CN213124438U

CN213124438U - IGBT mounting structure and IGBT module assembly

Info

Publication number: CN213124438U
Application number: CN202022334047.5U
Authority: CN
Inventors: 陈振威; 黄猛; 王京; 俞贤桥; 孙一嘉
Original assignee: Gree Electric Appliances Inc of Zhuhai
Current assignee: Gree Electric Appliances Inc of Zhuhai
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2021-05-04
Anticipated expiration: 2030-10-19

Abstract

The invention discloses an IGBT mounting structure and an IGBT module component, wherein the IGBT mounting structure comprises: the mounting frame is provided with a pressure groove structure matched with the IGBT, and an installation space for accommodating the IGBT is formed by the pressure groove structure and the radiator in a surrounding mode; the mounting frame is provided with a bolt hole for mounting an adjusting bolt. The IGBT mounting structure and the IGBT module assembly provided by the invention can effectively solve the problem that in the prior art, the IGBT cannot be tightly attached to a radiator, so that heat cannot be timely and effectively transferred to the radiator, and the operation of the IGBT is influenced.

Description

IGBT mounting structure and IGBT module assembly

Technical Field

The invention relates to the technical field of semiconductors, in particular to an IGBT (insulated gate bipolar transistor) mounting structure and an IGBT module assembly.

Background

Since the invention of an Insulated Gate Bipolar Transistor (IGBT), the technology thereof has been developed rapidly, and the IGBT covers large-area power electronic applications as a core device for electric energy conversion. At present, the IGBT is widely applied to a plurality of fields of consumer appliances, industrial control, smart grids, new energy power generation and the like, and becomes a main switching device of a converter. Therefore, with the development and application of the IGBT, the installation modes and methods thereof are also infinite, and have advantages and disadvantages.

In the prior art, the following problems generally exist in the conventional common IGBT mounting mode: the IGBT can not be tightly attached to the radiator, so that heat can not be timely and effectively transferred to the radiator, and the operation of the IGBT is influenced.

Disclosure of Invention

The embodiment of the invention provides an IGBT mounting structure and an IGBT module assembly, and aims to solve the problem that in the prior art, an IGBT cannot be tightly attached to a radiator, so that heat cannot be timely and effectively transferred to the radiator, and the operation of the IGBT is influenced.

In order to achieve the above object, the present invention provides an IGBT mounting structure for mounting an IGBT on a heat sink, the IGBT mounting structure including: the mounting frame is provided with a pressure groove structure matched with the IGBT, and an installation space for accommodating the IGBT is formed by the pressure groove structure and the radiator in a surrounding mode; the mounting frame is provided with a bolt hole for mounting an adjusting bolt.

Further, the mounting bracket includes the clamp plate, and the clamp plate corresponds the setting with the indent structure, and the bolt hole is located the clamp plate.

Furthermore, the pressing plates are arranged at intervals, and a pressing groove structure is arranged between the two pressing plates.

Further, still include: the positioning buckle is arranged on the mounting frame and used for being connected with the PCB board in an clamped mode.

Further, the material of the mounting frame is a deformable elastic material.

Further, the groove depth of the indent structure is smaller than the height of the IGBT.

According to another aspect of the present invention, there is provided an IGBT module assembly including: the radiator is used for radiating the IGBT; the mounting frame is provided with a pressure groove structure matched with the IGBT, and an installation space for accommodating the IGBT is formed by the pressure groove structure and the radiator in a surrounding mode; the mounting rack is provided with bolt holes for mounting the adjusting bolts; the adjusting bolt penetrates through the bolt hole, and the mounting frame is connected to the radiator through the adjusting bolt; and the IGBT is positioned in the installation space, and the substrate of the IGBT is attached to the radiator.

Further, the mounting bracket includes the clamp plate, and the clamp plate corresponds the setting with the indent structure, and the bolt hole is located the clamp plate, clamp plate and radiator laminating.

Further, still include: the positioning buckle is arranged on the mounting frame; the PCB board, PCB board and location buckle joint, IGBT and PCB board welding.

Further, the mounting bracket has opposite first and second sides, the PCB board is located at the first side of the mounting bracket, the heat sink is located at the second side of the mounting bracket, and the notch of the indent structure faces the second side of the mounting bracket.

Furthermore, the PCB is provided with an avoiding hole for avoiding the adjusting bolt.

Further, the material of the mounting frame is a deformable elastic material.

According to the novel IGBT mounting structure designed by the invention, the IGBT is mounted and positioned through the groove pressing structure, the mounting frame is fixed on the radiator through the bolt holes in the mounting frame by using the adjusting bolts, the mounting space for accommodating the IGBT is defined between the groove pressing structure and the radiator, and the IGBT is tightly pressed while the mounting frame is fixed by the adjusting bolts, so that the IGBT can be tightly attached to the radiator. The IGBT mounting structure can realize that the IGBT is tightly attached to the radiator, and can effectively ensure that the heat of the IGBT is effectively and timely transmitted to the radiator, thereby keeping the IGBT working normally.

Drawings

Fig. 1 is a schematic structural view of an IGBT mounting structure according to a first embodiment of the invention;

fig. 2 is a schematic structural view of an IGBT module assembly according to a second embodiment of the invention;

fig. 3 is an exploded structural schematic view of an IGBT module assembly according to a second embodiment of the invention;

fig. 4 is a schematic perspective view of an IGBT module assembly according to a second embodiment of the present invention.

Detailed Description

The invention is described in further detail below with reference to the figures and the examples, but without limiting the invention.

Referring to fig. 1, according to a first embodiment of the present invention, there is provided an IGBT mounting structure for mounting an IGBT (insulated Gate Bipolar transistor), which is an insulated Gate Bipolar transistor, on a heat sink. The IGBT mounting structure comprises a mounting rack 10, a pressure groove structure 11 matched with the IGBT is arranged on the mounting rack 10, and a mounting space for accommodating the IGBT is enclosed between the pressure groove structure 11 and the radiator; the mounting bracket 10 is provided with bolt holes 12 for mounting the adjusting bolts.

In the novel IGBT mounting structure designed by the invention, the IGBT is mounted and positioned through the groove pressing structure 11, the mounting frame 10 is fixed on the radiator by using the adjusting bolt to penetrate through the bolt hole 12 on the mounting frame 10, the mounting space for accommodating the IGBT is enclosed between the groove pressing structure 11 and the radiator, and the IGBT is tightly pressed while the mounting frame 10 is fixed by the adjusting bolt, so that the IGBT can be tightly attached to the radiator. The IGBT mounting structure can realize that the IGBT is tightly attached to the radiator, and can effectively ensure that the heat of the IGBT is effectively and timely transmitted to the radiator, thereby keeping the IGBT working normally.

Preferably, the mounting frame 10 includes a pressing plate 13, the pressing plate 13 is disposed corresponding to the pressure groove structure 11, and the bolt holes 12 are located on the pressing plate 13. The effect of clamp plate 13 is that adjusting bolt transmits indent structure 11 when screwing up, and the clamp plate is preferred to be out of shape and bear and screw up the moment, and can not influence the IGBT module, avoids taking place because of the too big condition of direct damage IGBT of screwing up moment.

The pressing plates 13 are arranged at intervals, and a pressing groove structure 11 is arranged between the two pressing plates 13. In this embodiment, the mounting bracket 10 is a bar structure, the two pressing plates 13 are respectively located on two sides of one pressing groove structure 11, the two sides of the IGBT can be attached to the radiator through the adjusting bolts, and the heat dissipation efficiency is higher. The number of the pressure groove structures and the pressure plates depends on the number of the IGBTs.

Referring to fig. 1, the IGBT mounting structure further includes a positioning clip 14, the positioning clip 14 is disposed on the mounting bracket 10, and the positioning clip 14 is configured to be clamped with a PCB. Since the IGBT is finally soldered to the PCB, the positioning fastener 14 is disposed on the mounting bracket 10, and the mounting bracket 10 can be stably connected to the PCB, so that the connection is more stable and the structure is more reliable.

Preferably, the material of the mounting frame 10 is a deformable elastic material. When the IGBT mounting structure is used, a pressure is applied to the mounting frame 10 by screwing in the adjusting bolt, and the mounting frame will deform to some extent during this process and transfer the pressure to the IGBT, so that each individual IGBT is tightly attached to the heat sink. The material of the mounting bracket 10 can be nylon material, and the mounting bracket 10 has the characteristics of high mechanical strength, good toughness and fatigue resistance under the action of the material, can bear elastic deformation caused by the moments of different adjusting bolts, and does not cause functional damage to the structure. The material characteristic can avoid the situation that the IGBT is directly damaged due to overlarge tightening torque.

The trench depth of the indent structure 11 is smaller than the height of the IGBT. Because indent structure and IGBT base plate have the difference in height (for example the height of IGBT casing is 5mm, and the groove depth is 4mm), the difference in height makes adjusting bolt when screwing in, makes every IGBT can both guarantee the base plate closely to laminate with the radiator bottom plate better.

Referring to fig. 2 to 4, according to a second embodiment of the present invention, an IGBT module assembly is provided, where the IGBT module assembly includes a mounting bracket 10, a heat sink 20, an adjusting bolt 30, and an IGBT40, the mounting bracket 10 is provided with a indent structure 11 matching with the IGBT, and an installation space for accommodating the IGBT is enclosed between the indent structure 11 and the heat sink 20; the mounting bracket 10 is provided with bolt holes 12 for mounting the adjusting bolts 30. The heat sink 20 is used to dissipate heat of the IGBT. The adjusting bolt 30 is inserted into the bolt hole 12, and the mounting bracket 10 is connected to the heat sink 20 by the adjusting bolt 30. The IGBT40 is located in the mounting space, and the substrate of the IGBT is bonded to the heat sink 20.

The installation frame 10 is installed the location to the IGBT through indent structure 11, recycles adjusting bolt and passes bolt hole 12 on the installation frame 10 and fix the installation frame 10 on the radiator, has enclosed the installation space who holds the IGBT between indent structure 11 and the radiator, compresses tightly the IGBT when adjusting bolt fixed mounting frame 10 for the radiator can be hugged closely to the IGBT. The IGBT module component is designed with an installation frame structure, the IGBT and the radiator can be tightly attached through structural matching, and the heat of the IGBT can be effectively and timely transmitted to the radiator, so that the IGBT can be continuously and normally operated. The radiator is a carrier of the IGBT which radiates by means of other tools, so that the substrate at the bottom of the IGBT is tightly attached to the bottom plate of the radiator, and the IGBT is helped to effectively transmit heat generated inside the IGBT in time so as to ensure the normal work of the IGBT.

The mounting frame 10 comprises a pressing plate 13, the pressing plate 13 is arranged corresponding to the pressure groove structure 11, the bolt holes 12 are located on the pressing plate 13, and the pressing plate 13 is attached to the radiator 20. The effect of clamp plate 13 is that adjusting bolt transmits indent structure 11 when screwing up, and the clamp plate is preferred to be out of shape and bear and screw up the moment, and can not influence the IGBT module, avoids taking place because of the too big condition of direct damage IGBT of screwing up moment.

The pressing plates 13 are arranged at intervals, and a pressing groove structure 11 is arranged between the two pressing plates 13. In this embodiment, the mounting bracket 10 is a bar structure, the two pressing plates 13 are respectively located on two sides of one pressing groove structure 11, the two sides of the IGBT can be attached to the radiator through the adjusting bolts, and the heat dissipation efficiency is higher. The number of the pressure groove structures and the pressure plates depends on the number of the IGBTs, and the mounting rack 10 can support a large number of installations, and is simple in structure and low in cost. In order to enhance the heat exchange, a hollow structure is arranged at the bottom of the pressure tank structure 11.

With reference to fig. 2 and 3, the IGBT module assembly further includes a positioning clip 14 and a PCB board 50, the positioning clip 14 being disposed on the mounting bracket 10. The PCB 50 is clamped with the positioning buckle 14, and the IGBT is welded with the PCB 50. The IGBT40 is a plug-in package, and is to be installed on the back of the PCB, the 4 positioning buckles 14 of the installation rack 10 are respectively buckled in the 4 rectangular holes on the PCB, so that the installation rack can only vertically move up and down along the PCB; then, the pins of the IGBT40 are bent to 90 ° by using a tool, so that the IGBT is substantially parallel to the PCB 50, and then fixed on the PCB by welding.

The mounting block 10 has opposite first and second sides, the PCB board 50 is located at the first side of the mounting block 10, the heat sink 20 is located at the second side of the mounting block 10, and the notch of the indent structure 11 faces the second side of the mounting block 10. As can be seen from fig. 3 and 4, since the PCB 50 and the heat sink 20 are respectively disposed at both sides of the mounting bracket 10, and are operated from the side of the PCB 50 when the adjustment bolt is screwed in, the PCB 50 is provided with an avoiding hole 51 for avoiding the adjustment bolt 30 for easy mounting and dismounting.

The material of the mounting frame 10 is a deformable elastic material. The trench depth of the indent structure 11 is smaller than the height of the IGBT. When the IGBT mounting structure is used, a pressure is applied to the mounting frame 10 by screwing in the adjusting bolt, and the mounting frame will deform to some extent during this process and transfer the pressure to the IGBT, so that each individual IGBT is tightly attached to the heat sink. The material of the mounting bracket 10 can be nylon material, and the mounting bracket 10 has the characteristics of high mechanical strength, good toughness and fatigue resistance under the action of the material, can bear elastic deformation caused by the moments of different adjusting bolts, and does not cause functional damage to the structure. The material characteristic can avoid the situation that the IGBT is directly damaged due to overlarge tightening torque. Because indent structure and IGBT base plate have the difference in height (for example the height of IGBT casing is 5mm, and the groove depth is 4mm), the difference in height makes adjusting bolt when screwing in, makes every IGBT can both guarantee the base plate closely to laminate with the radiator bottom plate better.

When the IGBT module component is used, a plurality of IGBTs are required to be welded and installed on a PCB, and the base plate surface of the IGBT module component cannot be ensured on the same horizontal plane when the IGBTs are welded and fixed due to the dimensional tolerance of the structural appearance of the component and the positioning error generated during installation and welding. The structural characteristics of the IGBT module can completely overcome the problems, and the installation process is as follows:

when in installation, the 4 positioning buckles 14 of the installation rack 10 are respectively buckled in the 4 rectangular holes on the PCB, so that the installation rack can only vertically move up and down in the direction perpendicular to the PCB and cannot be separated from the PCB; then, bending and marking are carried out on the pins of the IGBTs at a uniform distance, and the process is to ensure that the substrates of the IGBTs are kept on the same horizontal plane as much as possible after each IGBT is bent for 90 degrees; after the bending is finished, the IGBTs are welded and fixed on the PCB, and a special tool can be used for uniformly positioning the IGBTs in the welding process so as to ensure that the substrate surfaces of the IGBTs are on the same horizontal plane as much as possible after the welding is finished.

After welding, the PCB is installed and fixed on the radiator according to the standard requirement; finally, the adjusting bolts are screwed in one by one through the avoidance holes on the PCB (the screwing depth of the adjusting bolts is determined by observing whether the mounting rack is loosened, and the adjusting bolts can be screwed when the mounting rack cannot be loosened); because the indent structure of mounting bracket and the difference in height of IGBT height (the height of IGBT casing is 5mm, indent structure groove depth 4mm), can offset the error that some IGBT base plate is not on the coplanar in the installation like this to guarantee that IGBT hugs closely and attaches on the radiator. Therefore, the installation of the discrete IGBT modules is simply and efficiently realized, and the installation mode can realize the simultaneous installation of a plurality of discrete IGBT modules. Moreover, the risk that the IGBT device is damaged due to overlarge tightening torque when the IGBT module is directly screwed and fixed by using the bolt is avoided. In addition, the installation mode is simple, efficient, easy to operate and low in installation cost.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.

