CN213093199U - Integrated package light emitting device and display system device - Google Patents

Abstract

The utility model relates to a LED technical field provides an integrated form encapsulation illuminator and display system device, integrated form encapsulation illuminator, including LED chip, driver chip, support plate and packaging structure. The driving chip is provided with a front mounting end face and a back mounting end face, the back mounting end face of the driving chip is arranged on the support plate, the LED chip is electrically connected with the front mounting end face of the driving chip, and the packaging structure is arranged on the support plate and covers the LED chip and the driving chip. The LED light-emitting device comprises a substrate, a support plate, a LED chip, a driving chip, a light-emitting device and a light-emitting device, wherein the LED chip is arranged on the substrate, the driving chip is formed by integrating electrical elements for driving and protecting the LED chip, the driving chip is provided with a front mounting end face and a back mounting end face, the back mounting end face of the driving chip is arranged on the support plate, the front mounting end face of the driving chip is electrically connected with the LED chip, and the driving chip is finally packaged in a packaging structure.

Description

Integrated package light emitting device and display system device

Technical Field

The utility model relates to a LED technical field especially provides an integrated form encapsulation illuminator and have this integrated form encapsulation illuminator's display system device.

Background

With the development of the technology becoming faster and faster, the speed of updating and iterating the LED (Light-Emitting Diode) Light source product becomes faster and faster, and the user's demand for high-quality LED Light sources becomes more and more urgent.

The traditional light-emitting device carries an external drive circuit and an LED together, the external drive circuit is often complex, and the driving and the protection of one LED lamp can be completed only by building more electronic components and drive chips, so that the product cannot be refined.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an integrated form encapsulation illuminator aims at solving the great problem of the whole volume of current LED illuminator.

In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides an integrated form encapsulation illuminator, includes LED chip, driver chip, support plate and packaging structure, driver chip has front installation terminal surface and back installation terminal surface, driver chip's back installation terminal surface is located on the support plate, the LED chip with driver chip the front installation terminal surface electric connection, packaging structure locates on the support plate and cladding in the LED chip with driver chip.

The utility model has the advantages that: the utility model provides an integrated form encapsulation illuminator, each electrical components integration formation driver chip that will be used for drive and protection LED chip, driver chip has front mounting terminal surface and back mounting terminal surface, driver chip's back mounting terminal surface is installed on the support plate, and driver chip's front mounting terminal surface and LED chip electric connection, and, encapsulate in packaging structure at last, like this, place the packaging structure in with driver chip in, make the whole volume of this illuminator accomplish littleer, and more exquisite.

In one embodiment, the LED chip is mounted on the carrier board.

In one embodiment, the package structure is a first adhesive body, and the first adhesive body covers the LED chip and the driving chip.

In one embodiment, the package structure includes a first cavity disposed on the carrier and a second encapsulant filled in the first cavity.

In one embodiment, the LED chip is mounted on the front mounting end surface of the driving chip.

In one embodiment, the package structure includes a second cavity disposed on the carrier and a third encapsulant filled in the second cavity.

In one embodiment, the package structure is a molding cavity covering the LED chip and the driving chip, a third cavity disposed on the carrier, and a fourth encapsulant filled between the molding cavity and the third cavity.

In one embodiment, the front mounting end surface of the driving chip is provided with an R light output end, a G light output end, a B light output end, a power input end, a ground end, a main input data end, a backup data input end, and a shared data output end.

In one embodiment, the number of the main input data terminals is two, the two main input data terminals extend to the back mounting end surface, and the two main input data terminals are electrically connected.

The utility model also provides a display system device, including the aforesaid integrated form encapsulation illuminator.

The utility model has the advantages that: the utility model provides a display system device, on the basis that has above-mentioned integrated form encapsulation illuminator, whole volume is littleer.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an integrated packaged light emitting device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an integrated packaged light emitting device according to another embodiment of the present invention;

fig. 3 is a schematic structural diagram of an integrated packaged light emitting device according to another embodiment of the present invention;

fig. 4 is a schematic structural diagram of an integrated packaged light emitting device according to still another embodiment of the present invention;

fig. 5 is a front view of a driving chip of an integrated packaged light emitting device according to an embodiment of the present invention;

fig. 6 is a rear view of a driving chip of an integrated package light emitting device according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

the integrated packaged light emitting device 100, the LED chip 10, the driver chip 20, the carrier 30, the package structure 40, a front surface mounting end surface 20a, a back surface mounting end surface 20B, a first encapsulant 401, a first cavity 402, a second encapsulant 403, a second cavity 404, a third encapsulant 405, a molding cavity 406, a third cavity 407, a fourth encapsulant 408, an R light output end 21, a G light output end 22, a B light output end 23, a power input end 24, a ground end 25, a main input data end 26, a backup data input end 27, and a shared data output end 28.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1, fig. 5 and fig. 6, an integrated package light emitting device 100 of the present application includes an LED chip 10, a driving chip 20, a carrier 30 and a package structure 40. The driving chip 20 has a front surface mounting end surface 20a and a back surface mounting end surface 20b, the back surface mounting end surface 20b of the driving chip 20 is disposed on the carrier plate 30, the LED chip 10 is electrically connected to the front surface mounting end surface 20a of the driving chip 20, and the package structure 40 is disposed on the carrier plate 30 and covers the LED chip 10 and the driving chip 20.

The utility model provides an integrated form encapsulation illuminator 100, each electrical components integration that will be used for drive and protection LED chip 10 forms driver chip 20, driver chip 20 has front mounting terminal surface 20a and back mounting terminal surface 20b, driver chip 20's back mounting terminal surface 20b is installed on support plate 30, and driver chip 20's front mounting terminal surface 20a and LED chip 10 electric connection, and, encapsulate in packaging structure 40 at last, like this, place packaging structure 40 in with driver chip 20 in, make this illuminator whole volume possible littleer, and more exquisite.

Referring to fig. 1, 5 and 6, in one embodiment, the LED chip 10 is mounted on a carrier 30. It can be understood that the LED chip 10 and the driving chip 20 are disposed on the carrier 30 side by side, so that the overall size of the light emitting device is reduced to a moderate size.

With reference to fig. 1, in this embodiment, the package structure 40 is a first encapsulant 401, and the first encapsulant 401 encapsulates the LED chip 10 and the driving chip 20. As can be appreciated, the first colloid 401 is directly used to encapsulate the LED chip 10 and the driving chip 20, which is simple in process and high in efficiency.

Referring to fig. 2, in another embodiment, the package structure 40 includes a first cavity 402 disposed on the carrier 30 and a second encapsulant 403 filled in the first cavity 402. It can be understood that the first cavity 402 and the carrier 30 form a receiving cavity, the LED chip 10 and the driving chip 20 are disposed in the receiving cavity, and the second glue 403 is filled in the receiving cavity, so as to achieve the purpose of packaging.

Referring to fig. 3, 5 and 6, in one embodiment, the LED chip 10 is mounted on the front mounting end surface 20a of the driving chip 20. It can be understood that the LED chip 10 and the driving chip 20 are stacked, thereby further reducing the overall size of the light emitting device.

With continued reference to fig. 3, in the embodiment, the package structure 40 is a second cavity 404 disposed on the carrier 30 and a third encapsulant 405 filled in the second cavity 404. Similarly, the second cavity 404 and the carrier 30 form an accommodating cavity, the LED chip 10 and the driving chip 20 are disposed in the accommodating cavity, and the third encapsulant 405 is filled in the accommodating cavity, so as to achieve the purpose of packaging.

Referring to fig. 4, in another embodiment, the package structure 40 is a molding cavity covering the LED chip 10 and the driving chip 20, a third cavity 407 disposed on the carrier 30, and a fourth encapsulant 408 filled between the molding cavity 406 and the third cavity 407. It can be understood that the LED chip 10 and the driving chip 20 are fixed by the molding cavity 406, and then the fourth colloid 408 fills the space between the third cavity 407 and the molding cavity 406 to achieve packaging.

