CN213184249U - Silicon chip burst sucking disc subassembly - Google Patents
Silicon chip burst sucking disc subassembly Download PDFInfo
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- CN213184249U CN213184249U CN202021866295.8U CN202021866295U CN213184249U CN 213184249 U CN213184249 U CN 213184249U CN 202021866295 U CN202021866295 U CN 202021866295U CN 213184249 U CN213184249 U CN 213184249U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a silicon wafer slicing sucker component, which comprises a gas collecting plate, a sealing plate, a slot plate and a suction component, the sealing plate is positioned between the gas collecting plate and the slot plate, the suction assembly comprises a first suction cup and a second suction cup, the first sucker and the second sucker are arranged on the slot plate in a staggered manner, the first sucker and the second sucker are fixedly provided with an L-shaped air passage and a groove, the sealing plate is used for sealing the air inlet channel of the air collecting plate and the slot plate, the air collecting plate supplies air for the suction assembly, the utility model discloses a two sets of at least groove structure adsorb the silicon chip, increase the stability of adsorbing the silicon chip, the utility model discloses a first O shape circle and second O shape circle seal the installation of gas collecting plate, closing plate and slot board, guarantee the leakproofness of gas circulation, improve the efficiency that the subassembly was absorb in gaseous entering.
Description
Technical Field
The utility model belongs to the photovoltaic field relates to a silicon chip burst sucking disc subassembly.
Background
Semiconductor or photovoltaic materials are widely applied to industries such as electronics, new energy and the like, the semiconductor and photovoltaic materials can be applied to products generally through processing treatment, a CVD technology, a diffusion technology or an oxidation technology is one of the processing modes, wherein the CVD technology is chemical vapor deposition, the CVD technology is widely applied to semiconductor or photovoltaic material processing at present, common processing equipment includes PECVD, LPCVD, APCVD and the like, and besides the CVD technology, the diffusion technology includes phosphorus diffusion, boron diffusion and the like. At present, many related devices exist in the industry, and can be selected to process according to specific processing requirements, and the processing of semiconductor or photovoltaic materials is generally realized by feeding sheet materials into a furnace to react under the conditions of certain temperature and pressure.
The existing technology needs to divide two silicon wafers in a groove in a flower basket into two groups, but the existing silicon wafer dividing and conveying device cannot meet the requirement of dividing the two groups equally, and the equipment effectively solves the problem.
Disclosure of Invention
The utility model discloses an overcome prior art not enough, provide a silicon chip burst sucking disc subassembly.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a silicon chip burst sucking disc subassembly which characterized in that: including gas collection board, closing plate, slot board and absorption subassembly, the closing plate is located between gas collection board and the slot board, it includes first sucking disc and second sucking disc to absorb the subassembly, first sucking disc and second sucking disc are crisscross to be installed on the slot board, L type air flue and recess have set firmly on first sucking disc and the second sucking disc, the closing plate seals for the inlet channel of gas collection board with the slot board, the gas collection board is for absorbing the subassembly air feed, it absorbs the silicon chip through the recess to absorb the subassembly.
Further, the method comprises the following steps of; be provided with the air cavity that the opening is outwards in the gas collection board, the gas collection board sets firmly the through-hole with the air cavity intercommunication, through-hole and external vacuum apparatus intercommunication, external vacuum apparatus is the air inlet assembly energy supply, external vacuum apparatus sets up to vacuum generator or vacuum pump, first connecting hole and first locating hole have set firmly on the gas collection board, first locating hole fixes a position the installation of gas collection board and closing plate, the gas collection board sets firmly through first connecting hole with the closing plate and is connected.
Further, the method comprises the following steps of; the sealing plate is fixedly provided with an air outlet groove, two groups of ventilation assemblies are arranged in parallel and are fixedly provided in the air outlet groove, one group of ventilation assemblies are formed by transversely arranging a plurality of groups of penetrating first air outlet holes, the other group of ventilation assemblies are formed by transversely arranging a plurality of groups of penetrating second air outlet holes, the first air outlet holes and the second air outlet holes are arranged in a pairwise staggered manner, a first groove which is positioned on the outer side of the air outlet groove and is of an inwards concave structure is fixedly arranged on the sealing plate, a second groove which is positioned on the outer side of the first air outlet holes and is of an inwards concave structure is fixedly arranged on the other side surface of the sealing plate, a second connecting hole and a second positioning hole are fixedly arranged on the sealing plate, the second positioning hole is used for positioning the installation of the sealing plate and the air collecting plate and the slot plate, and the sealing plate and the slot plate.
Further, the method comprises the following steps of; the sealing structure is characterized by further comprising a sealing assembly, wherein the sealing assembly comprises a first O-shaped ring and a second O-shaped ring, the first O-shaped ring is installed in the first groove, the sealing performance of the air collecting plate and the sealing plate after installation is guaranteed, the second O-shaped ring is installed in the second groove, and the sealing performance of the sealing plate and the suction assembly after installation is guaranteed.
Further, the method comprises the following steps of; the groove inserting plate is fixedly provided with a first groove which penetrates through the groove inserting plate and corresponds to the first air outlet holes one by one and a second groove which corresponds to the second air outlet holes one by one, the groove inserting plate is fixedly provided with a third connecting hole and a third positioning hole, the third positioning hole is used for positioning the installation of the groove inserting plate and the sealing plate, and the groove inserting plate and the sealing plate are fixedly connected through the third connecting hole.
Further, the method comprises the following steps of; the first sucker and the second sucker are of mirror image structures, the first sucker and the second sucker are inserted into the second slot and the first slot respectively, the first sucker and the second sucker are connected to the slot plate in a staggered mode, slots are formed between the adjacent first suckers and the adjacent second suckers, and the silicon wafer is sucked into the slots by the equipment.
Further, the method comprises the following steps of; the first sucker comprises a fixing part and a sucking sheet part, the fixing part is inserted into the first slot, the connection between the sucking component and the slot plate is fixed by arranging a locking device and a fixing device, the locking device comprises an open cavity fixedly arranged on the side surface of the slot plate, locking holes which are symmetrical up and down and correspond to the first slot one by one are fixedly arranged on the open cavity, the locking holes are communicated with the first slot and the second slot, the locking holes are threaded holes, a fastening screw extends into the second slot through the locking holes to press the fixing part against the inner wall of the second slot so as to lock the first sucker and limit the axial and radial movement of the first sucker, the locking mode of the second sucker is the same as that of the first sucker, the fixing device comprises a sucker inserting strip, the sucker inserting strip is fixedly provided with fixing holes which are symmetrical up and down, and the sucker inserting strip is fixedly connected with the slot plate through the fixing holes, the side face of the fixing part is fixedly provided with a clamping cavity, the sucker inserting strip is inserted into the clamping cavity to be connected in a buckling mode, the first sucker is limited to move in the radial direction, and the fixing mode of the second sucker is the same as that of the first sucker.
Further, the method comprises the following steps of; the L-shaped air passage is provided with air holes, the air holes comprise a first air hole and a second air hole, the L-shaped air passage comprises a vertical forming surface extending to the upper end surface of the fixing part and a horizontal forming surface positioned on the channel surface, the second air hole is fixedly arranged on the vertical forming surface of the L-shaped air passage, the first air hole is fixedly arranged on the horizontal forming surface of the L-shaped air passage, the L-shaped air passage is fixedly provided with a concave part, the concave part and the L-shaped air passage form an external-placing type stepped structure, the first suction disc further comprises a cover plate, the cover plate is arranged on the concave part, the L-shaped air passage is communicated with an air passage opening, a clamping block which is buckled with the air passage opening is fixedly arranged on the cover plate, a groove is fixedly arranged on the other side surface of the first suction disc, the groove at least comprises a second groove and a first groove, the second groove and the first groove are arranged into a ring-, the first air hole is positioned in the first groove.
Further, the method comprises the following steps of; the upper surface and the lower surface of the card cavity are fixedly provided with inclined planes, the upper surface and the lower surface and the vertical side of the fixing part form obtuse angles, so that the sucking disc inserting strip can be conveniently led in, the inclined planes are connected and arranged between the fixing part and the sucking disc part, the included angles formed by the inclined planes, the fixing part and the sucking disc part are obtuse angles, the side edges of the sucking disc part are provided with inclined edges, the included angles formed by the inclined edges and the sucking disc part are obtuse angles, so that silicon wafers can be conveniently led in and led out when the silicon wafers are sucked and separated, the lower part is arranged on the lower side of the sucking disc part and is of a wedge-shaped structure, so that the sucking disc part can be conveniently inserted between two groups of silicon wafers, the cover plate shape is matched with an L-shaped air passage, the cover plate thickness is matched with the depressed part thickness, the fixture block and the air channel opening are convenient to install and separate.
Further, the method comprises the following steps of; the length and the width of the sealing plate are matched with those of the gas collecting plate, the length and the width of the slot plate are matched with those of the sealing plate, the number, the position and the shape of the second connecting holes and the second positioning holes are matched with those of the first connecting holes and the first positioning holes, and the number, the position and the shape of the third connecting holes and the third positioning holes are matched with those of the second connecting holes and the second positioning holes.
To sum up, the utility model discloses an useful part lies in:
1) the utility model discloses a first locating hole, second locating hole and third locating hole are fixed a position the installation of gas collection board, closing plate and slotting plate, guarantee the installation accuracy of gas collection board, closing plate and slotting plate, have improved the installation effectiveness.
2) The utility model discloses a first O shape circle and second O shape circle seal the installation of gas collection board, closing plate and slot board, guarantee the leakproofness of gas circulation, improve the efficiency that gaseous entering absorbs the subassembly.
3) The utility model discloses a card chamber upper and lower surface sets firmly the inclined plane, and the leading-in of the sucking disc cutting of being convenient for sets up the hypotenuse at the sucking disc side simultaneously, and the silicon chip is leading-in and deriving when being convenient for absorb and separate the silicon chip, and the sucking disc downside has the lower part of wedge structure in addition, and the sucking disc portion of being convenient for inserts between two sets of silicon chips to efficiency has been improved.
4) The utility model discloses an at least two sets of groove structure adsorb the silicon chip, increase the stability of adsorbing the silicon chip.
5) The utility model discloses well locking device and fixing device are adopted to locking device with the sucking disc locking, prevent that the sucking disc from radially taking place not hard up in the axial, and fixing device adopts the sucking disc cutting to guarantee that the sucking disc can not take place the displacement and become flexible in radial.
Drawings
Fig. 1 is an explosion diagram of the device of the present invention.
Fig. 2 is a schematic view of the gas collecting plate of the present invention.
Fig. 3 is a schematic view of a sealing plate according to the present invention.
Fig. 4 is a schematic view of a sealing plate of the present invention.
Fig. 5 is the installation schematic diagram of the middle chute plate, the sucking disc inserting strip and the sucking component of the utility model.
Fig. 6 is a schematic view of the slot board of the present invention.
Fig. 7 is a schematic view of the sucker cutting of the present invention.
Fig. 8 is a first suction cup drawing of the present invention.
Fig. 9 shows a second drawing of the first suction cup of the present invention.
Fig. 10 is an enlarged schematic view of a in fig. 9.
Fig. 11 is a schematic view of a second suction cup according to the present invention.
The labels in the figure are: the suction cup comprises a gas collecting plate 100, a first connecting hole 101, a first positioning hole 102, a through hole 103, an air cavity 104, a sealing plate 200, a second connecting hole 201, a second positioning hole 202, an air outlet groove 203, a first groove 204, a first O-shaped ring 205, a first air outlet hole 206, a second groove 207, a second air outlet hole 208, a mounting surface 210, a connecting surface 220, a slot plate 300, a third connecting hole 301, a third positioning hole 302, a first slot 304, an open cavity 305, a locking hole 306, a second slot 307, a suction cup insert strip 400, an abutting surface 401, an outer surface 402, a fixing hole 403, a first suction cup 500, a cover plate 501, a fixture block 502, a fixing portion 510, an air passage opening 511, a clamp cavity 512, an inclined platform 513, a suction cup portion 520, a passage surface 521, a first air hole 522, a depressed portion 523, a lower member 524, an L-shaped air passage, a second air hole 526, an inclined edge 527, a suction surface 530, a first groove 531, a second groove 532 and.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic concept of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
All directional indicators (such as upper, lower, left, right, front, rear, horizontal, vertical … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture, if the specific posture changes, the directional indicator changes accordingly.
The first embodiment is as follows:
as shown in fig. 1-11, a silicon wafer slicing chuck assembly comprises a gas collecting plate 100, a sealing plate 200, a slot plate 300 and a suction assembly, wherein the sealing plate 200 is located between the gas collecting plate 100 and the slot plate 300, the suction assembly comprises a first suction cup 500 and a second suction cup 600, the first suction cup 500 and the second suction cup 600 are installed on the slot plate 300 in a staggered manner, an L-shaped air passage 525 and a groove are fixedly arranged on the first suction cup 500 and the second suction cup 600, the sealing plate 200 seals an air inlet channel of the gas collecting plate 100 and the slot plate 300, the gas collecting plate 100 supplies air for the suction assembly, and the suction assembly sucks a silicon wafer through the groove.
As shown in fig. 1-2, in the present embodiment, the gas collecting plate 100 is configured as a rectangular parallelepiped; an air cavity 104 with an outward opening is arranged in the air collecting plate 100, a through hole 103 communicated with the air cavity 104 is fixedly arranged on the side surface of the air collecting plate 100, the through hole 103 is communicated with an external vacuum device, the external vacuum device supplies power to an air inlet assembly, the external vacuum device can be set to be a vacuum generator or a vacuum pump, four groups of first connecting holes 101 which are arranged in a rectangular array and positioned on the outer side of the air cavity 104 are fixedly arranged on the air collecting plate 100, a first positioning hole 102 is arranged between the first connecting holes 101 in the horizontal direction according to the visual angle shown in fig. 2, the two groups of first positioning holes 102 are in a central symmetry structure, specifically, the first positioning hole 102 positioned on the upper side is close to the first connecting hole 101 positioned on the upper right side, the first positioning hole 102 positioned on the lower side is close to the first connecting hole 101 positioned on the lower left side, and the first positioning hole, the efficiency and the precision of installation are guaranteed.
As shown in fig. 3-4, in this embodiment, the sealing plate 200 is configured as a rectangular parallelepiped structure, and the length and width of the sealing plate 200 match the length and width of the gas collecting plate 100, the sealing plate 200 includes a mounting surface 210 and a connecting surface 220 that are arranged in parallel, an inward concave gas outlet groove 203 is fixedly disposed on the mounting surface 210, two sets of ventilation components that are arranged in parallel (in the direction of arrow shown in the figure) are fixedly disposed in the gas outlet groove 203, the ventilation component located at the upper side is formed by transversely arranging a plurality of sets of first gas outlet holes 206 that penetrate through the ventilation component, the ventilation component located at the lower side is formed by transversely arranging a plurality of sets of second gas outlet holes 208 that penetrate through the ventilation component, the first gas outlet holes 206 and the second gas outlet holes 208 are the same in number and are staggered in pairs, a first groove 204 located at the outer side of the gas outlet groove 203 is fixedly disposed on, the connecting surface 220 is fixedly provided with a second groove 207 positioned outside the first air outlet 206, the second groove 207 is designed to be a concave structure, the sealing plate 200 is fixedly provided with a second connecting hole 201 and a second positioning hole 202, and the number, position and shape of the second connecting hole 201 and the second positioning hole 202 are matched with the number, position and shape of the first connecting hole 101 and the first positioning hole 102.
As shown in fig. 3 and 5, in order to prevent gas from leaking in the gap of the installation gap of the equipment and ensure the tightness of gas circulation, the equipment is further provided with a sealing assembly, the sealing assembly comprises a first O-ring 205 and a second O-ring 303, the first O-ring 205 is installed in the first groove 204 to ensure the tightness after the gas collecting plate 100 and the sealing plate 200 are installed, so that the gas circulation between the gas collecting plate 100 and the sealing plate 200 is facilitated, the second O-ring 303 is installed in the second groove 207 to ensure the tightness between the sealing plate 200 and the suction assembly, and the efficiency of the gas entering the suction assembly is improved.
As shown in fig. 5 to 6, the slot board 300 is configured as a rectangular parallelepiped structure, and the length and width of the slot board 300 match the length and width of the sealing board 200, the slot board 300 is fixedly provided with a first slot 304 which penetrates up and down and corresponds to the first air outlet 206 one by one, and a second slot 307 which corresponds to the second air outlet 208 one by one, in this embodiment, the adjacent first slot 304 and the adjacent second slot 307 are communicated with each other, so as to improve the processing efficiency and quality, the slot board 300 is fixedly provided with a third connecting hole 301 and a third positioning hole 302, the number, position and shape of the third connecting hole 301 and the third positioning hole 302 match the number, position and shape of the second connecting hole 201 and the second positioning hole 202, when the air collecting board 100, the sealing board 200, and the slot board 300 are installed, the first fastener penetrates through the second positioning hole 202, the upper end of the first fastener is connected with the gas collecting plate 100 through the first positioning hole 102, the lower end of the first fastener is connected with the slot plate 300 through the third positioning hole 302, the gas collecting plate 100, the sealing plate 200 and the slot plate 300 are positioned, so that the installation accuracy of the gas collecting plate 100, the sealing plate 200 and the slot plate 300 is guaranteed, and the second fastener sequentially passes through the third connecting hole 301, the second connecting hole 201 and the first connecting hole 101, so that the gas collecting plate 100, the sealing plate 200 and the slot plate 300 are fixedly connected.
As shown in fig. 7 to 11, the suction assembly includes a first suction cup 500 and a second suction cup 600, in this embodiment, the first suction cup 500 and the second suction cup 600 are mirror images, the first suction cup 500 and the second suction cup 600 are respectively inserted into a second slot 307 and a first slot 304, so that the first suction cup 500 and the second suction cup 600 are alternately connected to a slot board 300, a slot (not shown) is formed between the adjacent first suction cup 500 and the second suction cup 600, a device sucks a silicon wafer into the slot, specifically, taking the first suction cup 500 as an example, the first suction cup 500 includes a fixing portion 510 and a suction piece portion 520, the width of the fixing portion 510 is smaller than the width of the suction piece portion 520, the width, thickness and height of the fixing portion 510 match the width, thickness and height of the first slot 304, the fixing portion 510 is inserted into the first slot 304, and the upper end surface of the fixing portion 510 is flush with the upper surface of the slot board 300, in order to ensure the stability of the fixing of the suction assembly and the slot plate 300, the apparatus is provided with a locking device and a fixing device, the locking device includes an open cavity 305 fixedly arranged on the front and rear side surfaces of the slot plate 300, locking holes 306 which are vertically symmetrical and correspond to the first slot 304 one by one are fixedly arranged on the open cavity 305, the locking holes 306 are communicated with the first slot 304 and the second slot 307, in this embodiment, the locking holes 306 are threaded holes, and a fastening screw extends into the second slot 307 through the locking holes 306 to abut against the inner wall of the second slot 307 against the fixing portion 510, so that the first suction cup 500 is locked, the first suction cup 500 is prevented from being loosened in the axial direction and the radial direction, and the locking mode of the second suction cup 600 is the same as that of the first suction cup 500.
The fixing device comprises a sucker strip 400, the sucker strip 400 comprises a supporting surface 401 and an outer surface 402 which are arranged in parallel, fixing holes 403 which are symmetrical up and down and penetrate through are fixedly arranged on the sucker strip 400, in the embodiment, the positions of the fixing holes 403 are close to the supporting surface 401, mounting holes (not shown) for connecting the sucker strip 400 are fixedly arranged on the slot plate 300, the number of the mounting holes is matched with that of the positions of the fixing holes 403, the mounting piece enables the sucker strip 400 and the slot plate 300 to be fixedly connected through the connection of the mounting holes and the fixing holes 403, in addition, a clamping cavity 512 is fixedly arranged on the side surface of the fixing part 510, inclined surfaces are fixedly arranged on the upper surface and the lower surface of the clamping cavity 512, the inclined surfaces, the upper surface and the lower surface of the clamping cavity and the vertical side surface of the fixing part 510 form an obtuse angle, so that the sucker strip 400 can be conveniently guided in, when the sucker strip 400 is installed, the upper and lower surfaces of the second suction cup 600 are abutted against the upper and lower surfaces of the clamping cavity 512, so that the first suction cup 500 is prevented from being displaced and loosened in the radial direction, and the second suction cup 600 is fixed in the same manner as the first suction cup 500.
Fix the sucking disc through above-mentioned structure, it is little to guarantee that the sucking disc adopts the accumulative total error after the installation of inserted sheet formula to can the position of every sucking disc of accurate location, and not influenced between the adjacent sucking disc position, when one of them sucking disc damages, unscrew the screw, alright change with taking the sucking disc out, thereby conveniently change the sucking disc, improve and dismantle efficiency.
The fixing part 510 and the suction piece part 520 are connected and provided with an inclined platform 513, the fixing part 510 and the suction piece part 520 form an obtuse angle, the first suction disc 500 is of an integrally formed structure, if the fixing part 510 and the suction piece part 520 form a right angle or an acute angle, accumulation easily occurs at the right angle or the acute angle, the qualification rate is reduced, the inclined platform 513, the fixing part 510 and the suction piece part 520 form an obtuse angle, the qualification rate is improved, the side edge of the suction piece part 520 is provided with an inclined edge 527, the inclined edge 527 and the suction piece part 520 form an obtuse angle, silicon wafers are guided in and out when the silicon wafers are sucked and separated, a lower part 524 is arranged on the lower side of the suction piece part 520, the suction piece part 520 is conveniently inserted between two groups of silicon wafers, a gas channel opening 511 is fixedly arranged on the fixing part 510, and the gas channel opening 511 upwards penetrates through the upper end, the air channel opening 511 corresponds to the first air outlet 206 after the first suction cup 500 is installed.
