed in the reserved circular hole in fixed mount (5) bottom, two, left and right, the outside of fixed mount (5) adopts two end face seal plate (7) adhesive seal, extracting bar (6) is positioned on two positions, row's wafer holder structure middle, and both ends horizontal embeds in the reserved circular hole in end face seal plate (7) top, two, left and right, the wafer holder bar (1) of two rows has the wafer holder draw-in groove (3) of several ellipse arcs respectively to inner side symmetry, the upper surface of wafer support bar (4) has several wafers corresponding and supports draw-in groove (2), wafer supports that the wafer holder draw-in groove (3) of draw-in groove (2) and both sides is on same arc surface, the i.e. clamp structure of shape fixed wafer in a row.
2., according to a kind of small size CdS single crystal sheet ultrasonic cleaning bracket according to claim 1 or claim 2, it is characterized in that: described rack for cleaning entirety all adopts polytetrafluoroethylmaterial material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775386.3A CN104465464A (en) | 2014-12-16 | 2014-12-16 | Small-size cadmium sulfide single crystal wafer ultrasonic washing frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775386.3A CN104465464A (en) | 2014-12-16 | 2014-12-16 | Small-size cadmium sulfide single crystal wafer ultrasonic washing frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104465464A true CN104465464A (en) | 2015-03-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410775386.3A Pending CN104465464A (en) | 2014-12-16 | 2014-12-16 | Small-size cadmium sulfide single crystal wafer ultrasonic washing frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104465464A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106140671A (en) * | 2015-04-13 | 2016-11-23 | 中国工程物理研究院机械制造工艺研究所 | Cleaning method after KDP crystal MRF |
| CN107399018A (en) * | 2017-08-02 | 2017-11-28 | 北京石晶光电科技股份有限公司济源分公司 | A kind of comprehensive cleaning means of quartz water chip |
| CN107993968A (en) * | 2018-01-08 | 2018-05-04 | 中国电子科技集团公司第四十六研究所 | A kind of bogey for special-shaped chip |
| CN110379751A (en) * | 2019-07-25 | 2019-10-25 | 常州时创能源科技有限公司 | A kind of silicon chip flower basket equipped with carrying frame |
| CN112222953A (en) * | 2020-09-04 | 2021-01-15 | 山东国晶新材料有限公司 | Method for polishing surface of clamping rod |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08108157A (en) * | 1994-10-13 | 1996-04-30 | Sony Corp | Ultrasonic washer |
| CN1192579A (en) * | 1997-02-04 | 1998-09-09 | 佳能株式会社 | Wafer processing apparatus, wafer processing method, and SOI wafer fabrication method |
| CN1371527A (en) * | 1999-10-05 | 2002-09-25 | 西科生产及处理公司 | Clamping device for semiconductor wafer |
| KR20040003715A (en) * | 2002-07-03 | 2004-01-13 | (주)케이.씨.텍 | Apparatus for treating a wafer |
| CN201644434U (en) * | 2009-11-26 | 2010-11-24 | 北京有色金属研究总院 | Flower basket applicable to multi-size wafer cleaning |
| CN202103032U (en) * | 2011-06-17 | 2012-01-04 | 北京通美晶体技术有限公司 | Wafer washing and drying basket |
-
2014
- 2014-12-16 CN CN201410775386.3A patent/CN104465464A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08108157A (en) * | 1994-10-13 | 1996-04-30 | Sony Corp | Ultrasonic washer |
| CN1192579A (en) * | 1997-02-04 | 1998-09-09 | 佳能株式会社 | Wafer processing apparatus, wafer processing method, and SOI wafer fabrication method |
| CN1371527A (en) * | 1999-10-05 | 2002-09-25 | 西科生产及处理公司 | Clamping device for semiconductor wafer |
| KR20040003715A (en) * | 2002-07-03 | 2004-01-13 | (주)케이.씨.텍 | Apparatus for treating a wafer |
| CN201644434U (en) * | 2009-11-26 | 2010-11-24 | 北京有色金属研究总院 | Flower basket applicable to multi-size wafer cleaning |
| CN202103032U (en) * | 2011-06-17 | 2012-01-04 | 北京通美晶体技术有限公司 | Wafer washing and drying basket |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106140671A (en) * | 2015-04-13 | 2016-11-23 | 中国工程物理研究院机械制造工艺研究所 | Cleaning method after KDP crystal MRF |
| CN106140671B (en) * | 2015-04-13 | 2021-04-30 | 中国工程物理研究院机械制造工艺研究所 | Cleaning method for KDP crystal after magneto-rheological polishing |
| CN107399018A (en) * | 2017-08-02 | 2017-11-28 | 北京石晶光电科技股份有限公司济源分公司 | A kind of comprehensive cleaning means of quartz water chip |
| CN107993968A (en) * | 2018-01-08 | 2018-05-04 | 中国电子科技集团公司第四十六研究所 | A kind of bogey for special-shaped chip |
| CN110379751A (en) * | 2019-07-25 | 2019-10-25 | 常州时创能源科技有限公司 | A kind of silicon chip flower basket equipped with carrying frame |
| CN110379751B (en) * | 2019-07-25 | 2024-02-13 | 常州时创能源股份有限公司 | Silicon wafer flower basket with bearing frame |
| CN112222953A (en) * | 2020-09-04 | 2021-01-15 | 山东国晶新材料有限公司 | Method for polishing surface of clamping rod |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |