CN211605126U - Vacuum chuck and chamfering machine - Google Patents
Vacuum chuck and chamfering machine Download PDFInfo
- Publication number
- CN211605126U CN211605126U CN202020837378.8U CN202020837378U CN211605126U CN 211605126 U CN211605126 U CN 211605126U CN 202020837378 U CN202020837378 U CN 202020837378U CN 211605126 U CN211605126 U CN 211605126U
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- vacuum chuck
- adsorption holes
- upper cover
- vacuum
- porous upper
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Abstract
The utility model provides a vacuum chuck and beveler belongs to semiconductor technical field. The vacuum chuck includes: the sucker comprises a sucker body and a porous upper cover which is opposite to the sucker body in a box, wherein the porous upper cover is provided with a plurality of adsorption holes which are arranged in an array manner, and the adsorption holes are formed into a grid structure; the sucking disc is internally provided with an exhaust tube which is communicated with the plurality of adsorption holes. The technical scheme of the utility model the problem that the silicon chip atress was concentrated can be solved.
Description
Technical Field
The utility model relates to the field of semiconductor technology, especially indicate a vacuum chuck and beveler.
Background
The vacuum chuck is used as a main carrier for bearing the silicon wafer by the chamfering machine, and the precision requirement is high. The quality of the vacuum chuck directly influences the precision of the surface of the silicon wafer, if the vacuum pressure of the vacuum chuck is too concentrated, the probability of damage to the surface of the silicon wafer is greatly improved, and the left damage is difficult to treat in the subsequent process.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a vacuum chuck and beveler can solve the problem that the silicon chip atress is concentrated.
In order to solve the above technical problem, embodiments of the present invention provide the following technical solutions:
on the one hand, the embodiment of the utility model provides a vacuum chuck, include:
the sucker comprises a sucker body and a porous upper cover which is opposite to the sucker body in a box, wherein the porous upper cover is provided with a plurality of adsorption holes which are arranged in an array manner, and the adsorption holes are formed into a grid structure;
the sucking disc is internally provided with an exhaust tube which is communicated with the plurality of adsorption holes.
In some embodiments, a vacuum extractor is further included in communication with the pump-out tube.
In some embodiments, the number of adsorption holes is greater than 2000.
In some embodiments, the plurality of adsorption holes are all the same size.
In some embodiments, the adsorption wells are square.
In some embodiments, the adsorption pores are 3mm by 3mm in size.
In some embodiments, the chuck body is made of ceramic.
In some embodiments, the porous top cover is made of plastic.
The embodiment of the utility model provides a beveler is still provided, include as above vacuum chuck.
The embodiment of the utility model has the following beneficial effect:
in the above embodiment, vacuum chuck includes the sucking disc body and with the sucking disc body is to the porous upper cover of box, cover on the porous upper cover and be provided with the adsorption holes that a plurality of arrays were arranged, it is a plurality of adsorption holes group becomes latticed structure, can disperse vacuum suction like this evenly, the original seal of a government organization in old china that the sucking disc stress concentration produced of effectual solution is marked with a government organization in old china.
Drawings
FIG. 1 is a schematic view of a conventional vacuum chuck;
FIG. 2 is a schematic structural view of a porous upper cover according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a vacuum chuck according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived from the description of the embodiments of the present invention by a person skilled in the art, are within the scope of the present invention.
FIG. 1 is a schematic view of a conventional vacuum chuck, wherein 13 circular holes with a diameter of 4mm are formed in the vacuum chuck, and suction force of the vacuum chuck is too concentrated after a silicon wafer is adsorbed, so that chuck marks are easily generated on the silicon wafer and the surface of the silicon wafer is damaged; or the silicon chip is broken due to uneven suction force and over-concentrated stress.
In order to solve the problem, the embodiment of the utility model provides a vacuum chuck and beveler can solve the problem that the silicon chip atress is concentrated.
An embodiment of the present invention provides a vacuum chuck, as shown in fig. 2 and fig. 3, including:
the suction cup comprises a suction cup body 2 and a porous upper cover 1 which is opposite to the suction cup body 2, wherein a plurality of adsorption holes 11 which are arranged in an array mode are formed in the porous upper cover 1, and the adsorption holes 11 form a grid structure;
an exhaust tube 3 is arranged in the sucker body 2, and the exhaust tube 3 is communicated with the adsorption holes 11.
In this embodiment, vacuum chuck include sucking disc body 2 and with sucking disc body 2 is to porous upper cover 1 of box, be provided with the adsorption hole 11 that a plurality of arrays were arranged on the porous upper cover 1, a plurality of adsorption holes 11 constitute latticed structure, can disperse vacuum suction like this evenly, the original sucking disc stress of effectual solution concentrates the seal of a government organization in old china that produces.
In some embodiments, the vacuum chuck further comprises a vacuum pumping device in communication with the pumping tube 3, and the vacuum pumping device can provide vacuum suction force to suck the silicon wafer onto the vacuum chuck.
Specifically, the porous upper cover 1 can be disc-shaped, the adsorption holes 11 on the porous upper cover 1 form a grid-shaped structure, and after vacuum pumping is performed, vacuum suction force is dispersed through the grid-shaped structure, so that the purpose of uniform stress is achieved, and sucking disc marks can be prevented from being generated on the silicon wafer and damaging the surface of the silicon wafer; in addition, the condition of silicon chip breaking can be avoided.
In order to ensure uniform stress, the size of the plurality of adsorption holes 11 is the same.
In some embodiments, the adsorption holes 11 may have a square shape, and of course, the shape of the adsorption holes 11 is not limited to the square shape, and may also have other shapes, such as a circle, a triangle, a ring, and the like.
In some embodiments, when the adsorption holes 11 are square, the size of the adsorption holes 11 may be 3mm by 3 mm.
In order to disperse the vacuum suction force as much as possible, the number of the suction holes 11 is more than 2000, and may be about 2700. At present, the vacuum pressure is controlled to be-60 to-90 KPA during chamfering, if each adsorption hole 11 is square, the size of each adsorption hole 11 is 3mm x 3mm, approximately 2700 adsorption holes 11 are arranged on the porous upper cover 1, the vacuum suction force is uniformly dispersed in the 2700 adsorption holes 11, and the stress of each adsorption hole 11 is-0.03 KPA, so that the stress concentration problem is effectively solved; when the silicon wafer is adsorbed on the surface of the vacuum chuck, the problem of chuck marks generated by concentrated suction can be effectively solved.
In some embodiments, the chuck body 2 may be made of ceramic, but the chuck body 2 is not limited to ceramic, and other materials such as stainless steel may be used.
In some embodiments, the porous upper cover 1 can be made of plastic, and the plastic has certain buffering performance, so that when a silicon wafer is adsorbed, the silicon wafer can be prevented from being damaged as much as possible; of course, the porous upper cover 1 is not limited to plastic, and other materials having a buffer material may be used.
The embodiment of the utility model provides a beveler is still provided, include as above vacuum chuck.
In this embodiment, the vacuum chuck of beveler include sucking disc body 2 and with sucking disc body 2 is to the porous upper cover 1 of box, be provided with the adsorption hole 11 that a plurality of arrays were arranged on the porous upper cover 1, a plurality of adsorption holes 11 constitute latticed structure, can disperse vacuum suction like this evenly, the original sucking disc stress of effectual solution concentrates the seal of a government organization in old china that produces.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (9)
1. A vacuum chuck, comprising:
the sucker comprises a sucker body and a porous upper cover which is opposite to the sucker body in a box, wherein the porous upper cover is provided with a plurality of adsorption holes which are arranged in an array manner, and the adsorption holes are formed into a grid structure;
the sucking disc is internally provided with an exhaust tube which is communicated with the plurality of adsorption holes.
2. The vacuum chuck as set forth in claim 1 further comprising a vacuum extractor in communication with said suction tube.
3. The vacuum chuck as claimed in claim 1, wherein the number of the suction holes is more than 2000.
4. The vacuum chuck as claimed in claim 1, wherein the plurality of suction holes are all the same size.
5. The vacuum chuck as claimed in claim 1, wherein the suction hole has a square shape.
6. The vacuum chuck according to claim 5, wherein the size of the suction hole is 3mm by 3 mm.
7. The vacuum chuck as claimed in claim 1, wherein said chuck body is made of ceramic.
8. The vacuum chuck as claimed in claim 1, wherein the porous top cover is made of plastic.
9. A chamfering machine comprising the vacuum chuck according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020837378.8U CN211605126U (en) | 2020-05-19 | 2020-05-19 | Vacuum chuck and chamfering machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020837378.8U CN211605126U (en) | 2020-05-19 | 2020-05-19 | Vacuum chuck and chamfering machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211605126U true CN211605126U (en) | 2020-09-29 |
Family
ID=72584996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020837378.8U Active CN211605126U (en) | 2020-05-19 | 2020-05-19 | Vacuum chuck and chamfering machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211605126U (en) |
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2020
- 2020-05-19 CN CN202020837378.8U patent/CN211605126U/en active Active
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