Referring to fig. 5, in one embodiment, the front mounting end surface 20a of the driving chip 20 is provided with an R light output end 21, a G light output end 22, a B light output end 23, a power input end 24, a ground end 25, a main input data end 26, a backup data input end 27, and a shared data output end 28. It is understood that the integrated driving chip 20 has each port disposed on the front mounting end surface 20a for facilitating electrical connection with the LED chip 10. The R light output end 21, the G light output end 22, and the B light output end 23 are respectively connected to three-color input ends of the LED chip 10; the power input end 24 is connected with an external power supply; the grounding terminal 25 is arranged for grounding, and one or two grounding terminals 25 can be arranged; the primary input data terminal 26, the backup data input terminal 27 and the shared data output terminal 28 are used for the transmission of electrical control signals.

Referring to fig. 6, in one embodiment, the number of the main input data terminals 26 is two, the two main input data terminals 26 extend to the rear mounting end surface 20b, and the two main input data terminals 26 are electrically connected. It is understood that when a plurality of the packaged light emitting devices 100 are connected in series and the first data output terminal of the controller is connected to the primary data input terminal of the first packaged light emitting device 100, the first data output terminal of the controller may also be connected to the backup data input terminal 27 of the second packaged light emitting device 100; the main data input end of the first integrated package light emitting device 100 is connected with the main data input end of the second integrated package light emitting device 100; the main data input terminal of the second encapsulated light emitting device 100 is connected to the backup data input terminal 27 of the third encapsulated light emitting device 100, and so on, so that even if one of the light emitting devices fails, the control signal can still be transmitted to control the light emitting device arranged after the failure, thereby reducing the failure rate in the using process.

The present invention also provides a display system device, which includes the above-mentioned integrated package light-emitting device 100.

The utility model provides a display system device, on the basis that has above-mentioned integrated form encapsulation illuminator 100, whole volume is littleer.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. An integrated encapsulated light emitting device, comprising: the LED driving device comprises an LED chip, a driving chip, a carrier plate and a packaging structure, wherein the driving chip is provided with a front mounting end face and a back mounting end face, the back mounting end face of the driving chip is arranged on the carrier plate, the LED chip is electrically connected with the front mounting end face of the driving chip, and the packaging structure is arranged on the carrier plate and is coated on the LED chip and the driving chip.

2. The integrated encapsulated lighting device of claim 1, wherein: the LED chip is arranged on the carrier plate.

3. The integrated encapsulated lighting device of claim 2, wherein: the packaging structure is a first colloid, and the LED chip and the driving chip are coated with the first colloid.

4. The integrated encapsulated lighting device of claim 2, wherein: the packaging structure comprises a first cavity arranged on the carrier plate and a second colloid filled in the first cavity.

5. The integrated encapsulated lighting device of claim 1, wherein: the LED chip is mounted on the front mounting end face of the driving chip.

6. The integrated encapsulated lighting device of claim 5, wherein: the packaging structure comprises a second cavity arranged on the carrier plate and a third colloid filled in the second cavity.

7. An integrated encapsulated lighting device as claimed in claim 5, wherein: the packaging structure comprises a die pressing cavity body, a third cavity body and a fourth colloid, wherein the die pressing cavity body is covered on the LED chip and the driving chip, the third cavity body is arranged on the carrier plate, and the fourth colloid is filled between the die pressing cavity body and the third cavity body.

8. An integrated encapsulated lighting device as claimed in any one of claims 1 to 7, wherein: the front mounting end face of the driving chip is provided with an R light output end, a G light output end, a B light output end, a power input end, a grounding end, a main input data end, a backup data input end and a shared data output end.

9. The integrated encapsulated lighting device of claim 8, wherein: the number of the main input data ends is two, the two main input data ends extend to the back mounting end face, and the two main input data ends are electrically connected.

10. A display system apparatus, characterized by: comprising an integrated encapsulated light emitting device as claimed in any of claims 1 to 9.

Images