The suction piece part 520 comprises two groups of side faces of a channel face 521 and an adsorption face 530 which are arranged in parallel, an L-shaped air passage 525 located on one side of the channel face 521 is fixedly arranged on the first suction disc 500, a through air hole is formed in the L-shaped air passage 525, the air hole comprises a first air hole 522 and a second air hole 526, in the embodiment, the L-shaped air passage 525 is of a concave L-shaped structure, the L-shaped air passage 525 comprises a vertical forming face extending to the upper end face of the fixing part 510 and a horizontal forming face located on the channel face 521, the second air hole 526 is fixedly arranged on the vertical forming face of the L-shaped air passage 525, the first air hole 522 is fixedly arranged on the horizontal forming face of the L-shaped air passage 525, a recessed part 523 is fixedly arranged on the front side of the L-shaped air passage 525, the recessed part 523 and the L-shaped air passage 525 form an outward-placing step structure, and the first suction disc 500 further comprises, the shape of the cover plate 501 is matched with that of the L-shaped air passage 525, the thickness of the cover plate 501 is matched with that of the concave part 523, the sealing stability and the flatness of the first sucking disc 500 are guaranteed, the silicon wafer is prevented from colliding with the first sucking disc 500, the qualification rate is reduced, the efficiency and the quality of guiding in and out the silicon wafer are improved, the air passage opening 511 is communicated with the L-shaped air passage 525, the air passage opening 511 is positioned on the inner side of the L-shaped air passage 525, the cover plate 501 is fixedly provided with the fixture block 502, the angle formed by the air passage opening 511 and the L-shaped air passage 525 is an obtuse angle, the angle formed by the fixture block 502 and the side surface of the cover plate 501 is an obtuse angle, the fixture block 502 is matched with the air passage opening 511, the installation and the separation of the fixture block 502 and the air passage opening 511 are facilitated, the efficiency is improved, the adsorption surface 530, in this embodiment, the second groove 532 and the first groove 531 are arranged in a circular ring structure, the second air hole 526 is located in the second groove 532, the first air hole 522 is located in the first groove 531, two sets of adsorption points are arranged in this embodiment, the stability of adsorbing a silicon wafer is increased, and meanwhile, the adsorption force of the silicon wafer is kept balanced by the positions where the second groove 532 and the first groove 531 are located on the adsorption surface 530, so that the stress of a silicon wafer part or the stress is prevented from being uneven, and the adsorption efficiency is reduced.
In the process of sucking the silicon wafer, negative pressure is accessed in the through hole 103, negative pressure gas passes through the air cavity 104 and the first air outlet 206 and enters the air channel opening 511 on the sucker fixing part 510, gas enters the L-shaped air channel 525 through the air channel opening 511, and enters the second groove 532 and the first groove 531 through the second air hole 526 and the first air hole 522, the sucking part 520 of the sucker is inserted between two troughs in the flower basket at the moment, the silicon wafer close to the sucking part is sucked, the whole assembly can be lifted through the motor or the cylinder after the sucking, thereby the sucked and unadsorbed silicon wafer is separated, and the sucking and separating functions of the silicon wafer are realized.
In addition, the suction assembly can also comprise a vacuum filter, and the vacuum filter can filter impurities in the air and protect the normal use of the equipment, so that the service life of the equipment is prolonged.
In other embodiments, the recess may be provided in an oval, square or other shape that matches the shape of the silicon wafer.
In other embodiments, the number of air holes and corresponding grooves on the suction cup is greater than two.
It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Claims (10)
1. The utility model provides a silicon chip burst sucking disc subassembly which characterized in that: including gas collection board, closing plate, slot board and absorption subassembly, the closing plate is located between gas collection board and the slot board, it includes first sucking disc and second sucking disc to absorb the subassembly, first sucking disc and second sucking disc are crisscross to be installed on the slot board, L type air flue and recess have set firmly on first sucking disc and the second sucking disc, the closing plate seals for the inlet channel of gas collection board with the slot board, the gas collection board is for absorbing the subassembly air feed, it absorbs the silicon chip through the recess to absorb the subassembly.
2. The silicon wafer slicing chuck assembly of claim 1, wherein: be provided with the air cavity that the opening is outwards in the gas collection board, the gas collection board sets firmly the through-hole with the air cavity intercommunication, through-hole and external vacuum apparatus intercommunication, external vacuum apparatus is the air inlet assembly energy supply, external vacuum apparatus sets up to vacuum generator or vacuum pump, first connecting hole and first locating hole have set firmly on the gas collection board, first locating hole fixes a position the installation of gas collection board and closing plate, the gas collection board sets firmly through first connecting hole with the closing plate and is connected.