Of course, the above is a preferred embodiment of the present invention. It should be noted that, for a person skilled in the art, several modifications and refinements can be made without departing from the basic principle of the invention, and these modifications and refinements are also considered to be within the protective scope of the invention.

Claims

1. An IGBT mounting structure for mounting the IGBT on a heat sink, characterized by comprising:

the mounting rack (10) is provided with a pressure groove structure (11) matched with the IGBT, and an installation space for accommodating the IGBT is enclosed between the pressure groove structure (11) and the radiator; and the mounting rack (10) is provided with a bolt hole (12) for mounting an adjusting bolt.

2. The IGBT mounting structure according to claim 1, wherein the mounting bracket (10) includes a pressing plate (13), the pressing plate (13) is disposed corresponding to the pressure groove structure (11), and the bolt holes (12) are located on the pressing plate (13).

3. The IGBT mounting structure according to claim 2, characterized in that the pressing plates (13) are provided in plurality and spaced apart, and one of the indent structures (11) is provided between two of the pressing plates (13).

4. The IGBT mounting structure according to claim 1, further comprising:

the positioning buckle (14), the positioning buckle (14) is arranged on the mounting rack (10), and the positioning buckle (14) is used for being clamped with the PCB.

5. The IGBT mounting structure according to claim 1, wherein the material of the mounting bracket (10) is a deformable elastic material.

6. The IGBT mounting structure according to claim 1 or 5, characterized in that the indent structure (11) has a groove depth smaller than the height of the IGBT.

7. An IGBT module assembly, comprising:

a heat sink (20) for dissipating heat from the IGBT;

the mounting rack (10) is provided with a pressure groove structure (11) matched with the IGBT, and a mounting space for accommodating the IGBT is enclosed between the pressure groove structure (11) and the radiator (20); the mounting rack (10) is provided with a bolt hole (12) for mounting an adjusting bolt (30);

the adjusting bolt (30) is arranged in the bolt hole (12) in a penetrating mode, and the mounting frame (10) is connected to the radiator (20) through the adjusting bolt (30);

and an IGBT located in the installation space, wherein a substrate of the IGBT is attached to the heat sink (20).

8. The IGBT module assembly according to claim 7, wherein the mounting bracket (10) includes a pressing plate (13), the pressing plate (13) is disposed corresponding to the pressure groove structure (11), the bolt holes (12) are located on the pressing plate (13), and the pressing plate (13) is attached to the heat sink (20).

9. The IGBT module assembly according to claim 8, wherein the pressing plate (13) is provided in plurality and spaced apart, and one of the groove structures (11) is provided between two pressing plates (13).

10. The IGBT module assembly of claim 7, further comprising:

a positioning catch (14), the positioning catch (14) being provided on the mounting frame (10);

PCB board (50), PCB board (50) with location buckle (14) joint, the IGBT with PCB board (50) welding.

11. The IGBT module assembly of claim 10,

the mounting frame (10) has a first side and a second side opposite to each other, the PCB board (50) is located at the first side of the mounting frame (10), the heat sink (20) is located at the second side of the mounting frame (10), and the notch of the indent structure (11) faces the second side of the mounting frame (10).

12. The IGBT module assembly according to claim 10 or 11, wherein an avoidance hole (51) for avoiding the adjusting bolt (30) is provided on the PCB board (50).

13. The IGBT module assembly according to claim 7, wherein the material of the mounting bracket (10) is a deformable, resilient material.

14. The IGBT module assembly according to claim 7 or 13, characterized in that the indent structures (11) have a groove depth that is smaller than the height of the IGBT.