3. The silicon wafer slicing chuck assembly of claim 2, wherein: the sealing plate is fixedly provided with an air outlet groove, two groups of ventilation assemblies are arranged in parallel and are fixedly provided in the air outlet groove, one group of ventilation assemblies are formed by transversely arranging a plurality of groups of penetrating first air outlet holes, the other group of ventilation assemblies are formed by transversely arranging a plurality of groups of penetrating second air outlet holes, the first air outlet holes and the second air outlet holes are arranged in a pairwise staggered manner, a first groove which is positioned on the outer side of the air outlet groove and is of an inwards concave structure is fixedly arranged on the sealing plate, a second groove which is positioned on the outer side of the first air outlet holes and is of an inwards concave structure is fixedly arranged on the other side surface of the sealing plate, a second connecting hole and a second positioning hole are fixedly arranged on the sealing plate, the second positioning hole is used for positioning the installation of the sealing plate and the air collecting plate and the slot plate, and the sealing plate and the slot plate.
4. The silicon wafer slicing chuck assembly of claim 1, wherein: the sealing structure is characterized by further comprising a sealing assembly, wherein the sealing assembly comprises a first O-shaped ring and a second O-shaped ring, the first O-shaped ring is installed in the first groove, the sealing performance of the air collecting plate and the sealing plate after installation is guaranteed, the second O-shaped ring is installed in the second groove, and the sealing performance of the sealing plate and the suction assembly after installation is guaranteed.
5. The silicon wafer slicing chuck assembly of claim 3, wherein: the groove inserting plate is fixedly provided with a first groove which penetrates through the groove inserting plate and corresponds to the first air outlet holes one by one and a second groove which corresponds to the second air outlet holes one by one, the groove inserting plate is fixedly provided with a third connecting hole and a third positioning hole, the third positioning hole is used for positioning the installation of the groove inserting plate and the sealing plate, and the groove inserting plate and the sealing plate are fixedly connected through the third connecting hole.
6. The silicon wafer slicing chuck assembly of claim 1, wherein: the first sucker and the second sucker are of mirror image structures, the first sucker and the second sucker are inserted into the second slot and the first slot respectively, the first sucker and the second sucker are connected to the slot plate in a staggered mode, slots are formed between the adjacent first suckers and the adjacent second suckers, and the silicon wafer is sucked into the slots by the equipment.
7. The silicon wafer slicing chuck assembly of claim 1, wherein: the first sucker comprises a fixing part and a sucking sheet part, the fixing part is inserted into the first slot, the connection between the sucking component and the slot plate is fixed by arranging a locking device and a fixing device, the locking device comprises an open cavity fixedly arranged on the side surface of the slot plate, locking holes which are symmetrical up and down and correspond to the first slot one by one are fixedly arranged on the open cavity, the locking holes are communicated with the first slot and the second slot, the locking holes are threaded holes, a fastening screw extends into the second slot through the locking holes to press the fixing part against the inner wall of the second slot so as to lock the first sucker and limit the axial and radial movement of the first sucker, the locking mode of the second sucker is the same as that of the first sucker, the fixing device comprises a sucker inserting strip, the sucker inserting strip is fixedly provided with fixing holes which are symmetrical up and down, and the sucker inserting strip is fixedly connected with the slot plate through the fixing holes, the side face of the fixing part is fixedly provided with a clamping cavity, the sucker inserting strip is inserted into the clamping cavity to be connected in a buckling mode, the first sucker is limited to move in the radial direction, and the fixing mode of the second sucker is the same as that of the first sucker.
8. The silicon wafer slicing chuck assembly of claim 7, wherein: the L-shaped air passage is provided with air holes, the air holes comprise a first air hole and a second air hole, the L-shaped air passage comprises a vertical forming surface extending to the upper end surface of the fixing part and a horizontal forming surface positioned on the channel surface, the second air hole is fixedly arranged on the vertical forming surface of the L-shaped air passage, the first air hole is fixedly arranged on the horizontal forming surface of the L-shaped air passage, the L-shaped air passage is fixedly provided with a concave part, the concave part and the L-shaped air passage form an external-placing type stepped structure, the first suction disc further comprises a cover plate, the cover plate is arranged on the concave part, the L-shaped air passage is communicated with an air passage opening, a clamping block which is buckled with the air passage opening is fixedly arranged on the cover plate, a groove is fixedly arranged on the other side surface of the first suction disc, the groove at least comprises a second groove and a first groove, the second groove and the first groove are arranged into a ring-, the first air hole is positioned in the first groove.
9. The silicon wafer slicing chuck assembly of claim 8, wherein: the upper surface and the lower surface of the card cavity are fixedly provided with inclined planes, the upper surface and the lower surface and the vertical side of the fixing part form obtuse angles, so that the sucking disc inserting strip can be conveniently led in, the inclined planes are connected and arranged between the fixing part and the sucking disc part, the included angles formed by the inclined planes, the fixing part and the sucking disc part are obtuse angles, the side edges of the sucking disc part are provided with inclined edges, the included angles formed by the inclined edges and the sucking disc part are obtuse angles, so that silicon wafers can be conveniently led in and led out when the silicon wafers are sucked and separated, the lower part is arranged on the lower side of the sucking disc part and is of a wedge-shaped structure, so that the sucking disc part can be conveniently inserted between two groups of silicon wafers, the cover plate shape is matched with an L-shaped air passage, the cover plate thickness is matched with the depressed part, the fixture block and the air channel opening are convenient to install and separate.
10. The silicon wafer slicing chuck assembly of claim 5, wherein: the length and the width of the sealing plate are matched with those of the gas collecting plate, the length and the width of the slot plate are matched with those of the sealing plate, the number, the position and the shape of the second connecting holes and the second positioning holes are matched with those of the first connecting holes and the first positioning holes, and the number, the position and the shape of the third connecting holes and the third positioning holes are matched with those of the second connecting holes and the second positioning holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021866295.8U CN213184249U (en) | 2020-08-31 | 2020-08-31 | Silicon chip burst sucking disc subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021866295.8U CN213184249U (en) | 2020-08-31 | 2020-08-31 | Silicon chip burst sucking disc subassembly |
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| Publication Number | Publication Date |
|---|---|
| CN213184249U true CN213184249U (en) | 2021-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021866295.8U Active CN213184249U (en) | 2020-08-31 | 2020-08-31 | Silicon chip burst sucking disc subassembly |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113291814A (en) * | 2021-05-28 | 2021-08-24 | 艾华(无锡)半导体科技有限公司 | Suction disc group for sucking multiple wafers |
| CN113915225A (en) * | 2021-09-16 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Sucking disc inserts mechanism and sucking disc device soon |
| CN113977564A (en) * | 2021-09-16 | 2022-01-28 | 苏州诚拓智能装备有限公司 | Silicon chip pickup device |
| CN114783933A (en) * | 2022-04-22 | 2022-07-22 | 嘉兴市耐思威精密机械有限公司 | Sucking disc subassembly convenient to equipment, dismantlement are maintained |
| CN114783933B (en) * | 2022-04-22 | 2024-07-02 | 嘉兴市耐思威精密机械有限公司 | Sucking disc subassembly convenient to equipment, dismantlement are maintained |
-
2020
- 2020-08-31 CN CN202021866295.8U patent/CN213184249U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113291814A (en) * | 2021-05-28 | 2021-08-24 | 艾华(无锡)半导体科技有限公司 | Suction disc group for sucking multiple wafers |
| CN113291814B (en) * | 2021-05-28 | 2022-09-16 | 艾华(无锡)半导体科技有限公司 | Suction disc group for sucking multiple wafers |
| CN113915225A (en) * | 2021-09-16 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Sucking disc inserts mechanism and sucking disc device soon |
| CN113977564A (en) * | 2021-09-16 | 2022-01-28 | 苏州诚拓智能装备有限公司 | Silicon chip pickup device |
| CN114783933A (en) * | 2022-04-22 | 2022-07-22 | 嘉兴市耐思威精密机械有限公司 | Sucking disc subassembly convenient to equipment, dismantlement are maintained |
| CN114783933B (en) * | 2022-04-22 | 2024-07-02 | 嘉兴市耐思威精密机械有限公司 | Sucking disc subassembly convenient to equipment, dismantlement are maintained |
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Effective date of registration: 20220816 Address after: 3, Dongqinghe Road, Xibei, Xishan District, Wuxi City, Jiangsu Province, 214192 Patentee after: Laplace (Wuxi) semiconductor technology Co.,Ltd. Address before: No. 209, Zhangjing East Section, Xigang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Xiaoqiang Semiconductor Technology Co.,Ltd. |